P16v Gen 1 AMD

Version: 3.0 | 05/22/2024

Product Name

P16v

Product Display Name

P16v Gen 1

Information Date

27-Feb-24

SECTION I: SYSTEM OVERVIEW

Description

Have it all with the P16s Gen 2 AMD featuring powerful AMD Ryzen™ PRO 7000 Series Processors and integrated AMD Radeon™ 700M Graphics, based on RDNA™ 3 Architecture with AMD PRO graphics Driver delivering the perfect performance engine for entry-level professionals looking for a workstation class system at an also perfect price point.

CPU

Processor Support

Intel 13th Gen Raptor Lake H Series (45W) Core i5, i7, i9

Socket Type

BGA

Operating Systems

Preloaded

Windows 11 Pro 64-bit (22H2)
Windows 11 Home 64-bit (22H2)
Windows 11 Home Chinese Language (PRC only)
Ubuntu Linux 64-bit (Version 22.04 LTS, running the 4.15.0 kernel)
No Operating System

Supported

Ubuntu Linux 22.04 Cert only
Red Hat Enterprise Linux (RHEL) 8.6

Memory

Number of DIMM Slots

Up to 2 DIMM sockets

Channels

Single Channel w/ 1DIMM
Dual Channel w/ 2DIMMs

Type

DDR5 SoDIMM

ECC Support

No

Speed

Native: Up to 5600MHz
Actual: Up to 5200Mhz

Max DIMM Size

48GB

Max System Memory

96GB

Min System Memory

8GB

Soldered Memory

None

Disclaimers

No ECC memory on P16v i Gen 1

Storage

Storage Slots

2 x M.2 2280

SATA

No

PCIe

Solid State Drive, OPAL2 PCIe-NVMe M.2 2280S3 – TLC

SAS

No

Interface

PCIe

Security

OPAL

Optional Hard Disk Drive Controllers

No

Video

Integrated Graphics

Processor Graphics Intel® Iris Xe Graphics
Utilized via “Hybrid Mode” in BIOS

Discrete Graphics

NVIDIA RTX A500 or RTX A1000 or RTX 2000 Ada

Adapter

None

Bus Interface

PEG

Display

Resolutions

FHD+ / UHD+

Camera

Resolution

FHD 1080p or 5MP+IR Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes

Keyboard

Number of Keys

US : 105 / UK : 106 / JP : 110

Numpad

Yes

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

CS23 KYB with numberpad

Key stroke

1.5mm

Key pitch

19.05mm

Keyboard backlight

Optional

Keyboard thickness

Standard

TrackPad / Fingerprint Reader

TrackPoint Details

CS22 TL TrackPoint (t=4.8mm)

Finger Print Reader Model

9.45*3.29 FPR, MoC with LED

Multi-Touch

Yes

Resolution

1000 ppi

TrackPad/TouchPad thickness

3.4mm

TrackPad/TouchPad type

3+2 BCP

TrackPad size

115mm x 67.6mm

TrackPad material/finish

Glass like mylar surface

I/O – Ports and Connectors

USB

2x USB-A (5Gbps) (1x Powered)

Thunderbolt

2x USB-C® (Thunderbolt™ 4)

HDMI

1x HDMI 2.1 up to 8K/60Hz

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated SD Card Reader (SD Express/UHS-II) (MMC,SD,SDHC SDXC, SDUC)

Smart Card Reader

Yes (optional)

Power Connector

DC-In

Docking Port

Docking Via USB-C® (Thunderbolt™ 4)

VirtualLink

None

Network adapter

No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter

Disclaimers

HDMI 2.1: Up to 8K/60Hz

Power Connector

Main

DC-In

USB-C

1x USB-C® (Thunderbolt™ 4)

Ethernet

Vendor

N/A

Count

N/A

EEPROM

N/A

Speeds

N/A

Functions

N/A

Connectors

No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter

WWAN

Model

Fibocom L860-GL 4G LTE CAT16 with eSIM

Near Field Communications

Model

Foxconn NXP NPC300 NFC

Audio

Vendor

Realtek

Type

Intel High Definition Audio

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3287

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1K/48K/96K/192KHz sample rate

Signal to Noise Ratio

Mic In: 90dB FSA
Headphone Out@32ohm: 97dB FSA

Analog Audio

None

Dolby Digital

Dolby Audio Premium SW Support

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Power adapter

Type

135W/170W AC Adapter

Dimensions

200cc (118 x 77 x 22)

Input Voltage

100-240V

Security

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Chassis Information

Format

Clamshell

Color

Thunder black

Thermal Solutions

Dual FAN, Intelligent Cooling

Dimensions

Length
14.37 inches
365 millimeters

Width
9.84 inches
261.9 millimeters

Height
0.97 inches
24.66 millimeters

Weight

4.85lbs/2.2kg

Packaging Parameters

Height (mm)

341

Height (inch)

13.43

Width (mm)

535

Width (inch)

21.06

Depth (mm)

95

Depth (inch)

3.74

Weight (kgs)

Retail: 3.77kgs

Weight (lbs)

Retail: 8.31bs

Security & Serviceability

Self Healing BIOS

Yes

Access Panel

Removeable bottom cover

Number of Screws

9

Swappable Components

Bottom cover, memory module, M.2 solid-state drive, speaker assembly, coin-cell battery, TrackPoint pointing cap

Storage Slots

2 slots

Memory

2 SoDIMM slots

System Board

FR4

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

None

Security Chip

Yes (for TMP 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating Environment

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

SECTION II: SUPPORTED COMPONENTS

Supported Components

Processor

Intel® Core™ i5-13500H non-vPro processor (E-cores up to 3.50 GHz P-cores up to 4.70 GHz)
Intel® Core™ i7-13700H non-vPro processor (E-cores up to 3.70 GHz P-cores up to 5.0 GHz)
Intel® Core™ i7-13800H vPro processor (E-cores up to 4.0 GHz P-cores up to 5.20 GHz)
Intel® Core™ i9-13900H vPro processor (E-cores up to 4.10 GHz P-cores up to 5.40 GHz)

Memory Support

DDR5 5600MHz SoDIMM (native)
DDR5 5200MHz SoDIMM (operational)

Chipset (PCH)

None

Size of BIOS Flash

64MB

Super I/O

None

Clock

Crystal

Audio

Realtek High Definition Audio

Ethernet

No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter

Memory

System Capacity Options

8GB
16GB (16GB*1 or 8GB*2)
32GB (32GB*1 or 16GB*2)
48GB
64GB (32GB*2)
96GB (48GB*2)

Memory Types

8GB DDR5 5600MHz SoDIMM
16GB DDR5 5600MHz SoDIMM
32GB DDR5 5600MHz SoDIMM
48GB DDR5 5600MHz SoDIMM

Brand of Memory

Samsung
SK Hynix
Ramaxel

Memory clock frequency(MHz)

Native: Up to 5600MHz
Actual: Up to 5200Mhz

Disclaimers

No ECC memory on P16v i Gen 1

Storage

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

256GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)

512GB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
Hynix
WD
Kioxia

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Removeable Media

Media Card Reader Specifications

SD Express 7.0 UHS-II

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel® Core™ i5-13500H Non vPro

Intel® Core™ i7-13700H Non vPro

Intel® Core™ i7-13800H vPro

Intel® Core™ i9-13900H vPro processor

Integrated Graphics

Intel® Iris Xe Graphics

Intel® Iris Xe Graphics

Intel® Iris Xe Graphics

Intel® Iris Xe Graphics

# of Cores

12

14

14

14

# of Threads

16

20

20

20

Processor Base Frequency

2.6GHz on P-cores and 1.9GHz on E-cores

2.4GHz on P-cores and 1.8GHz on E-cores

2.5GHz on P-cores and 1.8GHz on E-cores

2.6GHz on P-cores and 1.9GHz on E-cores

Max Turbo Frequency

4.7GHz on P-cores and 3.5GHz on E-cores

5.0Ghz on P-cores and 3.7GHz on E-cores

5.2Ghz on P-cores and 4.0GHz on E-cores

5.4GHz on P-cores and 4.1GHz on E-cores

Cache

18 MB

24 MB

24 MB

24 MB

TDP

45W

45W

45W

45 W

Display Specifications

Model

FHD+

FHD+ on-cell touch

FHD+

UHD+

Resolution

1920 x 1200

1920 x 1200

1920 x 1200

3840 x 2400

Diagonal

16″

16″

16″

16″

Aspect Ratio

Ratio 16:10

Ratio 16:10

Ratio 16:10

Ratio 16:10

Backlight

LED

LED

LED

LED

PPI

141.5 (Pixel Pitch:0.17952mm x 0.17952mm )

141.5 (Pixel Pitch:0.17952mm x 0.17952mm )

141.5 (Pixel Pitch:0.17952mm x 0.17952mm )

283 (Pixel Pitch: 0.09mm x 0.09mm)

Active Area

344.68 x 215.42

344.68 x 215.42

344.68 x 215.42

344.678 x 215.424

Refresh Rate

48 / 60 Hz

60Hz

48 / 60 Hz

60Hz

Contrast Ratio

800:1 (TYP)

800:1 (TYP)

1200:1 (TYP)

1400:1 (TYP)

Viewing Angle (*1)

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

Color gamut

45% NTSC

45% NTSC

100% sRGB

100% DCI-P3

Brightness

300nit

300nit

300nit

800nit, HDR 400

Color Depth

16.7M

16.7M

16.7M

1064M

Interface

eDP 1.2

eDP 1.2

eDP 1.4

eDP 1.4

Panel ID Recognition

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

Weight

max 410g

Max 410g

max 325g

max 330g

Color Calibrator

None

None

None

X-Rite Factory Color Calibration

Panel Technology

IPS, Anti-Glare

IPS, Anti-Glare

IPS, Anti-Glare

IPS, Anti-Glare

Touch Panel

None

Yes

None

None

SSD Specifications

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280 PCIe

Solid State Storage Devices

Supported Types

M.2

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280 S3

M.2 2280-S3

Interface Type

PCIe NVMe

PCIe NVMe

Read/Write IOPS Specifications

Read: 250K (1TB, 512GB), 200K (256GB)
Write: 240K (1TB, 512GB), 190K (256GB)

Read: 550K (1TB/2TB), 350K (512GB)
Write: 400K (1TB/2TB), 370K (512GB)
IOPS, 4K Random, 32 q depth, 8 threads

Bandwidth Performance

PCIe Gen4x4 Value (8Gb/S)

PCIe Gen4x4 Performance (16Gb/S)

Power Consumption (Max)

3.0A (duration for 10 us)

8.0W

Active(AVG)

5W

8.0W (Sequential read)

Idle

5mW (L1.2)

5mW (Low power state)

Min MTBF

2,000,000 (h)

2,000,000 (h)

Min Sequential Read

3000MB/s (2TB, 1TB, 512GB), 2900MB/s (256GB)

6400MB/s (1TB/2TB), 6000MB/s (512GB), 5000MB/s (256GB)

Min Sequential Write

1600MB/s (2TB, 1TB/512GB), 900MB/s (256GB)

5000MB/s (2TB), 3800MB/s (1TB), 3200MB/s (512GB), 1600MB/s (256GB)

Hardware Encryption

Yes

Yes for OPAL, No for Pyrite

Discrete Graphics Adapter

GPU Name

NVIDIA RTX A500

NVIDIA RTX A1000

NVIDIA RTX 2000 Ada

CUDA Processing Cores

2048

2560

3072

GPU Memory

4GB

6GB

8GB

Memory Bandwidth

112.02 GB/s

132.02 GB/s

256 Gb/s

Memory Type

GDDR6

GDDR6

GDDR6

Memory Interface

64-bit

96-bit

128-bit

Display Port

1.4

1.4

1.4

OpenGL

4.6

4.6

4.6

Shader Model

7

7

7

DirectX

12

12

12 Ultimate

PCIe Generation

4

4

4

Floating-Point Performance

3

3.7

9.3

VR Ready

Yes

Yes

Yes

Simultaneous Multi-Projection

N/A

N/A

74.7

NVIDIA FXAA/TXAA Antialiasing

Yes

Yes

Yes

NVIDIA nView Display Management Technology

Yes

Yes

Yes

GPU Direct for Video

Yes

Yes

Yes

Vulkan Support

Yes

Yes

Yes

NVIDIA Optimus

Yes

Yes

Yes

WLAN

Model

Garfield Peak 2 Intel Wi-Fi 6E AX211 (Gig+) + BT5.3 (HW Ready)

Connector: Main, Aux/GNSS, GNSS

ANT1:AUX WiFi + BT; ANT2: Main WiFi

Antenna Diversity

Supported

MIMO

Supported

GNSS Bian

N/A

Radio ON/OFF Control

Supported

Connector interface

CNVi

Operating Temperature (Adapter Shield)

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Windows 11, 64-bit*,Microsoft Windows 10*, Linux*(limited feature support), Chrome*

Wi-Fi Alliance

Wi-Fi CERTIFIED* a/b/g/n/ac/ax with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Miracast* as Source, and Wi-Fi Direct (For Microsoft Windows* only)

IEEE WLAN Standard

IEEE 802.11a/b/g/n/ac/ax, 802.11d,802.11e, 802.11h, 802.11i, 802.11w, 802.11r, 802.11k, 802.11v, pending OS support; Fine Timing Measurement based on 802.11-2016

Roaming

Support seamless roaming between access points

Bluetooth*

Bluetooth 5.3 (HW Ready)

Authentication

WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA

Authentication Protocols

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

Encryption

64-bit and 128-bit WEP, 128-bit AES-CCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives.

US Government

FIPS, FISMA

Product Safety

UL,C-UL,CB (IEC 60950-1)

Disclaimers

1) 6GHz channel of Wi-Fi 6E is only available with Windows 11
2) Bluetooth may be limited by OS

Battery

Dimension

L: 312mm*W: 58.8mm*T 9.4mm

Weight

MAX 349.75g

Type (Chemistry and Cell)

Li-Polymer (4S1P), 4-cell

Voltage

15.52 V

Battery Capacity

90Wh

Charging Time

On Charge Time (0- 100%) * 117 min
Off Charge Time (0 – 80%) ** 56 min
Off Charge Time (0 – 100%) ** 115 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2032

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

No

Asset Tag

Yes

Remote Wakeup/Remote Shutdown

Only support WOL when system is connected with Dock.

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

EMC & Safety

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Environmentals

Energy Star

ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Silver Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at: https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Manageability

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Materials Used

90% Recycled Magnesium C Cover
85% PCC Plastic Key Caps on Keyboard
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
90% PCC Plastic SIM Tray
30% PCC Plastic 135W Slim AC Adapter
30% PCC Plastic 170W Slim AC Adapter
Low Temperature Solder (SSD, fingerprint reader module, TrackPad)
Plastic free packaging with 90% recycled and/or FSC certified content (standard)

TCO Certification

9.0

Disclaimers

1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material

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