P3 Tiny Gen 2

Product Name

P3 Tiny Gen 2

Product Display Name

ThinkStation P3 Tiny Gen 2

Information Date

11-Jun-25

Hardware Maintenance Manual

TBD

Drivers & Software

TBD

Available Whitepapers

TBD

Description

Engineered to go where others cant, the Lenovo ThinkStation P3 Tiny Gen 2 offers uncompromising performance in a form factor that is 96% smaller than a traditional desktop. At only one liter in total volume, the industrys smallest workstation combines the power of Intel Core Ultra processors (Series 2) and NVIDIA RTX graphics in a simple, efficient design.

Processor Support

Intel Arrow Lake-S Series

Socket Type

Socket-V (LGA 1851)

Preloaded

Windows 11 Pro 64-bit
Windows 11 Home 64-bit
Windows 11 IOT LTSC
Ubuntu 24.04 LTS

Supported

Red Hat Enterprise Linux
Ubuntu 24.04 LTS

Slots

2

Channels

Supports up to 2 DIMM Sockets, 2 Channels

Type

DDR5 ECC and non-ECC CSODIMM
DDR5 ECC and non-ECC SODIMM

ECC Support

Yes, CPU Dependent

Speed

Up to 6400MT/s CSODIMM
Up to 5600MT/s SODIMM

Max DIMM Size

64GB DDR5 CSODIMM
48GB DDR5 SODIMM

Max System Memory

128GB

Disclaimers

*Memory speed impacted by number and type of DIMMs installed.
*Memory speed can be dependent on the individual CPU capabilities.

PCIe

1 x M.2 2280 PCIe Connector, Gen 5 Onboard (from CPU)
1 x M.2 2280 PCIe Connector, Gen 4 Onboard (from PCH)
1 x M.2 2280 PCIe Connector, Gen 4 Onboard (from PCH)

Integrated Graphics

Intel Graphics (CPU dependent)

Discrete Graphics

Nvidia RTX A400 (miniDP x4) – 4GB GDDR6, PCIe4, Single-Slot
Nvidia RTX A1000 (miniDP x4) – 8GB GDDR6, PCIe4, Single-Slot

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x8 Gen 4 Routed From CPU

Slot 1

PCIe 4.0 x8, Half Height, Half Length, 50W, With Latch

USB

2 x USB-A 3.2 Gen 2 (10Gb/s) – one supports 2.1A charging
1 x USB-C 3.2 Gen 2 (20Gb/s)

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Actual USB throughput will vary depending on the type and quantity of USB devices used.

USB

3 x USB-A 3.2 Gen 2 (10Gb/s)
1 x USB-A 3.2 Gen 1 (5Gb/s)

DisplayPort

1 x Standard DP 1.4
Optional 2 x DP 1.2 (Config dependent), via flexible I/O port card

HDMI

1 x Standard HDMI 2.1
Optional 2 x HDMI 2.0 (Config dependent), via flexible I/O port card
Optional 2 x HDMI 2.1 (Config dependent), via flexible I/O port card

Type-C

Optional 1 x USB-C 3.1 Gen 1 (Config dependent), via flexible I/O port card

VGA Port

Optional 2 x VGA Port (Config dependent), via flexible I/O port card

Serial Port

Optional 2 x Serial Port (Config dependent), via flexible I/O port card
Optional 1 x Serial Port Expansion PCIe x1 Adapter

Ethernet

1 x Standard
Optional 2 x 2.5G LAN Port (Config dependent), via flexible I/O port card

Optional USB Adapter

Dual USB-A 3.2 Gen 1 (CPU dependent), via flexible I/O card
Quad USB-A 3.2 Gen 1 (CPU dependent), via flexible I/O card

Optional Network Adapter

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Broadcom 5720 Dual Port Gigabit Ethernet Adapter
Broadcom 5719 Quad Port Gigabit Ethernet Adapter
Intel Gale Peak 2 BE200 WIFI7 + Bluetooth 5 PCIe Adapter

Disclaimers

Actual USB throughout will vary depending on the type and quantity of USB devices used.

Vendor

Intel Jacksonville I219-LM (w/ AMT 16.x)

Speeds

10/100/1000 Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Vendor

Realtek

Type

Integrated Audio

Internal Speaker

Yes, 1.5W

Connectors

Mic + Headphone combo jack

Chipset

ALC233VB

Number of Channels

2

Number of Bits/Audio Resolution

2 channels of DAC support 24-bit PCM format
2 stereo of ADC support 16-bit PCM format

Temp Sensors

Ambient Sensor

Fans

1 x CPU Fans

Power Supply

170W

230W

300W

330W

Power Efficiency

90% Efficient @ 50% Load

Operating Voltage Range

100 – 240V

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

2.5A

3.5A

4.5A

Graphics

No

Power Supply Fan

No

ENERGY STAR Qualified (config dependent)

Yes

Aux Power Drop

No

Vendor

AMI

Self-Healing BIOS

Yes

Color

Raven Black

PSU

170W, 230W, 300W, and 330W Available, Autosensing

Thermal Solutions

One System Fan Standard

Dimensions

37mm / 1.5″ H
182mm / 7.2″ D
179mm / 7.0″ W

Weight

1.4kg / 3lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Height (mm/in)

141mm / 5.6″

Width (mm/in)

268mm / 10.6″

Depth (mm/in)

490mm / 19.3″

Weight (kgs/lbs)

2.8kg / 6 lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

TPM

Infineon SLB9672, FW 15.23, TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 16.x)

Cable Lock Support

Yes, Standard

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Optional via External ODD Box

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Air Temperature

Operating: 5_ – 35_ (41F to 95F)

Storage

Storage: -40_C to 60_C (-40_F to 140_F) in Original Shipping Carton
Storage: -10_C to 60_C (14_F to 140_F) Without Carton

Humidity

Relative Humidity Operating: 20% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25_C (77_F) max
Wet Bulb Temperature Non-operating: 40_C (104_F) max

Altitude

Operating: 0m to 3048m (0ft to 10000ft)
Storage: 0m to 12,192m (0ft to 40000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min
Operating Vibration:
Random,0.27G at 5-500 Hz, 0.5 octave/min
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min

Shock

Operating Shock: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)
Rack Operation Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)
Non-operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Disclaimers

Extended operating temperatures are possible – please contact your Lenovo Rep

Board Size

6.7″ x 6.9″ (171mm x 175mm)

Layout

Custom ATX

Processor Support

Intel Arrow Lake-S Series

Socket Type

Socket-V (LGA 1851)

Memory Support

DDR5 up to 6400MHz CSODIMM Memory (non-ECC)
DDR5 up to 5600MHz SODIMM Memory (non-ECC)

Voltage Regulator

65W TDP Capable

Chipset (PCH)

Intel W880 Chipset

Flash

1 x 64MB

Super I/O

IT5652E

Clock

Intel Native isCLK

Audio

Realtek ALC233VB Codec

Ethernet

Intel Jacksonville I219-LM

Processor Level

Intel Arrow Lake

Processor

Intel Ultra 7 265
Intel Ultra 7 265T
Intel Ultra 5 245
Intel Ultra 5 245T
Intel Ultra 5 235
Intel Ultra 5 235T
Intel Ultra 5 225
Intel Ultra 5 225T

Memory Type

CSODIMM 6400 MHz / SODIMM 5600 MHz

Memory

8GB 6400MHz DDR5 non-ECC CSODIMM
16GB 6400MHz DDR5 non-ECC CSODIMM
32GB 6400MHz DDR5 non-ECC CSODIMM
64GB 6400MHz DDR5 non-ECC CSODIMM
8GB 5600MHz DDR5 ECC SODIMM
16GB 5600MHz DDR5 ECC SODIMM
32GB 5600MHz DDR5 ECC SODIMM
48GB 5600MHz DDR5 ECC SODIMM

Disclaimers

*Memory speed dependent on CPU support.

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe SSD, Gen 5 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 5 x4, NVMe OPAL
2048GB M.2 PCIe SSD, Gen 5 x4, NVMe OPAL
256GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

RAID Levels and Requirements

NVMe Drives Support RAID 0/1/5

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

DVD-ROM Drive

Optional via External ODD Box – Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Optional via External ODD Box – Slim DVD Burner/CD-RW Drive

Keyboard

AI Traditional USB Keyboard
AI Calliope USB Keyboard
AI EOS Wireless Keyboard

Pointing Devices

Calliope USB Mouse

Network

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Broadcom 5720 NetXtreme PCIe 1Gb 2-port RJ45 Ethernet Adapter
Broadcom 5719 NetXtreme PCIe 1Gb 4-port RJ45 Ethernet Adapter

WiFi Cards

Intel Gale Peak 2 BE200 WIFI7 + Bluetooth 5.4 PCIe

Parallel Card

4-Port Serial Expansion Card PCIe x1

CPU

Intel Ultra 9 285T 1.4GHz/24C/24T/36M 35W

Intel Ultra 9 285 2.5GHz/24C/24T/36M 65W

Intel Ultra 7 265T 1.5GHz/20C/20T/30M 35W

Intel Ultra 7 265 2.4GHz/20C/20T/30M 65W

Intel Ultra 5 245T 2.2GHz/14C/14T/24M 35W

# of Cores

24C

20C

14C

# of Threads

24T

20T

14T

Processor Base Frequency

1.4 GHz

2.5GHz

1.5GHz

2.4GHz

2.2GHz

Max Turbo Frequency

5.4GHz

5.6GHz

5.3GHz

5.1GHz

Cache

36M

30M

24M

TDP

35W

65W

35W

65W

35W

CPU

Intel Ultra 5 245 3.5GHz/14C/14T/24M 65W

Intel Ultra 5 235T 2.2GHz/14C/14T/24M 35W

Intel Ultra 5 235 3.4GHz/14C/14T/24M 65W

Intel Ultra 5 225T 2.5GHz/10C/10T/20M 35W

Intel Ultra 5 225 3.3GHz/10C/10T/20M 65W

# of Cores

14C

10C

# of Threads

14T

10T

Processor Base Frequency

3.5GHz

2.2GHz

3.4GHz

2.5GHz

3.3GHz

Max Turbo Frequency

5.1GHz

5.0GHz

4.9GHz

Cache

24M

20M

TDP

65W

35W

65W

35W

65W

Drive

NVMe 2280 M.2 512GB Gen5 PCIe SSD (OPAL)

NVMe 2280 M.2 1TB Gen5 PCIe SSD (OPAL)

NVMe 2280 M.2 2TB Gen5 PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22x80x2.38mm

Interface Type

PCIe Gen 5×4

Power Active (AVG)

10W

Power Idle

50mW

Typical Sequential Read

13000 MB/s

13800 MB/s

Typical Sequential Write

6000 MB/s

11000 MB/s

12000 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

1400K IOPS

2200K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

1600K IOPS

1700K IOPS

Operating Temperature Range

0 to 70C

Endurance Rating (Lifetime Writes)

150 TB

300 TB

600 TB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

Drive

NVMe 2280 M.2 256GB Gen4 PCIe SSD (OPAL)

NVMe 2280 M.2 512GB Gen4 PCIe SSD (OPAL)

NVMe 2280 M.2 1TB Gen4 PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22x80x2.38mm

Interface Type

PCIe Gen 4×4

Power Active (AVG)

5.8W

Power Idle

35mW

Typical Sequential Read

5500 MB/s

6900 MB/s

Typical Sequential Write

3000 MB/s

6200 MB/s

6800 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

600K IOPS

660K IOPS

680K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

650K IOPS

600K IOPS

Operating Temperature Range

0 to 70C

Endurance Rating (Lifetime Writes)

75 TB

150 TB

300 TB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

Type

Intel Graphics

Display Interface

1x DP 1.2, 1x HDMI 2.0

Video Resolution (max)

4096×2304 @ 60Hz (DP) ,4096×2160@60Hz (HDMI)

Adapter

Nvidia RTX A1000(miniDP x4) – 8GB GDDR6

Nvidia RTX A400(miniDP x4) – 4GB GDDR6

Bus Interface

PCI Express 4.0 _8

Display Interface

Four mini-DisplayPort connectors

Memory Clock Frequency (MHz)

6001MHz

Memory Size

8GB

4GB

Memory Interface

128bit

64bit

Memory Bandwidth

Up to 192GB/s

Up to 96GB/s

GPU Core Frequency (MHz)

Base:727 MHz
Boost:1462 MHz
Max Boost:2100 MHz

Base:1417 MHz
Boost:1762 MHz
Max Boost:2100 MHz

Maximum Power Consumption

50W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
7680 _ 4320 _ 24 bpp at 120 Hz
7680 _ 4320 _ 36 bpp at 60 Hz
5120 _ 3200 _ 24 bpp at 60 Hz
Up to four simultaneous displays

Thermal Solution

Active

Dimension

2.713 inches _ 6.463 inches, single-slot

Card

Intel Wi-Fi 7 BE200 PCIE M.2 module

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Supplier PN

BE200.NGWG, MM# 99C462

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Data Rates Supported

2.4G/5G/6G

10/100/1000Mbps (Copper)

Controller Details

Intel Wi-Fi 7 BE200

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Controller Bus Architecture

PCIe 2.1 (5GT/s)

Data Transfer Mode

WLAN

Ethernet

Power Consumption

M.2 power supply:
supply: 3.3V
worst case:
2000mA

Copper:
I350-T2 V2= 4.4W

Copper:
I350T4V2= 5W

IEEE Standards Compliance

IEEE 802.11 be
IEEE 802.11 a/b/d/e/g/h/i/k/n/r/u/v/w/ac/ax

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

Wireless Functionality inPre-boot Environment
WiFi UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

NA

Supported

Network Transfer Rate

NA

1,000Mbps Full Duplex

Operating System Driver Support

Windows11, Linux, Free BSD

Windows 10/11, Linux, Free BSD, XEN,Vmware

Manageability

Supported

Manageability Capabilities Alerting

Supported

Lithography

NA

TDP

NA

Firmware Based Thermal Management

Operating Temperature Range

0C to 50C

0C to 55C (32F to 131F)

# of Ports

NA

2

4

Data Rate Per Port

2×2

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

M.2: PCIe*, USB

PCIe Gen 2.1

NC Sideband Interface

Not Available

Jumbo Frames Supported

Yes

1000Base-T

NA

Yes

MACsec IEEE 802.1 AE

NA

IEEE 1588

NA

Supported

Supported Under vPro

Supported

Not Available

Model

Intel Wi-Fi 7 BE200 PCIE M.2 module

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Connector

RF cable

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Website

BE200

i350 T2

i350 T4

Auto-Negotiation

IEEE 802.11 be Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

Intel vPro

Supported

Not Available

Intel� Standard Manageablity

Supported

Power Optimizer Platform Low-power Management Systems

Supported

Energy Efficient Ethernet

Supported

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Receive Side Scaling

Supported

Dual Tx and Rx Queues

Yes

Jumbo Frames (up to 9KB)

Supported

Teaming

Supported

Wake from Deep Sx

Supported(S4)

Supported

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Network Proxy/ARP Support

Supported

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v5.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Energy Star

ENERGY STAR 9.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

Materials Used

System
35% PCC recycled plastic in Front and Rear Bezel
Packaging
Carton: 90% Recycled and/or FSC certified content3
Cushion: 90% Recycled EPE

TCO Certification

10.0

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

Table of Contents

SECTION I: Platform Overview

CPU

Operating Systems

Memory

Storage

Video

Slots

Front I/O

Rear I/O

Ethernet

Audio

Thermal

Power Specifications

BIOS

Chassis Information

Packaging Dimensions

Security & Serviceability

Operating Environment

SECTION II: Platform Detail

Motherboard Core

Supported Components

Storage

RAID

Optical Drive/Removable Media

Keyboard and Pointing Devices

PCIe Adapters

SECTION III: Supported Component Detail

CPU Specifications Part 1

CPU Specifications Part 2

Solid State Storage Specifications Part 1

Solid State Storage Specifications Part 2

Integrated Graphics Adapter

Discrete Graphics Adapter

Ethernet Specifications Group 1 Part 1

Ethernet Specifications Group 1 Part 2

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

Industry Standard Specification Support

Social and Environmental Responsibility

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Network and Labeling

Regulations & Standards

Environmentals