P1 Gen 9

Product Name

P1 Gen 9

Product Display Name

ThinkPad P1 Gen 9

Information Date

16-Mar-26

Description

Designed with the mobile-first user in mind, the Lenovo ThinkPad P1 is the perfect combination of workstation know-how, ultra-premium performance, AI-readiness, and true mobility for creative professionals, engineers, and high-level executives.

Processor Support

Intel Core Ultra Series 3 – H-Series (35W)

Type

BGA

Preloaded

Windows 11 Pro 64-bit
Windows 11 Home 64-bit
Windows 11 Home Single Language 64-bit
Windows 11 Home Chinese Language Edition 64-bit
Ubuntu Linux 24.04
Fedora 42
No Operating System

Supported

Ubuntu Linux 24.04 Cert only
Red Hat Enterprise Linux (RHEL) 10.2
Debian 13.x qualification (not for limited configurations only)

Number of DIMM Slots

n/a

Channels

Dual Channel

Type

LPDDR5 LPCAMM2

ECC Support

No

Speed

Up to 9600MT/s

Max DIMM LPCAMM2 Size

96GB

Max System Memory

96GB

Min System Memory

16GB

Soldered Memory

None

Disclaimers

Memory spec frequency listed; system support frequency
may vary by configuration
No ECC memory

Storage Slots

2x M.2 2280

SATA

No

PCIe

Solid State Drive, 2x OPAL2 PCIe NVMe M.2 – TLC

SAS

None

Interface

PCIe Gen 5 Performance or Gen 4 Value

Security

OPAL2 for NVMe SSD

Optional Hard Disk Drive Controllers

None

Disclaimers

Two slots total. Of total two, one is Gen 5 and the other is Gen 4. Regarding Gen 4 slot, if Gen 5 drives are used in Gen 4 slots, they will run at speeds lower than Gen 5, but faster than Gen 4.

Dual slot storage unavailable with WWAN. Limited to single slot only

Integrated Graphics

Intel® Arc™ Pro Graphics 12Xe (leveraged alone without discrete graphics)
Intel® Graphics 4Xe (leveraged via “Hybrid Mode” in BIOS together with discrete graphics)

Discrete Graphics

NVIDIA® RTX™ PRO 1000 Blackwell, NVIDIA® RTX™ PRO 2000

Adapter

None

Bus Interface

PCI Express 5.0

Resolutions

WUXGA (FHD+) / WQUXGA (UHD+) / 3.2k T-OLED Touch

Resolution

5MP RGB + IR Hybrid Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes

Number of Keys

US : 84 / UK : 85 / JP :89

Numpad

No

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

2026 Full size KB without NumPad (Bottom loading)

Key stroke

1.5mm

Key pitch

19.05 mm (Vertical & Horizontal)

Keyboard backlight

Yes

Keyboard thickness

4.0mm

TrackPoint Details

4.6 mm TrackPoint w/ TTS

Finger Print Reader Model

MoC – integrated with Power button with discrete LED

Multi-Touch

Yes

Resolution

1000 ppi

TrackPad/Haptic TouchPad thickness

3.65mm

TrackPad/Haptic TouchPad type

Haptic TouchPad

TrackPad size

135mm x 85mm

TrackPad material/finish

Glass surface

USB

1x USB-A (10Gbps)

Thunderbolt

1x USB-C (Thunderbolt™ 4)
2x USB-C (Thunderbolt™ 5)

HDMI

1x HDMI 2.1

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated SD Express 7.0 Card Reader (Backwards compatible with UHS-II & UHS-I at UHS-I speeds) (MMC,SD,SDHC SDXC)

Smart Card Reader

None

Power Connector

DC-In via USB-C® PD 3.1 (any Type-C port)

Docking Port

Docking Via USB-C® PD 3.1 (any Type-C port)

VirtualLink

None

Network adapter

No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter

Disclaimers

HDMI 2.1: up to 8K@60Hz or 4K@120Hz

Main

DC-In via USB-C® PD 3.1 (any Type-C port)

USB-C

see above

Disclaimers

Fast Charge via 140W charger

Vendor

N/A

Count

N/A

EEPROM

N/A

Speeds

N/A

Functions

N/A

Connectors

No native RJ-45 port

Disclaimers

RJ-45 functionality provided via USB-C® to Ethernet Adapter

Model

5G: Foxconn Snapdragon X61 5G Modem-RF
System 5G sub-6GHz CAT20

Disclaimers

WWAN & WWAN Ready are exclusive with second SSD. WWAN can only be had on single SSD configs
WWAN Ready not available for PRC

Model

Foxconn NXP NPC300 NFC

Vendor

Realtek

Type

Intel High Definition Audio (2 channel)

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3306 w/ Smart Amp

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1k/48k/96k/192kHz sample rate

Signal to Noise Ratio

Mic In: 95dB FSA
Headphone Out@32ohm: 100dB FSA

Analog Audio

None

Dolby Digital

Dolby ATMOS

Digital Out (S/PDIF)

No

Speaker Power Rating

Woofers: 4Ohm (2W)
Tweeters: 8Ohm (1W)

Type

140W Type-C PD 3.1 EPR
AC Adapter

Dimensions

(120 x 62.5 x 22mm)

Weight

Max 340g

Input Voltage

100-240V

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Format

16″ Clamshell

Color & Material

Black
Aluminum

Thermal Solutions

Internal Dual Fan, Flex Cooling, Intelligent Cooling, Dual by-pass design

Dimensions

Length
13.95 inches
354.4 millimeters

Width
9.49 inches
241.2 millimeters

Height
0.39 (front) / 0.62 (rear), 0.81 (max) inches
9.9 (front) / 15.8 (rear), 20.6 (max) millimeters

Weight

Starting weight: Coming Soon

Height (mm)

329mm

Height (inch)

12.95in

Width (mm)

518mm

Width (inch)

20.39in

Depth (mm)

80mm

Depth (inch)

3.14in

Weight (kgs)

3.2kgs

Weight (lbs)

7.05lbs

Hardware Maintenance Manual

P1 Gen 9 HMM

Drivers & Software

P1 Gen 9 Drivers & Software

Self Healing BIOS

Yes

Access Panel

Removable bottom cover

Number of Screws

6 captive screws

Swappable Components

Bottom cover, battery, 1x right side USB-C, M.2 Solid State Drive, LPCAMM2 memory module, speaker, WWAN module, SIM tray, pen

Storage Slots

2 slots

Memory Slots

0 (no slots for LPCAMM2)

System Board

n/a

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

None

Security Chip

Yes,TPM 2.0

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

Processor

Intel® Core™ Ultra 7 356H processor (P-cores up to 4.7 GHz)
Intel® Core™ Ultra 7 366H processor (P-cores up to 4.8 GHz)
Intel® Core™ Ultra X7 368H processor (P-cores up to 5.0 GHz)
Intel® Core™ Ultra 9 386H processor (P-cores up to 4.9 GHz)
Intel® Core™ Ultra X9 388H processor (P-cores up to 5.1 GHz)

Memory Support

LPDDR5x 9600MT/s LPCAMM2

Chipset (PCH)

OnPkg PCH-P

Size of BIOS Flash

64MB + 16MB

Super I/O

None

Clock

Crystal

Audio

Dolby Atmos

Ethernet

No native RJ-45 port

Disclaimers

RJ-45 functionality provided via USB-C® to Ethernet Adapter

System Capacity Options

16GB
32GB
64GB
96GB

Memory Types

16GB LPDDR5x 9600MT/s LPCAMM2
32GB LPDDR5x 9600MT/s LPCAMM2
64GB LPDDR5x 9600MT/s LPCAMM2
96GB LPDDR5x 9600MT/s LPCAMM2

Brand of Memory

Ramaxel
Micron
Samsung
SK Hynix

Memory Speed

9600MT/s

Disclaimers

Memory spec frequency listed; system support frequency
may vary by configuration
No ECC memory

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)

512GB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
4TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
UnionMem
SanDisk
Micron
Hynix

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Disclaimers

Two slots total. Of total two, one is Gen 5 and the other is Gen 4. Regarding Gen 4 slot, if Gen 5 drives are used in Gen 4 slots, they will run at speeds lower than Gen 5, but faster than Gen 4.

Dual slot storage unavailable with WWAN. Limited to single slot only

Media Card Reader Specifications

SD Express 7.0

Disclaimers

(Backwards compatible with UHS-II & UHS-I at UHS-I speeds) (MMC,SD,SDHC SDXC)

CPU

Intel® Core™ Ultra 7 356H processor (P-cores up to 4.7 GHz)

Intel® Core™ Ultra 7 366H processor (P-cores up to 4.8 GHz)

Intel® Core™ Ultra X7 368H processor (P-cores up to 5.0 GHz)

Intel® Core™ Ultra 9 386H processor (P-cores up to 4.9 GHz)

Intel® Core™ Ultra X9 388H processor (P-cores up to 5.1 GHz)

Integrated Graphics

Intel® Graphics 4Xe

Intel® Arc™ Pro Graphics 12Xe

Intel® Graphics 4Xe

Intel® Arc™ Pro Graphics 12Xe

# of Cores

4 P-cores and 8 E-cores

# of Threads

16

Max Turbo Frequency

P-cores up to 4.7 GHz

P-cores up to 4.8 GHz

P-cores up to 5.0 GHz

P-cores up to 4.9 GHz

P-cores up to 5.1 GHz

Cache

18 MB

TDP

35 W

Model

WUXGA IPS Non-Touch, Low Power

WQUXGA IPS Non-Touch

3.2k Tandem-OLED Touch

Resolution

FHD+ (1920 x 1200)

UHD+ (3840 x 2400)

3.2k (3200 x 2000)

Diagonal

16″

Aspect Ratio

16:10

Backlight

LED

N/A

PPI

142

283

236

Active Area

FHD+: 344.68mm x 215.42mm

UHD+: 344.678mm x 215.424mm

3.2k: 344.448mm x 215.280mm

Refresh Rate

Max 60Hz

40-120Hz VRR

Contrast Ratio

FHD+: 1200:1

UHD+: 1500:1

3.2k: 100,000:1

Viewing Angle

FHD+: 89/89/89/89 degree

UHD+: 85/85/85/85 degree

3.2k: 85/85/85/85 degree

Color gamut

100% sRGB

100% DCI-P3

Brightness

500 nits

800 nits

SDR 600 nits / HDR 1500 nits

HDR

N/A

HDR400
Dolby Vision

HDR600
Dolby Vision

Color Depth

FHD+: 16.7M (8-bit)

UHD+: 1064M (8-bit + 2 FRC)

3.2k: 1074M (8-bit + 2 FRC)

Interface

FHD+: eDP 1.4b

UHD+: eDP 1.4b

3.2k: eDP 1.4b

Panel ID Recognition

EDID in BIOS Table

Weight

320g max

330g max

199g max

Color Calibrator

X-Rite Factory Color Calibration

Panel Technology

IPS, Anti-Glare

Tandem-OLED, AGARAS

Touch Panel

None

Multi-Finger Touch Panel

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280-S3 PCIe

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Disclaimers

Two slots total. Of total two, one is Gen 5 and the other is Gen 4. Regarding Gen 4 slot, if Gen 5 drives are used in Gen 4 slots, they will run at speeds lower than Gen 5, but faster than Gen 4.

Dual slot storage unavailable with WWAN. Limited to single slot only

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280-S3

Interface Type

PCIe NVMe

Read/Write IOPS Specifications

Read: 600K (1TB), 450K (512GB)
Write: 500K (1TB,512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Read: 1500K (4TB/2TB), 1600K (1TB), 1000K (512GB)
Write: 1500K (4TB/2TB/1TB), 1200K (512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Bandwidth Performance

PCIe Gen4x4 Value – 512GB-1TB

PCIe Gen5x4 Performance – 512GB-4TB

Power Consumption (Max)

3.0A (duration for 10 us)

4.5A (duration for 10 us)

Active(AVG)

5W

10W

Idle

5mW (L1.2)

Min MTBF

2,000,000 (h)

Min Sequential Read

5000MB/s (1TB), 4800MB/s (512GB)

14000MB/s (4TB/2TB/1TB), 12000MB/s (512GB)

Min Sequential Write

4000MB/s (1TB/512GB)

12000MB/s (4TB/2TB), 11000MB/s (1TB), 6000MB/s (512GB)

Hardware Encryption

OPAL

Laptop GPUs

NVIDIA RTX PRO 1000 Blackwell Laptop GPU

NVIDIA RTX PRO 2000 Blackwell Laptop GPU

NVIDIA CUDA Processing Cores

2560

3328

NVIDIA RT Cores

4th Gen

Tensor Cores

5th Gen

GPU Memory

8GB

Peak Memory Bandwidth

384 GB/s

Memory Type

GDDR7

Memory Interface

128-bit

DisplayPort

2.1b

Open GL

4.6

Shader Model

6.8

DirectX

12.2

PCIe Generation

5

Single Precision Floating-Point Performance

13.6

17.7

Tensor Performance

440

572

NVIDIA FXAA/TXAA Anti-Aliasing

FXAA Yes / TXAA No

NVIDIA RTX Desktop Manager

Yes

Vulkan Support

Yes

NVIDIA Optimus

No

NVIDIA Max-Q Technology

Yes

NVENC/NVDEC

Yes

Model

Intel Wi-Fi 7 BE211 (Whale Peak 2) + BT6 (HW Ready)

Antenna Diversity

Supported

MIMO

Supported

Radio ON/OFF Control

Supported

Connector interface

M.2 CNVi

Operating Temperature (Adapter Shield)

0c to +50c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 11, Linux, Fedora

Wi-Fi Alliance

Wi-Fi CERTIFIED 7, Wi-Fi CERTIFIED 6 with Wi-Fi 6E, Wi-Fi CERTIFIED a/b/g/n/ac, WMM, WMM-PowerSave, WPA3, Protected Management Frames, Wi-Fi Direct, Wi-Fi Agile Multiband

IEEE WLAN Standard

IEEE 802.11-2020 and select amendments (selected feature coverage)
IEEE 802.11a, b, d, e, g, h, i, k, n, r, u, v, w, ac, ax, be; Fine Timing Measurement based on 802.11-2016, Wi-Fi Location R2 (802.11az) HW readiness

Roaming

Support seamless roaming between access points

Bluetooth

Bluetooth 6

Authentication Protocols

802.1X EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 – MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA’)

Encryption

128-bit AES-CCMP, 256-bit AES-GCMP

Regulatory

Please contact your local Lenovo representatives

US Government

FIPS 140-3

Product Safety

UL, C-UL, CB (62368-1)

Disclaimers

1) For more details, please refer to the Intel document as below.
https://www.intel.com/content/www/us/en/products/sku/230079/intel-wifi-7-be201/specifications.html
2) Bluetooth version may be limited by OS

Dimension

L: 306.9 mm*W: 59.0 mm*T 8.365 mm

Weight

MAX 351.9 g

Type (Chemistry and Cell)

Li-Polymer (4S1P), 4-cell

Voltage

15.6 V

Battery Capacity

90Wh

Charging Time

On Charge Time (0- 100%) * 120 min
Off Charge Time (0 – 80%) ** 60 min
Off Charge Time (0 – 100%) ** 120 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2016

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

No

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

No

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

But FW based ROM flash recovery is supported.

Keyboard-less Operation

Yes, if Remote wakeup is Wake on LAN from S4/S5.

Per-port Control

N/A

Adaptive Cooling

Yes, if it is I/O port enable/disable by BIOS Setup.

Security

Yes, if it is thermal & fan control.

Intel(R) AMT (includes ASF 2.0)

Yes, BIOS password / Hard disk password / Finger print

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

Yes. If you select vPro model

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Canada
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – United Kingdom
EMC – USA/Territories

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2025-0236
Section 9 – Low Halogen Scorecard

Homologation PCRB Compliant
In the following countries:Afghanistan, Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belize, Benin, Bermuda, Bolivia, Bosnia and Herzegovina, Botswana, Brazil – No Inmetro 170, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, Chile, China, Colombia, Comoros, Congo, Congo Dem. Republic, Costa Rica, Cote D'ivoire – Ivory Coast, Dijbouti, Dominica, Dominican Republic, Ecuador, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Guinea-Bissau, Guyana, Haiti, Honduras, Hong Kong, India, Indonesia, Iraq, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Kyrgyzstan, Laos, Lebanon, Lesotho, Liberia, Libya, Macau, Macedonia, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mayotte, Mexico, Moldova, Mongolia, Montenegro, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Rwanda, Saint Kitts and Nevis, Saint Lucia, San Marino, Sao Tome and Principe, Saudi Arabia, Senegal, Serbia, Sierra Leone, Singapore, Solomon Islands, South Africa, South Korea, Sri Lanka, Suriname, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Trinidad and Tobago, Tunisia, Turkiye, Turkmenistan, Uganda, Ukraine, United Arab Emirates, United Kingdom, Uruguay, USA/Territories, Uzbekistan, Vatican City Holy See, Venezuela, Vietnam, Wallis and Futuna, Yemen, Zambia, Zimbabwe

Energy Star

ENERGY STAR® Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Materials Used

90% Recycled Magnesium Aluminum C Cover
75% Recycled Aluminum A Cover
55% Recycled Aluminum D Cover
50% PCC Plastic D Cover (Attached Internal Components)
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
90% PCC Plastic 140W AC Adapter
46% Total PCC Plastic
Low Temperature Solder (SSD, fingerprint reader module)
Plastic Free Packaging with 90% Recycled and/or FSC Certified Content (standard)

TCO Certification

TCO 10.0

Disclaimers

1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material

Table of Contents

SECTION I: SYSTEM OVERVIEW

CPU

Operating Systems

Memory

Storage

Video

Display

Camera

Keyboard

TrackPad / Fingerprint Reader

I/O – Ports and Connectors

Power Connector

Ethernet

WWAN

Near Field Communications

Audio

Power adapter

Security

Chassis Information

Packaging Parameters

Security & Serviceability

Operating Environment

SECTION II: SUPPORTED COMPONENTS

Supported Components

Memory

Storage

Removeable Media

SECTION III: Supported Component Detail

CPU Specifications

Display Specifications

SSD Specifications

Solid State Storage Devices

Discrete Graphics Adapter

WLAN

Battery

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

EMC & Safety

Environmental

Manageability