Lenovo ThinkStation: PCs & Tablets
P1 Gen 6
Version: 6.0 | 05/21/2024
Information Date
27-Feb-24
Description
ThinkPad P1
Designed with the modern user in mind, the ThinkPad® P1 is the perfect combination of workstation know-how, ultra-premium design, and true mobility, without sacrificing looks for power.
Processor Support
Intel 13th Gen Raptor Lake H Series (45W) Core i7 and i9
Type
BGA
Preloaded
Windows 11SV2 64-bit (Sun Valley 2)
Windows 11 Pro 64-bit (22H2)
Windows 11 Home 64-bit
Windows 11 Home Single Language 64-bit
Windows 11 Home Chinese Language Edition 64-bit
Ubuntu Linux 64-bit (Version 20.04 LTS, running the 4.15.0 kernel)
Ubuntu Linux Data Science Workstation
Fedora 36 Linux (depending on NVIDIA open source driver status)
No Operating System
Supported
Ubuntu Linux 22.04 Cert only
Red Hat Enterprise Linux (RHEL) 8.6 (depending on NVIDIA open source driver status)
Number of DIMM Slots
2 DIMM sockets
Channels
Single Channel w/ 1DIMM
Dual Channel w/ 2DIMMs
Type
DDR5 SoDIMM
ECC Support
No
Speed
Up to 5600MHz
Max DIMM Size
48GB
Max System Memory
96GB
Min System Memory
8GB
Soldered Memory
None
Disclaimers
No ECC memory on P1 Gen 6
Storage Slots
2x M.2 (NV RTX A1000, 2000 Ada)
1x M.2 (NV RTX 35/4/5000 Ada, NV GF RTX 4060/80/90)
SATA
None
PCIe
Solid State Drive, 2x OPAL2 PCIe NVMe M.2
SAS
None
Interface
PCIe Gen 4 Performance or Gen 4 Value
Security
OPAL2 for NVMe SSD
Optional Hard Disk Drive Controllers
None
Integrated Graphics
For Intel® i7-13700H
Processor Graphics Intel® Iris Xe Graphics
Utilized via “Hybrid Mode” in BIOS
For Intel® i7-13800H vPro
Processor Graphics Intel® Iris Xe Graphics
Utilized via “Hybrid Mode” in BIOS
For Intel® i9-13900H vPro
Processor Graphics Intel® Iris Xe Graphics
Utilized via “Hybrid Mode” in BIOS
Discrete Graphics
NV RTX A1000, NV RTX 2/35/4/5000 Ada, NV GF RTX 4060/80/90
Adapter
None
Bus Interface
PEG
Resolutions
WUXGA (FHD+) / WQXGA (QHD+) / WQUXGA (UHD+) OLED Touch
Resolution
FHD 1080p + IR Hybrid Camera/ 5MP+ IR Hybrid Camera with human presence detection
Frames per Second
30 fps
Focus
Fixed 50cm
Camera Interface
USB 2.0
IR Camera
Yes, On Select Model
Number of Keys
US : 84 / UK : 85 / JP :89
Numpad
No
Size
100% ISO
Function Key Features
Yes
Backlit
Yes
Keyboard size
Como 2021 Full size KB without NumPad (Bottom loading)
Key stroke
1.5mm
Key pitch
19.05 mm (Vertical & Horizontal)
Keyboard backlight
Yes
Keyboard thickness
4.55mm
TrackPoint Details
COMO TrackPoint module (t5.55mm)
Finger Print Reader Model
Synaptics Metallica 8×8 FPR, MoC – integrated with Power button
Multi-Touch
Yes
Resolution
1000 ppi
TouchPad/Trackpad thickness
3.3mm
TouchPad/Trackpad type
3 Buttons Clickpad
Trackpad size
115mm x 62mm
Trackpad material/finish
Glass surface
USB
2x USB-A (5Gbps) (1 powered)
2x USB C® (10Gbps)
Thunderbolt
2x USB-C® (Thunderbolt™ 4)
HDMI
1x HDMI 2.1 up to 8K/60Hz
Audio Combo Jack
1x Microphone & Headphone Combo Jack (3.5mm)
Media Card Reader
Dedicated SD Express 7.0 Card Reader (UHS-I) (MMC,SD,SDHC SDXC)
Smart Card Reader
None
Power Connector
DC-In
Docking Port
Docking Via USB-C® (Thunderbolt™ 4)
VirtualLink
None
Network adapter
No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter
Disclaimers
HDMI 2.1: Up to 8K/60Hz
Main
DC-In
USB-C
1x USB-C® (Thunderbolt™ 4)
Vendor
N/A
Count
N/A
EEPROM
N/A
Speeds
N/A
Functions
N/A
Connectors
No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter
Model
Fibocom L860-GL-16 4G CAT16 (WW and PRC only)
Model
Foxconn NXP NPC300 NFC
Vendor
Realtek
Type
Intel High Definition Audio (2 channel)
Internal Speaker
2 channel
Connectors
Microphone & Headphone Combo Jack (3.5mm)
Chipset
ALC3306 w/ Smart Amp
Number of Channels
4-channel DAC, 4-channel ADC
Number of Bits/Audio Resolution
16/20/24-bit PCM format
Sampling Rate (Recording/Playback)
44.1k/48k/96k/192kHz sample rate
Signal to Noise Ratio
Mic In: 95dB FSA
Headphone Out@32ohm: 100dB FSA
Analog Audio
None
Dolby Digital
Dolby ATMOS
Digital Out (S/PDIF)
No
Speaker Power Rating
2W@4ohm/ch
Type
Slim 170/230W AC Adapter
Slim 170W AC Adapter
Slim 230W AC Adapter
Dimensions
200cc (118 x 77 x 22mm)
240cc (142 x 77 x 22mm)
353cc (160 x 87 x 25.4mm)
Weight
Max 370g
Max 475g
Max 815g
Input Voltage
100-240V
100-240V
100-240V
TPM
Version 2.0
Asset ID
Yes
vPro
Intel vPro for WS
Format
16″ Thin & Light
Color
Deep Black
Carbon Fiber Weave
Thermal Solutions
Internal Dual FAN, Intelligent Cooling, KBD air intake, Dual by-pass design
Vapor Chamber and Liquid Metal Cooling
Dimensions
Length
14.15 inches
359.5 millimeters
Width
9.99 inches
253.8 millimeters
Height
Non-Touch
0.69 inches
17.5 millimeters
Touch
0.68 inches
17.3 millimeters
Weight
Non-Touch Model: 4 Cell Battery 1.86kgs/4.11lbs
Touch Model: 4 Cell Battery 1.78kgs/3.92lbs
Standard
Retail
Height (mm)
329mm
325mm
Height (inch)
12.95in
12.79in
Width (mm)
518mm
531mm
Width (inch)
20.39in
20.90in
Depth (mm)
80mm
80mm
Depth (inch)
3.14in
3.14in
Weight (kgs)
3.3kgs
4.1kgs
Weight (lbs)
7.27lbs
9.03lbs
Hardware Maintenance Manual
P1 Gen 6 HMM — need link
Drivers & Software
P1 Gen 6 Drivers & Software — need link
Self Healing BIOS
Yes
Access Panel
Removable bottom cover
Number of Screws
7
Swappable Components
Bottom cover, memory module, M.2 solid-state drive, coin-cell battery, TrackPoint pointing cap, SIM Tray
Storage Slots
2 slots
Memory
2 SoDIMM slots
Restore CD/DVD/USB Set
None, Restore Media available via Lenovo Customer Support Center
Cable Lock Support
Security-lock slot, Optional Kensington Cable Lock
Power-On Password
Yes
Hard Disk Password
Yes; User and Master hard disk password
Supervisor Password
Yes
NIC LEDs (integrated)
None
Security Chip
Yes (for TPM 2.0)
Access Panel Key Lock
Bottom Cover Tamper Detection
Boot Sequence Control
Yes
Operating – Air Temperature
At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)
Non Operating – Air Temperature
At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)
Humidity
Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)
Corrosive Gas
G1
Particulates
P1
Processor
Intel® Core™ i7-13700H processor (E-cores up to 3.70 GHz P-cores up to 5.0 GHz)
Intel® Core™ i7-13800H vPro processor (E-cores up to 4.0 GHz P-cores up to 5.20 GHz)
Intel® Core™ i9-13900H vPro processor (E-cores up to 4.1 GHz P-cores up to 5.4 GHz)
Memory Support
DDR5 5600MHz SoDIMM
Chipset (PCH)
OnPkg PCH-P
Size of BIOS Flash
64MB + 16MB
Super I/O
None
Clock
Crystal
Audio
Realtek High Definition Audio
Ethernet
No native RJ-45 port
RJ-45 functionality provided via USB-C® to Ethernet Adapter
System Capacity Options
8GB
16GB
32GB
48GB
Memory Types
8GB DDR5 5600MHz SoDIMM
16GB DDR5 5600MHz SoDIMM
32GB DDR5 5600MHz SoDIMM
48GB DDR5 5600MHz SoDIMM
Brand of Memory
Samsung
SK Hynix
Ramaxel
Micron
Memory Speed
5600MHz
Disclaimers
No ECC memory on P1 Gen 6
2.5″ SAS Hard Disk Drive (HDD)
None
2.5″ SATA Hard Disk Drive (HDD)
None
2.5″ SATA Solid State Drive (SSD)
None
M.2 (NGFF) PCIe Solid State Drive (SSD)
256GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
4TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
2.5″ PCIe Solid State Drive (SSD)
None
Brand of Drive
Samsung
Western Digital
Hynix
Kioxia
Intel Optane Storage Technology
None
RAID
Optional, Selectable in BIOS
RAID Level and Requirements
RAID-0/1
Media Card Reader Specifications
SD Express 7.0 UHS-II
CPU
Intel® Core™ i7-13700H processor (E-cores up to 3.50 GHz P-cores up to 5.0 GHz)
Intel® Core™ i7-13800H vPro processor (E-cores up to 4.0 GHz P-cores up to 5.20 GHz)
Intel® Core™ i9-13900H vPro processor (E-cores up to 4.10 GHz P-cores up to 5.40 GHz)
Integrated Graphics
Intel® Iris Xe Graphics
Intel® Iris Xe Graphics
Intel® Iris Xe Graphics
# of Cores
6 P-cores and 8 E-cores
6 P-cores and 8 E-cores
6 P-cores and 8 E-cores
# of Threads
20
20
20
Processor Base Frequency
2.4GHz on P-cores and 1.8GHz on E-cores
2.5GHz on P-cores and 1.8GHz on E-cores
2.6GHz on P-cores and 1.9GHz on E-cores
Max Turbo Frequency
E-cores up to 3.50 GHz P-cores up to 5.0 GHz
E-cores up to 4.0 GHz P-cores up to 5.20 GHz
E-cores up to 4.10 GHz P-cores up to 5.40 GHz
Cache
24 MB
24 MB
24 MB
TDP
45 W
45 W
45 W
Model
WUXGA Non-Touch
WQXGA Non-Touch
WQUXGA OLED Touch
Resolution
FHD+ (1920 x 1200)
QHD+ (2560 x 1600)
UHD+ (3840 x 2400)
Diagonal
16″
16″
16″
Aspect Ratio
16:10
16:10
16:10
Backlight
LED
LED
LED
PPI
FHD+: 142
QHD+: 189
UHD+: 283
Active Area
FHD+: 344.68mm x 215.42mm
QHD+: 344.68mm x 215.42mm
UHD+: 344.448mm x 215.280mm
Refresh Rate
Max 60Hz
Max 165Hz
Max 60Hz
Contrast Ratio
FHD+: 1200:1
QHD+: 1200:1
UHD+: 100,000:1
Viewing Angle
FHD+: 89/89/80/80 degree
QHD+: 85/85/85/85 degree
UHD+: 87.5/87.5/87.5/87.5 degree
Color gamut
100% sRGB
100% sRGB
100% DCI-P3
Brightness
300 nits
500 nits
400 nits (SDR)
500 nits (HDR)
HDR
N/A
N/A
HDR400
Dolby Vision
Color Depth
FHD+: 16.7M (8-bit)
QHD+: 16.7M (8-bit + 2 FRC)
RGB 8-bit + 2 FRC (HDR)
RGB 8-bit (SDR)
Interface
FHD+: eDP 1.4
QHD+: eDP 1.4
UHD+: eDP 1.4
Panel ID Recognition
EDID in BIOS Table
EDID in BIOS Table
EDID in BIOS Table
Weight
330g max
330g max
200g max
Color Calibrator
X-Rite Pantone Color Calibration
X-Rite Pantone Color Calibration
X-Rite Pantone Color Calibration
Panel Technology
IPS, Anti-Glare
IPS, Anti-Glare
OLED, ARAS
Touch Panel
None
None
Multi-Finger Touch Panel
2.5″ SATA Solid State Drive (SSD)
N/A
M.2 (NGFF) PCIe Solid State Drive (SSD)
2x M.2 2280-S3 PCIe
2.5″ PCIe Solid State Drive (SSD)
N/A
Intel Optane Storage Technology
N/A
Supported Types
M.2
M.2
M.2
Dimensions inches/centimeters (W x D x H)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)
22.0 (+-0.15) x 80.0 (+-0.15) x 3.5 (max)
Size
M.2 2280-S3
M.2 2280-S3
M.2 2280-D2
Interface Type
PCIe NVMe
PCIe NVMe
PCIe NVMe
Read/Write IOPS Specifications
Read: 300K (512GB/1TB), 200K (256GB)
Write: 240K (512GB/1TB), 190K (256GB)
IOPS, 4K Random, 32 q depth, 4 threads
Read: 550K (1TB/2TB), 350K (512GB)
Write: 400K (1TB/2TB), 370K (512GB)
IOPS, 4K Random, 32 q depth, 8 threads
Read: 600K (4TB)
Write: 400K (4TB)
IOPS, 4K Random, 32 q depth, 8 threads
Bandwidth Performance
PCIe Gen4x4 Value (16Gb/S)
PCIe Gen4x4 Performance (16Gb/S)
PCIe Gen4x4 Performance (16Gb/S)
Power Consumption (Max)
5.0W
8.2W
7.4W
Active(AVG)
5.0W (Sequential read)
8.2W (Sequential read)
7.4W (Sequential read)
Idle
5mW (Low power state)
5mW (Low power state)
5mW (Low power state)
Min MTBF
2,000,000 (h)
2,000,000 (h)
2,000,000 (h)
Min Sequential Read
3000MB/s (512GB/1TB), 2900MB/s (256GB)
6400MB/s (1TB/2TB), 6000MB/s (512GB)
6400MB/s (4TB)
Min Sequential Write
2100MB/s (512GB/1TB), 1100MB/s (256GB)
5000MB/s (2TB), 3800MB/s (1TB), 3200MB/s (512GB)
5000MB/s (4TB)
Hardware Encryption
Yes
Yes
Yes
Laptop GPUs
NVIDIA RTX A1000 Laptop GPU
NVIDIA RTX 2000 Ada 8GB Laptop GPU
NVIDIA RTX 3500 Ada 12GB Laptop GPU
NVIDIA RTX 4000 Ada Laptop GPU
NVIDIA RTX 5000 Ada Laptop GPU
NVIDIA GeForce RTX 4060
NVIDIA GeForce RTX 4080
NVIDIA GeForce RTX 4090
NVIDIA CUDA Processing Cores
2560
3072
5120
7,424
9,728
3,072
7,424
9,728
NVIDIA RT Cores
20 (2nd Gen)
24 (3rd Gen)
40 (3rd Gen)
58 (3rd Gen)
76 (3rd Gen)
24 (3rd Gen)
58 (3rd Gen)
76 (3rd Gen)
Tensor Cores
80 (3rd Gen)
96 (4th Gen)
160 (4th Gen)
232 (4th Gen)
304 (4th Gen)
96 (4th Gen)
232 (4th Gen)
304 (4th Gen)
GPU Memory
6GB
8GB
12GB, ECC
12GB, ECC
16GB, ECC
8GB
12GB
16GB
Peak Memory Bandwidth
168 GB/s
256 GB/s
432 GB/s
432 GB/s
576 GB/s
Coming Soon
Coming Soon
Coming Soon
Memory Type
GDDR6
GDDR6
GDDR6
GDDR6
GDDR6
GDDR6
GDDR6
GDDR6
Memory Interface
96-bit
128-bit
192-bit
192-bit
256-bit
128-bit
192-bit
256-bit
DisplayPort
1.4a
1.4a
1.4a
1.4a
1.4a
1.4a
1.4a
1.4a
Open GL
4.6
4.6
4.6
4.6
4.6
Coming Soon
Coming Soon
Coming Soon
Shader Model
7.0
7.0
7.0
7.0
7.0
Coming Soon
Coming Soon
Coming Soon
DirectX
12 Ultimate
12 Ultimate
12 Ultimate
12 Ultimate
12 Ultimate
13 Ultimate
14 Ultimate
15 Ultimate
PCIe Generation
4
4
4
4
4
4
4
4
Single Precision Floating-Point Performance
9.3
14.5
23
33.6
42.6
Coming Soon
Coming Soon
Coming Soon
Tensor Performance
74.6
231.6
368.6
538
681.8
Coming Soon
Coming Soon
Coming Soon
NVIDIA FXAA/TXAA Anti-Aliasing
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
NVIDIA RTX Desktop Manager
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Vulkan Support
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
NVIDIA Optimus
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
NVIDIA Max-Q Technology
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
NVENC/NVDEC
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Model
Garfield Peak 2 Intel Wi-Fi 6E AX211 (Gig+) + BT5.3 (HW Ready)
Antenna Diversity
Supported
MIMO
Supported
Radio ON/OFF Control
Supported
Connector interface
M.2 CNVi
Operating Temperature (Adapter Shield)
0c to +80c
Humidity Non-Operating
50%~90% Rh non condensing (at temperatures of 25c to 35c)
Operating Systems
Microsoft Windows 11, Windows 10, Linux
Wi-Fi Alliance
Wi-Fi CERTIFIED 6 with Wi-Fi 6E, Wi-Fi CERTIFIED a/b/g/n/ac, WMM, WMM-PowerSave, WPA3, Protected Management Frames, Wi-Fi Direct, Wi-Fi Agile Multiband
IEEE WLAN Standard
IEEE 802.11-2016 and select amendments (selected feature coverage)
IEEE 802.11a, b, d, e, g, h, i, k, n, r, u, v, w, ac, ax; Fine Timing Measurement based on 802.11-2016, Wi-Fi Location R2 (802.11az) HW readiness
Roaming
Support seamless roaming between access points
Bluetooth
BT 5.3 (HW Ready)
Authentication Protocols
802.1X EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 – MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA’)
Encryption
128-bit AES-CCMP, 256-bit AES-GCMP
Regulatory
For a list of country approvals, please contact your local Intel representatives
US Government
FIPS 140-2
Product Safety
UL,C-UL,CB (IEC 60950-1)
Disclaimers
1) For more details, please refer to the Intel document as below.
https://www.intel.es/content/www/es/es/products/docs/wireless/wi-fi-6e-ax211-module-brief.html
2) Bluetooth may be limited by OS
Dimension
L: 312mm*W: 58.8mm*T 9.4mm
Weight
MAX 343.2g
Type (Chemistry and Cell)
Li-Polymer (4S1P), 4-cell
Voltage
15.52 V
Battery Capacity
90Wh
Charging Time
On Charge Time (0- 100%) * 120 min
Off Charge Time (0 – 80%) ** 60 min
Off Charge Time (0 – 100%) ** 120 min
Operating Temperature Range
between 10°C (50°F) and 35°C (95°F)
Warranty
1 Year / 3 Year Available
Coin Cell Battery (Model)
CR2016
WMI Support
Yes, if it is BIOS Setup change by WMI.
ROM-Based Setup Utility (F1)
Yes
Bootblock Recovery
No
Replicated Setup
Yes, it supported with SRSETUP tool.
Boot Control
Yes, it means Boot order change.
Discrete Mode
Yes
Memory Change Alert
N/A
Thermal Alert
N/A
Asset Tag
Yes
System/Emergency ROM Flash Recovery with Video
N/A
But FW based ROM flash recovery is supported.
Remote Wakeup/Remote Shutdown
Yes, if Remote wakeup is Wake on LAN from S4/S5.
Keyboard-less Operation
N/A
Per-port Control
Yes, if it is I/O port enable/disable by BIOS Setup.
Adaptive Cooling
Yes, if it is thermal & fan control.
Security
Yes, BIOS password / Hard disk password / Finger print
Intel(R) AMT (includes ASF 2.0)
Yes. If you select vPro model
Intel(R) TXT
Yes. If you select vPro model
Memory Modes
N/A
EMC
Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – United Kingdom
EMC – USA/Territories
Safety
To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com
Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard
Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho
Energy Star
ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov
EPEAT
EPEAT Certification Available on select models
IT ECO declaration
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
Hazardous Substances
The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication
Industry Standard Specifications
This product meets the following industry standard specifications for manageability functionality:
Remote Manageability Software Solutions
Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)
System Software Manager
Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Service, Support, and Warranty
On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
Materials Used
90% Recycled Magnesium C Cover
55% Recycled Aluminum D Cover
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
30% PCC Plastic 170W AC Adapter
Low Temperature Solder (motherboard, SSD, fignerprint reader module, ClickPad
Plastic free packaging with 90% recycled and/or FSC certified content (standard)
TCO Certification
9.0
Disclaimers
1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material
