Lenovo ThinkStation: PCs & Tablets
P16 Gen 3
Version: 1.0 | 10/16/2025
Datasheet Specs
Product Display Name
ThinkPad P16 Gen 3
Information Date
Sept 5 2025
Description
The Lenovo ThinkPad P16 is the ultimate mobile workstation for professionals who demand superior performance, reliability, and innovation. With a new, thinner, and lighter chassis design, it serves as a powerful desktop replacement while offering enhanced portability and usability.
Processor Support
Intel Core Ultra Series 2 – HX-Series (45W) Core 5, 7, and 9
Socket Type
BGA
Preloaded
Windows 11 Pro 64-bit (24H2)
Windows 11 Home 64-bit
Windows 11 Home Single Language 64-bit
Windows 11 Home Chinese Language Edition 64-bit
Ubuntu Linux 64-bit (Version 24.04)
Fedora 40 Linux (depending on NVIDIA open source driver status)
No Operating System
Supported
Ubuntu Linux 24.04 Cert only
Red Hat Enterprise Linux (RHEL) 10.0 (depending on NVIDIA open source driver status)
Number of DIMM Slots
Up to 4 Slots
Channels
Single Channel w/ 1 DIMM
Dual Channel w/ 2-4 DIMMs
Type
DDR5 SoDIMM ECC and non-ECC
ECC Support
Yes (16GB and 32GB SoDIMMs only)
Speed
Native: Up to 5600MT/s
Actual: Up to 4800MT/s
Max DIMM Size
48GB
Max System Memory
192GB (non-ECC)
128GB (ECC)
Min System Memory
16GB
Soldered Memory
None
Storage Slots
3x M.2 2280
SATA
No
PCIe
Solid State Drive, 2x OPAL2 PCIe NVMe M.2 – TLC
SAS
No
Interface
PCIe Gen 5 Performance or Gen 4 Value
Security
OPAL2 for NVMe SSD
Optional Hard Disk Drive Controllers
No
Disclaimers
Triple slot storage is available with all CPU & GPU options
Integrated Graphics
Processor Graphics Intel® Arc Pro Graphics
Utilized via “Hybrid Mode” in BIOS
Discrete Graphics
NV RTX PRO 1000 Blackwell, 2000 Blackwell, 3000 Blackwell,
4000 Blackwell, 5000 Blackwell
Adapter
None
Bus Interface
PCI Express 5.0
Resolutions
WUXGA (FHD+) / WQUXGA (UHD+) / 3.2k T-OLED Touch
Resolution
5MP RGB Camera or 5MP RGB + IR Hybrid Camera
Frames per Second
30 fps
Focus
Fixed 50cm
Camera Interface
USB
IR Camera
Yes
Number of Keys
US : 105 / UK : 106 / JP : 110
Numpad
Yes
Size
100% ISO
Function Key Features
Yes
Backlit
Yes
Keyboard size
CS25 KYB with numberpad
Key stroke
1.5mm
Key pitch
19.05mm
Keyboard backlight
Yes
Keyboard thickness
4.0mm
TrackPoint Details
CS22 TL TrackPoint (t=4.8mm)
Finger Print Reader Model
3.24 MoC Black Round FoP
Multi-Touch
Yes
Resolution
n/a
TouchPad/Trackpad thickness
3.6mm
TouchPad/Trackpad type
TrackPad
Trackpad size
115mm x 67.6mm
Trackpad material/finish
Glass like mylar surface
USB
2x USB-A (10Gbps)
Thunderbolt
1x USB-C (Thunderbolt™ 4)
2x USB-C (Thunderbolt™ 5)
HDMI
1x HDMI 2.1
Audio Combo Jack
1x Microphone & Headphone Combo Jack (3.5mm)
Media Card Reader
Dedicated SD Express 8.0 Card Reader (Backwards compatible with UHS-I & UHS-II) (MMC,SD,SDHC SDXC)
Smart Card Reader
Yes (optional)
Power Connector
DC-In via USB-C® (Thunderbolt™ 5) PD 3.1
Docking Port
Docking Via USB-C® (Thunderbolt™ 5) PD 3.1
VirtualLink
None
Network adapter
Full size 2.5Gbps RJ-45 port
Disclaimers
HDMI 2.1: Up to 8K/60Hz
Main
DC-In via USB-C® (Thunderbolt™ 5) PD 3.1
USB-C
see above
Disclaimers
normal charge via 140W and fast charge via 180W charger
Vendor
Intel
Count
1
EEPROM
16Mb SPI ROM
Speeds
2.5Gbps
Functions
Ethernet Connection I226
Connectors
Full size 2.5Gbps RJ-45 port
Model
5G: Rolling Wireless RW350R-GL 5G sub-6GHz CAT19/CAT18
Disclaimers
WWAN support country dependent
Model
Foxconn NXP NPC300 NFC
Vendor
Cirrus
Type
Soundwire Audio
Internal Speaker
2 channel
Connectors
Microphone & Headphone Combo Jack (3.5mm)
Chipset
Cirrus Logic Codec: CS42L43, Smart AMP: CS35L56
Number of Channels
2-channel DAC, 2-channel ADC, 2-channel Class D
Number of Bits/Audio Resolution
24bit / PCM-format
Sampling Rate (Recording/Playback)
Recording:48000Hz / Playback:48000Hz
Signal to Noise Ratio
Mic In: 90dB FSA
Headphone Out@32ohm: 97dB FSA
Analog Audio
None
Dolby Digital
Dolby ATMOS
Digital Out (S/PDIF)
No
Speaker Power Rating
2W@4ohm/ch
Type
180W Type-C PD 3.1 EPR
AC Adapter
Dimensions
(139.5 x 69 x 22mm)
Weight
Max 430g
Input Voltage
100-240V
TPM
Version 2.0
Asset ID
Yes
vPro
Intel vPro for WS
Format
16″ Clamshell
Color & Material
Black
Aluminum
Thermal Solutions
Internal Dual Fan, Flex Cooling, Intelligent Cooling, Dual by-pass design
Dimensions
Length
14.25 inches
362 millimeters
Width
9.92 inches
252 millimeters
Height
0.62 (front) / 0.82 (rear), 1.17 (max) inches
15.8 (front) / 20.9 (rear), 29.8 (max) millimeters
Weight
5.6lbs/2.54kg
Height (mm)
330
Height (inch)
12.992
Width (mm)
510
Width (inch)
20.079
Depth (mm)
96
Depth (inch)
3.78
Weight (kgs)
start from 4.03 kg
Weight (lbs)
start from 8.866 lbs
Hardware Maintenance Manual
P16 Gen 3 HMM
Drivers & Software
P16 Gen 3 Drivers & Software
Self Healing BIOS
Yes
Access Panel
Removeable bottom cover
Number of Screws
23 Total
1.D cover with screw->9PCS
2.Battery with screw->4PCS
3.SSD Gen5 BKT with screw->1PCS + C SSD BKT assy with screw-> 4PCS
4.SSD Gen4 CRU mylar with screw->2PCS
5.WWAN BKT with screw->1PCS+ C WWAN BKT assy with screw->2PCS
Swappable Components
Bottom cover, battery, M.2 Solid State Drive, SoDIMM memory module, WWAN module, SIM tray, keyboard, RTC battery
Storage Slots
3 slots
Memory
4 slots
System Board
FR4 & HDI (GPU B1)
Restore CD/DVD/USB Set
None, Restore Media available via Lenovo Customer Support Center
Cable Lock Support
Security-lock slot, Optional Kensington Cable Lock
Power-On Password
Yes
Hard Disk Password
Yes; User and Master hard disk password
Supervisor Password
Yes
NIC LEDs (integrated)
Yes
Security Chip
Yes (for TMP 2.0)
Access Panel Key Lock
Bottom Cover Tamper Detection
Boot Sequence Control
Yes
Operating – Air Temperature
Meet MIL810G
At altitude 15,000 feet for 1 hour
43°C for 2hrs
-21°C for 2hrs
Non Operating – Air Temperature
Meet MIL810G
At altitude 15,000 feet for 1 hour
63°C for 4hrs
-25°C for 24hrs
Humidity
Meet MIL810G
95% RH, 30~60C, 24hrs*10cycles
Corrosive Gas
G1
Particulates
P1
Processor
Intel® Core™ Ultra 5 245HX processor (E-cores up to 4.5 GHz P-cores up to 5.1 GHz)
Intel® Core™ Ultra 7 255HX processor (E-cores up to 4.5 GHz P-cores up to 5.2 GHz)
Intel® Core™ Ultra 7 265HX processor (E-cores up to 4.6 GHz P-cores up to 5.3 GHz)
Intel® Core™ Ultra 9 275HX processor (E-cores up to 4.6 GHz P-cores up to 5.4 GHz)
Intel® Core™ Ultra 9 285HX processor (E-cores up to 4.6 GHz P-cores up to 5.5 GHz)
Memory Support
DDR5 SoDIMM ECC/non-ECC
Native: 5600MT/s
Actual: 4800MT/s
Chipset (PCH)
Mobile Intel® HM880 Chipset
Size of BIOS Flash
64MB
Super I/O
None
Clock
Crystal
Audio
Dolby Atmos
Ethernet
Full size 2.5Gbps RJ-45 port
System Capacity Options
16GB (16GB*1 or 8GB*2)
32GB (32GB*1 or 16GB*2 or 8GB*4)
48GB (42GB*1)
64GB (32GB*2 or 16GB*4)
96GB (48GB*2)
128GB (32GB*4)
192GB (48GB*4)
Memory Types
8GB DDR5 5600MT/s SoDIMM non-ECC
16GB DDR5 5600MT/s SoDIMM non-ECC
32GB DDR5 5600MT/s SoDIMM non-ECC
48GB DDR5 5600MT/s SoDIMM non-ECC
16GB DDR5 5600MT/s SoDIMM ECC
32GB DDR5 5600MT/s SoDIMM ECC
Brand of Memory
Samsung
Micron
SK Hynix
Ramaxel
Memory clock frequency(MHz)
Native: 5600MT/s, Operational: 4800MT/s
2.5″ SAS Hard Disk Drive (HDD)
None
2.5″ SATA Hard Disk Drive (HDD)
None
2.5″ SATA Solid State Drive (SSD)
None
M.2 (NGFF) PCIe Solid State Drive (SSD)
256GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
4TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2.5″ PCIe Solid State Drive (SSD)
None
Brand of Drive
Samsung
Union Memory
SanDisk
Micron
Hynix
Intel Optane Storage Technology
None
RAID
Optional, Selectable in BIOS
RAID Level and Requirements
RAID-0/1/5
Media Card Reader Specifications
SD Express 8.0
Disclaimers
Backwards compatible with UHS-I and UHS-II
CPU
Intel® Core™ Ultra 5 245HX processor (E-cores up to 4.5 GHz P-cores up to 5.1 GHz)
Intel® Core™ Ultra 7 255HX processor (E-cores up to 4.5 GHz P-cores up to 5.2 GHz)
Intel® Core™ Ultra 7 265HX processor (E-cores up to 4.6 GHz P-cores up to 5.3 GHz)
Intel® Core™ Ultra 9 275HX processor (E-cores up to 4.6 GHz P-cores up to 5.4 GHz)
Intel® Core™ Ultra 9 285HX processor (E-cores up to 4.6 GHz P-cores up to 5.5 GHz)
Integrated Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
# of Cores
4 P-cores and 8 E-cores
8 P-cores and 12 E-cores
8 P-cores and 12 E-cores
8 P-cores and 16 E-cores
8 P-cores and 16 E-cores
# of Threads
14
20
20
24
24
Processor Base Frequency
E-cores up to 2.6 GHz / P-cores up to 3.1 GHz
E-cores up to 1.8 GHz / P-cores up to 2.4 GHz
E-cores up to 2.3 GHz / P-cores up to 2.6 GHz
E-cores up to 2.1 GHz / P-cores up to 2.7 GHz
E-cores up to 2.1 GHz / P-cores up to 2.8 GHz
Max Turbo Frequency
E-cores up to 4.5 GHz / P-cores up to 5.1 GHz
E-cores up to 4.5 GHz / P-cores up to 5.2 GHz
E-cores up to 4.6 GHz / P-cores up to 5.3 GHz
E-cores up to 4.6 GHz / P-cores up to 5.4 GHz
E-cores up to 4.6 GHz / P-cores up to 5.5 GHz
Cache
24 MB
30 MB
30 MB
36 MB
36 MB
TDP
45 W
45 W
45 W
45 W
45 W
Model
WUXGA IPS Non-Touch, Low Power
WQUXGA IPS Non-Touch
3.2k Tandem-OLED Touch
Resolution
FHD+ (1920 x 1200)
UHD+ (3840 x 2400)
3.2k (3200 x 2000)
Diagonal
16″
16″
16″
Aspect Ratio
16:10
16:10
16:10
Backlight
LED
LED
N/A
PPI
142
283
236
Active Area
FHD+: 344.68mm x 215.42mm
UHD+: 344.678mm x 215.424mm
3.2k: 344.448mm x 215.280mm
Refresh Rate
Max 60Hz
Max 60Hz
40-120Hz VRR
Contrast Ratio
FHD+: 1200:1
UHD+: 1500:1
3.2k: 100,000:1
Viewing Angle (*1)
FHD+: 89/89/89/89 degree
UHD+: 85/85/85/85 degree
3.2k: 85/85/85/85 degree
Color gamut
100% sRGB
100% DCI-P3
100% DCI-P3
Brightness
500 nits
800 nits
SDR 600 nits / HDR 1500 nits
HDR
N/A
HDR400
Dolby Vision
HDR600
Dolby Vision
Color Depth
FHD+: 16.7M (8-bit)
UHD+: 1064M (8-bit + 2 FRC)
3.2k: 1074M (8-bit + 2 FRC)
Interface
FHD+: eDP 1.4b
UHD+: eDP 1.4b
3.2k: eDP 1.4b
Panel ID Recognition
EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
Weight
320g max
330g max
199g max
Color Calibrator
X-Rite Factory Color Calibration
X-Rite Factory Color Calibration
X-Rite Factory Color Calibration
Panel Technology
IPS, Anti-Glare
IPS, Anti-Glare
Tandem-OLED, AGARAS
Touch Panel
None
None
Multi-Finger Touch Panel
2.5″ SATA Solid State Drive (SSD)
N/A
M.2 (NGFF) PCIe Solid State Drive (SSD)
3x M.2 2280-S3 PCIe
2.5″ PCIe Solid State Drive (SSD)
N/A
Intel Optane Storage Technology
N/A
Supported Types
M.2
M.2
Dimensions inches/centimeters (W x D x H)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
Size
M.2 2280-S3
M.2 2280-S3
Interface Type
PCIe NVMe
PCIe NVMe
Read/Write IOPS Specifications
Read: 600K (1TB), 450K (512GB), 250K (256GB)
Write: 500K (1TB,512GB), 400K (256GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.
Read: 1500K (4TB/2TB), 1200K (1TB), 1000K (512GB)
Write: 1500K (4TB/2TB/1TB), 1200K (512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.
Bandwidth Performance
PCIe Gen4x4 Value – 256GB-1TB
PCIe Gen5x4 Performance – 512GB-4TB
Power Consumption (Max)
3.0A (duration for 10 us)
4.5A (duration for 10 us)
Active(AVG)
5W
10W
Idle
5mW (L1.2)
5mW (L1.2)
Min MTBF
2,000,000 (h)
2,000,000 (h)
Min Sequential Read
5000MB/s (1TB), 4800MB/s (512GB), 4000MB/s (256GB)
14000MB/s (4TB/2TB/1TB), 11000MB/s (512GB)
Min Sequential Write
4000MB/s (1TB/512GB), 2000MB/s (256GB)
12000MB/s (4TB/2TB), 11000MB/s (1TB), 5500MB/s (512GB)
Hardware Encryption
OPAL
OPAL
Laptop GPUs
NVIDIA RTX PRO 1000 Blackwell Laptop GPU
NVIDIA RTX PRO 2000 Blackwell Laptop GPU
NVIDIA RTX PRO 3000 Blackwell Laptop GPU
NVIDIA RTX PRO 4000 Blackwell Laptop GPU
NVIDIA RTX PRO 5000 Blackwell Laptop GPU
NVIDIA CUDA Processing Cores
2560
3328
5888
7680
10496
NVIDIA RT Cores
4th Gen
4th Gen
4th Gen
4th Gen
4th Gen
Tensor Cores
5th Gen
5th Gen
5th Gen
5th Gen
5th Gen
GPU Memory
8GB
8GB
12GB
16GB
24GB
Peak Memory Bandwidth
384 GB/s
384 GB/s
672 GB/s
896 GB/s
896 GB/s
Memory Type
GDDR7
GDDR7
GDDR7
GDDR7
GDDR7
Memory Interface
128-bit
128-bit
192-bit
256-bit
256-bit
DisplayPort
2.1b
2.1b
2.1b
2.1b
2.1b
Open GL
4.6
4.6
4.6
4.6
4.6
Shader Model
7
7
7
7
7
DirectX
12 Ultimate
12 Ultimate
12 Ultimate
12 Ultimate
12 Ultimate
PCIe Generation
5
5
5
5
5
Single Precision Floating-Point Performance
13.6
17.7
29.1
38.7
49.8
Tensor Performance
193
231.6
231.6
231.6
231.6
NVIDIA FXAA/TXAA Anti-Aliasing
Yes
Yes
Yes
Yes
Yes
NVIDIA RTX Desktop Manager
No
No
No
No
No
Vulkan Support
Yes
Yes
Yes
Yes
Yes
NVIDIA Optimus
Yes
Yes
Yes
Yes
Yes
NVIDIA Max-Q Technology
Yes
Yes
Yes
Yes
Yes
NVENC/NVDEC
Yes
Yes
Yes
Yes
Yes
Model
Intel Wi-Fi 7 BE200 (Gale Peak 2) + BT5.4 (HW Ready)
Connector: Main, Aux/GNSS, GNSS
ANT1:Wi-Fi+Bluetooth ; ANT2:Wi-Fi
Antenna Diversity
Supported
MIMO
Supported
GNSS Bian
N/A
Radio ON/OFF Control
Supported
Connector interface
M.2 PCIe + USB
Operating Temperature (Adapter Shield)
0c to +50c
Humidity Non-Operating
50%~90% Rh non condensing (at temperatures of 25c to 35c)
Operating Systems
Microsoft Windows 11, Linux
Wi-Fi Alliance
n/a
IEEE WLAN Standard
IEEE 802.11a/b/g/n/ac/ax/be
Roaming
Support seamless roaming between access points
Bluetooth*
Bluetooth 5.4
Authentication Protocols
802.1X EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 -MSCHAPv2
(EAP-SIM, EAP-AKA, EAP-AKA’)
Encryption
128-bit AES-CCMP, 256-bit AES-GCMP
Regulatory
For a list of country approvals, please contact your local Intel representatives.
US Government
FIPS 140-2
Product Safety
UL,C-UL,CB (IEC62368-1)
Disclaimers
1) 6GHz channel of Wi-Fi 6E is only available with Windows 11
2) Bluetooth may be limited by OS
Dimension
L: 310mm*W: 44.5mm*T 12.7mm
Weight
Max 365g
Type (Chemistry and Cell)
Li-Polymer (4S1P), 4-cell
Voltage
15.6 V
Battery Capacity
99.9Wh
Charging Time
On Charge Time (0- 100%) * 113min
Off Charge Time (0 – 80%) ** 57 min
Off Charge Time (0 – 100%) ** 109 min
Operating Temperature Range
between 10°C (50°F) and 35°C (95°F)
Warranty
1 Year / 3 Year Available
Coin Cell Battery (Model)
CR2032
WMI Support
Yes, if it is BIOS Setup change by WMI.
ROM-Based Setup Utility (F1)
Yes
Bootblock Recovery
Support NIST
Replicated Setup
Yes, it supported with SRSETUP tool.
Boot Control
Yes, it means Boot order change.
Discrete Mode
Support Discrete Mode
Memory Change Alert
N/A
Thermal Alert
N/A
Asset Tag
Yes
System/Emergency ROM Flash Recovery with Video
N/A
Remote Wakeup/Remote Shutdown
Only support WOL when system is connected with Dock.
Keyboard-less Operation
N/A
Per-port Control
Yes, if it is I/O port enable/disable by BIOS Setup.
Adaptive Cooling
Yes, if it is thermal & fan control.
Security
Yes, BIOS password / Hard disk password / Finger print
Intel(R) AMT (includes ASF 2.0)
Yes. If you select vPro model
Intel(R) TXT
Yes. If you select vPro model
Memory Modes
N/A
UEFI
UEFI 2.9A
EMC
Published, Certified Existing Reports
EMC – Australia
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam
Safety
To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com
Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard
Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho
Energy Star
ENERGY STAR® Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov
EPEAT
EPEAT Gold Certification Available on select models
IT ECO declaration
The latest environmental information about Lenovo products is available at: https://www.lenovo.com/us/en/compliance/eco-declaration/
Hazardous Substances
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
https://www.lenovo.com/content/dam/lenovo/site-design/esg-document-library/global/corp-policies/materials/Lenovo_Commitment_to_RoHS.pdf
Industry Standard Specifications
This product meets the following industry standard specifications for manageability functionality:
Remote Manageability Software Solutions
Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)
System Software Manager
Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Service, Support, and Warranty
On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
Materials Used
50% Recycled Aluminum A Cover
90% Recycled Magnesium Aluminum C Cover
55% Recycled Aluminum D Cover
85% PCC Plastic Key Caps (non-Black Keyboard)
90% PCC Plastic Speaker Enclosure
97% PCC Plastic Battery Pack Enclosure
90% PCC Plastic 180W Slim AC Adapter
Low Temperature Solder (SSD, fingerprint reader module, FHD+ panel)
Plastic free packaging with 90% recycled and/or FSC certified content
(standard/bulk)
TCO Certification
TCO 10.0
Disclaimers
1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material
