P16v i Gen 3

Product Name

P16v Gen 3

Product Display Name

ThinkPad P16v Gen 3

Information Date

Sept 5 2025

Description

The Lenovo ThinkPad P16v is a powerful mobile workstation designed for a broad range of power users across various industries who need a reliable and efficient device at an affordable price point.

Processor Support

Intel Core Ultra Series 2 – H-Series (35W) Core 7 and 9

Socket Type

BGA

Preloaded

Windows 11 Pro 64-bit (24H2)
Windows 11 Home 64-bit
Windows 11 Home Single Language 64-bit
Windows 11 Home Chinese Language Edition 64-bit
Ubuntu Linux 64-bit (Version 24.04)
No Operating System

Supported

Ubuntu Linux 24.04 Cert only
Red Hat Enterprise Linux (RHEL) 9.4 (depending on NVIDIA open source driver status)

Number of DIMM Slots

Up to 2 Slots

Channels

Single Channel w/ 1 DIMM
Dual Channel w/ 2 DIMMs

Type

DDR5 SoDIMM or DDR5 CSoDIMM

ECC Support

No

Speed

Up to 5600MT/s SoDIMMs or 6400MT/s CSoDIMMs

Max DIMM Size

48GB

Max System Memory

96GB

Min System Memory

16GB

Soldered Memory

None

Disclaimers

No ECC memory on P16v Gen 3

Storage Slots

2x M.2 2280

SATA

No

PCIe

Solid State Drive, 2x OPAL2 PCIe NVMe M.2 – TLC

SAS

No

Interface

PCIe Gen 5 Performance or Gen 4 Value

Security

OPAL2 for NVMe SSD

Optional Hard Disk Drive Controllers

No

Disclaimers

Dual slot storage is available with all CPU & GPU options

Integrated Graphics

Processor Graphics Intel® Arc Pro Graphics
Utilized via "Hybrid Mode" in BIOS

Discrete Graphics

NV RTX PRO 500 Blackwell, 1000 Blackwell, 2000 Blackwell

Adapter

None

Bus Interface

PCI Express 5.0

Resolutions

WUXGA (FHD+) / WQUXGA (UHD+)

Resolution

5MP RGB Camera or 5MP RGB + IR Hybrid Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes

Number of Keys

US : 105 / UK : 106 / JP : 110

Numpad

Yes

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

CS25 KYB with numberpad

Key stroke

1.5mm

Key pitch

19.05mm

Keyboard backlight

Yes

Keyboard thickness

4.0mm

TrackPoint Details

CS22 TL TrackPoint (t=4.8mm)

Finger Print Reader Model

11*3.24 FPR, MoC with LED

Multi-Touch

Yes

Resolution

n/a

TouchPad/Trackpad thickness

3.4mm

TouchPad/Trackpad type

TrackPad

Trackpad size

115mm x 67.6mm

Trackpad material/finish

Glass like mylar surface

USB

2x USB-A (10Gbps)

Thunderbolt

2x USB-C® (Thunderbolt™ 4)

HDMI

1x HDMI 2.1

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated SD Express 7.0 Card Reader (Backwards compatible with UHS-I & UHS-II) (MMC,SD,SDHC SDXC)

Smart Card Reader

Yes (optional)

Power Connector

DC-In via USB-C® (Thunderbolt™ 4) PD 3.1

Docking Port

Docking Via USB-C® (Thunderbolt™ 4) PD 3.1

VirtualLink

None

Network adapter

Full size 1.0Gbps RJ-45 port

Disclaimers

HDMI 2.1: Up to 8K/60Hz

Main

DC-In via USB-C® (Thunderbolt™ 4) PD 3.1

USB-C

see above

Disclaimers

normal charge via 100W and fast charge via 140W charger

Vendor

Intel

Count

1

EEPROM

No

Speeds

1.0Gbps

Functions

Ethernet Connection I219

Connectors

Full size 1.0Gbps RJ-45 port

Model

5G: Rolling Wireless RW350R-GL 5G sub-6GHz CAT19/CAT18

Disclaimers

WWAN support country dependent

Model

Foxconn NXP NPC300 NFC

Vendor

Realtek

Type

Intel High Definition Audio

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3287

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1K/48K/96K/192KHz sample rate

Signal to Noise Ratio

Mic In: 90dB FSA
Headphone Out@32ohm: 97dB FSA

Analog Audio

None

Dolby Digital

Dolby Atmos

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Type

140W Type-C PD 3.1 EPR
AC Adapter

Dimensions

(120 x 62.5 x 22mm)

Weight

Max 340g

Input Voltage

100-240V

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Format

16" Clamshell

Color & Material

Black
Aluminum and Plastic

Thermal Solutions

Internal Dual Fan, Intelligent Cooling

Dimensions

Length
14.23 inches
361.50 millimeters

Width
9.79 inches
248.60 millimeters

Height
0.50 (front) / 0.77 (rear), 1.04 (max) inches
12.8 (front) / 19.55 (rear), 26.3 (max) millimeters

Weight

4.60lbs/2.1kg

Height (mm)

25.05, MKT : 22.3

Height (inch)

0.986, MKT : 0.878

Width (mm)

365

Width (inch)

14.37

Depth (mm)

261.92

Depth (inch)

10.31

Weight (kgs)

start from 2.32 kg

Weight (lbs)

start from 4.92 lbs

Hardware Maintenance Manual

P16v Gen 3 HMM

Drivers & Software

P16v Gen 3 Drivers & Software

Self Healing BIOS

Yes

Access Panel

Removeable bottom cover

Number of Screws

6+2

Swappable Components

Bottom cover, battery, M.2 Solid State Drive, SoDIMM & CSoDIMM memory module, WWAN module, SIM tray, keyboard, RTC battery

Storage Slots

2 slots

Memory

2 slots

System Board

FR4

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

Yes

Security Chip

Yes (for TMP 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating – Air Temperature

Meet MIL810G
At altitude 15,000 feet for 1 hour
43°C for 2hrs
-21°C for 2hrs

Non Operating – Air Temperature

Meet MIL810G
At altitude 15,000 feet for 1 hour
63°C for 4hrs
-25°C for 24hrs

Humidity

Meet MIL810G
95% RH, 30~60C, 24hrs*10cycles

Corrosive Gas

G1

Particulates

P1

Processor

Intel® Core™ Ultra 7 255H processor (E-cores up to 4.4 GHz P-cores up to 5.1 GHz)
Intel® Core™ Ultra 7 265H processor (E-cores up to 4.5 GHz P-cores up to 5.3 GHz)
Intel® Core™ Ultra 9 285H processor (E-cores up to 4.5 GHz P-cores up to 5.4 GHz)

Memory Support

DDR5 5600MT/s SoDIMM or DDR5 6400MT/s CSoDIMM

Chipset (PCH)

N/A

Size of BIOS Flash

64MB

Super I/O

None

Clock

Crystal

Audio

Dolby Atmos

Ethernet

Full size 1.0Gbps RJ-45 port

System Capacity Options

16GB (16GB*1)
32GB (32GB*1 or 16GB*2)
48GB (42GB*1)
64GB (32GB*2)
96GB (48GB*2)

Memory Types

16GB DDR5 5600MT/s SoDIMM
32GB DDR5 5600MT/s SoDIMM

32GB DDR5 6400MT/s CSoDIMM
48GB DDR5 6400MT/s CSoDIMM

Brand of Memory

Samsung
Micron
Hynix
Ramaxel

Memory clock frequency(MHz)

5600MT/s (SoDIMM) or 6400MT/s (CSoDIMM)

Disclaimers

No ECC memory on P16v Gen 3

2.5" SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5" SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)

512GB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
Union Memory
WD
Micron
Hynix
Kioxia

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Media Card Reader Specifications

SD Express 7.0

Disclaimers

Backwards compatible with UHS-I and UHS-II

CPU

Intel® Core™ Ultra 7 255H processor (E-cores up to 4.4 GHz P-cores up to 5.1 GHz)

Intel® Core™ Ultra 7 265H processor (E-cores up to 4.5 GHz P-cores up to 5.3 GHz)

Intel® Core™ Ultra 9 285H processor (E-cores up to 4.5 GHz P-cores up to 5.4 GHz)

Integrated Graphics

Intel® Arc Pro Graphics

# of Cores

6 P-cores and 8 E-cores

# of Threads

16

Processor Base Frequency

E-cores up to 1.5 GHz / P-cores up to 2.0 GHz

E-cores up to 1.7 GHz / P-cores up to 2.2 GHz

E-cores up to 2.7 GHz / P-cores up to 2.9 GHz

Max Turbo Frequency

E-cores up to 4.4 GHz / P-cores up to 5.1 GHz

E-cores up to 4.5 GHz / P-cores up to 5.3 GHz

E-cores up to 4.5 GHz / P-cores up to 5.4 GHz

Cache

24 MB

TDP

45 W

Model

WUXGA IPS Non-Touch

WUXGA IPS Non-Touch, Low Power

WQUXGA OLED Touch

Resolution

FHD+ (1920 x 1200)

UHD+ (3840 x 2400)

Diagonal

16"

Aspect Ratio

Ratio 16:10

Backlight

LED

N/A

PPI

141.5 (Pixel Pitch:0.17952mm x 0.17952mm )

283 (Pixel Pitch: 0.09mm x 0.09mm)

Active Area

FHD+: 344.68mm x 215.42mm

UHD+: 344.678mm x 215.424mm

Refresh Rate

Max 60Hz

Contrast Ratio

FHD+: 1200:1

UHD+: 1500:1

Viewing Angle (*1)

FHD+: 89/89/89/89 degree

UHD+: 85/85/85/85 degree

Color gamut

45% NTSC

100% sRGB

100% DCI-P3

Brightness

400nit

500nit

400nit

HDR

N/A

Dolby Vision

Color Depth

FHD+: 16.7M (8-bit)

UHD+: 1064M (8-bit + 2 FRC)

Interface

FHD+: eDP 1.4b

UHD+: eDP 1.4b

Panel ID Recognition

EDID in BIOS Table

Weight

max 410g

max 320g

max 221g

Color Calibrator

AICCP Factory Color Calibration

X-Rite Factory Color Calibration

Panel Technology

IPS, Anti-Glare

OLED, AGARAS

Touch Panel

None

Multi-Finger Touch Panel

2.5" SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280-S3 PCIe

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280-S3

Interface Type

PCIe NVMe

Read/Write IOPS Specifications

Read: 600K (1TB), 450K (512GB)
Write: 500K (1TB,512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Read: 1500K (2TB), 1200K (1TB), 1000K (512GB)
Write: 1500K (2TB/1TB), 1200K (512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Bandwidth Performance

PCIe Gen4x4 Value – 512GB-1TB

PCIe Gen5x4 Performance – 512GB-2TB

Power Consumption (Max)

3.0A (duration for 10 us)

4.5A (duration for 10 us)

Active(AVG)

5W

10W

Idle

5mW (L1.2)

Min MTBF

2,000,000 (h)

Min Sequential Read

5000MB/s (1TB), 4800MB/s (512GB),

14000MB/s (2TB/1TB), 11000MB/s (512GB)

Min Sequential Write

4000MB/s (1TB/512GB)

12000MB/s (2TB), 11000MB/s (1TB), 5500MB/s (512GB)

Hardware Encryption

OPAL

Laptop GPUs

NVIDIA RTX PRO 500 Blackwell Laptop GPU

NVIDIA RTX PRO 1000 Blackwell Laptop GPU

NVIDIA RTX PRO 2000 Blackwell Laptop GPU

NVIDIA CUDA Processing Cores

1792

2560

3328

NVIDIA RT Cores

4th Gen

Tensor Cores

5th Gen

GPU Memory

6GB

8GB

Peak Memory Bandwidth

288 GB/s

384 GB/s

Memory Type

GDDR7

Memory Interface

96-bit

128-bit

DisplayPort

2.1b

Open GL

4.6

Shader Model

7

DirectX

12 Ultimate

PCIe Generation

5

Single Precision Floating-Point Performance

9.2

13.6

17.7

Tensor Performance

147.4

193

231.6

NVIDIA FXAA/TXAA Anti-Aliasing

Yes

NVIDIA RTX Desktop Manager

No

Vulkan Support

Yes

NVIDIA Optimus

Yes

NVIDIA Max-Q Technology

Yes

NVENC/NVDEC

Yes

Model

Intel Wi-Fi 7 BE201 (Fillmore Peak 2) + BT5.4 (HW Ready)

Connector: Main, Aux/GNSS, GNSS

ANT1:AUX WiFi + BT; ANT2: Main WiFi

Antenna Diversity

Supported

MIMO

Supported

GNSS Bian

N/A

Radio ON/OFF Control

Supported

Connector interface

M.2: CNVio2

Operating Temperature (Adapter Shield)

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 11, Linux

Wi-Fi Alliance

n/a

IEEE WLAN Standard

IEEE 802.11a, b, d, e, g, h, i, k, n, r, u, v, w, ac, ax, be

Roaming

Support seamless roaming between access points

Bluetooth*

Bluetooth 5.4

Authentication Protocols

802.1X
EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 -MSCHAPv2
, EAP-SIM, EAP-AKA, EAP-AKA

Encryption

128-bit AES-CCMP, 256-bit AES-GCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives.

US Government

FIPS 140-2

Product Safety

IEC62368-1 and IEC60950-1

Disclaimers

1) 6GHz channel of Wi-Fi 6E/7 is only available with Windows 11
2) Bluetooth may be limited by OS

Dimension

L: 306.9mm*W: 59mm*T 8.13mm

Weight

MAX 318g

Type (Chemistry and Cell)

Li-Polymer (4S1P), 4-cell

Voltage

15.6 V

Battery Capacity

90Wh

Charging Time

On Charge Time (0- 100%) * 105 min
Off Charge Time (0 – 80%) ** 56 min
Off Charge Time (0 – 100%) ** 100 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2032

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

Support NIST

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

No

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

Only support WOL when system is connected with Dock.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

N/A

UEFI

UEFI 2.9A

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Energy Star

ENERGY STAR® Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Gold Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at: https://www.lenovo.com/us/en/compliance/eco-declaration/

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment ("RoHS recast" or "RoHS 2").
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/content/dam/lenovo/site-design/esg-document-library/global/corp-policies/materials/Lenovo_Commitment_to_RoHS.pdf

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site service for parts and labor and includes free telephone support 8am â€“ 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Materials Used

75% Recycled Aluminum A Cover
30% PCC Plastic C Cover
30% PCC Plastic D Cover
90% PCC Plastic 140W Slim AC Adapter
Low Temperature Solder (SSD, fingerprint reader module, motherboard and FHD+)
Plastic free packaging with 90% recycled
and/or FSC certified content (standard/
bulk)

TCO Certification

TCO 10.0

Disclaimers

1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material

Table of Contents

SECTION I: SYSTEM OVERVIEW

CPU

Operating Systems

Memory

Storage

Video

Display

Camera

Keyboard

Touchpad / Fingerprint Reader

I/O – Ports and Connectors

Power Connector

Ethernet

WWAN

Near Field Communications

Audio

Power adapter

Security

Chassis Information

Packaging Parameters

Security & Serviceability

Operating Environment

SECTION II: SUPPORTED COMPONENTS

Supported Components

Memory

Storage

Removeable Media

Display Specifications

SSD Specifications

Solid State Storage Devices

Discrete Graphics Adapter

WLAN

Battery

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

EMC & Safety

Environmentals

Manageability