P14s i Gen 4

Version: 5.0 | 05/21/2024

Product Display Name

Information Date

27-Feb-24

Description

ThinkPad P14s i

LENOVO’S LIGHTEST MOBILE WORKSTATION

The ThinkPad® P14s i, Lenovo’s most mobile workstation, combines the latest Intel® Core™ processors and NVIDIA® professional graphics, all in a 14-inch chassis. Perfect for highly-mobile power users, the P14s i strikes the balance between power and mobility–allowing students, architects, and engineers to be creative anytime, anywhere.

CPU

Processor Support

Raptor Lake P28 Series Core i5/i7

Socket Type

BGA

Operating Systems

Preloaded

Windows 11 Pro 64 (22H2)
Windows 11 Home 64
Windows 11 Home Single Language 64
Windows 11 Home Chinese Language Edition 64
CMIT Government Edition
Ubuntu (Version22.04)

Supported

Windows 11 Pro 64 (22H2)
Windows 11 Home 64
Windows 11 Home Single Language 64
Windows 11 Home Chinese Language Edition 64
CMIT Government Edition
Ubuntu (Version22.04)

Memory

Number of DIMM Slots

1 soldered-down DIMM + 1 DIMM slot

Channels

Single Channel w/ 1 soldered DIMM
Dual Channel w/ 1 soldered DIMM + 1 add-in DIMM

Type

DDR5, LPDDR5x

ECC Support

No

Speed

5600, 7500 MHz

Max DIMM Size

32GB

Max System Memory

UMA: 48GB DDR5; SWG: 64GB LPDDR5x

Min System Memory

UMA: 16GB DDR5; SWG: 16GB LPDDR5x

Soldered Memory

16GB/32GB/64GB

Storage

Storage Slots

1 x PCIe Gen 4 M.2 2280

SATA

/

PCIe

Solid State Drive, OPAL2 PCIe-NVMe Gen 4 M.2 2280- TLC

SAS

None

Interface

PCIe Gen 4

Security

PCIE

Optional Hard Disk Drive Controllers

OPAL2 for NVMe SSD

Video

Integrated Graphics

Processor Graphics Intel® Iris Xe (dual RAM channel required)

Discrete Graphics

NVIDIA RTX A500

Adapter

None

Bus Interface

PEG

Disclaimers

Dual RAM channel required

Display

Resolutions

FHD+ / 2.8k OLED

Camera

Resolution

HD 720p/FHD 1080p/5MP

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes (optional)

Keyboard

Number of Keys

US : 84 / UK : 85 / JP : 89

Numpad

No

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

CS20 KYB

Key stroke

1.5mm

Key pitch

19.05mm

Keyboard backlight

Optional

Keyboard thickness

Standard

Touchpad / Fingerprint Reader

TrackPoint Details

COMO TrackPoint module (t5.5mm)

Finger Print Reader Model

Synaprics Metallica 8×8 FPR, MoC

Multi-Touch

Yes

Resolution

1000 ppi

TouchPad/Trackpad thickness

3.3mm

TouchPad/Trackpad type

3 BCP

Trackpad size

115mm x 61 mm

Trackpad material/finish

Mylar surface

I/O – Ports and Connectors

USB

2x USB-A (5Gbps) (1 powered)

Thunderbolt

2x USB-C® (Thunderbolt™ 4)

HDMI

1x HDMI 2.1 up to 4K/60Hz

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

N/A

Smart Card Reader

Yes (optional)

Power Connector

DC-In

Docking Port

Docking Via USB-C® (Thunderbolt™ 4)

VirtualLink

None

Network adapter

Gigabit Ethernet (RJ45)

Disclaimers

HDMI 2.1: Up to 8K/60Hz

Power Connector

Main

DC-In

USB-C

1x USB-C® (Thunderbolt™ 4)

Ethernet

Vendor

Intel

Count

x1

EEPROM

SPI ROM (Merge with BIOS/MEFW)

Speeds

10/100/1000 Mbps

Functions

Wake On LAN
MAC Address Pass Through
PXE Boot
Flash Over LAN

Connectors

RJ45

WWAN

Model

optional: CAT16/CAT4 with physical eSIM optional

Near Field Communications

Model

Yes, optional

Audio

Vendor

Realtek

Type

High Definition Audio Codec

Internal Speaker

Yes, dual speakers

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3287

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

n

Signal to Noise Ratio

90dB Signal-to-Noise Ratio (A-weighting) for ADC input.
100dB Signal-to-Noise Ratio (A-weighting) for DAC output

Analog Audio

None

Dolby Digital

Yes

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Power adapter

Type

100W AC Adapter

65W AC Slim Adapter

65W AC Adapter

Dimensions

108mm x 56mm x 26.5mm

88mm x 51mm x 22mm

108.5mm x 46.5mm x 29.5mm

Input Voltage

100-240V

100-240V

100-240V

Security

TPM

Yes, TPM2.0

Asset ID

Yes

vPro

Yes on vPro model

Chassis Information

Format

Ultraslim Notebook

Color

Thunder Black/Storm Grey

Thermal Solutions

Internal Single FAN, Intelligent Cooling

Dimensions

Length
12.50 inches
317.7 millimeters

Width
8.93 inches
226.9 millimeters

Height
UMA : 21.8 mm (design value) 17.9 mm (Mkt claim)
SWG : 22.5 mm (design value) 17.95 mm (Mkt claim)

UMA : 0.85 in (design value) 0.70 in (Mkt claim)
SWG : 0.88 in (design value) 0.70 in (Mkt claim)

Weight

Starting weight 1.34kg / 2.97 lbs

Packaging Parameters

Height (mm)

300

Height (inch)

11.8

Width (mm)

446

Width (inch)

17.6

Depth (mm)

81

Depth (inch)

3.1

Weight (kgs)

0.32kg

Weight (lbs)

0.71lbs

Security & Serviceability

Self Healing BIOS

No

Access Panel

Removeable bottom cover

Number of Screws

6

Swappable Components

Base cover assembly, TrackPoint pointing stick, Lenovo factory recovery USB key, Power cord, ac power adapter (65W)

Storage Slots

1 storage slot

Memory

1 soldered down RAM + 1 SODIMM slot

System Board

1190 System Board. No self-service CRU.

Restore CD/DVD/USB Set

None. Purchase via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

Yes (if it means the LED for Ethernet)

Security Chip

Yes (for TPM 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating Environment

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

Supported Components

Processor

Intel® Core™ i5-1340P (4+8C)
Intel® Core™ i5-1350P (4+8C), vPro
Intel® Core™ i7-1360P (4+8C)
Intel® Core™ i7-1370P (4+8C), vPro

Memory Support

DDR5 ,LPDDR5x

Chipset (PCH)

Integrated Soc

Size of BIOS Flash

16 MB

Super I/O

N/A

Clock

Crystal

Audio

Realtek High Definition Audio

Ethernet

Non-vPro model: Intel® Ethernet Connection I219-V (Jacksonville)
vPro model: Intel® Ethernet Connection I219-LM (Jacksonville)

Memory

System Capacity Options

UMA: Up to 48GB DDR5 (8,16,32 DIMM + 16 soldered down)
SWG: Up to 64GB LPDDR5x (soldered down only)

non-ECC

DDR5 : 8GB/16GB/32GB
LPDDR5x ” 16GB/32GB/64GB

Brand of non-ECC Memory

Samsung
SK Hynix
Micron
Ramaxel

ECC

None

Brand of ECC Memory

N/A

Memory clock frequency(MHz)

DDR5 5600 MHz
LPDDR5x 7500 MHz

Storage

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

256GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G4 NVMe M.2 2280
512GB Opal 2 PCIe G4 NVMe Performance M.2 2280
1TB Opal 2 PCIe G4 NVMe M.2 2280
1TB Opal 2 PCIe G4 NVMe Performance M.2 2280
2TB Opal 2 PCIe Gen4 Performance NVMe M.2 2280

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
UnionMem
WD
Hynix
Kioxia
SSSTC

Intel Optane Storage Technology

Yes

RAID

Not Supported

Removeable Media

Media Card Reader Specifications

N/A

CPU Specifications

CPU

Intel® Core™ i5-1340P (4+8C)

Intel® Core™ i5-1350P (4+8C)

Intel® Core™ i7-1360P (4+8C)

Intel® Core™ i7-1370P (6+8C)

Integrated Graphics

Intel Iris Xe Graphics

Intel Iris Xe Graphics

Intel Iris Xe Graphics

Intel Iris Xe Graphics

# of Cores

4 P Core+8 E Core

4 P Core+8 E Core

4 P Core+8 E Core

6 P Core+8 E Core

# of Threads

16

16

16

20

Max Turbo Frequency

4.6 GHz

4.7 GHz

5.0 GHz

5.2 GHz

P-core Max Turbo Frequency

4.6 GHz

4.7 GHz

5.0 GHz

5.2 GHz

E-core Max Turbo Frequency

3.4 GHz

3.5 GHz

3.7 GHz

3.9 GHz

Cache

12MB

12MB

18MB

24MB

TDP

20W-28W

20W-28W

20W-28W

20W-28W

Disclaimers

Dual RAM channel required

Dual RAM channel required

Dual RAM channel required

Dual RAM channel required

Display Specifications

Model

WUXGA

WUXGA oncell touch

WUXGA low power

WUXGA ePrivacy

2.2K

2.8k

Resolution

1920 x 1200

1920 x 1200

1920 x 1200

1920 x 1200

2240 x 1400

2880 x 1800

Diagonal

14″

14″

14″

14″

14″

14″

Aspect Ratio

Ratio 16:10

Ratio 16:10

Ratio 16:10

Ratio 16:10

Ratio 16:10

Ratio 16:10

Backlight

LED

LED

LED

LED

LED

None

PPI

162

162

162

162

189

243

Active Area

302 x 188

302 x 188

302 x 188

302 x 188

302 x 188

302 x 188

Refresh Rate

60 Hz

60 Hz

60 Hz

60Hz

60 Hz

60 Hz

Contrast Ratio

800:1 (TYP)

800:1 (TYP)

1000:1 (TYP)

1500:1 (TYP)

1500:1 (TYP)

100000:1 (TYP)

Viewing Angle

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

85/85/85/85 degree

Color gamut

45% NTSC

45% NTSC

100% sRGB

100% sRGB

100% sRGB

100% DCI-P3

Brightness

300nit

300nit

400nit

500nit

300nit

400nit

Contrast

Ratio 800:1

Ratio 800:1

Ratio 1000:1

Ratio 1500:1

Ratio 1500:1

Ratio 100000:1

Color Depth

16M

16M

16M

16M

16M

1074M

Interface

eDP 1.2

eDP 1.2

eDP 1.4

eDP 1.4

eDP 1.4

eDP 1.4

Panel ID Recognition

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

Weight

305g max

310g max

245g max

270g max

235g max

180g max

Color Calibrator

None

None

Adaptive ICC profile

None

None

X-Rite Factory Color Calibration, Dolby Vision

Panel Technology

IPS, Anti-Glare

IPS, Anti-Glare

IPS, Anti-Glare, LBL, Eyesafe certified

IPS, Anti-Glare

IPS, Anti-Glare, LBL

OLED, Anti-Glare/Anti-reflection/Anti-fingerprint, LBL,Eyesafe certified

Touch Panel

None

YES

None

YES

None

None

HDD Specifications

2.5″ SAS Hard Disk Drive (HDD)

N/A

2.5″ SATA Hard Disk Drive (HDD)

N/A

HDD Storage Device Specifications

Connector

N/A

Transfer Rate (Gb/sec)

N/A

HDD Performance

Spindle Speed(RPM)

N/A

Power off to Spindle Stop(sec)

N/A

DC Power to Drive Ready(sec)

N/A

Receipt of Start Unit Command to Drive Ready(sec)

N/A

Average Latency(msec)

N/A

HDD Power Management

Input (VDC)

N/A

Typical (Watts)

N/A

Idle (Watts)

N/A

HDD Dimensions

Height (mm – Max)

N/A

Width (mm)

N/A

Depth (mm – Max)

N/A

Weight (grams)

N/A

HDD Temperature

Operating(C) Ambient

N/A

Operating(C) Base Casting

N/A

Non-Operating(C) Ambient

N/A

Gradient(C per Hour)

N/A

HDD Shock

Operating(Gs @ 2ms)

N/A

Non-Operating(Gs @ 2ms)

N/A

SSD Specifications

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

1x M.2 2280 PCIe Gen4

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Solid State Storage Devices

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280S3

Interface Type

PCIe NVMe Gen4

Read/Write IOPS Specifications

Performance PCIe Gen4
Read: 800k(2TB/1TB/512GB)
Write: 700k(2TB/1TB/512GB)

Value PCIe Gen4
Read: 300k (1TB/512GB/256GB)
Write: 500k(1TB/512GB/256GB)

Bandwidth Performance

PCIe Gen4 x 4 (16Gbps)

Power Consumption (Max)

3.0A (10us average)

Active(AVG)

5W

Idle

5mW (L1.2)

Min MTBF

2’000’000

Min Sequential Read

Performance PCIe Gen4
6500MB/s (2TB/1TB/512GB)

Value PCIe Gen4
3700MB/s (1TB/512GB/256GB)

Min Sequential Write

Performance PCIe Gen4
5000MB/s (2TB/1TB/512GB)

Value PCIe Gen4
2800MB/s (1TB/512GB/256GB)

Hardware Encryption

Yes

Discrete Graphics Adapter

GPU Name

NVIDIA RTX A500

CUDA Processing Cores

2048

GPU Memory

4 GB

Memory Bandwidth

96 GB/s

Memory Type

GDDR6

Memory Interface

64-bit

TGP Max Power Consumption

30

Display Port

0

OpenGL

4.6

Shader Model

7

DirectX

12

PCIe Generation

4

Floating-Point Performance

1.1

VR Ready

NO

Simultaneous Multi-Projection

No

NVIDIA FXAA/TXAA Antialiasing

Yes

NVIDIA nView Display Management Technology

Yes

GPU Direct for Video

NO

Vulkan Support

Yes

NVIDIA Optimus

Yes

WLAN

Model

INTEL WIFI 6E_AX211 CNVi_2X2AX+BT5.2

Qualcomm NFA-725A PCIE_2X2AX+BT5.2

Connector: Main, Aux/GNSS, GNSS

ANT1:AUX WiFi + BT; ANT2: Main WiFi

ANT1:AUX WiFi + BT; ANT2: Main WiFi

Antenna Diversity

Supported

Supported

MIMO

Supported

Supported

GNSS Bian

N/A

N/A

Radio ON/OFF Control

Supported

Supported

Connector interface

CNVi

PCIE

Operating Temperature (Adapter Shield)

0c to +80c

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 7*, Microsoft Windows 8.1*, Microsoft Windows 10*, Linux* (limited feature support), Android

Microsoft Windows 7*, Microsoft Windows 8.1*, Microsoft Windows 10*, Linux* (limited feature support), Android

Wi-Fi Alliance

Wi-Fi CERTIFIED* a/b/g/n/ac, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Direct* for peer to peer device connections, Wi-Fi Miracast* as Source.

Wi-Fi CERTIFIED* a/b/g/n/ac, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Direct* for peer to peer device connections, Wi-Fi Miracast* as Source.

IEEE WLAN Standard

IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w; 802.11r, 802.11k, 802.11v pending OS support; Fine Timing Measurement based on 802.11REVmc

IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w; 802.11r, 802.11k, 802.11v pending OS support; Fine Timing Measurement based on 802.11REVmc

Roaming

Support seamless roaming between access points

Support seamless roaming between access points

Bluetooth*

Dual Mode Bluetooth® 5.0, BLE

Dual Mode Bluetooth® 5.0, BLE

Authentication

WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA

WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA

Authentication Protocols

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

Encryption

64-bit and 128-bit WEP, 128-bit AES-CCMP

64-bit and 128-bit WEP, 128-bit AES-CCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives.

For a list of country approvals, please contact your local Intel representatives.

US Government

FIPS10, FISMA

FIPS10, FISMA

Product Safety

UL,C-UL,CB (IEC 60950-1)

UL,C-UL,CB (IEC 60950-1)

Disclaimers

1) 6GHz channel of Wi-Fi 6E is only available with Windows 11
2) Bluetooth may be limited by OS

1) 6GHz channel of Wi-Fi 6E is only available with Windows 11
2) Bluetooth may be limited by OS

Battery

Dimension

270 mm x 68.5 mm x 6.16 mm

270 mm x 68.5 mm x 6.16 mm

Weight

173g

212g

Type (Chemistry and Cell)

Li-ion Polymer

Li-ion Polymer

Voltage

11.58V ~ 11.61V

15.44V ~ 15.48V

Battery Life

Up to 9.7hrs (MM18)

Up to 9.7hrs (MM18)

Battery Capacity

Integrated 3-cell 39.3Wh battery

Integrated 4-cell 52.5Wh battery

Charging Time

0% to 100% 0% to 80%
Battery Charging Time (in-operation) 2.06 hr
Battery Charging Time (off) 1.89 hr 0.92 hr

0% to 100% 0% to 80%
Battery Charging Time (in-operation) 2.39hr
Battery Charging Time (off) 1.98 hr 0.99 hr

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2016

CR2016

BIOS Specifications

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

N/A

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

Yes, if Remote wakeup is Wake on LAN from S4/S5.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

N/A

EMC & Safety

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories

Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Izod Test – EPEAT Compliant

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Environmentals

Energy Star

ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Declaration of Conformance For Machine Types: 21HF, 21HG

IT ECO declaration

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Manageability

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkPad supports software management tools from the Lenovo Vantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Environmentals

Energy Star

ENERGY STAR® 8.0

EPEAT

EPEAT® Gold

RoHS Compliant

RoHS Compliant

TCO

TCO 9.0

Sustainability

97% PCC recycled plastic: Speaker enclosure
97% recycled plastic: 52.5WHr Battery
95% PCC recycled plastic: 65W PSU
90% recycled/sustainable packaging
Low-temperature solder

Disclaimers

Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material.

Materials Used

50% Recycled Aluminum A Cover
90% Recycled Magnesium C Cover
55% Recycled Aluminum D Cover
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
90% PCC Plastic Slim 65W AC Adapter
90% PCC Plastic Standard 65W AC Adapter
30% PCC Plastic 100W AC Adapter (90% coming soon)
Low Temperature Solder (motherboard, memory, SSD, fingerprint reader module, ClickPad)
Plastic free packaging with 90% recycled and/or FSC certified content (standard)

TCO Certification

9.0

Disclaimers

1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material

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