Lenovo ThinkStation: PCs & Tablets
P1 Gen 8
Version: 1.0 | 10/16/2025
Product Name
P1 Gen 8
Product Display Name
ThinkPad P1 Gen 8
Information Date
5-Sep-25
Description
Designed with the mobile-first user in mind, the Lenovo ThinkPad P1 is the perfect combination of workstation know-how, ultra-premium performance, Artificial Intelligence ready, and true mobility. All new premier sustainable design, the ultimate in beauty and power.
Processor Support
Intel Core Ultra Series 2 – H-Series (35W) Core 5, 7, and 9
Type
BGA
Preloaded
Windows 11 Pro 64-bit (24H2)
Windows 11 Home 64-bit
Windows 11 Home Single Language 64-bit
Windows 11 Home Chinese Language Edition 64-bit
Ubuntu Linux 64-bit (Version 24.04)
Fedora 41 Linux (depending on NVIDIA open source driver status)
No Operating System
Supported
Ubuntu Linux 24.04 Cert only
Red Hat Enterprise Linux (RHEL) 9.6 (depending on NVIDIA open source driver status)
Debian 13 qualification (not for limited configurations only)
Number of DIMM Slots
n/a
Channels
Dual Channel
Type
LPDDR5 LPCAMM2
ECC Support
No
Speed
Up to 7467MT/s
Max DIMM LPCAMM2 Size
64GB
Max System Memory
64GB
Min System Memory
16GB
Soldered Memory
None
Disclaimers
No ECC memory on P1 Gen 8
Storage Slots
2x M.2 2280
SATA
No
PCIe
Solid State Drive, 2x OPAL2 PCIe NVMe M.2 – TLC
SAS
None
Interface
PCIe Gen 5 Performance or Gen 4 Value
Security
OPAL2 for NVMe SSD
Optional Hard Disk Drive Controllers
None
Disclaimers
Dual slot storage is available with all CPU & GPU options
Integrated Graphics
Processor Graphics Intel® Arc Pro Graphics
Utilized via “Hybrid Mode” in BIOS
Discrete Graphics
NV RTX PRO 1000 Blackwell, 2000 Blackwell
Adapter
None
Bus Interface
PCI Express 5.0
Resolutions
WUXGA (FHD+) / WQUXGA (UHD+) / 3.2k T-OLED Touch
Resolution
5MP RGB + IR Hybrid Camera
Frames per Second
30 fps
Focus
Fixed 50cm
Camera Interface
USB 2.0
IR Camera
Yes
Number of Keys
US : 84 / UK : 85 / JP :89
Numpad
No
Size
100% ISO
Function Key Features
Yes
Backlit
Yes
Keyboard size
2024 Full size KB without NumPad (Bottom loading)
Key stroke
1.5mm
Key pitch
19.05 mm (Vertical & Horizontal)
Keyboard backlight
Yes
Keyboard thickness
4.0mm
TrackPoint Details
CS22 4.8 mm TrackPoint w/ TTS
Finger Print Reader Model
Synaptics Metallica 8×8 FPR, MoC – integrated with Power button
Multi-Touch
Yes
Resolution
1000 ppi
TrackPad/Haptic TouchPad thickness
3.65mm
TrackPad/Haptic TouchPad type
Haptic TouchPad
TrackPad size
135mm x 85mm
TrackPad material/finish
Glass surface
USB
1x USB-A (10Gbps)
Thunderbolt
1x USB-C (Thunderbolt™ 4)
2x USB-C (Thunderbolt™ 5)
HDMI
1x HDMI 2.1
Audio Combo Jack
1x Microphone & Headphone Combo Jack (3.5mm)
Media Card Reader
Dedicated SD Express 7.0 Card Reader (Backwards compatible with UHS-I & UHS-II) (MMC,SD,SDHC SDXC)
Smart Card Reader
None
Power Connector
DC-In via USB-C® (Thunderbolt™ 5) PD 3.1
Docking Port
Docking Via USB-C® (Thunderbolt™ 5) PD 3.1
VirtualLink
None
Network adapter
No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter
Disclaimers
HDMI 2.1: Up to 8K/60Hz
Main
DC-In via USB-C® (Thunderbolt™ 5) PD 3.1
USB-C
see above
Disclaimers
normal charge via 100W and fast charge via 140W charger
Vendor
N/A
Count
N/A
EEPROM
N/A
Speeds
N/A
Functions
N/A
Connectors
No native RJ-45 port
Disclaimers
RJ-45 functionality provided via USB-C® to Ethernet Adapter
Model
N/A
Disclaimers
N/A
Model
Foxconn NXP NPC300 NFC
Disclaimers
NFC supported for EMEA only
Vendor
Realtek
Type
Intel High Definition Audio (2 channel)
Internal Speaker
2 channel
Connectors
Microphone & Headphone Combo Jack (3.5mm)
Chipset
ALC3306 w/ Smart Amp
Number of Channels
4-channel DAC, 4-channel ADC
Number of Bits/Audio Resolution
16/20/24-bit PCM format
Sampling Rate (Recording/Playback)
44.1k/48k/96k/192kHz sample rate
Signal to Noise Ratio
Mic In: 95dB FSA
Headphone Out@32ohm: 100dB FSA
Analog Audio
None
Dolby Digital
Dolby ATMOS
Digital Out (S/PDIF)
No
Speaker Power Rating
2W@4ohm/ch
Type
140W Type-C PD 3.1 EPR
AC Adapter
Dimensions
(120 x 62.5 x 22mm)
Weight
Max 340g
Input Voltage
100-240V
TPM
Version 2.0
Asset ID
Yes
vPro
Intel vPro for WS
Format
16″ Clamshell
Color & Material
Black
Aluminum
Thermal Solutions
Internal Dual Fan, Flex Cooling, Intelligent Cooling, Dual by-pass design, Liquid Metal Cooling
Dimensions
Length
13.95 inches
354.30 millimeters
Width
9.49 inches
241.00 millimeters
Height
0.39 (front) / 0.62 (rear), 0.81 (max) inches
9.9 (front) / 15.8 (rear), 20.6 (max) millimeters
Weight
Starting weight: 1.84kgs/4.06lbs (T-OLED + UMA model)
Height (mm)
329mm
Height (inch)
12.95in
Width (mm)
518mm
Width (inch)
20.39in
Depth (mm)
80mm
Depth (inch)
3.14in
Weight (kgs)
3.2kgs
Weight (lbs)
7.05lbs
Hardware Maintenance Manual
P1 Gen 8 HMM
Drivers & Software
P1 Gen 8 Drivers & Software
Self Healing BIOS
Yes
Access Panel
Removable bottom cover
Number of Screws
6
Swappable Components
Bottom cover, battery, 1x right side USB-C, M.2 Solid State Drive, LPCAMM2 memory module, speaker, RTC battery
Storage Slots
2 slots
Memory Slots
0 (no slots for CAMM2)
System Board
n/a
Restore CD/DVD/USB Set
None, Restore Media available via Lenovo Customer Support Center
Cable Lock Support
Security-lock slot, Optional Kensington Cable Lock
Power-On Password
Yes
Hard Disk Password
Yes; User and Master hard disk password
Supervisor Password
Yes
NIC LEDs (integrated)
None
Security Chip
Yes (for TPM 2.0)
Access Panel Key Lock
Bottom Cover Tamper Detection
Boot Sequence Control
Yes
Operating – Air Temperature
At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)
Non Operating – Air Temperature
At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)
Humidity
Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)
Corrosive Gas
G1
Particulates
P1
Processor
Intel® Core™ Ultra 5 235H processor (E-cores up to 4.4 GHz P-cores up to 5.0 GHz)
Intel® Core™ Ultra 7 255H processor (E-cores up to 4.4 GHz P-cores up to 5.1 GHz)
Intel® Core™ Ultra 7 265H processor (E-cores up to 4.5 GHz P-cores up to 5.3 GHz)
Intel® Core™ Ultra 9 285H processor (E-cores up to 4.5 GHz P-cores up to 5.4 GHz)
Memory Support
LPDDR5x 7467MT/s LPCAMM2
Chipset (PCH)
OnPkg PCH-P
Size of BIOS Flash
64MB + 16MB
Super I/O
None
Clock
Crystal
Audio
Dolby Atmos
Ethernet
No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter
System Capacity Options
16GB
32GB
64GB
Memory Types
16GB LPDDR5x 7467MT/s LPCAMM2
32GB LPDDR5x 7467MT/s LPCAMM2
64GB LPDDR5x 7467MT/s LPCAMM2
Brand of Memory
Samsung
Ramaxel
Micron
Memory Speed
7467MT/s
Disclaimers
No ECC memory on P1 Gen 8
2.5″ SAS Hard Disk Drive (HDD)
None
2.5″ SATA Hard Disk Drive (HDD)
None
2.5″ SATA Solid State Drive (SSD)
None
M.2 (NGFF) PCIe Solid State Drive (SSD)
256GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
4TB OPAL2 PCIe 5×4 Performance TLC (M.2 2280-S3)
2.5″ PCIe Solid State Drive (SSD)
None
Brand of Drive
SanDisk
Micron
Samsung
UnionMem
Hynix
Kioxia
Intel Optane Storage Technology
None
RAID
Optional, Selectable in BIOS
RAID Level and Requirements
RAID-0/1
Media Card Reader Specifications
SD Express 7.0
Disclaimers
Backwards compatible with UHS-I and UHS-II
CPU
Intel® Core™ Ultra 5 235H processor (E-cores up to 4.4 GHz P-cores up to 5.0 GHz)
Intel® Core™ Ultra 7 255H processor (E-cores up to 4.4 GHz P-cores up to 5.1 GHz)
Intel® Core™ Ultra 7 265H processor (E-cores up to 4.5 GHz P-cores up to 5.3 GHz)
Intel® Core™ Ultra 9 285H processor (E-cores up to 4.5 GHz P-cores up to 5.4 GHz)
Integrated Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
Intel® Arc Pro Graphics
# of Cores
4 P-cores and 8 E-cores
6 P-cores and 8 E-cores
6 P-cores and 8 E-cores
6 P-cores and 8 E-cores
# of Threads
14
16
16
16
Processor Base Frequency
E-cores up to 1.8 GHz / P-cores up to 2.4 GHz
E-cores up to 1.5 GHz / P-cores up to 2.0 GHz
E-cores up to 1.7 GHz / P-cores up to 2.2 GHz
E-cores up to 2.7 GHz / P-cores up to 2.9 GHz
Max Turbo Frequency
E-cores up to 4.4 GHz / P-cores up to 5.0 GHz
E-cores up to 4.4 GHz / P-cores up to 5.1 GHz
E-cores up to 4.5 GHz / P-cores up to 5.3 GHz
E-cores up to 4.5 GHz / P-cores up to 5.4 GHz
Cache
18 MB
24 MB
24 MB
24 MB
TDP
35 W
35 W
35 W
35 W
Model
WUXGA IPS Non-Touch, Low Power
WQUXGA IPS Non-Touch
3.2k Tandem-OLED Touch
Resolution
FHD+ (1920 x 1200)
UHD+ (3840 x 2400)
3.2k (3200 x 2000)
Diagonal
16″
16″
16″
Aspect Ratio
16:10
16:10
16:10
Backlight
LED
LED
N/A
PPI
142
283
236
Active Area
FHD+: 344.68mm x 215.42mm
UHD+: 344.678mm x 215.424mm
3.2k: 344.448mm x 215.280mm
Refresh Rate
Max 60Hz
Max 60Hz
40-120Hz VRR
Contrast Ratio
FHD+: 1200:1
UHD+: 1500:1
3.2k: 100,000:1
Viewing Angle
FHD+: 89/89/89/89 degree
UHD+: 85/85/85/85 degree
3.2k: 85/85/85/85 degree
Color gamut
100% sRGB
100% DCI-P3
100% DCI-P3
Brightness
500 nits
800 nits
SDR 600 nits / HDR 1500 nits
HDR
N/A
HDR400
Dolby Vision
HDR600
Dolby Vision
Color Depth
FHD+: 16.7M (8-bit)
UHD+: 1064M (8-bit + 2 FRC)
3.2k: 1074M (8-bit + 2 FRC)
Interface
FHD+: eDP 1.4b
UHD+: eDP 1.4b
3.2k: eDP 1.4b
Panel ID Recognition
EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
Weight
320g max
330g max
199g max
Color Calibrator
X-Rite Factory Color Calibration
X-Rite Factory Color Calibration
X-Rite Factory Color Calibration
Panel Technology
IPS, Anti-Glare
IPS, Anti-Glare
Tandem-OLED, AGARAS
Touch Panel
None
None
Multi-Finger Touch Panel
2.5″ SATA Solid State Drive (SSD)
N/A
M.2 (NGFF) PCIe Solid State Drive (SSD)
2x M.2 2280-S3 PCIe
2.5″ PCIe Solid State Drive (SSD)
N/A
Intel Optane Storage Technology
N/A
Supported Types
M.2
M.2
Dimensions inches/centimeters (W x D x H)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
Size
M.2 2280-S3
M.2 2280-S3
Interface Type
PCIe NVMe
PCIe NVMe
Read/Write IOPS Specifications
Read: 600K (1TB), 450K (512GB), 250K (256GB)
Write: 500K (1TB,512GB), 400K (256GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.
Read: 1500K (4TB/2TB), 1200K (1TB), 1000K (512GB)
Write: 1500K (4TB/2TB/1TB), 1200K (512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.
Bandwidth Performance
PCIe Gen4x4 Value – 256GB-1TB
PCIe Gen5x4 Performance – 512GB-4TB
Power Consumption (Max)
3.0A (duration for 10 us)
4.5A (duration for 10 us)
Active(AVG)
5W
10W
Idle
5mW (L1.2)
5mW (L1.2)
Min MTBF
2,000,000 (h)
2,000,000 (h)
Min Sequential Read
5000MB/s (1TB), 4800MB/s (512GB), 4000MB/s (256GB)
14000MB/s (4TB/2TB/1TB), 11000MB/s (512GB)
Min Sequential Write
4000MB/s (1TB/512GB), 2000MB/s (256GB)
12000MB/s (4TB/2TB), 11000MB/s (1TB), 5500MB/s (512GB)
Hardware Encryption
OPAL
OPAL
Laptop GPUs
NVIDIA RTX PRO 1000 Blackwell Laptop GPU
NVIDIA RTX PRO 2000 Blackwell Laptop GPU
NVIDIA CUDA Processing Cores
2560
3328
NVIDIA RT Cores
(4th Gen)
(4th Gen)
Tensor Cores
(5th Gen)
(5th Gen)
GPU Memory
8GB
8GB
Peak Memory Bandwidth
384 GB/s
384 GB/s
Memory Type
GDDR7
GDDR7
Memory Interface
128-bit
128-bit
DisplayPort
2.1b
2.1b
Open GL
4.6
4.6
Shader Model
7
7
DirectX
12 Ultimate
12 Ultimate
PCIe Generation
5
5
Single Precision Floating-Point Performance
13.6
17.7
Tensor Performance
193
231.6
NVIDIA FXAA/TXAA Anti-Aliasing
Yes
Yes
NVIDIA RTX Desktop Manager
No
No
Vulkan Support
Yes
Yes
NVIDIA Optimus
Yes
Yes
NVIDIA Max-Q Technology
Yes
Yes
NVENC/NVDEC
Yes
Yes
Model
Intel Wi-Fi 7 BE201 (Fillmore Peak 2) + BT5.4 (HW Ready)
Antenna Diversity
Supported
MIMO
Supported
Radio ON/OFF Control
Supported
Connector interface
M.2 PCIe
Operating Temperature (Adapter Shield)
0c to +80c
Humidity Non-Operating
50%~90% Rh non condensing (at temperatures of 25c to 35c)
Operating Systems
Microsoft Windows 11, Linux, Fedora
Wi-Fi Alliance
Wi-Fi CERTIFIED 7, Wi-Fi CERTIFIED 6 with Wi-Fi 6E, Wi-Fi CERTIFIED a/b/g/n/ac, WMM, WMM-PowerSave, WPA3, Protected Management Frames, Wi-Fi Direct, Wi-Fi Agile Multiband
IEEE WLAN Standard
IEEE 802.11-2020 and select amendments (selected feature coverage)
IEEE 802.11a, b, d, e, g, h, i, k, n, r, u, v, w, ac, ax, be; Fine Timing Measurement based on 802.11-2016, Wi-Fi Location R2 (802.11az) HW readiness
Roaming
Support seamless roaming between access points
Bluetooth
Bluetooth 5.4
Authentication Protocols
802.1X EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 – MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA’)
Encryption
128-bit AES-CCMP, 256-bit AES-GCMP
Regulatory
For a list of country approvals, please contact your local Intel representatives
US Government
FIPS 140-3
Product Safety
UL, C-UL, CB (62368-1)
Disclaimers
1) For more details, please refer to the Intel document as below.
https://www.intel.com/content/www/us/en/products/sku/230078/intel-wifi-7-be200/specifications.html
2) Bluetooth version may be limited by OS
Dimension
L: 306.9 mm*W: 59.0 mm*T 8.365 mm
Weight
MAX 351.9 g
Type (Chemistry and Cell)
Li-Polymer (4S1P), 4-cell
Voltage
15.6 V
Battery Capacity
90Wh
Charging Time
On Charge Time (0- 100%) * 120 min
Off Charge Time (0 – 80%) ** 60 min
Off Charge Time (0 – 100%) ** 120 min
Operating Temperature Range
between 10°C (50°F) and 35°C (95°F)
Warranty
1 Year / 3 Year Available
Coin Cell Battery (Model)
CR2016
WMI Support
Yes, if it is BIOS Setup change by WMI.
ROM-Based Setup Utility (F1)
Yes
Bootblock Recovery
No
Replicated Setup
Yes, it supported with SRSETUP tool.
Boot Control
Yes, it means Boot order change.
Discrete Mode
No
Memory Change Alert
N/A
Thermal Alert
N/A
Asset Tag
Yes
System/Emergency ROM Flash Recovery with Video
N/A
But FW based ROM flash recovery is supported.
Remote Wakeup/Remote Shutdown
Yes, if Remote wakeup is Wake on LAN from S4/S5.
Keyboard-less Operation
N/A
Per-port Control
Yes, if it is I/O port enable/disable by BIOS Setup.
Adaptive Cooling
Yes, if it is thermal & fan control.
Security
Yes, BIOS password / Hard disk password / Finger print
Intel(R) AMT (includes ASF 2.0)
Yes. If you select vPro model
Intel(R) TXT
Yes. If you select vPro model
Memory Modes
N/A
UEFI
UEFI 2.9A (UEFI version is returned as 2.7 but BIOS supports UEFI 2.9A)
EMC
Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – United Kingdom
EMC – USA/Territories
Safety
To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com
Low Halogen Declaration of Conformance
TNOT-2025-0236
Section 9 – Low Halogen Scorecard
Homologation PCRB Compliant
In the following countries:Afghanistan, Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belize, Benin, Bermuda, Bolivia, Bosnia and Herzegovina, Botswana, Brazil – No Inmetro 170, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, Chile, China, Colombia, Comoros, Congo, Congo Dem. Republic, Costa Rica, Cote D'ivoire – Ivory Coast, Dijbouti, Dominica, Dominican Republic, Ecuador, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Guinea-Bissau, Guyana, Haiti, Honduras, Hong Kong, India, Indonesia, Iraq, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Kyrgyzstan, Laos, Lebanon, Lesotho, Liberia, Libya, Macau, Macedonia, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mayotte, Mexico, Moldova, Mongolia, Montenegro, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Rwanda, Saint Kitts and Nevis, Saint Lucia, San Marino, Sao Tome and Principe, Saudi Arabia, Senegal, Serbia, Sierra Leone, Singapore, Solomon Islands, South Africa, South Korea, Sri Lanka, Suriname, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Trinidad and Tobago, Tunisia, Turkiye, Turkmenistan, Uganda, Ukraine, United Arab Emirates, United Kingdom, Uruguay, USA/Territories, Uzbekistan, Vatican City Holy See, Venezuela, Vietnam, Wallis and Futuna, Yemen, Zambia, Zimbabwe
Energy Star
ENERGY STAR® Version 9.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov
EPEAT
EPEAT Certification Available on select models
IT ECO declaration
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
Hazardous Substances
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication
Industry Standard Specifications
This product meets the following industry standard specifications for manageability functionality:
Remote Manageability Software Solutions
Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)
System Software Manager
Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Service, Support, and Warranty
On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
Materials Used
90% Recycled Magnesium C Cover
55% Recycled Aluminum D Cover
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
30% PCC Plastic 135W & 170W AC Adapter
Low Temperature Solder (SSD, fignerprint reader module)
Plastic free packaging with 90% recycled and/or FSC certified content (standard)
TCO Certification
TCO 10.0
Disclaimers
1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material
