ThinkStation P620

Version: 1.0 | 08/21/2020

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Hardware Maintenance Manual

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Drivers & Software

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SECTION I: Platform Overview

Description

Introducing the new ThinkStation P620. The first ever AMD Ryzen Threadripper PRO powered workstation offers stunning performance with up to 64 cores and up to 4.0GHz. Perfect for those who demand more power for today’s multithreaded pplications, the P620 combines Lenovo’s legendary reliability and customerdriven innovation with professional manageability and enterprise-class support.

CPU

Processor Support

AMD Castle Peak Workstation Processor

Socket Type

Socket-SP3 (SM-LGA)

Operating Systems

Preloaded

Windows 10 Pro 64-bit
Ubuntu 20.04 LTS (configuration specific)

Supported

Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.2

Memory

Slots

Up to 8 DIMMs

Channels

Supports up to 8 DIMM Sockets, 8 Channels

Type

288-Pin, 3200MHz ECC RDIMM

ECC Support

Yes

Speed

Up to 3200MHz

Max DIMM Size

64GB

Max System Memory

512GB

Storage

Total Bays/Size

4 x 3.5″

SATA

6 x SATA Connectors, Gen 3

PCIe

2 x M.2 PCIe Connectors Onboard, Gen 4
Additional M.2 NVMe Drives Supported by Single Adapters

eSATA

1 x eSATA Connector, Gen 3

Disclaimers

Additional parts/enclosures may be required for some configurations

Video

Integrated Graphics

Not Available

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slot 1

PCIe 4.0 x16, Full Height, Full Length, 75W, Without Latch

Slot 2

PCIe 4.0 x8, Full Height, Full Length, 25W, Open-Ended

Slot 3

PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch

Slot 4

PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch

Slot 5

PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch

Slot 6

PCIe 4.0 x8, Full Height, Full Length, 25W, Open-Ended

Front I/O

USB

2 x USB 3.2 Gen 2 Type-C (15W)
1 x USB 3.2 Gen 2 Type-A (11W)
1 x USB 3.2 Gen 2 Type-A

Audio

1 x Front Stereo + MIC Headset

Media Card Reader

Optional: Front 15-in-1 Media Card Reader supporting SD-UHS-II (requires Flex module)

Flex Module

Flex Module: Supports Two 5.25″ Flex Bays With Several Options Integrated
• Up to Two 5.25” Slim ODD Cages
• Up to One 5.25” Slim ODD and HDD Cage (FBSE)
• Up to One Front Access Storage Enclosure (FASE)
• Up to Two Front Removable Drive Enclosure – M.2 (CRU)
• Up to One Flex Module for One or More of the Following Options:
– 9.0mm Optical/15-in-1 USB 3.1 Gen 1 Reader/Front USB 3.1 Gen 1 Type-C/Front eSATA
Note:
1. Only one 15-in-1 media card reader can be supported.
2. Only one USB 3.1 Gen 1 Type-C cable can be supported.
3. Only one front eSATA cable can be supported.

Disclaimers

Not all components above available concurrently in a single Flex module

Rear I/O

USB

4 x USB 3.2 Gen 2 Type-A
2 x USB 2.0 Type-A

Audio

3 x Rear (Line Out, Line In, MIC); Retaskable to 5.1

DisplayPort

As Supported by GPU

HDMI

As Supported by GPU

DVI

As Supported by GPU

VirtualLink

As Supported by GPU

VGA Port

As Supported by GPU

Serial Port

Optional 1 x Rear Port

Ethernet

1 x 10GbE – RJ45

PS/2

2 x PS/2

IEEE 1394

Not Available

eSATA

Optional PCIe Bracket

Parallel Port

Not Available

Optional USB Adapter

Not Available

Optional Network Adapter

Aquantia Single Port 10G Ethernet Adapter
PCI-E 1 x WiFi Card With BT HP External Antenna Kit (9260 AC)

Ethernet

Vendor

Marvell AQC107 10G Ethernet

Speeds

10G/5G/2.5G/1G/100Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Audio

Vendor

Realtek

Type

HD (5.1)

Internal Speaker

Yes

Connectors

3 x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)

Chipset

ALC4050

Number of Channels

6 (rear) + 2 (front)

Number of Bits/Audio Resolution

6 Channel DAC supports 16/20/24 bit PCM
Stereo ADC supports 16/20 bit PCM

Thermal

Temp Sensors

CPU VR Sensor – Thermal Diode – Connected to Super I/O
PCI Zone 1 Sensor – Thermal Thermistor – Connected to Super I/O
PCI Zone 2/Chipset Sensor – Thermal Thermistor – Connected to Super I/O
PCI Zone 3 Sensor – Thermal Diode – Connected to Super I/O
M.2 Sensor – Thermal Thermistor – Connected to Super I/O
Ambient Cabled Sensor – Thermal Diode – Connected to Super I/O
PSU Thermal Sensor – Thermal Thermistor – Connected to Super I/O

Fans

2 x CPU Fan 4-pin Header With 3-pin Key
1 x Rear System Fan 4-pin Header With 3-pin Key
1 x Front System Fan 4-pin Header With 3-pin Key
2 x ODD Bay Fan 4-pin Header With 3-pin Key (optional)
2 x Memory Fan 4-pin Header with 3-pin Key
1 x PSU Fan Main PSU Power Connector

Power Specifications

Power Supply

1000W

Power Efficiency

92% Efficient @ 50% Load

Main

C14

Operating Voltage Range

100 – 240V

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

9A-15A

Graphics

2 x 8 pin (6+2)
2 x 6 pin

Power Supply Fan

Yes

ENERGY STAR® Qualified (config dependent)

Yes

80 PLUS Compliant

Yes

Built-in Self Test (BIST) LED

Yes

Aux Power Drop

Yes

BIOS

Vendor

AMI

Chassis Information

Color

Graphite Black

PSU

1000W Available, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions

Two System Fans Standard (1 front, 1 rear), One PSU Fan, Two CPU Fans, Two MEM Fans

Dimensions

165mm/6.5″ W x 460mm/18.1″ D x 440mm/17.3″ H

Weight

24kg / 52.91lbs

Packaging Dimensions

Height (mm/in)

575mm / 22.64″

Width (mm/in)

302mm / 11.89″

Depth (mm)

580mm / 22.83″

Weight (kgs/lbs)

27.48kg / 60.58lbs

Disclaimers

Note: Actual Weight of the packaging will depend on the system configuration.

Security & Serviceability

TPM

Infineon SLB9670 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

NA

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

Unique Key Lock Kit – Optional
Common Key Lock Kit – Optional

Boot Sequence Control

Yes

Padlock Support

Not Supported

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Tool-less

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Retained With Screws

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 35G, 11ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time

SECTION II: Platform Detail

Board Size

13.44″ x 9.96″ (341.5mm x 253mm)

Layout

Custom ATX

Motherboard Core

Processor Support

AMD Castle Peak Workstation processor

Socket Type

Socket-SP3 (SM-LGA)

Memory Support

DDR4 up to 3200MHz RDIMM Memory

CPU-CPU Interconnect

N/A

Voltage Regulator

IR35204MTRPBF+TDA21475
IR35201MTRPBF+TDA21475

Chipset (PCH)

AMD 2019 Premium Chipset BXB-B

Flash

32MB

Super I/O

Nuvoton NCT6686D-L

Clock

AMD Integrated Clock

Audio

Realtek ALC4050H Codec on Motherboard
Realtek ALC4050 on Front Panel I/O

Ethernet

Marvell AQC10710Gb DASH

Supported Components

Processor Level

Castlepeak

Processor

AMD Threadripper Pro 3945WX 4.0GHz/12C/64M/3200/280W
AMD Threadripper Pro 3955WX 3.9GHz/16C/64M/3200/280W
AMD Threadripper Pro 3975WX 3.5GHz/32C/128M/3200/280W
AMD Threadripper Pro 3995WX 2.7GHz/64C/256M/3200/280W

Memory Type

RDIMMs – 3200MHz

Memory

16GB DDR4 ECC RDIMM PC4-3200
32GB DDR4 ECC RDIMM PC4-3200
64GB DDR4 ECC RDIMM PC4-3200

Storage

3.5″ SATA Hard Disk Drive (HDD)

1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)

M.2 PCIe Solid State Drive (SSD)

256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
256GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL

RAID

RAID Levels and Requirements

M.2 RAID via AMD CPU – supports RAID 0, 1
SATA RAID via Onboard AMD SATA Controller – supports RAID 0, 1, 5, 10

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.

Optical Drive/Removable Media

DVD-ROM Drive

DVD-ROM, 9.0mm Slim, SATA

DVD Burner/CD-RW Drive

DVD Burner/CD-RW Rambo, 9.0mm Slim, SATA

Blu-Ray Burner Drive

Blu Ray Burner w/AACS encryption, 9.0mm Slim, SATA

Media Card Reader Specifications

Optional Front USB 3.0 15-in-1 Media card reader supporting SD UHS-II (requires Flex module)

Keyboard and Pointing Devices

Keyboard

Traditional USB Keyboard
Traditional PS/2 Keyboard
Smart Card USB Keyboard
Calliope USB Keyboard

Pointing Devices

Calliope USB Mouse
Lenovo USB Laser Mouse
Fingerprint USB Mouse
PS/2 Optical Mouse

Expansion Bays

5.25″ External Access Bays

Flex Module: Supports Two 5.25″ Flex Bays With Several Options Integrated
• Up to Two 5.25” Slim ODD Cages
• Up to One 5.25” Slim ODD and HDD Cage (FBSE)
• Up to One Front Access Storage Enclosure (FASE)
• Up to Two Front Removable Drive Enclosure – M.2 (CRU)
• Up to One Flex Module for One or More of the Following Options:
– 9.0mm Optical/15-in-1 USB 3.1 Gen 1 Reader/Front USB 3.1 Gen 1 Type-C/Front eSATA
Note:
1. Only one 15-in-1 media card reader can be supported.
2. Only one USB 3.1 Gen 1 Type-C cable can be supported.
3. Only one front eSATA cable can be supported.

PCIe Adapters

Network

Marvell 10G Ethernet Adapter (single port)

WiFi Cards

 Intel PCIe WiFi Card With BT (9260 AC)

PCIe to M.2 Adapter Card

Single M.2 PCIe Adapter
Quad M.2 PCIe Adapter

SECTION III: Supported Component Detail

CPU Specifications

CPU

Ryzen Threadripper PRO 3995WX

Ryzen Threadripper PRO 3975WX

Ryzen Threadripper PRO 3955WX

Ryzen Threadripper PRO 3945WX

# of Cores

64

32

16

12

# of Threads

128

64

32

24

Processor Base Frequency

2.7GHz

3.5GHz

3.9GHz

4.0GHz

Max Turbo Frequency

4.2GHz

4.2GHz

4.3GHz

4.3GHz

Cache

256MB

128MB

64MB

64MB

TDP

280W

280W

280W

280W

HDD Specifications

Drive

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

4TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise)

3.5″ SATA Hard Disk Drive (HDD)

Yes

Yes

Yes

2.5″ SATA Hard Disk Drive (HDD)

Not Available

Not Available

Not Available

Connector

SATA

SATA

SATA

Transfer Rate (Gb/sec)

Average Data Rate, Read/Write 156MB/s

Maximum data transfer rate 220 MB/s

Maximum data transfer rate 215 MB/s

Spindle Speed (RPM)

7,200

7,200

7,200

Power Off to Spindle Stop (sec)

NA

NA

NA

DC Power to Drive Ready (sec)

<10.0

<17.0

<17.0

Average Latency (msec)

4.16

6

4.16

Input (VDC)

5

5

5

Typical (Watts)

6.19

6.7

7.35

Idle (Watts)

4.6

4.5

4.48

Physical Dimensions

101.6mm x 146.99mm x 19.88mm

101.6mm x 146.99mm x 20.2mm

101.85mm x 147mm x 26.1mm

Weight (grams)

420

415

649

Operating (C) Ambient

0 to 60

0 to 60

5 to 60

Operating (C) Base Casting

60

60

60

Non-Operating (C) Ambient

(-40 to 70)

(-40 to 70)

(-40 to 70)

Gradient (C per Hour)

20

20

20

Operating (Gs @ 2ms)

70

80

Read 70 Gs / Write 40 Gs

Non-Operating (Gs @ 2ms)

350

350

300

Solid State Storage Specifications

Drive

2048GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280

1024GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280

512GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280

256GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280

1024GB NVMe M.2 SSD TLC

Dimensions Millimeters (W x D x H)

X

X

X

X

22 x 80 x 2.3

Interface Type

X

X

X

X

PCIe Gen 3 x4 NVMe

Power Active (AVG)

X

X

X

X

5W

Power Idle

X

X

X

X

50mW

Typical Sequential Read

X

X

X

X

3200MB/s

Typical Sequential Write

X

X

X

X

1600MB/s

Operating Temperature Range

X

X

X

X

0 to 55°C

Endurance Rating (Lifetime Writes)

X

X

X

X

300TB

Mean Time Between Failures (MTBF)

X

X

X

X

2.0M POH

Hardware Encryption

X

X

X

X

AES 256-bit

Solid State Storage Specifications

Drive

512GB NVMe M.2 SSD TLC

256GB NVMe M.2 SSD TLC

Dimensions Millimeters (W x D x H)

22 x 80 x 2.3

22 x 80 x 2.3

Interface Type

PCIe Gen 3 x4 NVMe

PCIe Gen 3 x4 NVMe

Power Active (AVG)

5W

5W

Power Idle

50mW

50mW

Typical Sequential Read

3200MB/s

3000MB/s

Typical Sequential Write

1600MB/s

1300MB/s

Typical Random Read (4GB Span)

340K IOPS

205K IOPS

Typical Random Write (4GB Span)

275K IOPS.

260K IOPS.

Operating Temperature Range

0 to 55°C

0 to 55°C

Endurance Rating (Lifetime Writes)

150TB

85TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

Hardware Encryption

AES 256-bit

AES 256-bit

HDD Controllers

PCI Bus

PCIe Gen4

PCI Modes

RAID, AHCI

RAID Levels

0, 1, 5, 10, Volume and RAIDable

Data Transfer Rates

AMD RAIDXpert2 (OS)
RAID and PD operations in BIOS

PCI Card Type

SATA 6Gbs
NVMe 16Gbs

PCI Voltage

Onboard AMD controller (Bixby)

Disclaimers

SATA, M.2 NVMe

Optical Drive Specifications

Description

DVD-ROM, 9.0mm Slim

DVD Burner/CD-RW Rambo, 9.0mm Slim

Blu Ray Burner w/AACS encryption, 9.0 slim

Interface Type

SATA

SATA

SATA

Discrete Graphics Adapter

Adapter

Quadro P620

Quadro P1000

Quadro P2200

Quadro RTX 4000

Quadro RTX 5000

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

Display Interface

4 x mDP 1.4

4 x mDP 1.4

4 x DP 1.4

3 x DP 1.4
1 x VirtualLink

4 x DP 1.4
1 x VirtualLink

Graphics Chipset

Pascal

Pascal

Pascal

Turing

Turing

Memory Clock Frequency (MHz)

1252MHz

1253MHz

1251MHz

1625MHz

1750MHz

Memory Size

2GB GDDR5

4GB GDDR5

5GB GDDR5X

8GB GDDR6

16GB GDDR6

Memory Interface

128-bit

128-bit

160-bit

256-bit

256-bit

Memory Bandwidth

Up to 80GB/s

Up to 82GB/s

Up to 200GB/s

Up to 416GB/s

Up to 448GB/s

GPU Cores

CUDA Cores: 512

CUDA Cores: 640

CUDA Cores: 1280

CUDA Cores: 2304
Tensor Cores: 288
RT Cores: 36

CUDA Cores: 3072
Tensor Cores: 384
RT Cores: 48

GPU Core Frequency (MHz)

1266MHz

1266MHz

1000MHz

1005MHz

1620MHz

Maximum Power Consumption

40W

47W

75W

Total board power: 160W
Total graphics power: 125W

Total board power: 265W
Total graphics power: 230W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz

4 x 3840×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
4 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Dimension

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

4.4″ H x 7.9″ L
Single Slot

4.4″ H x 9.5″ L
Single Slot

4.4″ H x 10.5″ L
Dual Slot, Full Height

Advanced Display

Not Available

Not Available

Not Available

SYNC 2

SYNC 2

SLI/NVLink Support

Not Available

Not Available

Not Available

Not Available

NVLink

Discrete Graphics Adapter

Adapter

Quadro RTX 6000

Quadro RTX 8000

Quadro GV100

AMD Radeon Pro WX3200

AMD Radeon Pro W 5500

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 4.0 x16

Display Interface

4 x DP 1.4
1 x VirtualLink

4 x DP 1.4
1 x VirtualLink

4 x DP 1.4

4 x mDP 1.4

4 x DP 1.4

Graphics Chipset

Turing

Turing

Volta

Polaris

RDNA

Memory Clock Frequency (MHz)

1750MHz

1750MHz

858MHz

X

X

Memory Size

24GB GDDR6

48GB GDDR6

32GB HBM2

4GB GDDR5

8GB GDDR6

Memory Interface

384-bit

384-bit

4096-bit

128-bit

128-bit

Memory Bandwidth

Up to 672GB/s

Up to 672GB/s

Up to 870GB/s

96GB/s

224 GB/s

GPU Cores

CUDA Cores: 4608
Tensor Cores: 576
RT Cores: 72

CUDA Cores: 4608
Tensor Cores: 576
RT Cores: 72

CUDA Cores: 5120
Tensor Cores: 640

640

1408

GPU Core Frequency (MHz)

1440MHz

1395MHz

1132MHz

X

X

Maximum Power Consumption

Total board power: 295W
Total graphics power: 260W

Total board power: 295W
Total graphics power: 260W

250W

50W

125W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 3840 x 2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 1920×1080 @ 60Hz
4 x 3840×2160 @ 60Hz
2 x 5120×2880 @ 60Hz
1 x 7680×4320 @ 60Hz

4 x 1920×1080 @ 60Hz 4 x 3840×2160 @ 60Hz 2 x 5120×2880 @ 60Hz 2 x 7680×4320 @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

X

X

Dimension

4.4″ H x 10.5″ L
Dual Slot, Full Height

4.4″ H x 10.5″ L
Dual Slot, Full Height

4.4″ H x 10.5″ L
Dual Slot, Full Height

2.7″ H x 6.6″ L Single Slot, Half Height

4.4″ H x 9.5″ L Single Slot, Full Height

Advanced Display

SYNC 2

SYNC 2

Not Available

Not Available

Not Available

SLI/NVLink Support

NVLink

NVLink

NVLink

Not Available

Not Available

Discrete Graphics Adapter

Adapter

AMD Radeon Pro W 5700

Bus Interface

PCIe 4.0 x16

Display Interface

5 x mDP 1.4

Graphics Chipset

RDNA

Memory Size

8GB GDDR6

Memory Interface

256-bit

Memory Bandwidth

448 GB/s

GPU Cores

2304

Maximum Power Consumption

205W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

6 x 1920×1080 @ 60Hz
6 x 3840×2160 @ 60Hz
3 x 5120×2880 @ 60Hz
3 x 7680×4320 @ 60Hz

Dimension

4.4″ H x 10.5″ L
Double Slot, Full Height

Advanced Display

Not Available

SLI/NVLink Support

Not Available

Ethernet

Model

Marvell AQC-107 (Onboard LOM)

AQN-107 Optional PCIe AIC

Description

Five speed 10GBASE-T LAN on Motherboard NIC

Five speed 10GBASE-T LAN on Motherboard NIC

Connector

RJ-45 Copper

RJ-45 Copper

Controller Bus Architecture

PCIe Gen3 x4

PCIe Gen3 x4

Data Transfer Mode

Ethernet

Ethernet

DMTF DASH

Supported

Not Supported

Data Rates Supported

100Mbs, 1Gbs, 2.5Gbs, 5Gbs, 10Gbs

100Mbs, 1Gbs, 2.5Gbs, 5Gbs, 10Gbs

5GBASE-T (IEEE 802.3 specification conformance)

Supported

Supported

2.5GBASE-T (IEEE 802.3 specification conformance)

Supported

Supported

10GBASE-T (IEEE 802.3 specification conformance)

Supported

Supported

100BASE-TX (IEEE 802.3 specification conformance)

Supported

Supported

1000BASE-T (IEEE 802.3 specification conformance)

Supported

Supported

Auto-Negotiation

Supported

Supported

Power Optimizer Platform Low-power Management Systems

N/A

N/A

MACsec IEEE 802.1 AE

Supported

Supported

Energy Efficient Ethernet

Supported

Supported

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Receive Side Scaling

Supported

Supported

Dual Tx and Rx Queues

Supported

Supported

Quality of Service (QoS) and Data Center Bridging (DCB)

Up to 8 QoS traffic classes

Up to 8 QoS traffic classes

Jumbo Frames (up to 9KB)

Supported (Up to 16KB)

Supported, Up to 9KB frames

Teaming

No

Yes(?)

Integrated Auto Connect Battery Saver (ACBS) Battery Savings

N/A

N/A

Timing and Synchronization

IEEE 1588 Ver1 & Ver2 (AVB)
NTP Ver3 & Ver4
SNTP Ver4

IEEE 1588 Ver1 & Ver2 (AVB)
NTP Ver3 & Ver4
SNTP Ver4

Integrated Switched Voltage Regulator (iSVR)

N/A

N/A

NC Sideband Interface

SMBus

SMBus

Shared Flash with System BIOS

No

No

Wake from Deep Sx

Supported

Supported

Wake on LAN (Magic Packet, PING, Pattern)

Supported

Supported

Operating System Support

Win10 and Linux 8

Win10 and Linux 8

Manageability Capabilities Alerting

ASF 1.0 and 2.0

ASF 1.0 and 2.0

Network Proxy/ARP Support

Supported

Supported

TDP

108C

108C

Temperature Operating range

0-55C w/ no air flow

0-55C w/ no air flow

Power Consumption

6W @ 10Gbs
4W @5Gbs

6W @ 10Gbs
4W @5Gbs

IEEE Standards Compliance

IEEE 802.3bz – NBASE-T
IEEE 802.3x – Flow Control
IEEE 802.1P – Quality of Service
IEEE 802.1QAV – AVB

IEEE 802.3bz – NBASE-T
IEEE 802.3x – Flow Control
IEEE 802.1P – Quality of Service
IEEE 802.1QAV – AVB

Boot ROM Support

UEFI (Unified Extensible Firmware Interface) 2.3/2.5
PXE (Preboot Execution Environment) 2.0

UEFI (Unified Extensible Firmware Interface) 2.3/2.5
PXE (Preboot Execution Environment) 2.1

Media Card Reader

Description

15-in-1 USB 3.0 Media Card Reader

Interface Type

Integrated into Front Panel

Form Factor

SD UHS-II, Compact Flash, SM

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery with Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.1

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

Regulations & Standards

EMC & Safety

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL
UL-GS
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Environmentals

Energy Star

ENERGY STAR® v8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

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