P7 - Lenovo ThinkStation

Information Date

22-Aug-23

Hardware Maintenance Manual

HMM

Drivers & Software

Available Whitepapers

Power Configurator

Memory Configurator

Storage Configurator

Intel VROC Configurator

Discrete RAID Configurator

Windows 11 Installation

Windows 10 Installation

Red Hat Enterprise Linux 9 Installation

Ubuntu Linux 22.04 LTS Installation

Description

The bold Lenovo ThinkStationP7 is a force to be reckoned with and brings together a breakthrough new compute architecture with an advanced thermal design in a rack-optimized, Aston Martin-inspired chassis. Featuring the latest Intel® Xeon® W processors, up to 56 cores, robust PCIe Gen 5 connectivity, and highspeed DDR5 memory, and up to three NVIDIA RTX 6000 Ada GPUs the P7 delivers staggering performance output from a single-socket platform.

Processor Support

4th Generation Intel Xeon Scalable Processors

Socket Type

Socket-E (LGA-4677)

Preloaded

Windows 11 Pro 64-bit for Workstation
Ubuntu 22.04 LTS (configuration specific)

Supported

Red Hat Enterprise Linux 9.x
Ubuntu 22.04 LTS

Slots

Up to 8 DIMMS

Channels

8 Memory Channels

Type

DDR5, 288-Pin, ECC RDIMM and 3DS RDIMMS*

ECC Support

Yes

Speed

Up to 4800MHz

Max DIMM Size

64GB DDR5 ECC RDIMM
128GB DDR5 ECC 3DS-RDIMM

Max System Memory

1TB

Disclaimers

*Actual Memory Speed is dependent on the CPU

Total Bays/Size

3 (2 std, 1 optional)

SATA

3 x SATA 3.0 Connectors

PCIe (M.2)

2 x M.2 NVMe 2280/22110 PCIe Connectors Onboard (Gen5)
1x optional M.2 NVMe 2280/22110 Onboard (Gen4)

Disclaimers

*See Storage Whitepaper for details on the available usage options.

Integrated Graphics

Not Available

Discrete Graphics

NVIDIA T400(MiniDP x3) – 4GB GDDR6, PCIe3, Single-Slot
NVIDIA T1000(MiniDP x4) – 8GB GDDR6, PCIe3, Single-Slot
NVIDIA RTX A2000(MiniDP x4) – 12GB GDDR6, PCIe4, Dual-Slot
NVIDIA RTX A4000 (4xDP) – 16GB GDDR6, PCIe4, Single-Slot
NVIDIA RTX A4500(DP x4) – 20GB, GDDR6, PCIe4, Dual-Slot
NVIDIA RTX A5500(DP x4) – 24GB GDDR6, PCIe4, Dual-Slot
NVIDIA RTX A6000(DP x4) – 48GB GDDR6, PCIe4, Dual-Slot
NVIDIA RTX6000 Ada(DP x4) – 48GB GDDR6, PCIe4, Dual-Slot
NVIDIA Quadro SYNC II card

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slot 1

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 2

PCIe 4.0 x8, Full Height, Full Length, 25W, Open Ended

Slot 3

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 4

PCIe 4.0 x4, Full Height, Full Length, 25W, Open Ended

Slot 5

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 6

PCIe 4.0 x16, Full Height, Full Length, 75W

Slot 7

PCIe 5.0 x4, Full Height, Full Length, 25W, Open Ended

Disclaimers

Note: Slot 7 will not support a full length card when the vertical M.2 option is installed

USB

2 x USB-A 3.2 Gen 2 (10Gbps)
2 x USB-C 3.2 Gen 2 (10Gbps)

Audio

1 x 3.5mm Global Headset Jack (Headphone + Mic in)

Media Card Reader

USB 3.0 15-in-1 Media card reader supporting SD UHS-II (Optional)

Flex Bay

Front access drive bay

Disclaimers

Note: Actual USB throughput will vary depending on the type and quantity of USB devices used.

USB

3x USB-A 3.2 Gen 1 (5Gbps)
2 x USB-A 2.0 (480Mbps)
1x USB-C 3.2 Gen 2×2 (20Gbps)

Audio

2 x Rear (Line Out, Line In retasked as Mic)

DisplayPort

As Supported by GPU

HDMI

As Supported by GPU

Serial Port

Optional 1x Rear Port

Ethernet

1 x 1GbE – RJ45
1 x 10GbE – RJ45

PS/2

Optional PS/2 AIC PCIe adapter (2 port)

Optional Network Adapter

Broadcom 5720 Dual Port Gigabit PCIe Ethernet Adapter
Broadcom 5719 Quad Port Gigabit PCIe Ethernet Adapter
Bitland RTL8168H 1000M PCIE Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Intel AX210 WIFI PCIe adapter with Internal Antennas

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Vendor

Aquantia 10 GbE AQC113C-B1-C
Intel 1 GbE I219 (Vpro, AMT)

Speeds

10/100/1000/10000Mbps Aquantia AQC113C
10/100/1000Mbps Intel I219

Functions

PXE, WOL, Jumbo Frames
ASF, Teaming (Intel only)

Connectors

2 x RJ45

Disclaimers

Note: Network speeds listed are theoretical.

Vendor

Realtek

Type

HD (2.0)

Internal Speaker

1 x 1.5 watt 4 ohm

Connectors

2 x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic)
1 x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset

Realtek ALC897Q Codec (rear)
Realtec ALC4032 (front)

Number of Channels

Rear Audio: 2 Channels
Front Audio: 2 Channels

Number of Bits/Audio Resolution

Rear Codec:
10 Channel DAC Supports 16/20/24-bit PCM
2 Stereo ADC Supports 16/20/24-bit PCM
Front Codec:
One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit
One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Disclaimers

*Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Temp Sensors

Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel
PCIe Zone 1 Sensor – Thermistor
PCIe Zone 2 Sensor – Thermistor
PCIe Zone 3 Sensor – Thermistor
PCIe Zone 4 Sensor – Thermistor
DIMM Right Sensor – Thermistor
DIMM Left Sensor – Thermistor
Storage (M.2) Sensor – Thermistor

Fans

2x Front PCIe Fans (PCIe1_4_FAN & PCIe5_7_Fan) – 4-pin cable connector
1x Front BCB Optional Fan (FAN_INT_STORG) – 4-pin cable connector
2x Memory Fans (MEM_FAN_B & MEM_FAN_T) – 4-pin cable connector
1x Rear Fan (REAR_FAN1) – 4-pin cable connector
1x CPU Fan (FAN_CPU) – 4-pin cable connector
1x CPU Optional Fan (FAN_FRNT) – 8-pin cable connector
1x Front Flex Bay Optional Fan (FLEX_BAY_FAN) – 4-pin cable connector
PSU Fans – provided by PSU vendor

Power Supply

1000W / 1400W

Power Efficiency

92% Efficient @ 50% Load

Main

C14 socket to std C13 line cord

Operating Voltage Range

100 – 240V (autosensing)

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

1000W: 6A-12A
1400W: 9A-15A

Graphics

Up to 6 x 8-pin (6+2) PCIe*

Power Supply Fan

Yes

ENERGY STAR® Qualified (config dependent)

Yes

80 PLUS Compliant

Yes

Built-in Self Test (BIST) LED

Yes

Disclaimers

Note: Power Output of 1400W PSU Limited to 1125W for 100-111.9 Input Voltage.
*Quantity of Graphics power cables is configuration dependent
*See Power Configuration Whitepaper for additional details.

Vendor

AMI

Color

Storm Gray

PSU

One Fixed 1400W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
or
One Fixed 1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions

3 Front PCIe Fans
1 Rear Fan
2 CPU Fans (1 optional, 200-250W CPU SKUs)
1 Front Access Storage Fan (optional, configuration dependent)
2 DIMM Memory Fans
1 CPU Heatsink Fan
2 Autonomous PSU Fans

Dimensions

434mm / 17.1″ H (without feet)
440mm / 17.3″ (with feet)
508mm / 20″ D
175mm / 6.9″ W

Weight

23kg / 49.6lbs (max config)

Height (mm/in)

618mm / 24.23″

Width (mm/in)

324mm / 12.8″

Depth (mm)

695mm / 27.4″

Weight (kgs/lbs)

26.2kg / 57.8lbs (max config)

TPM

Infineon SPI TPM SLB9672 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Yes

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

Yes – common or unique

Boot Sequence Control

Yes

Padlock Support

No

Boot Without Keyboard and/or Mouse

Yes

Access Panel

Tool-less Side Cover Removal

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Tool-less*

Color Coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained with Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Download Recovery Service
or available through Lenovo Support.

Disclaimers

*Note: CPU Heatsink assembly requires a T30 bit.

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level

Vibration

Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operating: X,Y axis: +- 15G/3ms Z axis: +- 30G/3ms
Operating (Rack mounted): X,Y,Z axis: +- 15G/3ms
Non-operating target: Trapezoidal shock, 35g average, 11ms

Disclaimers

Extended operating temperatures are possible – please contact your Lenovo Rep

Board Size

15″ x 11.57″ (381mm x 294mm)

Layout

Lenovo Custom Extended ATX

Processor Support

Intel(R) Xeon(R) W-3400 series processors

Socket Type

Socket E (LGA 4677)

Memory Support

DDR5 up to 4800MHz RDIMM / 3DS RDIMM Memory

Voltage Regulator

Intel VR14.0 – 400W TDP Capable

Chipset (PCH)

Intel Alder Lake S PCH W790

Flash

2 x 64MB

Super I/O

1 x MEC1723(176 pin)

Clock

External Clock

Audio

Rear Codec: Realtek ALC897Q (Rear I/O)
Front Codec: Realtek ALC4032 (FPIO)

Ethernet

Aquantia 10Gb AQC113C-B1-C
Intel 1Gb I219

Processor Level

Intel Xeon Sapphire Rapids

Processor

Intel Xeon W9-3495X
Intel Xeon W9-3475X
Intel Xeon W7-3465X
Intel Xeon W7-3455
Intel Xeon W7-3445
Intel Xeon W5-3435X
Intel Xeon W5-3433
Intel Xeon W5-3425
Intel Xeon W5-3423

Memory Type

RDIMMs – 4800MHz, CPU Dependent

Memory

16GB DDR5 ECC RDIMM PC5-4800
32GB DDR5 ECC RDIMM PC5-4800
64GB DDR5 ECC RDIMM PC5-4800
128GB DDR5 ECC 3DS-RDIMM PC5-4800

Disclaimers

Additional CPU SKU’s certified.

3.5″ SATA Hard Disk Drive (HDD)

2TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)
12TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
1024GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
2048GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
4096GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

Disclaimers

Additional storage devices certified

Disclaimers

*NOTE: Some features available after launch

Keyboard

USB Traditional Keyboard
PS/2 Traditional Keyboard
Smart Card Keyboard
USB Calliope Keyboard

Pointing Devices

USB Calliope Mouse
PS/2 Black Optical Mouse
USB Fingerprint Mouse

5.25″ External Access Bays

Front access drive bay

Internal Access Bays

Optional internal 3.5″ drive bay

Network

Broadcom 5720 Dual Port Gigabit Ethernet Adapter
Broadcom 5719 Quad Port Gigabit Ethernet Adapter
Bitland RTL8168H 1000M PCIE Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

WiFi Cards

Intel PCIe WiFi Card With BT Internal Antenna Kit (AX210 6E)

Parallel Card

PS/2 (2 Port) PCIe adapter

Com port

Serial COM port cable with 5V transceiver

PCIe to M.2 Adapter Card

ThinkStation Quad AIC Gen 3 M.2 adapter

CPU

Intel Xeon W9-3495X

Intel Xeon W9-3475X

Intel Xeon W7-3465X

Intel Xeon W7-3455

Intel Xeon W7-3445

Intel Xeon W5-3435X

Intel Xeon W5-3433

Intel Xeon W5-3425

Intel Xeon W5-3423

Disclaimers

Drive

500GB SATA – 7200rpm, 6Gb/s, 2.5″

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

4TB SATA – 7200rpm, 6Gb/s, 3.5″

6TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Not Available

Yes

2.5″ SATA Hard Disk Drive (HDD)

Yes

Not Available

Connector

SATA

Transfer Rate (Gb/sec)

160MB/s OD read

Average data rate, read/write 156MB/s

Sustained data transfer rate 216 – 226MB/s

Spindle Speed (RPM)

7,200

DC Power to Drive Ready (sec)

3.5

<10.0

<17.0

Average Latency (msec)

4.2

4.16

Input (VDC)

5

Typical (Watts)

1.9

6.19

6.7

7.35

8.13

Idle (Watts)

0.7

4.6

4.5

5.45

6.21

Physical Dimensions

69.85mm x 100.34mm x 7mm

101.6mm x 146.99mm x 19.88mm

101.6mm x 146.99mm x 26.1mm

101.85mm x 147mm x 26.1mm

Weight (grams)

90

420

535

680

705

Operating (C) Ambient

0 to 60

5 to 60

Operating (C) Base Casting

60

Non-Operating (C) Ambient

(-40 to 70)

Gradient (C per Hour)

20

Operating (Gs @ 2ms)

400

70

80

Read 70 Gs / Write 40 Gs

Non-Operating (Gs @ 2ms)

1000

350

300

250

Disclaimers

Drive

256GB 2.5″ SATA SSD

512GB 2.5″ SATA SSD

1TB 2.5″ SATA SSD

2TB 2.5″ SATA SSD

256GB NVMe M.2 SSD TLC

512GB NVMe M.2 SSD TLC

1024GB NVMe M.2 SSD TLC

2048GB NVMe M.2 SSD TLC

480GB AIC Optane™ SSD

1.5TB U.2 Optane ™ SSD

Dimensions Millimeters (W x D x H)

70 x 100 x 7.0

22 x 80 x 2.3

20 x 168 x 104

70 x 100 x 15

Interface Type

SATA-III

PCIe Gen 3.0 x4 NVMe

Power Active (AVG)

1.8W

1.9W

2.2W

6W

5W

18W

Power Idle

50mW

7W

Typical Sequential Read

540MB/s

530MB/s

3000MB/s

3200MB/s

3500MB/s

2700MB/s

Typical Sequential Write

500MB/s

1300MB/s

1600MB/s

3000MB/s

2200MB/s

Operating Temperature Range

0 to 55°C

0 to 85°C

Endurance Rating (Lifetime Writes)

85TB

150TB

300TB

600TB

85TB

150TB

300TB

600TB

8.76PB

27.3PB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

No

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.

PCI Bus

PCH Integrated

PCI Modes

SATA 3.0

RAID Levels

0/1/5/10

Data Transfer Rates

6Gb/s

Internal Connectors

2 x MiniSAS HD (2 ports each) + 3 x SATA

Disclaimers

Operating Systems Supported

Windows 10 Pro for Workstations (Preload)
Windows 7 Pro 64
Red Hat Enterprise Linux 7.3
Ubuntu 16.04 and 18.04.2

Temperature

10° – 35°C (50° – 95°F)

Relative Humidity

10%-80% (non-condensing)

Maximum Wet Bulb Temperature

25°C max

Disclaimers

Adapter

T400

T1000

RTX A2000

RTX A4000

RTX A4500

RTX A5500

RTX A6000

RTX 6000 Ada

Bus Interface

PCIe 3.0 x16

PCIe 4.0 x16

Coming Soon

Display Interface

3 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4a

4 x DP 1.4a

4 x DP 1.4

4 x DP 1.4a

Coming Soon

Graphics Chipset

Turing

Coming Soon

Ampere

Coming Soon

Ampere

Coming Soon

Memory Clock Frequency (MHz)

Coming Soon

2000MHz

Coming Soon

Memory Size

2GB GDDR6

4GB GDDR6

Coming Soon

16GB GDDR6

Coming Soon

48GB GDDR6

Coming Soon

Memory Interface

64-bit

128-bit

Coming Soon

256-bit

Coming Soon

384-bit

Coming Soon

Memory Bandwidth

80GB/s

160GB/s

Coming Soon

448 GB/s

Coming Soon

Up to 768GB/s

Coming Soon

GPU Cores

CUDA Cores: 384

CUDA Cores: 896

Coming Soon

CUDA Cores: 6411
Tensor Cores: 192
RT Cores: 48

Coming Soon

CUDA Cores: 10,752
Tensor Cores: 336
RT Cores: 84

Coming Soon

Maximum Power Consumption

30W

50W

Coming Soon

140W

Coming Soon

300W

Coming Soon

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

Coming Soon

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Coming Soon

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Coming Soon

Thermal Solution

Active

Coming Soon

Active

Coming Soon

Active

Coming Soon

Dimension

2.7″ H x 6.1″ L
Single Slot

Coming Soon

4.4″ H x 9.5″ L
Single Slot

Coming Soon

4.4″ H x 10.5″ L
Dual Slot, Full Height

Coming Soon

Advanced Display

Coming Soon

SYNC 2

Coming Soon

SYNC 2

Coming Soon

SLI/NVLink Support

Coming Soon

NVLink

Coming Soon

Disclaimers

Card

Intel I210-T1 Single Port Gigabit Ethernet Adapter (Springville)

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel X540-T2 Dual Port Copper 10Gb Ethernet Adapter

Intel X710-DA2 Dual Port Fiber 10Gb Ethernet Adapter

Intel Ethernet SFP+ SR Optics Module

Intel Dual Band Wireless-AC 7260 ASM

Intel Winstorm Peak 8265 2×2 AC+BT 4.2 Vpro M.2 Combo

Supplier PN

I210T1, MM# 941033

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

MM#928955

MM# 952103

MM#: 941243

7260HMWDTX.R, MM# 936170

MM#: 946658

Data Rates Supported

10/100/1000Mbps copper

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

100/1000Mbps and 10Gbps Copper

1GbE/10GbE Optical fiber
10GbE Direct Attach (DAC)

Not Available

Intel Dual Band Wireless-AC 7260

Intel Dual Band Wireless-AC 8265

Controller Details

Intel® Ethernet Controller I210

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Intel Ethernet Controller X540

Intel Ethernet Controller X710-AM2

Not Available

Intel Dual Band Wireless-AC 7260, Dual Band, 2×2, WiFi+BT

Intel Dual Band Wireless-AC 8265, 2×2, WiFi+BT, MU-MIMO

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 3.0 (8GT/s)

Not Available

PCIe M.2

Data Transfer Mode

Ethernet

Not Available

WiFi (802.11ac), 2.4GHz, 5GHz

Power Consumption

0.81W

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

X540-T2:
10Gps= 17.4W
1Gbps= 9.5W
100Mbps=6.6W
X540-T1:
10Gbps=10.8W
1Gbps= 7.7W
100Mbps= 6.4W

Dual-port 10GBASE-SR= 4.3W typ/4.8W max
Dual-port 1000BASE-SX= 4W typ/4.3W max
Dual-port 10GBASE-LR= 4.5W typ/ 5.1W max
Dual-port Direct Attach (Twinax)= 3.3W typ/3.7W max

Not Available

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3 100/1000/10GBASE-T

IEEE 802.3 1/1010GBASE-SR/LR, SFF-8431 10GSFP+DAC

Not Available

IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w

IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w, 802.11r, 802.11k, 802.11v (pending)

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Not Available

Network Transfer Mode (Full/Half Duplex)

Supported

Not Available

Network Transfer Rate

1,000Mbps Full Duplex

Not Available

300/867Mbps

867Mbps

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Windows ServerLinux, FreeBSD

Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x

Not Available

Windows 10, 32-bit*, Windows 10, 64-bit*, Windows 8.1, 32-bit*, Windows 8.1, 64-bit*, Windows 8, 32-bit*, Windows 8, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*, Linux*

Windows 10, 64-bit*, Windows 8.1, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*, Linux*

Manageability

Supported

Not Available

Manageability Capabilities Alerting

Supported

Not Available

TDP

Firmware Based Thermal Management

Not Available

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

Not Available

0°C to 80°C (32°F to 176°F)

# of Ports

1

2

4

2

Not Available

Data Rate Per Port

10/100/1000Mbps (copper)

10/100/1000Mbps (copper), 1000Mbps (fiber)

100/1,000Mbps, 10Gbps

1Gbps, 10Gbps

Not Available

System Interface Type

PCIe Gen 2.1

PCIe 3.0

Not Available

PCIe M.2

NC Sideband Interface

Not Available

Yes

Not Available

Jumbo Frames Supported

Yes

Not Available

1000Base-T

Yes

Not Available

IEEE 1588

Supported

Not Available

Supported

Not Available

Supported Under vPro

Not Available

Supported

Disclaimers

Model

i210-T1

Dual Port Copper= I350-T2V2
Dual Port LC-Fiber= I350-F2

Dual Port Copper= I350-T4 V2
Dual Port LC-Fiber= I350-F4

Dual Port Copper= X540-T2

X710-DA2

AC 7260 NGW

AC 8265 NGW

Connector

RJ-45 Copper

2 x Ports RJ-45 Copper or 2 x Ports LC-Fiber

4 x Ports RJ-45 Copper or 4 x Ports LC-Fiber

2 x Ports RJ-45 Copper

2 x SFPs Receptable

2 x Antennas

Website

i210 T1

i350 T2/F2

i350 T4/F4

x540 T2

x710 DA2

7260 NGW

8265 NGW

IEEE* 802.3* Auto-negotiaton

Not Available

Intel® vPro™

Not Available

Supported

Intel® Standard Manageablity

Supported

Not Available

Power Optimizer Platform Low-power Management Systems

Supported

Energy Efficient Ethernet

Supported

Not Available

Supported

Not Available

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Not Available

Receive Side Scaling

Supported

Not Available

Dual Tx and Rx Queues

Yes

Not Available

Jumbo Frames (up to 9KB)

Supported

Not Available

Supported

Not Available

Teaming

Supported

Not Available

Wake from Deep Sx

Supported

Not Available

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2003, 2008; RHEL 4, Linux/SLES 11, Vmware

Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x

Not Available

Network Proxy/ARP Support

Supported

Not Available

Disclaimers

Description

9-in-1 (USB 2.0)

Disclaimers

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery With Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and Power management Interface)

Advanced Configuration and Power Interface v6.1

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cmÂ²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

EMC & Safety

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Energy Star

ENERGY STAR® v7.0

EPEAT

EPEAT® Silver Certification Available on Select Models

Greenguard

RoHS

RoHS Compliant

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification

9.0

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

Table of Contents

P7

Product Information

CPU

Operating Systems

Memory

Storage

Video

Slots

Front I/O

Rear I/O

Ethernet

Audio

Thermal

Power Specifications

BIOS

Chassis Information

Packaging Dimensions

Security & Serviceability

Operating Environment

Motherboard Core

Supported Components

Storage

RAID

Keyboard and Pointing Devices

Expansion Bays

PCIe Adapters

CPU Specifications

HDD Specifications

Solid State Storage Specifications

HDD Controllers

Optical Drive Specifications

Integrated Graphics Adapter

Discrete Graphics Adapter

Ethernet Specifications

Ethernet Specifications Continued

Media Card Reader

BIOS Specifications

Industry Standard Specification Support

Social and Environmental Responsibility

Safety, EMC Connection to the Telephone Network and Labeling

Regulations & Standards

Environmentals