Version: 1.0 | 02/02/2021
Hardware Maintenance Manual
Drivers & Software
Description
Introducing the new ThinkStation P620. The first ever AMD Ryzen Threadripper PRO powered workstation offers stunning performance with up to 64 cores and up to 4.0GHz. Perfect for those who demand more power for today’s multithreaded pplications, the P620 combines Lenovo’s legendary reliability and customerdriven innovation with professional manageability and enterprise-class support.
Processor Support
AMD Castle Peak Workstation Processor
Socket Type
Socket-SP3 (SM-LGA)
Preloaded
Windows 10 Pro 64-bit
Ubuntu 20.04 LTS (configuration specific)
Supported
Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.3
Slots
Up to 8 DIMMs
Channels
Supports up to 8 DIMM Sockets, 8 Channels
Type
288-Pin, 3200MHz ECC RDIMM
ECC Support
Yes
Speed
Up to 3200MHz
Max DIMM Size
128GB
Max System Memory
1TB
Total Bays/Size
4 x 3.5″
SATA
6 x SATA Connectors, Gen 3
PCIe
2 x M.2 PCIe Connectors Onboard, Gen 4
Additional M.2 NVMe Drives Supported by Single Adapters
eSATA
1 x eSATA Connector, Gen 3
Disclaimers
Additional parts/enclosures may be required for some configurations
Integrated Graphics
Not Available
Discrete Graphics
PCIe Add-In-Card, Details in Section Below
Multi-GPU Support
Yes
Type
PCIe Add-In-Card
Bus Interface
PCIe x16
Slot 1
PCIe 4.0 x16, Full Height, Full Length, 75W, Without Latch
Slot 2
PCIe 4.0 x8, Full Height, Full Length, 25W, Open-Ended
Slot 3
PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch
Slot 4
PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch
Slot 5
PCIe 4.0 x16, Full Height, Full Length, 75W, With Latch
Slot 6
PCIe 4.0 x8, Full Height, Full Length, 25W, Open-Ended
USB
2 x USB 3.2 Gen 2 Type-C (15W)
1 x USB 3.2 Gen 2 Type-A (11W)
1 x USB 3.2 Gen 2 Type-A
Audio
1 x Front Stereo + MIC Headset
Media Card Reader
Optional: Front 15-in-1 Media Card Reader supporting SD-UHS-II (requires Flex module)
Flex Module
Flex Module: Supports Two 5.25″ Flex Bays With Several Options Integrated
• Up to Two 5.25” Slim ODD Cages
• Up to One 5.25” Slim ODD and HDD Cage (FBSE)
• Up to One Front Access Storage Enclosure (FASE)
• Up to Two Front Removable Drive Enclosure – M.2 (CRU)
• Up to One Flex Module for One or More of the Following Options:
– 9.0mm Optical/15-in-1 USB 3.1 Gen 1 Reader/Front USB 3.1 Gen 1 Type-C/Front eSATA
Note:
1. Only one 15-in-1 media card reader can be supported.
2. Only one USB 3.1 Gen 1 Type-C cable can be supported.
3. Only one front eSATA cable can be supported.
Disclaimers
Not all components above available concurrently in a single Flex module
USB
4 x USB 3.2 Gen 2 Type-A
2 x USB 2.0 Type-A
Audio
3 x Rear (Line Out, Line In, MIC); Retaskable to 5.1
DisplayPort
As Supported by GPU
HDMI
As Supported by GPU
DVI
As Supported by GPU
VirtualLink
As Supported by GPU
VGA Port
As Supported by GPU
Serial Port
Optional 1 x Rear Port
Ethernet
1 x 10GbE – RJ45
PS/2
2 x PS/2
IEEE 1394
Not Available
eSATA
Optional PCIe Bracket
Parallel Port
Not Available
Optional USB Adapter
Not Available
Optional Network Adapter
Aquantia Single Port 10G Ethernet Adapter
PCI-E 1 x WiFi Card With BT HP External Antenna Kit (9260 AC)
Vendor
Marvell AQC107 10G Ethernet
Speeds
10G/5G/2.5G/1G/100Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
1 x RJ45
Vendor
Realtek
Type
HD (5.1)
Internal Speaker
Yes
Connectors
3 x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
Chipset
ALC4050
Number of Channels
6 (rear) + 2 (front)
Number of Bits/Audio Resolution
6 Channel DAC supports 16/20/24 bit PCM
Stereo ADC supports 16/20 bit PCM
Temp Sensors
CPU VR Sensor – Thermal Diode – Connected to Super I/O
PCI Zone 1 Sensor – Thermal Thermistor – Connected to Super I/O
PCI Zone 2/Chipset Sensor – Thermal Thermistor – Connected to Super I/O
PCI Zone 3 Sensor – Thermal Diode – Connected to Super I/O
M.2 Sensor – Thermal Thermistor – Connected to Super I/O
Ambient Cabled Sensor – Thermal Diode – Connected to Super I/O
PSU Thermal Sensor – Thermal Thermistor – Connected to Super I/O
Fans
2 x CPU Fan 4-pin Header With 3-pin Key
1 x Rear System Fan 4-pin Header With 3-pin Key
1 x Front System Fan 4-pin Header With 3-pin Key
2 x ODD Bay Fan 4-pin Header With 3-pin Key (optional)
2 x Memory Fan 4-pin Header with 3-pin Key
1 x PSU Fan Main PSU Power Connector
Power Supply
1000W
Power Efficiency
92% Efficient @ 50% Load
Main
C14
Operating Voltage Range
100 – 240V
Rated Voltage Range
90-264VAC
Rated Line Frequency
47Hz / 63Hz
Operating Line Frequency Range
50Hz / 60Hz
Rated Input Current
9A-15A
Graphics
2 x 8 pin (6+2)
2 x 6 pin
Power Supply Fan
Yes
ENERGY STAR® Qualified (config dependent)
Yes
80 PLUS Compliant
Yes
Built-in Self Test (BIST) LED
Yes
Aux Power Drop
Yes
Vendor
AMI
Color
Graphite Black
PSU
1000W Available, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
Thermal Solutions
Two System Fans Standard (1 front, 1 rear), One PSU Fan, Two CPU Fans, Two MEM Fans
Dimensions
440mm/17.3″ H x 460mm/18.1″ D x 165mm/6.5″ W
Weight
24kg / 52.91lbs
Height (mm/in)
575mm / 22.64″
Width (mm/in)
302mm / 11.89″
Depth (mm)
580mm / 22.83″
Weight (kgs/lbs)
27.48kg / 60.58lbs
Disclaimers
Note: Actual Weight of the packaging will depend on the system configuration.
TPM
Infineon SLB9670 TPM 2.0
Asset ID
Yes, 1024 x 8bit
vPro
NA
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
Unique Key Lock Kit – Optional
Common Key Lock Kit – Optional
Boot Sequence Control
Yes
Padlock Support
Not Supported
Boot without keyboard and/or mouse
Yes
Access Panel
Tool-less Side Cover Removal
Optical Drive
Tool-less
Hard Drives
Tool-less
Expansion Cards
Tool-less
Processor Socket
Retained With Screws
Color coded User Touch Points
Yes
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained With Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Customer Support Center
Air Temperature
Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage
Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity
Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
Altitude
Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)
Vibration
Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock
Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 35G, 11ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time
Board Size
13.44″ x 9.96″ (341.5mm x 253mm)
Layout
Custom ATX
Processor Support
AMD Castle Peak Workstation processor
Socket Type
Socket-SP3 (SM-LGA)
Memory Support
DDR4 up to 3200MHz RDIMM Memory
CPU-CPU Interconnect
N/A
Voltage Regulator
IR35204MTRPBF+TDA21475
IR35201MTRPBF+TDA21475
Chipset (PCH)
AMD 2019 Premium Chipset BXB-B
Flash
32MB
Super I/O
Nuvoton NCT6686D-L
Clock
AMD Integrated Clock
Audio
Realtek ALC4050H Codec on Motherboard
Realtek ALC4050 on Front Panel I/O
Ethernet
Marvell AQC10710Gb DASH
Processor Level
Castlepeak
Processor
AMD Threadripper Pro 3945WX 4.0GHz/12C/64M/3200/280W
AMD Threadripper Pro 3955WX 3.9GHz/16C/64M/3200/280W
AMD Threadripper Pro 3975WX 3.5GHz/32C/128M/3200/280W
AMD Threadripper Pro 3995WX 2.7GHz/64C/256M/3200/280W
Memory Type
RDIMMs – 3200MHz
Memory
16GB DDR4 ECC RDIMM PC4-3200
32GB DDR4 ECC RDIMM PC4-3200
64GB DDR4 ECC RDIMM PC4-3200
3.5″ SATA Hard Disk Drive (HDD)
1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)
M.2 PCIe Solid State Drive (SSD)
256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
256GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
RAID Levels and Requirements
M.2 RAID via AMD CPU – supports RAID 0, 1
SATA RAID via Onboard AMD SATA Controller – supports RAID 0, 1, 5, 10
Notes
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.
DVD-ROM Drive
DVD-ROM, 9.0mm Slim, SATA
DVD Burner/CD-RW Drive
DVD Burner/CD-RW Rambo, 9.0mm Slim, SATA
Blu-Ray Burner Drive
Blu Ray Burner w/AACS encryption, 9.0mm Slim, SATA
Media Card Reader Specifications
Optional Front USB 3.0 15-in-1 Media card reader supporting SD UHS-II (requires Flex module)
Keyboard
Traditional USB Keyboard
Traditional PS/2 Keyboard
Smart Card USB Keyboard
Calliope USB Keyboard
Pointing Devices
Calliope USB Mouse
Lenovo USB Laser Mouse
Fingerprint USB Mouse
PS/2 Optical Mouse
5.25″ External Access Bays
Flex Module: Supports Two 5.25″ Flex Bays With Several Options Integrated
• Up to Two 5.25” Slim ODD Cages
• Up to One 5.25” Slim ODD and HDD Cage (FBSE)
• Up to One Front Access Storage Enclosure (FASE)
• Up to Two Front Removable Drive Enclosure – M.2 (CRU)
• Up to One Flex Module for One or More of the Following Options:
– 9.0mm Optical/15-in-1 USB 3.1 Gen 1 Reader/Front USB 3.1 Gen 1 Type-C/Front eSATA
Note:
1. Only one 15-in-1 media card reader can be supported.
2. Only one USB 3.1 Gen 1 Type-C cable can be supported.
3. Only one front eSATA cable can be supported.
Network
Marvell 10G Ethernet Adapter (single port)
Intel X550-T2 10G Ethernet Adapter (dual port)
Intel I350-T4 1G Ethernet Adapter (quad port)
Thunderbolt
Rear Thunderbolt PCIe Adapter
WiFi Cards
Intel PCIe WiFi Card With BT (9260 AC)
PCIe to M.2 Adapter Card
Single M.2 PCIe Adapter
Quad M.2 PCIe Adapter
CPU
Ryzen Threadripper PRO 3995WX
Ryzen Threadripper PRO 3975WX
Ryzen Threadripper PRO 3955WX
Ryzen Threadripper PRO 3945WX
# of Cores
64
32
16
12
# of Threads
128
64
32
24
Processor Base Frequency
2.7GHz
3.5GHz
3.9GHz
4.0GHz
Max Turbo Frequency
4.2GHz
4.2GHz
4.3GHz
4.3GHz
Cache
256MB
128MB
64MB
64MB
TDP
280W
280W
280W
280W
Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise)
3.5″ SATA Hard Disk Drive (HDD)
Yes
Yes
Yes
2.5″ SATA Hard Disk Drive (HDD)
Not Available
Not Available
Not Available
Connector
SATA
SATA
SATA
Transfer Rate (Gb/sec)
Average Data Rate, Read/Write 156MB/s
Maximum data transfer rate 220 MB/s
Maximum data transfer rate 215 MB/s
Spindle Speed (RPM)
7,200
7,200
7,200
Power Off to Spindle Stop (sec)
NA
NA
NA
DC Power to Drive Ready (sec)
<10.0
<17.0
<17.0
Average Latency (msec)
4.16
6
4.16
Input (VDC)
5
5
5
Typical (Watts)
6.19
6.7
7.35
Idle (Watts)
4.6
4.5
4.48
Physical Dimensions
101.6mm x 146.99mm x 19.88mm
101.6mm x 146.99mm x 20.2mm
101.85mm x 147mm x 26.1mm
Weight (grams)
420
415
649
Operating (C) Ambient
0 to 60
0 to 60
5 to 60
Operating (C) Base Casting
60
60
60
Non-Operating (C) Ambient
(-40 to 70)
(-40 to 70)
(-40 to 70)
Gradient (C per Hour)
20
20
20
Operating (Gs @ 2ms)
70
80
Read 70 Gs / Write 40 Gs
Non-Operating (Gs @ 2ms)
350
350
300
Drive
2048GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280
1024GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280
512GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280
256GB M.2 SSD, NVMe, Opal, GEN4x4, TLC,2280
1024GB NVMe M.2 SSD TLC
Dimensions Millimeters (W x D x H)
X
X
X
X
22 x 80 x 2.3
Interface Type
X
X
X
X
PCIe Gen 3 x4 NVMe
Power Active (AVG)
X
X
X
X
5W
Power Idle
X
X
X
X
50mW
Typical Sequential Read
X
X
X
X
3200MB/s
Typical Sequential Write
X
X
X
X
1600MB/s
Operating Temperature Range
X
X
X
X
0 to 55°C
Endurance Rating (Lifetime Writes)
X
X
X
X
300TB
Mean Time Between Failures (MTBF)
X
X
X
X
2.0M POH
Hardware Encryption
X
X
X
X
AES 256-bit
Drive
512GB NVMe M.2 SSD TLC
256GB NVMe M.2 SSD TLC
Dimensions Millimeters (W x D x H)
22 x 80 x 2.3
22 x 80 x 2.3
Interface Type
PCIe Gen 3 x4 NVMe
PCIe Gen 3 x4 NVMe
Power Active (AVG)
5W
5W
Power Idle
50mW
50mW
Typical Sequential Read
3200MB/s
3000MB/s
Typical Sequential Write
1600MB/s
1300MB/s
Typical Random Read (4GB Span)
340K IOPS
205K IOPS
Typical Random Write (4GB Span)
275K IOPS.
260K IOPS.
Operating Temperature Range
0 to 55°C
0 to 55°C
Endurance Rating (Lifetime Writes)
150TB
85TB
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
Hardware Encryption
AES 256-bit
AES 256-bit
PCI Bus
PCIe Gen4
PCI Modes
RAID, AHCI
RAID Levels
0, 1, 5, 10, Volume and RAIDable
Data Transfer Rates
AMD RAIDXpert2 (OS)
RAID and PD operations in BIOS
PCI Card Type
SATA 6Gbs
NVMe 16Gbs
PCI Voltage
Onboard AMD controller (Bixby)
Disclaimers
SATA, M.2 NVMe
Description
DVD-ROM, 9.0mm Slim
DVD Burner/CD-RW Rambo, 9.0mm Slim
Blu Ray Burner w/AACS encryption, 9.0 slim
Interface Type
SATA
SATA
SATA
Adapter
Quadro P620
Quadro P1000
Quadro P2200
Quadro RTX 4000
Quadro RTX 5000
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
Display Interface
4 x mDP 1.4
4 x mDP 1.4
4 x DP 1.4
3 x DP 1.4
1 x VirtualLink
4 x DP 1.4
1 x VirtualLink
Graphics Chipset
Pascal
Pascal
Pascal
Turing
Turing
Memory Clock Frequency (MHz)
1252MHz
1253MHz
1251MHz
1625MHz
1750MHz
Memory Size
2GB GDDR5
4GB GDDR5
5GB GDDR5X
8GB GDDR6
16GB GDDR6
Memory Interface
128-bit
128-bit
160-bit
256-bit
256-bit
Memory Bandwidth
Up to 80GB/s
Up to 82GB/s
Up to 200GB/s
Up to 416GB/s
Up to 448GB/s
GPU Cores
CUDA Cores: 512
CUDA Cores: 640
CUDA Cores: 1280
CUDA Cores: 2304
Tensor Cores: 288
RT Cores: 36
CUDA Cores: 3072
Tensor Cores: 384
RT Cores: 48
GPU Core Frequency (MHz)
1266MHz
1266MHz
1000MHz
1005MHz
1620MHz
Maximum Power Consumption
40W
47W
75W
Total board power: 160W
Total graphics power: 125W
Total board power: 265W
Total graphics power: 230W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
4 x 3840×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
4 x 7680×4320 @ 60Hz
4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Dimension
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
4.4″ H x 7.9″ L
Single Slot
4.4″ H x 9.5″ L
Single Slot
4.4″ H x 10.5″ L
Dual Slot, Full Height
Advanced Display
Not Available
Not Available
Not Available
SYNC 2
SYNC 2
SLI/NVLink Support
Not Available
Not Available
Not Available
Not Available
NVLink
Adapter
Quadro RTX 6000
Quadro RTX 8000
Quadro GV100
AMD Radeon Pro WX3200
AMD Radeon Pro W 5500
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 4.0 x16
Display Interface
4 x DP 1.4
1 x VirtualLink
4 x DP 1.4
1 x VirtualLink
4 x DP 1.4
4 x mDP 1.4
4 x DP 1.4
Graphics Chipset
Turing
Turing
Volta
Polaris
RDNA
Memory Clock Frequency (MHz)
1750MHz
1750MHz
858MHz
X
X
Memory Size
24GB GDDR6
48GB GDDR6
32GB HBM2
4GB GDDR5
8GB GDDR6
Memory Interface
384-bit
384-bit
4096-bit
128-bit
128-bit
Memory Bandwidth
Up to 672GB/s
Up to 672GB/s
Up to 870GB/s
96GB/s
224 GB/s
GPU Cores
CUDA Cores: 4608
Tensor Cores: 576
RT Cores: 72
CUDA Cores: 4608
Tensor Cores: 576
RT Cores: 72
CUDA Cores: 5120
Tensor Cores: 640
640
1408
GPU Core Frequency (MHz)
1440MHz
1395MHz
1132MHz
X
X
Maximum Power Consumption
Total board power: 295W
Total graphics power: 260W
Total board power: 295W
Total graphics power: 260W
250W
50W
125W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz
4 x 3840 x 2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz
4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz
4 x 1920×1080 @ 60Hz
4 x 3840×2160 @ 60Hz
2 x 5120×2880 @ 60Hz
1 x 7680×4320 @ 60Hz
4 x 1920×1080 @ 60Hz 4 x 3840×2160 @ 60Hz 2 x 5120×2880 @ 60Hz 2 x 7680×4320 @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
X
X
Dimension
4.4″ H x 10.5″ L
Dual Slot, Full Height
4.4″ H x 10.5″ L
Dual Slot, Full Height
4.4″ H x 10.5″ L
Dual Slot, Full Height
2.7″ H x 6.6″ L Single Slot, Half Height
4.4″ H x 9.5″ L Single Slot, Full Height
Advanced Display
SYNC 2
SYNC 2
Not Available
Not Available
Not Available
SLI/NVLink Support
NVLink
NVLink
NVLink
Not Available
Not Available
Adapter
AMD Radeon Pro W 5700
Bus Interface
PCIe 4.0 x16
Display Interface
5 x mDP 1.4
Graphics Chipset
RDNA
Memory Size
8GB GDDR6
Memory Interface
256-bit
Memory Bandwidth
448 GB/s
GPU Cores
2304
Maximum Power Consumption
205W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
6 x 1920×1080 @ 60Hz
6 x 3840×2160 @ 60Hz
3 x 5120×2880 @ 60Hz
3 x 7680×4320 @ 60Hz
Dimension
4.4″ H x 10.5″ L
Double Slot, Full Height
Advanced Display
Not Available
SLI/NVLink Support
Not Available
Model
Marvell AQC-107 (Onboard LOM)
AQN-107 Optional PCIe AIC
Description
Five speed 10GBASE-T LAN on Motherboard NIC
Five speed 10GBASE-T LAN on Motherboard NIC
Connector
RJ-45 Copper
RJ-45 Copper
Controller Bus Architecture
PCIe Gen3 x4
PCIe Gen3 x4
Data Transfer Mode
Ethernet
Ethernet
Website
DMTF DASH
Supported
Not Supported
Data Rates Supported
100Mbs, 1Gbs, 2.5Gbs, 5Gbs, 10Gbs
100Mbs, 1Gbs, 2.5Gbs, 5Gbs, 10Gbs
5GBASE-T (IEEE 802.3 specification conformance)
Supported
Supported
2.5GBASE-T (IEEE 802.3 specification conformance)
Supported
Supported
10GBASE-T (IEEE 802.3 specification conformance)
Supported
Supported
100BASE-TX (IEEE 802.3 specification conformance)
Supported
Supported
1000BASE-T (IEEE 802.3 specification conformance)
Supported
Supported
Auto-Negotiation
Supported
Supported
Power Optimizer Platform Low-power Management Systems
N/A
N/A
MACsec IEEE 802.1 AE
Supported
Supported
Energy Efficient Ethernet
Supported
Supported
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)
Supported
Supported
Receive Side Scaling
Supported
Supported
Dual Tx and Rx Queues
Supported
Supported
Quality of Service (QoS) and Data Center Bridging (DCB)
Up to 8 QoS traffic classes
Up to 8 QoS traffic classes
Jumbo Frames (up to 9KB)
Supported (Up to 16KB)
Supported, Up to 9KB frames
Teaming
No
Yes(?)
Integrated Auto Connect Battery Saver (ACBS) Battery Savings
N/A
N/A
Timing and Synchronization
IEEE 1588 Ver1 & Ver2 (AVB)
NTP Ver3 & Ver4
SNTP Ver4
IEEE 1588 Ver1 & Ver2 (AVB)
NTP Ver3 & Ver4
SNTP Ver4
Integrated Switched Voltage Regulator (iSVR)
N/A
N/A
NC Sideband Interface
SMBus
SMBus
Shared Flash with System BIOS
No
No
Wake from Deep Sx
Supported
Supported
Wake on LAN (Magic Packet, PING, Pattern)
Supported
Supported
Operating System Support
Win10 and Linux 8
Win10 and Linux 8
Manageability Capabilities Alerting
ASF 1.0 and 2.0
ASF 1.0 and 2.0
Network Proxy/ARP Support
Supported
Supported
TDP
108C
108C
Temperature Operating range
0-55C w/ no air flow
0-55C w/ no air flow
Power Consumption
6W @ 10Gbs
4W @5Gbs
6W @ 10Gbs
4W @5Gbs
IEEE Standards Compliance
IEEE 802.3bz – NBASE-T
IEEE 802.3x – Flow Control
IEEE 802.1P – Quality of Service
IEEE 802.1QAV – AVB
IEEE 802.3bz – NBASE-T
IEEE 802.3x – Flow Control
IEEE 802.1P – Quality of Service
IEEE 802.1QAV – AVB
Boot ROM Support
UEFI (Unified Extensible Firmware Interface) 2.3/2.5
PXE (Preboot Execution Environment) 2.0
UEFI (Unified Extensible Firmware Interface) 2.3/2.5
PXE (Preboot Execution Environment) 2.1
Description
15-in-1 USB 3.0 Media Card Reader
Interface Type
Integrated into Front Panel
Form Factor
SD UHS-II, Compact Flash, SM
WMI Support
Compliant With Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1)
System Configuration Setup Program (text only interface) Available at Power-on With F1 Key
Bootblock Recovery
Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup
Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control
Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert
Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert
Power-on Error message in the Event of a Fan Failure
Asset Tag
Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery with Video
Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown
System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
Quick Resume Time
Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level
System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
Keyboard-less Operation
System Can be Booted Without a Keyboard
Per-port Control
Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface
Adaptive Cooling
Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security
User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock
Memory Modes
Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready
Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec
UEFI
Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v6.1
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot
El Torito Bootable CD-Rom Format Specification, v1.0
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI
NA (No PCI slot)
PCI Express
PCI Express Base Specification v3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification v2.0
UHCI
Universal Host Controller Interface Design Guide, Revision v1.1
USB
Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v3.2.1
XHCI
XHCI SPEC Revision v1.2
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
Not Available
Safety, EMC Connection to the Telephone Network and Labeling
Not Applicable, no Connection to a Telephone Network
System Software Manager
Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
EMC & Safety
FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL
UL-GS
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test
Energy Star
ENERGY STAR® v8.0
EPEAT
EPEAT Certification Available on Select Models
ErP Lot-3 2013
Yes
Hazardous Substances
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week