P3 Ultra

Version: 4.0 | 12/06/2023

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SECTION I: Platform Overview

Description

The Lenovo ThinkStation P3 Ultra features a revolutionary form factor that is redefining the power of small. With the latest 13th Gen Intel® Core™ processors, up to NVIDIA RTX™ A5500 mobile graphics, super-fast memory, and cutting-edge storage, this workstation breaks new ground by delivering superior performance and flexibility in a chassis less than four liters in total volume.

CPU

Processor Support

Intel Raptor Lake-S

Socket Type

Socket-V (LGA 1700)

Operating Systems

Preloaded

Windows 11 Pro
Windows 11 Home
Windows 10 Pro 64-bit
Windows 10 IOT LTSC
Ubuntu 22.04 LTS

Supported

Red Hat Enterprise Linux 9.x

Memory

Slots

Up to 4 SODIMMs

Channels

Supports up to 4 SODIMM Sockets, 2 Channels

Type

262-pin, 4000MHz ECC/non-ECC SODIMM

ECC Support

Yes

Speed

Up to 4000MHz

Max DIMM Size

32GB DDR5 SODIMM

Max System Memory

128GB

Disclaimers

Memory speed dependent on memory configuration

Storage

Total Bays/Size

1 x 2.5″

SATA

1 x SATA Connectors, Gen 3

PCIe

2 x M.2 PCIe Connector, Gen 4 Onboard

Disclaimers

Additional parts/enclosures may be required for some configurations.

Video

Integrated Graphics

Intel Integrated UHD Graphics 730 (CPU Dependent)
Intel Integrated UHD Graphics 770 (CPU Dependent)

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slots

Slot 1

MXM slot to PCIe 4.0 x16, Half Height, Half Length, 75W

Slot 2

PCIe 3.0 x8 (x4 electrical), Half Height, Half Length, 25W

Front I/O

USB

1 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x Thunderbolt 4 Type-C 40Gb/s

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Actual USB throughout will vary depending on the type and quantity of USB devices used.
USB-C ports are capable of Display output

Rear I/O

USB

4 x USB 3.2 Gen 2 Type-A 10Gb/s

DisplayPort

3 x Standard (CPU dependent)

Ethernet

1 x 2.5GbE – RJ45
1 x 1GbE – RJ45

Optional USB Adapter

USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP

Optional Network Adapter

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Broadcom 5720 2-Ports Ethernet Adapter
Broadcom 5719 4-Ports Ethernet Adapter
Intel AX211 M.2 Wi-Fi Module

Disclaimers

Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Vendor

Intel I225
Intel I210

Speeds

10/100/1000/2500Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

2 x RJ45

Disclaimers

Ethernet speed is port dependent.

Audio

Vendor

Realtek

Type

HD (5.1)

Internal Speaker

Internal 1.5W

Connectors

1 x Front 3.5mm Jack (Mic & Headphone)

Chipset

ALC897Q

Number of Channels

2 Channels (5.1 via driver selection)

Number of Bits/Audio Resolution

6 Channel DAC supports 16/20/24 bit PCM format for 5.1 audio selection
2 Stereo ADC supports 16/20 bit PCM format

Thermal

Temp Sensors

Ambient Sensor

Fans

1 x CPU Fan
1 x M.2 Fan

Power Specifications

Power Supply

170W

230W

300W

Power Efficiency

90% Efficient @ 50% Load

90% Efficient @ 50% Load

90% Efficient @ 50% Load

Main

20V DC Jack, yellow

20V DC Jack, yellow

20V DC Jack, yellow

Operating Voltage Range

100 – 240V

100 – 240V

100 – 240V

Rated Voltage Range

90-264VAC

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

2.5A

3.5A

4.5A

Power Supply Fan

No

No

No

ENERGY STAR® Qualified (config dependent)

Yes

Yes

Yes

Aux Power Drop

No

No

No

BIOS

Vendor

AMI

Self-Healing BIOS

Yes

Chassis Information

Color

Raven Black

PSU

170W, 230W, and 300W Available, Autosensing

Dimensions

205mm/8.1″ H
223mm/8.8″ D
87mm/3.4″ W

Weight

3.6kg / 7.9lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Packaging Dimensions

Height (mm/in)

216mm / 8.5″

Width (mm/in)

483mm / 19″

Depth (mm)

295mm / 11.625″

Weight (kgs/lbs)

5.7 kg / 12.5 lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Security & Serviceability

TPM

Infineon SLB9672 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 16.x)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

Yes

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Cover Removal

Optical Drive

No

Hard Drives

Tool-less

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 5⁰C to 40⁰C (41⁰F to 104⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 65⁰C (14⁰F to 149⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 90% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 40000ft)

Vibration

Package Vibration:
Three axes in use orientation (X, Y & Z-axis), 1.04Grms, 2-200Hz, 15mins/axis, random, packaged for shipment
Operating Vibration:
Random Vibration; 5 to 500 Hz, 0.27 G rms; 30 min/axis, X, Y, Z axes
Non-Operating Vibration:Random Vibration; 2 to 200 Hz, 1.04 G rms; 15 min/face, 6 faces

Shock

Operation Shock: Half-sine wave, 15G/3ms(X,Y), 30G/3ms(Z)
Non-operating Shock: Trapezoidal wave, 45G/11ms

SECTION II: Platform Detail

Board Size

7.24″ x 7.69″ (184.0mm x 195.5mm)

Layout

Custom

Motherboard Core

Processor Support

Intel Raptor Lake-S Core/Alder Lake-S Core

Socket Type

Socket-V (LGA 1700)

Memory Support

DDR5 up to 4000MHz SODIMM Memory (ECC and non-ECC)

Voltage Regulator

125W TDP Capable

Chipset (PCH)

Intel W680 Chipset

Flash

32MB

Super I/O

Nuvoton NCT6692D

Clock

Intel Native isCLK

Audio

Realtek ALC897Q Codec

Ethernet

Intel I225
Intel I210

Supported Components

Processor Level

Intel Raptor Lake-S Core/Alder Lake-S Core

Processor

i9-13900T
i9-13900K
i9-13900
i7-13700T
i7-13700K
i7-13700
i5-13600K
i5-13600
i5-13400T
i3-13100

i9-12900
i7-12700
i5-12500

Memory Type

ECC/non-ECC SODIMMs – 4000MHz

Memory

16GB DDR5 ECC SODIMM PC4-4000
32GB DDR5 ECC SODIMM PC4-4000

8GB DDR5 non-ECC SODIMM PC4-4000
16GB DDR5 non-ECC SODIMM PC4-4000
32GB DDR5 non-ECC SODIMM PC4-4000

Disclaimers

Memory speed dependent on memory configuration

Storage

2.5″ SATA Hard Disk Drive (HDD)

1TB SATA HDD 7200rpm, 6Gb/s, 2.5″ (FIPS certified)
1TB SATA HDD 7200rpm, 6Gb/s, 2.5″ (non-FIPS certified)

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
4096GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL

RAID

RAID Levels and Requirements

NVMe Drives Support RAID 0/1

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Optical Drive/Removable Media

Keyboard and Pointing Devices

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard
Calliope Wireless Keyboard

Pointing Devices

Calliope USB Mouse
Calliope Wireless Mouse

Expansion Bays

PCIe Adapters

Network

Intel I350-T2 Dual Ports Gigabit Ethernet Adapter
Intel I350-T4 Quad Ports Gigabit Ethernet Adapter
Broadcom 5720 2-Ports Ethernet Adapter
Broadcom 5719 4-Ports Ethernet Adapter

USB

USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP

WiFi Cards

Intel M.2 WiFi Card with BT – External Antenna Included (Intel AX211 vPro)

Disclaimers

There is an internal front antenna that comes standard in every system.

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel Core i9 13900T ( 1.1GHz / 24C / 32T / 30M / DDR4 3200 DDR5 5600 / 35W / Turbo / GT32)

Intel Core i9 13900 ( 2.0GHz / 24C / 32T / 32M / DDR4 3200 DDR5 5600 / 65W / Turbo / GT32)

Intel Core i9 13900K ( 3.0GHz / 24C / 32T / 36M / DDR4 3200 DDR5 5600 / 125W / Turbo / GT32)

Intel Core i7 13700T ( 1.4GHz / 16C / 24T / 30M / DDR4 3200 DDR5 5600 / 35W / Turbo / GT32)

Intel Core i7 13700 ( 2.1GHz / 16C / 24T / 30M / DDR4 3200 DDR5 5600 / 65W / Turbo / GT32)

Intel Core i7 13700K ( 3.4GHz / 16C / 24T / 30M / DDR4 3200 DDR5 5600 / 125W / Turbo / GT32)

Intel Core i3 13100 ( 3.4GHz / 4C / 8T / 12M / DDR4 3200 DDR5 4800 / 60W / Turbo / GT24)

Intel Core i5 13400T ( 1.3GHz / 10C / 16T / 20M / DDR4 3200 DDR5 4800 / 60W / Turbo / GT24)

Intel Core i5 13600 ( 2.7GHz / 14C / 20T / 24M / DDR4 3200 DDR5 4800 / 60W / Turbo / GT32)

Intel Core i5 13600K( 3.5GHz / 14C / 20T / 20M / DDR4 3200 DDR5 5600 / 125W / Turbo / GT32)

Intel Core i5 12500 ( 3.0GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800

Intel Core i7 12700 ( 2.1GHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)

Intel Core i9 12900 ( 2.4GHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)

# of Cores

24C

24C

24C

16C

16C

16c

4C

10C

14C

14C

6c

12c

16c

# of Threads

32

32

32

24

24

24

8

16

20

20

12

20

24

Processor Base Frequency

1.1 GHz

2.0GHz

3.0GHz

1.4GHz

2.1GHz

3.4GHz

3.4GHz

1.3GHz

2.7GHz

3.5Ghz

3.0GHz

2.1GHz

2.4GHz

Max Turbo Frequency

5.3GHz

5.6GHz

5.8GHz

4.9GHz

5.2GHz

5.4GHz

4.5GHz

4.4GHz

5.0GHz

5.1Ghz

4.6GHz

4.9GHz

5.1GHz

Cache

36M

36M

36M

30M

30M

30M

12M

20M

24M

24M

18M

25M

30M

TDP

35W

65W

125W

35W

65W

125W

60W

35W

65W

125W

65W

65W

65W

HDD Specifications

Drive

1TB SATA 2.5″ HDD HDD 7200 rpm, 6Gb/s

3.5″ SATA Hard Disk Drive (HDD)

Not Available

2.5″ SATA Hard Disk Drive (HDD)

Yes

Connector

SATA

Transfer Rate (Gb/sec)

160MB/s OD Read

Spindle Speed (RPM)

7,200

Power Off to Spindle Stop (sec)

NA

DC Power to Drive Ready (sec)

3.5

Average Latency (msec)

4.2

Input (VDC)

5

Typical (Watts)

1.9

Idle (Watts)

0.7

Physical Dimensions

69.85mm x 100.34mm x 7mm

Weight (grams)

90

Operating (C) Ambient

0 to 60

Operating (C) Base Casting

60

Non-Operating (C) Ambient

(-40 to 70)

Gradient (C per Hour)

20

Operating (Gs @ 2ms)

400

Non-Operating (Gs @ 2ms)

1000

Solid State Storage Specifications

Drive

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

NVMe 2280 M.2 4TB PCIe SSD (OPAL)

NVMe 2280 M.2 Value 256GB M.2 SSD, NVMe, OPAL, TLC, 2280 Gen4 x4

Dimensions Millimeters (W x D x H)

22 x 80 x 2.38

22 x 80 x 2.38

22 x 80 x 2.38

22 x 80 x 2.38

22 x 80 x 2.38

Interface Type

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

Power Active (AVG)

5.8W

5.8W

5.8W

?

4.5W

Power Idle

35 mW

35 mW

50mW

50mW

<15mW

Typical Sequential Read

6000 MB/s

6400 MB/s

6400 MB/s

6400 MB/s

4100 MB/s

Typical Sequential Write

3200 MB/s

3800 MB/s

5000 MB/s

5000 MB/s

2200 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

500K IOPS

550K IOPS

550K IOPS

650K IOPS

500K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

370K IOPS

400K IOPS

400K IOPS

450K IOPS

480K IOPS

Operating Temperature Range

0 to 55°C

0 to 55°C

0 to 55°C

?

0 to 85°C

Endurance Rating (Lifetime Writes)

150 TB

300 TB

600 TB

?

100TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

2.0M POH

2.0M POH

Hardware Encryption

AES 256 bit

AES 256 bit

AES 256 bit

AES 256 bit

AES 256 bit

HDD Controllers

Optical Drive Specifications

Integrated Graphics Adapter

Type

Intel® UHD Graphics 770

Display Interface

3 x DP 1.2

Video Resolution (max)

4096 x 2160 @ 60Hz(DP)

Discrete Graphics Adapter

Adapter

Quadro T400 – 4GB GDDR6

Quadro T1000 – 8GB GDDR6

NVIDIA Quadro A2000(DP x4) – 12GB GDDR6

NVIDIA RTX A5500 mobile,16GB, 4miniDP,GDDR6

Nvidia RTX A5000 mobile,16GB, 4miniDP,GDDR6

NVIDIA RTX A3000 mobile, 12GB, 4miniDP, GDDR6

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCI Express 4.0×16

PCI Express 4.0×16

PCI Express 4.0×16

PCI Express 4.0 x 16

Display Interface

3 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

Graphics Chipset

TU117-850

TU117-875

GP106-850

QN20-E5-R

QN20-E5

QN20-E1-R

Memory Clock Frequency (MHz)

5001MHz

5001MHz

6001MHz

2000MHZ

1750MHZ

1750MHZ

Memory Size

4GB GDDR6

8GB GDDR6

12GB GDDR6

16GB GDDR6

16GB GDDR6

12GB GDDR6

Memory Interface

64-bit

128-bit

192-bit

256-bit

256-bit

192bit

Memory Bandwidth

Up to 80GB/s

Up to 160GB/s

Up to 288GB/s

Up to 224GB/s

Up to 224GB/s

Up to 168GB/s

GPU Cores

CUDA Cores: 640

CUDA Cores: 896

???

CUDA Cores: 7424

???

TBD

GPU Core Frequency (MHz)

420MHz (base)/2100MHz (max boost)

1065MHz (base)/2100MHz (max boost)

1493MHz

975MHz

900MHz

855MHz

Maximum Power Consumption

30W

50W

75w (Board Power)

115w (Board Power)

115w (Board Power)

80w (Board Power)

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Active Fansink

Active Fansink

Active Fansink

Active Fansink

Dimension

2.713” H x 6.137” L
Single Slot, Low Profile

2.713” H x 6.137” L
Single Slot, Low Profile

6.6 inches, HHHL double-slot

3.25” H x 6.732” L

3.25” H x 6.732” L

3.25” H x 6.732” L

Advanced Display

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

SLI/NVLink Support

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

Intel® Ethernet Specifications

Card

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

2 x 2 AX WiFi with BT (M.2) vPro AX211-TWR/SFF

Supplier PN

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Coming Soon

Data Rates Supported

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

Coming Soon

Controller Details

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Coming Soon

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Coming Soon

Data Transfer Mode

Ethernet

Ethernet

Coming Soon

Power Consumption

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

Coming Soon

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Coming Soon

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Coming Soon

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Coming Soon

Network Transfer Rate

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Coming Soon

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Coming Soon

Manageability

Supported

Supported

Coming Soon

Manageability Capabilities Alerting

Supported

Supported

Coming Soon

TDP

Firmware Based Thermal Management

Firmware Based Thermal Management

Coming Soon

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

Coming Soon

# of Ports

2

4

Coming Soon

Data Rate Per Port

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

Coming Soon

System Interface Type

PCIe Gen 2.1

PCIe Gen 2.1

Coming Soon

NC Sideband Interface

Not Available

Not Available

Coming Soon

Jumbo Frames Supported

Yes

Yes

Coming Soon

1000Base-T

Yes

Yes

Coming Soon

IEEE 1588

Supported

Supported

Coming Soon

Supported Under vPro

Not Available

Not Available

Coming Soon

Disclaimers

Ethernet

Model

I350-T2

I350-T4

2 x 2 AX WiFi with BT (M.2) vPro AX211-TWR/SFF

Connector

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Coming Soon

Website

i350 T2

i350 T4

Coming Soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

Coming Soon

Intel® vPro™

Not Available

Not Available

Coming Soon

Intel® Standard Manageablity

Supported

Supported

Coming Soon

Power Optimizer Platform Low-power Management Systems

Supported

Supported

Coming Soon

Energy Efficient Ethernet

Supported

Supported

Coming Soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Coming Soon

Receive Side Scaling

Supported

Supported

Coming Soon

Dual Tx and Rx Queues

Yes

Yes

Coming Soon

Jumbo Frames (up to 9KB)

Supported

Supported

Coming Soon

Teaming

Supported

Supported

Coming Soon

Wake from Deep Sx

Supported

Supported

Coming Soon

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Coming Soon

Network Proxy/ARP Support

Supported

Supported

Coming Soon

Media Card Reader

Description

Not Available

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v4.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Safety, EMC Connection to the Telephone Network and Labeling

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

Regulations & Standards

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Environmentals

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

Materials Used

System
85% PCC recycled plastic in Front, Rear Bezel
35% PCC recycled plastic inside chassis
Packaging
Carton: 90% Recycled and/or FSC certified content3
Cushion: 90% Recycled EPE

TCO Certification

9.0

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

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