P16s Gen 5 AMD

Version: 1.0 | 03/16/2026

Product Name

Product Display Name

P16s Gen 5 AMD

Information Date

16-Mar-26

SECTION I: Platform Overview

Description

The Lenovo ThinkPad P16s Gen 5 AMD takes mainstream mobile workstations to the next level, combining breakthrough performance with exceptional portability.​

CPU

Processor Support

AMD Gorgon Point
Ryzen AI 9 HX PRO 470
Ryzen AI 7 PRO 450
Ryzen AI 5 PRO 440

Socket Type

BGA

Disclaimers

Operating Systems

Preloaded

Windows 11 Pro 64 (Win11 25H2)
Windows 11 Home 64
Windows 11 Home Chinese Language Edition 64
Ubuntu (V24.04)
Fedora

Supported

Windows 11 Pro 64 (Win11 25H2)
Windows 11 Home 64
Windows 11 Home Chinese Language Edition 64
Ubuntu(V24.04)
Fedora
Redhat

Disclaimers

Memory

Number of DIMM Slots

1 slot

Channels

Dual channel

Type

LPCAMM2

ECC Support

No

Speed

8533 MT/s (System 7500MT/s)

Max DIMM Size

96GB

Max System Memory

96GB

Min System Memory

16GB

Soldered Memory

NO

Disclaimers

Storage

Storage Slots

1 slot

SATA

NO

PCIe

Solid State Drive, OPAL2 PCIe-NVMe Gen 4 /Gen5 M.2 2280- TLC

SAS

None

Interface

PCIe Gen 4/ Gen5

Security

PCIE

Optional Hard Disk Drive Controllers

OPAL2 for NVMe SSD

Disclaimers

Video

Integrated Graphics

AMD Radeon™ 890M (Ryzen AI 9 HX PRO 470)
AMD Radeon™ 860M (Ryzen AI 7 PRO 450)
AMD Radeon™ 840M (Ryzen AI 5 PRO 440)

Discrete Graphics

NV RTX PRO 500
NV RTX PRO 1000
NV RTX PRO 2000

Adapter

None

Bus Interface

PCIE Gen4

Disclaimers

Display

Resolutions

FHD+ / 2.8k OLED

Camera

Resolution

5M

Frames per Second

30 fps

Focus

FF 50cm(fixed focus)

Camera Interface

USB 2.0

IR Camera

Yes (optional)

Keyboard

Number of Keys

US : 105 / UK : 106 / JP : 110

Numpad

Yes

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

CS26 Top mount Shrunken 15.6″ KBD w/ Numeric Pad

Key stroke

1.5mm

Key pitch

19.05mm

Keyboard backlight

Optional

Keyboard thickness

Standard

TrackPad / Fingerprint Reader

TrackPoint Details

TrackPoint height 4.6mm

Finger Print Reader Model

Synaprics Metallica 8×8 FPR, MoC

Multi-Touch

Yes

Resolution

1000 ppi

TrackPad/TouchPad thickness

3.6mm

TrackPad/TouchPad type

2 button ClickPad (Follow UE Spec) large full module & VB2

TrackPad size

115mm x 66.6mm

TrackPad material/finish

TP 3 Buttons (Follow UE Spec).

I/O – Ports and Connectors

USB

2x USB-A 3.2 (Gen 1) (1 powered)

Thunderbolt

2x Thunderbolt 4 (USB 4/USB-C 3.2 Gen 2/DP2.1/PD)

HDMI

1x HDMI 2.1 TMDS up to 4K/60Hz

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

SD Card Reader (SD Card 7.0 support)

Smart Card Reader

Yes (optional)

Power Connector

TYPE-C

Docking Port

N/A, Just USB-C Docking

VirtualLink

None

Network adapter

Gigabit Ethernet (RJ45)

Disclaimers

Power Connector

Main

TYPE-C

USB-C

2 x USBA3.0 and 2 x USB-C

Disclaimers

Ethernet

Vendor

Realtek

Count

x1

EEPROM

SPI ROM (Merge with BIOS/MEFW)

Speeds

10/100/1000 Mbps

Functions

Wake On LAN
MAC Address Pass Through
PXE Boot
Flash Over LAN

Connectors

RJ45

Disclaimers

WWAN

Model

5G Foxconn SDX61

Disclaimers

Near Field Communications

Model

Yes, optional

Disclaimers

Audio

Vendor

Realtek

Type

Soundwire codec

Internal Speaker

Yes, dual speakers

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3346

Number of Channels

3 stereo DACs, 2 stereo ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

n

Signal to Noise Ratio

94dB Signal-to-Noise Ratio (A-weighting) for ADC input.
99dB Signal-to-Noise Ratio (A-weighting) for DAC output

Analog Audio

None

Dolby Digital

Yes

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Disclaimers

Power adapter

Type

100W AC Adapter

140W AC Adapter

Dimensions

108mm x 56mm x 26.5mm

120×62.5x22mm

Input Voltage

100-240V

100-240V

Disclaimers

Security

TPM

Yes, TPM2.0

Asset ID

Yes

AMD Pro Technology

Yes

Disclaimers

Chassis Information

Format

Ultraslim Notebook

Color

Eclipse Black

Thermal Solutions

Internal dual FAN, Intelligent Cooling

Dimensions

Length
357.9 mm
14.09 in

Width
247.9 mm
9.75 in

Height
Front 11.45 mm / 0.45 in
Rear : 18.15 mm /0.71 in
Maximum: 23.3 mm / 0.87 in

Weight

Starting weight UMA 1.789kg / 3.94 lbs

Disclaimers

Packaging Parameters

Height (mm)

322

Height (inch)

12.7

Width (mm)

503

Width (inch)

19.8

Depth (mm)

76

Depth (inch)

3

Weight (kgs)

0.68(The total weight of the packaging materials)

Weight (lbs)

1.5(The total weight of the packaging materials)

Disclaimers

Security & Serviceability

Hardware Maintenance Manual

Drivers & Software

Self Healing BIOS

Yes

Access Panel

Removeable bottom cover

Number of Screws

8

Swappable Components

Base cover assembly, TrackPoint pointing stick, Lenovo factory recovery USB key, Power cord, ac power adapter (65W)

Storage Slots

1 storage slot

Memory

1 X LPCAMM2

System Board

1190 System Board. No self-service CRU.

Restore CD/DVD/USB Set

NO

Cable Lock Support

Nano Saver Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

No LED

Security Chip

Yes (for TMP 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Disclaimers

Operating Environment

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

Disclaimers

SECTION II: Platform Detail

Supported Components

Processor

AMD Gorgon Point
Ryzen AI 9 HX PRO 470
Ryzen AI 7 PRO 450
Ryzen AI 5 PRO 440

Memory Support

LPCAMM2

Chipset (PCH)

Integrated Soc

Size of BIOS Flash

64 MB

Super I/O

N/A

Clock

Crystal

Audio

Realtek Sound wire

Ethernet

Realtek RTL8111EPV

Notes

Disclaimers

Memory

System Capacity Options

Upto 96GB

non-ECC

Yes

Brand of non-ECC Memory

Samsung/Ramaxel/Sk Hynix/Micron

ECC

None

Brand of ECC Memory

N/A

Memory clock frequency(MHz)

8533 MT/s (System speed 7500MT/s)

Disclaimers

Storage

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

512GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G5 NVMe Performance M.2 2280
1TB Opal 2 PCIe G4 NVMe M.2 2280
1TB Opal 2 PCIe G5 NVMe Performance M.2 2280
2TB Opal 2 PCIe Gen5 Performance NVMe M.2 2280
4TB Opal 2 PCIe Gen5 Performance NVMe M.2 2280

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
SanDisk
Hynix
KIOXIA(Async)
UnionMem
Micron

Intel Optane Storage Technology

No

RAID

Not Supported

RAID Level and Requirements

Disclaimers

Removeable Media

Media Card Reader Specifications

N/A

Disclaimers

SECTION III: Supported Component Detail

CPU Specifications

CPU

AMD Gorgon Point Ryzen AI 5 PRO 440

AMD Gorgon Point Ryzen AI 7 PRO 450

AMD Gorgon Point Ryzen AI 9 HX PRO 470

Integrated Graphics

AMD Radeon™ 840M

AMD Radeon™ 860M

AMD Radeon™ 890M

# of Cores

6 cores

8 cores

12 Cores

# of Threads

12

16

24

Processor Base Frequency

2.0GHz

2.0GHz

2.0GHz

Max Turbo Frequency

4.8GHz

5.1GHz

5.2GHz

Cache

22MB

24MB

36MB

TDP

29W

29W

29W

AMD Spec Link

 https://www.amd.com/en/products/processors/laptop/ryzen-pro/ai-400-series/amd-ryzen-ai-5-pro-440.html

https://www.amd.com/en/products/processors/laptop/ryzen-pro/ai-400-series/amd-ryzen-ai-7-pro-450.html

https://www.amd.com/en/products/processors/laptop/ryzen-pro/ai-400-series/amd-ryzen-ai-9-hx-pro-470.html

Disclaimers

Display Specifications

Model

16″ 16:10 WUXGA(1920*1200) IPS 400nit NTSC45%, 60Hz 3.2t Bent, Non-touch

Low Power WUXGA (1920×1200)16:10 IPS ,Touch ,500nit, 60Hz, 100% sRGB, AG, AICCP, Eyesafe

2.8k (2880×1800) OLED 16:10 500nit ,120Hz, 100%DCI-P3,AG,Eyesafe, FCC X-Rite, Dolby Vision,HDR 1000TB

Resolution

1920 x 1200

1920 x 1200

2880×1800

Diagonal

16″

16″

16″

Aspect Ratio

Ratio 16:10

Ratio 16:10

Ratio 16:10

Backlight

LED

LED

OLED

PPI

142

142

283

Active Area

344.68 x 215.42

344.68 x 215.42

344.448 x 215.28

Refresh Rate

60Hz

60Hz

120Hz

Contrast Ratio

1200:1

1500:1

100000:1

Viewing Angle

89/89/89/89

89/89/89/89

170 degree

Color gamut

45% NTSC

sRGB 100%

100% DCI-P3

Brightness

400nit

500nit

500nit

Contrast

N/A

N/A

N/A

Color Depth

8bit

8bit

8bit+2FRC

Interface

eDP 1.2

eDP 1.4b

eDP 1.5

Panel ID Recognition

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

Weight

410g max

320g max

193g max

Color Calibrator

AICCP

AICCP

FCC X-Rite

Panel Technology

IPS, Anti-Glare

IPS, Anti-Glare

Anti-Glare

Touch Panel

None

None

None

Disclaimers

HDD Specifications

2.5″ SAS Hard Disk Drive (HDD)

N/A

2.5″ SATA Hard Disk Drive (HDD)

N/A

Disclaimers

HDD Storage Device Specifications

Connector

N/A

Transfer Rate (Gb/sec)

N/A

Disclaimers

HDD Performance

Spindle Speed(RPM)

N/A

Power off to Spindle Stop(sec)

N/A

DC Power to Drive Ready(sec)

N/A

Receipt of Start Unit Command to Drive Ready(sec)

N/A

Average Latency(msec)

N/A

Disclaimers

HDD Power Management

Input (VDC)

N/A

Typical (Watts)

N/A

Idle (Watts)

N/A

Disclaimers

HDD Dimensions

Height (mm – Max)

N/A

Width (mm)

N/A

Depth (mm – Max)

N/A

Weight (grams)

N/A

Disclaimers

HDD Temperature

Operating(C) Ambient

N/A

Operating(C) Base Casting

N/A

Non-Operating(C) Ambient

N/A

Gradient(C per Hour)

N/A

Disclaimers

HDD Shock

Operating(Gs @ 2ms)

N/A

Non-Operating(Gs @ 2ms)

N/A

Disclaimers

SSD Specifications

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

1x M.2 2280 PCIe Gen4/Gen5

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Disclaimers

Solid State Storage Devices

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280S3

Interface Type

PCIe NVMe Gen4 / Gen5

Read/Write IOPS Specifications

Performance PCIe Gen5p
Read: 1000k(4TB/2TB/1TB/512GB)
Write: 1200k(4TB/2TB/1TB/512GB)

PCIe Gen4value
Read: up to 450k (1TB/512GB/256GB)
Write: up to 500k(1TB/512GB/256GB)

Bandwidth Performance

PCIe Gen5 x 4 (16Gbps)

Power Consumption (Max)

3.0A (10us average)

Active(AVG)

5W

Idle

5mW (L1.2)

Min MTBF

2’000’000

Min Sequential Read

Performance PCIe Gen5p
up to 12000MB/s (4TB/2TB/1TB/512GB)

PCIe Gen4v
4800MB/s (1TB/512GB)

Min Sequential Write

Performance PCIe Gen5p
up to 6000MB/s (4TB/2TB/1TB/512GB)

PCIe Gen4v
4000MB/s (1TB/512GB)

Hardware Encryption

Yes

Disclaimers

Discrete Graphics Adapter

GPU Name

NVIDIA RTX PRO 500 (6GB GDDR7)

NVIDIA RTX PRO 1000 (8GB GDDR7)

NVIDIA RTX PRO 2000 (8GB GDDR7)

CUDA Processing Cores

1792

2560

3328

GPU Memory

6GB

8GB

8GB

Memory Bandwidth

288

384

384

Memory Type

GDDR7

GDDR7

GDDR7

Memory Interface

96-bit

128-bit

128-bit

TGP Max Power Consumption

55W

55W

55W

Display Port

N/A

N/A

N/A

OpenGL

4.6

4.6

4.6

Shader Model

10.4

10.4

10.4

DirectX

12

12

12

PCIe Generation

PCIE Gen4

PCIE Gen4

PCIE Gen4

Floating-Point Performance

9.2

13.6

17.7

VR Ready

No

No

No

Simultaneous Multi-Projection

No

No

No

NVIDIA FXAA/TXAA Antialiasing

Yes

Yes

Yes

NVIDIA nView Display Management Technology

Yes

Yes

Yes

GPU Direct for Video

N/A

N/A

N/A

Vulkan Support

Yes

Yes

Yes

NVIDIA Optimus

Yes

Yes

Yes

Disclaimers

WLAN

Model

MTK MT7925

Connector: Main, Aux/GNSS, GNSS

ANT1:AUX WiFi + BT; ANT2: Main WiFi

Antenna Diversity

Supported

MIMO

Not supported

GNSS Bian

N/A

Radio ON/OFF Control

Supported

Connector interface

M.2 PCIE(Wi-Fi)+USB(BT)

Operating Temperature (Adapter Shield)

-10c to +70c

Humidity Non-Operating

60%~85% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 11, Linux

Wi-Fi Alliance

Wi-Fi CERTIFIED* a/b/g/n/ac, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Direct* for peer to peer device connections, Wi-Fi Miracast* as Source.

IEEE WLAN Standard

IEEE 802.11a/b/g/n/ac/ax/be, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w; 802.11r, 802.11k, 802.11v pending OS support; Fine Timing Measurement based on 802.11REVmc

Roaming

Support seamless roaming between access points

Bluetooth*

Bluetooth® 5.4

Authentication

WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA

Authentication Protocols

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

Encryption

64-bit and 128-bit WEP, 128-bit AES-CCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives.

US Government

FIPS10, FISMA

Product Safety

UL,C-UL,CB (IEC 60950-1)

Disclaimers

Bluetooth may be limited by OS

Battery

Dimension

60wh: 265*59.5*6.98

90wh: 289.3*59.5*8.365

Weight

Max : 225g

Max : 313g

Type (Chemistry and Cell)

Li-ion

Li-ion

Voltage

11.61V

15.60V

Battery Capacity

60Wh

90Wh

Charging Time

QC1 ( 1hr charge from 0% to 80%)

QC1 ( 1hr charge from 0% to 80%)

Operating Temperature Range

Charge:0~60℃ / Discharge:-20~60℃

Charge:0~60℃ / Discharge:-20~60℃

Warranty

1yr standard, upsell to 3yr

1yr standard, upsell to 3yr

Coin Cell Battery (Model)

CR2016

CR2016

Disclaimers

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

Yes, it is NIST feature.

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

No, go hybrid graphic mode.

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

Yes, if Remote wakeup is Wake on LAN from S4/S5.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

AMD KVM

Yes

AMD Platform Security Processor

Yes

Memory Modes

N/A

UEFI

Unified Extensible Firmware Interface 2.9A

EMC & Safety

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – New Zealand
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories

Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Izod Test – EPEAT Compliant

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Environmentals

Energy Star

ENERGY STAR® Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Declaration of Conformance For Machine Types: 20S4, 20S5

IT ECO declaration

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Manageability

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:
Realtek LAN solution

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkPad supports software management tools from the Lenovo Vantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Environmentals

Energy Star

ENERGY STAR® 9.0

EPEAT

EPEAT® Gold

RoHS Compliant

RoHS Compliant

TCO

TCO 10.0

Sustainability

50% Recycled Aluminium A cover
90% Recycled Magnesium Aluminium C cover
30%PCC Recycled  D cover(WLAN)

45%PCC Recycled  D cover(WWAN)
85% PCC key caps

90% PCC speaker enclosure
97% PCC battery pack enclosure
90% PCC AC adapter
Plastic‑free packaging with 90% recycled and/or FSC content

Disclaimers

Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material.

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