PX - Lenovo ThinkStation

Description

Ultimate desktop to data center flexibility
The pinnacle of Lenovo technology, the ThinkStation PX goes beyond the limits of desktop performance to enable even the most extreme workflows. Featuring a thermally advanced, rack-optimized chassis co-designed with Aston Martin, this workstation powerhouse runs the most complex computing workloads seamlessly—whether desk-side or in a data center.

Processor Support

Dual 4th Generation Intel Xeon Scalable Processors

Socket Type

Socket-E (LGA-4677)

Disclaimers

Preloaded

Windows 11 Pro 64-bit for Workstation
Windows 10 Pro 64-bit for Workstation
Windows 10 IOT
Ubuntu 22.04 LTS (configuration specific)

Supported

Windows 10 Enterprise Edition
Red Hat Enterprise Linux 9.x
Ubuntu 22.04 LTS

Disclaimers

Slots

Up to 16 DIMMS (8 DIMMs per CPU)

Channels

8 Memory Channels per CPU

Type

DDR5, 288-Pin, ECC RDIMM and 3DS RDIMM*

ECC Support

Yes

Speed

Up to 4800MHz

Max DIMM Size

64GB DDR5 ECC RDIMM
128GB DDR5 ECC 3DS-RDIMM

Max System Memory

2TB

Disclaimers

*Actual Memory Speed is dependent on the CPU.

Total Bays/Size

Up to 4

SATA

3 x SFF-8680 Receptacles
1 x SATA 3.0 Connectors

PCIe (M.2)

3 x M.2 NVMe 2280 PCIe Connectors Onboard
4 x M.2 NVMe 2280 Front Accessible Drives

Disclaimers

*See Storage Whitepaper for details on the available usage options.

Integrated Graphics

Not Available

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slot 1

PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 2)

Slot 2

PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 2)

Slot 3

PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 2)

Slot 4

PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 2)

Slot 5

PCIe 4.0 x8, Full Height, Full Length, 25W, Open Ended (CPU 2)

Slot 6

PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 1)

Slot 7

PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 1)

Slot 8

PCIe 5.0 x16, Full Height, Full Length, 75W (CPU 1)

Slot 9

PCIe 4.0 x16, Full Height, Full Length, 75W (CPU 1)

Disclaimers

USB

1 x USB-A 3.2 Gen 2 (10Gbps)
1 x USB-A 3.2 Gen 2 (10Gbps) (with Always On Charging)
2 x USB-C 3.2 Gen 2 (10Gbps)

Audio

1 x 3.5mm Global Headset Jack (Headphone + Mic in)

Media Card Reader

N/A

Flex Bay

3 x Front access drive bay
Rear Flex Storage Enclosure (Shared with 2nd PSU Bay)

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

USB

2 x USB-A 2.0 (480Mbps)
4 x USB-A 3.2 Gen 1 (5Gbps)
1 x USB-C 3.2 Gen 2×2 (20Gbps)

Audio

2 x Rear (Line Out, Line In retasked as Mic)

DisplayPort

As Supported by GPU

HDMI

As Supported by GPU

Serial Port

Optional 1x Rear Port

Ethernet

1 x 1GbE – RJ45
1 x 10GbE – RJ45

PS/2

Optional PS/2 (2 port) PCIe adapter

Optional Network Adapter

Bitland RTL8168H 1000M PCIe Ethernet Adapter
Intel I210-T1 Single Port Gigabit PCIe Ethernet Adapter
Intel I350-T2 Dual Port Gigabit PCIe Ethernet Adapter
Intel I350-T4 Quad Port Gigabit PCIe Ethernet Adapter
Intel AX210 WIFI PCIe Adapter with Internal Antennas

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Vendor

Aquantia 10 GbE AQC113C-B1-C
Intel 1 GbE I219 (Vpro, AMT)

Speeds

10/100/1000/10000Mbps Aquantia AQC113C
10/100/1000Mbps Intel I219

Functions

PXE, WOL, Jumbo Frames
ASF, Teaming (Intel only)

Connectors

2 x RJ45

Disclaimers

Note: Network speeds listed are theoretical.

Vendor

Realtek

Type

HD (2.0)

Internal Speaker

1 x 1.5 watt 4 ohm

Connectors

2 x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic)
1 x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset

Realtek ALC897Q Codec (rear)
Realtec ALC4032 (front)

Number of Channels

Rear Audio: 2 Channels
Front Audio: 2 Channels

Number of Bits/Audio Resolution

Rear Codec:
10 Channel DAC Supports 16/20/24-bit PCM
2 Stereo ADC Supports 16/20/24-bit PCM
Front Codec:
One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit
One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Disclaimers

*Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Temp Sensors

Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel
PCIe Zone 1 Sensor – Thermistor
PCIe Zone 2 Sensor – Thermistor
PCIe Zone 3 Sensor – Thermistor
PCIe Zone 4 Sensor – Thermistor
M.2 Zone 1 Sensor – Thermistor
M.2 Zone 2 Sensor – Thermistor
MISC Sensor – Thermistor
HDD 1 Sensor – I2C Temp Sensor
HDD 2 Sensor – I2C Temp Sensor
HDD 3 Sensor – I2C Temp Sensor
PSU Bay 2 (HDD) Sensor – I2C Temp Sensor

Fans

2 x Front Fans (FRONT_FAN1) – 6-pin blind connect 1 Connector per 2 Fans
1 x Front Fan (FRONT_FAN2) – 4-pin blind connect 1 Connector per 1 Fans
1 x Front Fan (FRONT_FAN3) – 4-pin blind connect 1 Connector per 1 Fans
2 x Rear Fans (REAR_FAN1) – 6-pin blind connect 1 Connector per 2 Fans
1 x CPU 1 Fan (CPU1_FAN) – 4-pin header with 3-pin key
1 x CPU 2 Fan (CPU2_FAN) – 4-pin header with 3-pin key
1 x PSU HDD Fan (PSU_HDD_FAN) – PSU Edge Connector
3 x HDD Fans (HDD_FAN_X) – 4-pin header with 3-pin key
2 x PSU1 Fans – internal of PSU
2 x PSU2 Fans – internal of PSU
1 x CPU1 Memory Fan – CPU1_Pump_DDR – 4-pin header with 3-pin key
1 x CPU2 Memory Fan – CPU2_Pump_DDR – 4-pin header with 3-pin key

Disclaimers

Power Supply

1850 watts

Power Efficiency

92% Efficient @ 50% Load

Main

C20

Operating Voltage Range

100 – 240V (autosensing)

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

13 – 20A

Graphics

Up to 8 x 8-pin (6+2) PCIe*

Power Supply Fan

Yes

ENERGY STAR® Qualified (config dependent)

Yes

80 PLUS Compliant

Yes

Built-in Self Test (BIST) LED

Yes

Disclaimers

*Quantity of Graphics power cables is configuration dependent
*See Power Configuration Whitepaper for additional details.

Vendor

AMI

Disclaimers

Color

Storm Gray

PSU

One Fixed 1850W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
Optional: 2nd 1850W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions

2 Rear Fans
4 Front Fans
1 Fan per storage bay
1 Fan per CPU
2 Fans per PSU
Memory Fans (configuration dependent)

Dimensions

434.4mm/17.1″ H (without feet)
440.4mm/17.3″ H (with feet)
575mm/22.6″ D
220mm/8.7″ W

Weight

35.6 kg / 78.48 lbs

Disclaimers

Height (mm/in)

658mm / 25.91″

Width (mm/in)

397mm / 15.63″

Depth (mm/in)

802mm / 31.57″

Weight (kgs/lbs)

40.135 kg / 88.48 lbs

Disclaimers

TPM

Infineon SPI TPM SLB9672 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Yes

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

Yes

Boot Sequence Control

Yes

Padlock Support

No

Boot Without Keyboard and/or Mouse

Yes

Access Panel

Tool-less Side Cover Removal

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Tool-less*

Color Coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained with Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Download Recovery Service
or available through Lenovo Support.

Disclaimers

*Note: CPU Heatsink assembly requires a T30 bit.

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level

Vibration

Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operating: X,Y axis: +- 15G/3ms Z axis: +- 30G/3ms
Operating (Rack mounted): X,Y,Z axis: +- 15G/3ms
Non-operating target: Trapezoidal shock, 35g average, 11ms

Disclaimers

Board Size

16.26″ x 15.43″ (413mm x 392mm)

Layout

Lenovo Custom Extended ATX

Disclaimers

Processor Support

Intel Sapphire Rapids – Xeon Scalable Processors (Platinum, Gold, Silver)

Socket Type

Socket E (LGA 4677)

Memory Support

DDR5 up to 4800MHz RDIMM / 3DS RDIMM Memory

CPU-CPU Interconnect

Intel UPI v2.0, 3 links, x24, at speeds 12.8GT/s, 14.4GT/S and 16GT/s

Voltage Regulator

Intel VR14.0 – 400W TDP Capable

Chipset (PCH)

Intel Emmitsburg (Intel C741 Series)

Flash

2 x 64MB

Super I/O

2 x MEC1723(176 pin)

Clock

External Clock

Audio

Rear Codec: Realtek ALC897Q (Rear I/O)
Front Codec: Realtek ALC4032 (FPIO)

Ethernet

Aquantia 10Gb AQC113C-B1-C
Intel 1Gb I219

Processor Level

Intel Xeon Platinum

Processor

Intel XEON Sapphire Rapids Platinum 8490H
Intel XEON Sapphire Rapids Platinum 8468

Memory Type

RDIMMs – 4800MHz, CPU Dependent

Memory

16GB DDR5 ECC RDIMM PC5-4800
32GB DDR5 ECC RDIMM PC5-4800
64GB DDR5 ECC RDIMM PC5-4800

Disclaimers

Additional CPU SKUs certified

3.5″ SATA Hard Disk Drive (HDD)

2TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)
12TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
1024GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
2048GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
4096GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

Disclaimers

Additional Storage devices certified.

RAID Requirements

M.2 and SATA RAID via Intel VROC Controller

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.

Intel VROC

Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10
Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10

Disclaimers

*NOTE: Some features available after launch

Disclaimers

Keyboard

USB Traditional Keyboard
PS/2 Tradition Keyboard
Smart Card Keyboard
USB Calliope Keyboard

Pointing Devices

USB Fingerprint Mouse
USB Calliope Mouse
PS/2 Black Optical Mouse

Disclaimers

5.25″ External Access Bays

3 x Front access drive bays
1 x Rear PSU bay storage enclosure (Utilizes 2nd PSU bay)*

Disclaimers

See Storage Configuration whitepaper for detailed usage
*Only available on single PSU configurations

Network

Bitland RTL8168H 1000M PCIE Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

WiFi Cards

Intel PCIe WiFi Card With BT Internal Antenna Kit (AX210 6E)

PS/2

PS/2 (2-Port) PCIe adapter

Com port

Serial COM port cable with 5V transceiver

CPU

# of Cores

60

48

32

28

16

20

12

10

# of Threads

120

64

56

32

40

24

20

Processor Base Frequency

1.9GHz

2.10GHz

2.00GHz

2.00Ghz

2.00GHz

2.0GHz

2.70GHz

Max Turbo Frequency

3.50GHz

3.80GHz

3.40GHz

4.10GHz

4.00Ghz

3.90GHz

4.0GHz

Cache

112.5MB

105MB

60MB

52.5MB

30MB

37.5MB

30MB

26.25MB

TDP

350W

270W

205W

150W

165W

150W

Intel ARK Spec Link

Xeon Platinum 8490H

Xeon 8468

Xeon Gold 6430

Xeon Gold 5420+

Xeon Gold 5416S

Xeon Silver 4416+

Xeon Silver 4410Y

Xeon Silver 4410T

Disclaimers

Drive

2TB SATA – 7200rpm, 6Gb/s, 3.5″

Enterprise 6TB SATA – 7200rpm, 6Gb/s, 3.5″

Enterprise 12TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Yes

2.5″ SATA Hard Disk Drive (HDD)

Not Available

Connector

SATA

Transfer Rate (Gb/sec)

Average data rate, read/write 156MB/s

Spindle Speed (RPM)

7,200

DC Power to Drive Ready (sec)

<17.0

Average Latency (msec)

4.16

Input (VDC)

5

Typical (Watts)

6.7

Idle (Watts)

4.5

Physical Dimensions

101.6mm x 146.99mm x 26.1mm

Weight (grams)

535

Operating (C) Ambient

0 to 60

Operating (C) Base Casting

60

Non-Operating (C) Ambient

(-40 to 70)

Gradient (C per Hour)

20

Operating (Gs @ 2ms)

80

Non-Operating (Gs @ 2ms)

300

Disclaimers

Drive

512GB NVMe M.2 SSD TLC

1024GB NVMe M.2 SSD TLC

2048GB NVMe M.2 SSD TLC

4096GB NVMe M.2 SSD TLC

Dimensions Millimeters (W x D x H)

22 x 80 x 2.3

Interface Type

PCIe Gen 4.0 x4 NVMe

Power Active (AVG)

5W

Power Idle

50mW

Typical Sequential Read

6000MB/s

6400 MB/s

Typical Sequential Write

3200MB/s

3800MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

500K IOPS

550K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

370K IOPS

400K IOPS

Operating Temperature Range

0 to 55°C

Endurance Rating (Lifetime Writes)

150TB

300TB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.

PCI Bus

PCH Integrated

PCI Modes

SATA 3.0

RAID Levels

0/1/5/10

Data Transfer Rates

6Gb/s

Internal Connectors

2 x MiniSAS HD (2 ports each) + 3 x SATA

Disclaimers

Operating Systems Supported

Windows 10 Pro for Workstations (Preload)
Windows 7 Pro 64
Red Hat Enterprise Linux 7.3
Ubuntu 16.04 and 18.04.2

Temperature

10° – 35°C (50° – 95°F)

Relative Humidity

10%-80% (non-condensing)

Maximum Wet Bulb Temperature

25°C max

Disclaimers

Adapter

T400

T1000

RTX A2000

RTX A4000

RTX A4500

RTX A5000

RTX A5500

RTX A6000

Bus Interface

PCIe 3.0 x16

PCIe 4.0 x16

Display Interface

3 x mDP 1.4

4 x mDP 1.4

4 x DP 1.4a

4 x DP 1.4

4 x DP 1.4a

Graphics Chipset

Turing

Ampere

Memory Clock Frequency (MHz)

2000MHz

Memory Size

2GB GDDR6

4GB GDDR6

6GB/12GB GDDR6

16GB GDDR6

20GB GDDR6

24GB GDDR6

48GB GDDR6

Memory Interface

64-bit

128-bit

192-bit

256-bit

320-bit

384-bit

Memory Bandwidth

80GB/s

160GB/s

288GB/s

448 GB/s

640GB/s

Up to 768GB/s

GPU Cores

CUDA Cores: 384

CUDA Cores: 896

CUDA Cores: 3328
Tensor Cores: 104
RT Cores: 26

CUDA Cores: 6411
Tensor Cores: 192
RT Cores: 48

CUDA Cores: 7,168
Tensor Cores: 224
RT Cores: 56

CUDA Cores: 8,192
Tensor Cores: 256
RT Cores: 64

CUDA Cores: 10,752
Tensor Cores: 336
RT Cores: 84

Maximum Power Consumption

30W

50W

70W

140W

200W

230W

300W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Thermal Solution

Active

Dimension

2.7″ H x 6.1″ L
Single Slot

2.7″ H x 6.6″ L, Dual slot

4.4″ H x 9.5″ L
Single Slot

4.4″ H x 10.5″ L
Dual Slot, Full Height

Advanced Display

Not Available

SYNC 2

SLI/NVLink Support

Not Available

NVLink

Disclaimers

Card

Intel I210-T1 Single Port Gigabit Ethernet Adapter (Springville)

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel X550-T2 Dual Port Copper 10Gb Ethernet Adapter

Intel X710-DA2 Dual Port Fiber 10Gb Ethernet Adapter

Intel Ethernet SFP+ SR Optics Module

Intel AX210 Wifi 6E

Supplier PN

I210T1, MM# 941033

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

MM# 952103

MM#: 941243

Data Rates Supported

10/100/1000Mbps copper

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

1GbE/10GbE Optical fiber
10GbE Direct Attach (DAC)

Not Available

Controller Details

Intel® Ethernet Controller I210

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Intel Ethernet Controller X710-AM2

Not Available

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 3.0 (8GT/s)

Not Available

Data Transfer Mode

Ethernet

Not Available

Power Consumption

0.81W

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

Dual-port 10GBASE-SR= 4.3W typ/4.8W max
Dual-port 1000BASE-SX= 4W typ/4.3W max
Dual-port 10GBASE-LR= 4.5W typ/ 5.1W max
Dual-port Direct Attach (Twinax)= 3.3W typ/3.7W max

Not Available

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3 1/1010GBASE-SR/LR, SFF-8431 10GSFP+DAC

Not Available

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Not Available

Network Transfer Mode (Full/Half Duplex)

Supported

Not Available

Network Transfer Rate

1,000Mbps Full Duplex

Not Available

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x

Not Available

Manageability

Supported

Not Available

Manageability Capabilities Alerting

Supported

Not Available

TDP

Firmware Based Thermal Management

Not Available

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

Not Available

# of Ports

1

2

4

2

Not Available

Data Rate Per Port

10/100/1000Mbps (copper)

10/100/1000Mbps (copper), 1000Mbps (fiber)

1Gbps, 10Gbps

Not Available

System Interface Type

PCIe Gen 2.1

PCIe 3.0

Not Available

NC Sideband Interface

Not Available

Yes

Not Available

Jumbo Frames Supported

Yes

Not Available

1000Base-T

Yes

Not Available

IEEE 1588

Supported

Not Available

Supported Under vPro

Not Available

Disclaimers

Model

i210-T1

Dual Port Copper= I350-T2V2
Dual Port LC-Fiber= I350-F2

Dual Port Copper= I350-T4 V2
Dual Port LC-Fiber= I350-F4

X710-DA2

AC 7260 NGW

Connector

RJ-45 Copper

2 x Ports RJ-45 Copper or 2 x Ports LC-Fiber

4 x Ports RJ-45 Copper or 4 x Ports LC-Fiber

2 x SFPs Receptable

2 x Antennas

Website

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

Not Available

Intel® vPro™

Not Available

Supported

Intel® Standard Manageablity

Supported

Not Available

Power Optimizer Platform Low-power Management Systems

Supported

Energy Efficient Ethernet

Supported

Not Available

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Not Available

Receive Side Scaling

Supported

Not Available

Dual Tx and Rx Queues

Yes

Not Available

Jumbo Frames (up to 9KB)

Supported

Not Available

Teaming

Not Available

Supported

Not Available

Wake from Deep Sx

Supported

Not Available

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows 2008, 2012; RHEL 6.5/7.0, FreeBSD 9/10, Vmware ESXi 5.x

Not Available

Network Proxy/ARP Support

Supported

Not Available

Disclaimers

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

FW Resiliency 2.0

Compliant With NIST 800-193, EC Root of Trust providing ‘protection’, ‘detection’, and ‘recovery’ of UEFI code and data, EC FW, TPM FW and CSME FW.

System/Emergency ROM Flash Recovery With Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

Supervisor Password, System Management Password and Power-On Password can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Enhanced Tamper Protection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– BIOS signing with Hardware Security Module (HSM).
– Intel BIOS Guard and Boot Guard support
– Windows UEFI Firmware Update Support
– Certificate Based Bios Authentication & Management use certificate-based authentication to replace current use of SVP for authentication, it is also called “passwordless” mode.
– BIOS Modification and Event Log defines the BIOS setup configuration and boot tracking metrics and measurements that are required to provide insight into the health of a device
– System Deployment mode
– Subscription Certificate Storage provides a security interface for uses to store their certificates.
– Odometer can provide includes some metrics that are defined by each component to indicate its current status or history.
– Secure Wipe can secure erease HDD data.
– Support HTTPS boot
– Secure Boot Key Management Allows user to customize Secure Boot Keys.
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

BIOS Initialization to Factory

Support BIOS Setup option to initialize overall BIOS storage to the manufacturing default state, including all BIOS settings and internal data.

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 11 Ready

Supports Windows 11 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

UEFI

Unified Extensible Firmware Interface v2.9

UEFI PI

UEFI Platform Initialization Specification 1.7A

ACPI (Advanced Configuration and Power management Interface)

Advanced Configuration and Power Interface v6.4

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification Revision 5.0, Version 1.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.3

XHCI

XHCI SPEC Revision v1.2

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cmÂ²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

EMC & Safety

US/CANADA FCC/IC DoC
Japan VCCI
Taiwan BSMI
AS/NZS RCM
EU CE DoC
UK UKCA DoC
US/CANADA UL/CUL
German UL-GS
IEC62368-1 CB Report/Certificate
Suadi Arabia SIRC
Kuwait KUCAS
UAE EQM
China CCC
Singapore PSB
South Africa LOA
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Energy Star

ENERGY STAR® v8.0

EPEAT

EPEAT Gold

Greenguard

Yes

RoHS

RoHS Compliant

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

Table of Contents

PX

SECTION I: Platform Overview

CPU

Operating Systems

Memory

Storage

Video

Slots

Front I/O

Rear I/O

Ethernet

Audio

Thermal

Power Specifications

BIOS

Chassis Information

Packaging Dimensions

Security & Serviceability

Operating Environment

SECTION II: Platform Detail

Motherboard Core

Supported Components

Storage

RAID

Keyboard and Pointing Devices

Expansion Bays

PCIe Adapters

SECTION III: Supported Component Detail

CPU Specifications

HDD Specifications

Solid State Storage Specifications

HDD Controllers

Optical Drive Specifications

Discrete Graphics Adapter

Intel® Ethernet Specifications

Ethernet

Media Card Reader

SECTION IV: BIOS/Certifications/Standards/Environmental

BIOS Specifications

Industry Standard Specification Support

Social and Environmental Responsibility

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Network and Labeling

Regulations & Standards

Environmentals