Lenovo ThinkStation: PCs & Tablets
P14s Gen 6 AMD
Version: 1.0 | 06/24/2025
Product Name
P14s Gen 6 AMD
Product Display Name
P14s Gen 6 AMD
Information Date
23-Apr-24
Description
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The Lenovo ThinkPad P14s Gen 6 AMD, our thinnest and lightest mobile workstation, offers premium performance with AMD Ryzen AI PRO 300 Series processors, enabling AIaccelerated productivity and seamless multitasking for professionals on the move.
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Processor Support
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AMD Krackan Point Ryzen AI 7 PRO 350 & Ryzen AI 5 PRO 340
AMD Strix Point Ryzen AI 9 HX PRO 370
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Socket Type
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BGA
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Disclaimers
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Preloaded
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Windows 11 Pro 64 (Win11 2024)
Windows 11 Home 64
Windows 11 Home Chinese Language Edition 64
Ubuntu
Fedora
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Supported
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Windows 11 Pro 64 (Win11 2024)
Windows 11 Home 64
Windows 11 Home Chinese Language Edition 64
Ubuntu
Fedora
Redhat
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Disclaimers
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Number of DIMM Slots
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2 SoDIMM slot
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Channels
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Quad 32b channels
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Type
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DDR5
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ECC Support
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No
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Speed
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5600MT/S
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Max DIMM Size
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48GB
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Max System Memory
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96GB
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Min System Memory
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16GB
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Soldered Memory
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NO
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Disclaimers
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Storage Slots
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1 x PCIe Gen 4 M.2 2280
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SATA
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/
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PCIe
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Solid State Drive, OPAL2 PCIe-NVMe Gen 4 M.2 2280- TLC
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SAS
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None
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Interface
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PCIe Gen 4
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Security
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PCIE
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Optional Hard Disk Drive Controllers
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OPAL2 for NVMe SSD
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Disclaimers
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Integrated Graphics
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AMD Radeon� 890M (Ryzen AI 9 HX PRO 370)
AMD Radeon� 860M (Ryzen AI 7 PRO 350)
AMD Radeon� 840M (Ryzen AI 5 PRO 340)
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Discrete Graphics
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N/A
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Adapter
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None
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Bus Interface
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NA
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Disclaimers
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Resolutions
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FHD+ _1920 x 1200_ / 2.8k OLED (2880 x 1800)
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Resolution
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5MP RGB+IR/ 5MP RGB
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Frames per Second
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30 fps
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Focus
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Fixed 50cm
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Camera Interface
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USB 2.0
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IR Camera
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Yes (optional)
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Number of Keys
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US : 84 / UK : 85 / JP : 89
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Numpad
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No
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Size
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100% ISO
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Function Key Features
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Yes
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Backlit
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Yes
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Keyboard size
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CS24 Top mount Shrunken 14″ KBD
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Key stroke
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1.5mm (normal keys), 1.35mm (Fn keys)
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Key pitch
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19.05mm
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Keyboard backlight
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Optional
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_
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Keyboard thickness
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4.0mm (General)
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TrackPoint Details
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COMO TrackPoint module (t5.5mm)
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Finger Print Reader Model
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Synaprics Metallica 8×8 FPR, MoC
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Multi-Touch
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Yes
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Resolution
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1000 ppi
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TrackPad/TouchPad thickness
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3.3mm
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TrackPad/TouchPad type
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3 BCP
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TrackPad size
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115mm x 61 mm
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TrackPad material/finish
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Mylar surface
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USB
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2x USB-A 3.2 (Gen 1) (1 powered)
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Thunderbolt
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2x USB-C (USB4.0, TBT4, DP2.0)
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HDMI
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1x HDMI 2.1 TMDS up to 4K/60Hz
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Audio Combo Jack
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1x Microphone & Headphone Combo Jack (3.5mm)
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Media Card Reader
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N/A
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Smart Card Reader
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Yes (optional)
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Power Connector
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DC-In
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Docking Port
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2x USB-C
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VirtualLink
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None
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Network adapter
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Gigabit Ethernet (RJ45)
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Disclaimers
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Main
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DC-In
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USB-C
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2x USB-C (USB4.0, TBT4, DP2.0)
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Disclaimers
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Vendor
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Realtek
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Count
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x1
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EEPROM
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SPI ROM (Merge with BIOS/MEFW)
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Speeds
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10/100/1000 Mbps
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Functions
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Wake On LAN
MAC Address Pass Through
PXE Boot
Flash Over LAN
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Connectors
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RJ45
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Disclaimers
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Model
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Optional :5G Module Quectel RM520N-G /Cat16 Quectel EM160R-GL GEN2
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Disclaimers
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Model
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Yes , optional
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Disclaimers
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Vendor
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Realtek
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Type
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High Definition Audio Codec
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Internal Speaker
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Yes, dual speakers
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Connectors
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Microphone & Headphone Combo Jack (3.5mm)
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Chipset
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ALC3287
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Number of Channels
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4-channel DAC, 4-channel ADC
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Number of Bits/Audio Resolution
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16/20/24-bit PCM format
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Sampling Rate (Recording/Playback)
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n
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Signal to Noise Ratio
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90dB Signal-to-Noise Ratio (A-weighting) for ADC input.
100dB Signal-to-Noise Ratio (A-weighting) for DAC output
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Analog Audio
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None
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Dolby Digital
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Yes
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Digital Out (S/PDIF)
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No
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Speaker Power Rating
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2W@4ohm/ch
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Disclaimers
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Type
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PD 65W 2cable 110cc PCC90% 3pin
49cc GAN 65W PD3.0 USB-C, Wall Mount
80cc GAN 65W PD3.0 USB-C
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Dimensions
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90x46x26.5mm
47x35x30mm
75.7x48x22mm
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Input Voltage
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100-240V
100-240V
100-240V
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Disclaimers
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TPM
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Yes, TPM2.0
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Asset ID
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Yes
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Pro
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Yes
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Disclaimers
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Format
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Ultraslim Notebook
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Color
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Black
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Thermal Solutions
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Internal Single FAN, Intelligent Cooling
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Dimensions
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Length
315.90 millimeters
Width
223.70 millimeters
Height
16.13 mm (Rear)/ 10.9 mm (Front)
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Weight
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Starting weight 1.39kg / 3.06lbs
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Disclaimers
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Height (mm)
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300
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Height (inch)
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11.8
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Width (mm)
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446
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Width (inch)
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17.6
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Depth (mm)
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81
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Depth (inch)
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3.1
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Weight (kgs)
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0.32kg
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Weight (lbs)
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0.71lbs
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Disclaimers
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Hardware Maintenance Manual
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Drivers & Software
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Self Healing BIOS
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Yes
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Access Panel
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Removeable bottom cover
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Number of Screws
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6
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Swappable Components
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Base cover assembly, TrackPoint pointing stick, Lenovo factory recovery USB key, Power cord, ac power adapter (65W)
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Storage Slots
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1 storage slot
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Memory
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two DIMM
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System Board
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1190 System Board. No self-service CRU.
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Restore CD/DVD/USB Set
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None. Purchase via Lenovo Customer Support Center
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Cable Lock Support
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Security-lock slot
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Power-On Password
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Yes
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Hard Disk Password
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Yes; User and Master hard disk password
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Supervisor Password
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Yes
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NIC LEDs (integrated)
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Yes (if it means the LED for Ethernet)
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Security Chip
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Yes (for TPM 2.0)
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Access Panel Key Lock
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Bottom Cover Tamper Detection
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Boot Sequence Control
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Yes
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Disclaimers
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Operating – Air Temperature
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At altitudes up to 2438 m (8000 ft)
Operating: 5°C to 35°C (41°F to 95°F)
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Non Operating – Air Temperature
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At altitudes up to 2438 m (8000 ft)
Storage: 5°C to 43°C (41°F to 109°F)
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Humidity
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Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)
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Corrosive Gas
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G1
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Particulates
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P1
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Disclaimers
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Processor
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AMD Krackan Point Ryzen AI 5 PRO 340
AMD Krackan Point Ryzen AI 7 PRO 350
AMD Strix Point Ryzen AI 9 HX PRO 370
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Memory Support
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DDR5 5600MT/S
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_
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Chipset (PCH)
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Integrated Soc
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Size of BIOS Flash
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64 MB
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Super I/O
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N/A
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Clock
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Crystal
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Audio
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Realtek High Definition Audio
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Ethernet
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Realtek RTL8111EPV
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Notes
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Disclaimers
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System Capacity Options
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Upto 96GB
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non-ECC
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Yes
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Brand of non-ECC Memory
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Samsung/Ramaxel/Sk Hynix/Micron
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ECC
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None
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Brand of ECC Memory
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N/A
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Memory clock frequency(MHz)
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DDR5 5600 MT/S
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Disclaimers
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2.5″ SAS Hard Disk Drive (HDD)
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None
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2.5_ SATA Hard Disk Drive (HDD)
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None
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2.5″ SATA Solid State Drive (SSD)
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None
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M.2 (NGFF) PCIe Solid State Drive (SSD)
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256GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G4 NVMe Performance M.2 2280
1TB Opal 2 PCIe G4 NVMe M.2 2280
1TB Opal 2 PCIe G4 NVMe Performance M.2 2280
2TB Opal 2 PCIe Gen4 Performance NVMe M.2 2280
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2.5_ PCIe Solid State Drive (SSD)
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None
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Brand of Drive
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Samsung
UnionMem
WD
Hynix
Kioxia
Micron
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Intel Optane Storage Technology
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Yes
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RAID
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Not Supported
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RAID Level and Requirements
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_
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Disclaimers
_
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Media Card Reader Specifications
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N/A
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_
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Disclaimers
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CPU
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AMD Krackan Point Ryzen AI 5 PRO 340
AMD Krackan Point Ryzen AI 7 PRO 350
AMD Strix Point Ryzen AI 9 HX PRO 370
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Integrated Graphics
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AMD Radeon 840M
AMD Radeon 860M
AMD Radeon 890M
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_
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# of Cores
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6 cores
8 cores
12 Cores
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# of Threads
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12
16
24
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Processor Base Frequency
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2.0GHz
2.0GHz
2.0GHz
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_
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Max Turbo Frequency
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4.8GHz
5GHz
5.1GHz
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_
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Cache
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22MB
24MB
36MB
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TDP
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29W
29W
29W
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AMD Spec Link
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_
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Disclaimers
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Model
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WUXGA
WUXGA oncell touch
WUXGA low power
WUXGA ePrivacy
2.8k
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Resolution
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1920 x 1200
1920 x 1200
1920 x 1200
1920 x 1200
2880 x 1800
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Diagonal
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14″
14″
14″
14″
14″
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Aspect Ratio
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Ratio 16:10
Ratio 16:10
Ratio 16:10
Ratio 16:10
Ratio 16:10
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Backlight
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LED
LED
LED
LED
None
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PPI
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162
162
162
162
243
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Active Area
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302 x 188
302 x 188
302 x 188
302 x 188
302 x 188
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Refresh Rate
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60 Hz
60 Hz
60 Hz
60Hz
120 Hz
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Contrast Ratio
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800:1 (TYP)
800:1 (TYP)
1000:1 (TYP)
1500:1 (TYP)
100000:1 (TYP)
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Viewing Angle
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85/85/85/85 degree
85/85/85/85 degree
85/85/85/85 degree
85/85/85/85 degree
85/85/85/85 degree
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Color gamut
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45% NTSC
45% NTSC
100% sRGB
100% sRGB
100% DCI-P3
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Brightness
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400nit
400nit
500nit
500nit
500nit
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Contrast
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Ratio 800:1
Ratio 800:1
Ratio 1000:1
Ratio 1500:1
Ratio 100000:1
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Color Depth
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16M
16M
16M
16M
1074M
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Interface
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eDP 1.2
eDP 1.2
eDP 1.4
eDP 1.4
eDP 1.4
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Panel ID Recognition
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EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
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Weight
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305g max
310g max
245g max
270g max
180g max
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Color Calibrator
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None
None
Adaptive ICC profile
None
X-Rite Factory Color Calibration, Dolby Vision
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Panel Technology
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IPS, Anti-Glare
IPS, Anti-Glare
IPS, Anti-Glare, LBL, Eyesafe certified
IPS, Anti-Glare
OLED, Anti-Glare/Anti-reflection/Anti-fingerprint, LBL,Eyesafe certified
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Touch Panel
_
None
YES
None
YES
None
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Disclaimers
_
_
_
_
_
_
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2.5″ SAS Hard Disk Drive (HDD)
_
N/A
_
_
_
_
_
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2.5_ SATA Hard Disk Drive (HDD)
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N/A
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
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Connector
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N/A
_
_
_
_
_
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Transfer Rate (Gb/sec)
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N/A
_
_
_
_
_
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Disclaimers
_
_
_
_
_
_
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Spindle Speed(RPM)
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N/A
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_
_
_
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Power off to Spindle Stop(sec)
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N/A
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_
_
_
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DC Power to Drive Ready(sec)
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N/A
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_
_
_
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Receipt of Start Unit Command to Drive Ready(sec)
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N/A
_
_
_
_
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Average Latency(msec)
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N/A
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_
_
_
_
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Disclaimers
_
_
_
_
_
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Input (VDC)
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N/A
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_
_
_
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Typical (Watts)
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N/A
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_
_
_
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Idle (Watts)
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N/A
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_
_
_
_
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Disclaimers
_
_
_
_
_
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Height (mm Max)
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N/A
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_
_
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Width (mm)
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N/A
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_
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Depth (mm Max)
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N/A
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_
_
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Weight (grams)
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N/A
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_
_
_
_
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Disclaimers
_
_
_
_
_
_
_
_
Operating(C) Ambient
_
N/A
_
_
_
_
_
_
Operating(C) Base Casting
_
N/A
_
_
_
_
_
_
Non-Operating(C) Ambient
_
N/A
_
_
_
_
_
_
Gradient(C per Hour)
_
N/A
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
Operating(Gs @ 2ms)
_
N/A
_
_
_
_
_
_
Non-Operating(Gs @ 2ms)
_
N/A
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
2.5″ SATA Solid State Drive (SSD)
_
N/A
_
_
_
_
_
_
M.2 (NGFF) PCIe Solid State Drive (SSD)
_
1x M.2 2280 PCIe Gen4
_
_
_
_
_
_
2.5_ PCIe Solid State Drive (SSD)
_
N/A
_
_
_
_
_
_
Intel Optane Storage Technology
_
N/A
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
Supported Types
_
M.2
_
_
_
_
_
_
Dimensions inches/centimeters (W x D x H)
_
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
_
_
_
_
_
_
Size
_
M.2 2280S3
_
_
_
_
_
_
Interface Type
_
PCIe NVMe Gen4
_
_
_
_
_
_
Read/Write IOPS Specifications
_
Performance PCIe Gen4
Read: 700k (2TB), 600k (1TB)
Write: 600k (2TB, 1TB)
Value PCIe Gen4
Read: 300k (1TB), 250k (512GB), 200k (256GB)
Write: 240k (1TB, 512GB), 190k (256GB)
_
_
_
_
_
_
Bandwidth Performance
_
PCIe Gen4 x 4 (16Gbps)
_
_
_
_
_
_
Power Consumption (Max)
_
3.0A (10us average)
_
_
_
_
_
_
Active(AVG)
_
5W
_
_
_
_
_
_
Idle
_
5mW (L1.2)
_
_
_
_
_
_
Min MTBF
_
2�000�000
_
_
_
_
_
_
Min Sequential Read
_
Performance PCIe Gen4
6400MB/s (2TB, 1TB)
Value PCIe Gen4
3500MB/s (1TB, 512GB), 3200MB/s (256GB)
_
_
_
_
_
_
Min Sequential Write
_
Performance PCIe Gen4
5000MB/s (2TB), 4400MB/s (1TB)
Value PCIe Gen4
2900MB/s (1TB), 2500MB/s (512GB), 1800MB/s (256GB)
_
_
_
_
_
_
Hardware Encryption
_
Yes
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
GPU Name
_
N/A
_
_
_
_
_
_
CUDA Processing Cores
_
N/A
_
_
_
_
_
_
GPU Memory
_
N/A
_
_
_
_
_
_
Memory Bandwidth
_
N/A
_
_
_
_
_
_
Memory Type
_
N/A
_
_
_
_
_
_
Memory Interface
_
N/A
_
_
_
_
_
_
TGP Max Power Consumption
_
N/A
_
_
_
_
_
_
Display Port
_
N/A
_
_
_
_
_
_
OpenGL
_
N/A
_
_
_
_
_
_
Shader Model
_
N/A
_
_
_
_
_
_
DirectX
_
N/A
_
_
_
_
_
_
PCIe Generation
_
N/A
_
_
_
_
_
_
Floating-Point Performance
_
N/A
_
_
_
_
_
_
VR Ready
_
N/A
_
_
_
_
_
_
Simultaneous Multi-Projection
_
N/A
_
_
_
_
_
_
NVIDIA FXAA/TXAA Antialiasing
_
N/A
_
_
_
_
_
_
NVIDIA nView Display Management Technology
_
N/A
_
_
_
_
_
_
GPU Direct for Video
_
N/A
_
_
_
_
_
_
Vulkan Support
_
N/A
_
_
_
_
_
_
NVIDIA Optimus
_
N/A
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
Model
_
MTK MT7925
_
_
_
_
_
_
Connector: Main, Aux/GNSS, GNSS
_
ANT1:AUX WiFi + BT; ANT2: Main WiFi
_
_
_
_
_
_
Antenna Diversity
_
Supported
_
_
_
_
_
_
MIMO
_
Not supported
_
_
_
_
_
_
GNSS Bian
_
N/A
_
_
_
_
_
_
Radio ON/OFF Control
_
Supported
_
_
_
_
_
_
Connector interface
_
PCIE
_
_
_
_
_
_
Operating Temperature (Adapter Shield)
_
0c to +80c
_
_
_
_
_
_
Humidity Non-Operating
_
50%~90% Rh non condensing (at temperatures of 25c to 35c)
_
_
_
_
_
_
Operating Systems
_
Microsoft Windows 11, Linux
_
_
_
_
_
_
Wi-Fi Alliance
_
Wi-Fi CERTIFIED* a/b/g/n/ac, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Direct* for peer to peer device connections, Wi-Fi Miracast* as Source.
_
_
_
_
_
_
IEEE WLAN Standard
_
IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w; 802.11r, 802.11k, 802.11v pending OS support; Fine Timing Measurement based on 802.11REVmc
_
_
_
_
_
_
Roaming
_
Support seamless roaming between access points
_
_
_
_
_
_
Bluetooth*
_
Dual Mode Bluetooth 5.3
_
_
_
_
_
_
Authentication
_
WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA
_
_
_
_
_
_
Authentication Protocols
_
PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2
_
_
_
_
_
_
Encryption
_
64-bit and 128-bit WEP, 128-bit AES-CCMP
_
_
_
_
_
_
Regulatory
_
For a list of country approvals, please contact your local Intel representatives.
_
_
_
_
_
_
US Government
_
FIPS10, FISMA
_
_
_
_
_
_
Product Safety
_
UL,C-UL,CB (IEC 60950-1)
_
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
Dimension
_
270mm*69.7mm*6.41mm
270mm*69.7mm*6.16mm
_
_
_
_
_
Weight
_
247g
217g
_
_
_
_
_
Type (Chemistry and Cell)
_
Li-ion Polymer
Li-ion Polymer
_
_
_
_
_
Voltage
_
15.44V~15.48V
15.6V
_
_
_
_
_
Battery Life
_
_
_
_
_
_
_
_
Battery Capacity
_
Integrated 4- cell 52.5Wh battery
Integrated 4- cell 57Wh battery
_
_
_
_
_
Charging Time
_
in-operation: 2.1h 0~100%
in-operation: 1.97h 0~100%
_
_
_
_
_
Operating Temperature Range
_
off: 1h 0~80%, 2.05h 0~100%
off: 1h 0~80%, 2h 0~100%
_
_
_
_
_
Warranty
_
Between 10_ and 35_
Between 10_ and 35_
_
_
_
_
_
Coin Cell Battery (Model)
_
1 Year / 3 Year Available
1 Year / 3 Year Available
_
_
_
_
_
Disclaimers
_
_
_
_
_
_
_
_
WMI Support
_
Yes, if it is BIOS Setup change by WMI.
_
_
_
_
_
_
ROM-Based Setup Utility (F1)
_
Yes
_
_
_
_
_
_
Bootblock Recovery
_
N/A
_
_
_
_
_
_
Replicated Setup
_
Yes, it supported with SRSETUP tool.
_
_
_
_
_
_
Boot Control
_
Yes, it means Boot order change.
_
_
_
_
_
_
Discrete Mode
_
_
_
_
_
_
_
_
Memory Change Alert
_
N/A
_
_
_
_
_
_
Thermal Alert
_
N/A
_
_
_
_
_
_
Asset Tag
_
Yes
_
_
_
_
_
_
System/Emergency ROM Flash Recovery with Video
_
N/A
_
_
_
_
_
_
Remote Wakeup/Remote Shutdown
_
Yes, if Remote wakeup is Wake on LAN from S4/S5.
_
_
_
_
_
_
Keyboard-less Operation
_
N/A
_
_
_
_
_
_
Per-port Control
_
Yes, if it is I/O port enable/disable by BIOS Setup.
_
_
_
_
_
_
Adaptive Cooling
_
Yes, if it is thermal & fan control.
_
_
_
_
_
_
Security
_
Yes, BIOS password / Hard disk password / Finger print
_
_
_
_
_
_
Intel(R) AMT (includes ASF 2.0)
_
Yes. If you select vPro model
_
_
_
_
_
_
Intel(R) TXT
_
Yes. If you select vPro model
_
_
_
_
_
_
Memory Modes
_
N/A
_
_
_
_
_
_
EMC
_
Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam
_
_
_
_
_
_
Safety
_
To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com
Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard
Izod Test – EPEAT Compliant
Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho
_
_
_
_
_
_
Energy Star
_
ENERGY STAR Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov
_
_
_
_
_
_
EPEAT
_
EPEAT Declaration of Conformance For Machine Types: 20S4, 20S5
_
_
_
_
_
_
IT ECO declaration
_
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
_
_
_
_
_
_
Hazardous Substances
_
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
https://www.lenovo.com/rohs-communication
_
_
_
_
_
_
Industry Standard Specifications
_
This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT
_
_
_
_
_
_
Remote Manageability Software Solutions
_
Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
_
_
_
_
_
_
System Software Manager
_
Lenovo ThinkPad supports software management tools from the Lenovo Vantage System Update suite:
System Update
Update Retriever
_
_
_
_
_
_
Service, Support, and Warranty
_
On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
_
_
_
_
_
_
Energy Star
_
ENERGY STAR� 9.0
_
_
_
_
_
_
EPEAT
_
EPEAT� Gold
_
_
_
_
_
_
RoHS Compliant
_
RoHS Compliant
_
_
_
_
_
_
TCO
_
TCO 9.0
_
_
_
_
_
_
Sustainability
_
97% PCC recycled plastic: Speaker enclosure
97% recycled plastic: 52.5WHr Battery
95% PCC recycled plastic: 65W PSU
90% recycled/sustainable packaging
Low-temperature solder
_
_
_
_
_
_
Disclaimers
_
Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material.
_
_
_
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