P3 Tiny

Version: 4.0 | 03/20/2024

Product Information

Information Date

8-Feb-24

Hardware Maintenance Manual

HMM

Drivers & Software

Drivers & Software

Available Whitepapers

Memory Configurator

Storage Configurator

Windows 11/Windows 10 Installation

Red Hat Enterprise Linux 9 Installation

Ubuntu Linux 22.04 LTS Installation

Description

Engineered to go where others can’t, the Lenovo ThinkStation P3 Tiny combines simple and efficient design with the professional power of a workstation.

CPU

Processor Support

Intel Raptor Lake Refresh-S
Intel Raptor Lake-S

Socket Type

Socket-V (LGA 1700)

Operating Systems

Preloaded

Windows 11 Pro
Windows 11 Home
Ubuntu 22.04 LTS

Supported

Red Hat Enterprise Linux 9.x

Memory

Slots

Up to 2 SODIMMs

Channels

Supports up to 2 SODIMM Sockets, 2 Channels

Type

DDR5, 4800MHz non-ECC SODIMM

ECC Support

No

Speed

4800MHz

Max DIMM Size

32GB DDR5 SODIMM

Max System Memory

64GB

Disclaimers

Memory speed can be dependent on the individual CPU capabilities

Storage

PCIe

2 x M.2 PCIe Connectors, Gen 4 Onboard

Video

Integrated Graphics

Intel Integrated UHD Graphics 770 (CPU dependent)
Intel Integrated UHD Graphics 730 (CPU dependent)

Discrete Graphics

PCIe Add-In-Card, Details in Section 3 Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x8 Gen 4 Routed From CPU

Slots

Slot 1

PCIe 4.0 x8, Half Height, Half Length, 50W, With Latch

Front I/O

USB

2 x USB-A 3.2 Gen 2 (10Gb/s) – 1 supports 2.1A charging
1 x USB-C 3.2 Gen 2 (10Gb/s)

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Actual USB throughout will vary depending on the type and quantity of USB devices used.

Rear I/O

USB

2 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x USB 3.2 Gen 1 Type-A 5Gb/s

DisplayPort

1 x Standard
Optional 2 x punch out port

HDMI

1 x Standard
Optional 2 x punch out port

Type-C

Optional 1 x punch out port w/ DP function

VGA Port

Optional 2 x punch out port

Serial Port

Optional 2 x punch out port

Ethernet

1 x Standard
Optional 1 x punch out port

Optional USB Adapter

Dual USB-A 3.2 Gen 1 via punch out ports (requires both)
Quad USB-A 3.2 Gen 1 via punch out ports (requires both & shares 3.2 Gen 1 bandwidth)

Optional Network Adapter

Intel I350-T2 Quad Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Broadcom NetXtreme PCIe 1Gb 2-port RJ45 Ethernet Adapter
Broadcom NetXtreme PCIe 1Gb 4-port RJ45 Ethernet Adapter

Disclaimers

Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Vendor

Intel Jacksonville I219LM (w/ AMT 16.x)

Speeds

10/100/1000 Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Audio

Vendor

Realtek

Type

Integrated Audio

Internal Speaker

Yes

Connectors

Mic + Headphone combo jack

Chipset

ALC256

Number of Channels

2 Channels

Number of Bits/Audio Resolution

2 Channels of DAC support 24-bit PCM format
2 Channels of ADC support 16-bit PCM format

Thermal

Temp Sensors

Ambient Sensor

Fans

1 x CPU Fans

Power Specifications

Power Supply

170W

230W

300W

Power Efficiency

90% Efficient @ 50% Load

90% Efficient @ 50% Load

90% Efficient @ 50% Load

Operating Voltage Range

100 – 240V

100 – 240V

100 – 240V

Rated Voltage Range

90-264VAC

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

2.5A

3.5A

3.5A

Graphics

No

No

No

Power Supply Fan

No

No

No

ENERGY STAR® Qualified (config dependent)

Yes

Yes

Yes

Aux Power Drop

No

No

No

BIOS

Vendor

AMI

Self-Healing BIOS

Yes

Chassis Information

Color

Raven Black

PSU

170W, 230W, and 300W Available, Autosensing

Thermal Solutions

One System Fan Standard

Dimensions

37mm / 1.5″ H
182mm / 7.2″ D
179mm / 7.0″ W

Weight

1.4kg / 3lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Packaging Dimensions

Height (mm/in)

141mm / 5.6″

Width (mm/in)

268mm / 10.6″

Depth (mm/in)

490mm / 19.3″

Weight (kgs/lbs)

2.8kg / 6 lbs

Disclaimers

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Security & Serviceability

TPM

Infineon SLB9672, FW 15.21, TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 16.x)

Cable Lock Support

Yes, Standard

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Optional via External ODD Box

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 5℃ – 35℃ (41F to 95F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 20% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: 0m to 3048m (0ft to 10000ft)
Storage: 0m to 12,192m (0ft to 40000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min
Operating Vibration:
Random,0.27G at 5-500 Hz, 0.5 octave/min
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min

Shock

Operating Shock: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)
Rack Operation Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)
Non-operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Disclaimers

Extended operating temperatures are possible – please contact your Lenovo Rep

Board Size

6.7″ x 6.9″ (171mm x 175mm)

Layout

Custom ATX

Motherboard Core

Processor Support

Intel Raptor Lake Refresh Core
Intel Raptor Lake Core

Socket Type

Socket V (LGA 1700)

Memory Support

DDR5 up to 4800MHz SODIMM Memory (non-ECC)

Voltage Regulator

65W TDP Capable

Chipset (PCH)

Intel Q670 Chipset

Flash

32MB

Super I/O

Nuvoton NPCT750LABYX

Clock

Intel Native isCLK

Audio

Realtek ALC256 Codec

Ethernet

Intel Jacksonville I219LM

Supported Components

Processor Level

Intel Raptor Lake Refresh – Core
Intel Raptor Lake – Core

Processor

i9-14900
i9-14900T
i7-14700
i7-14700T
i5-14600
i5-14600T
i5-14500
i5-14500T
i5-14400
i5-14400T
i3-14100
i3-14100T

i9-13900
i9-13900T
i7-13700
i7-13700T
i5-13600
i5-13600T
i5-13500
i5-13500T
i5-13400
i5-13400T
i3-13100
i3-13100T

Memory Type

SODIMM 4800 MHz / SODIMM 5600 MHz

Memory

8GB 4800MHz DDR5 SDRAM SODIMM
16GB 4800MHz DDR5 SDRAM SODIMM
32GB 4800MHz DDR5 SDRAM SODIMM
16GB 5600MHz DDR5 SDRAM SODIMM
32GB 5600MHz DDR5 SDRAM SODIMM

Disclaimers

*14th Gen CPUs require BIOS M4WKT49A and later.

Storage

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

RAID

RAID Levels and Requirements

NVMe drives support RAID 0/1

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Optical Drive/Removable Media

DVD-ROM Drive

Optional via External ODD Box – Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Optional via External ODD Box – Slim DVD Burner/CD-RW Drive

Keyboard and Pointing Devices

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard

Pointing Devices

Calliope USB Mouse

PCIe Adapters

Network

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Broadcom NetXtreme PCIe 1Gb 2-port RJ45 Ethernet Adapter
Broadcom NetXtreme PCIe 1Gb 4-port RJ45 Ethernet Adapter

Thunderbolt

Rear Thunderbolt PCIe Adapter

WiFi Cards

Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non-vPro)
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX211 vPro)
Realtek Wi-Fi 6 RTL8852BE

CPU Specifications

CPU

Intel Core i9 13900T ( 1.1GHz / 24C / 32T / 30M /DDR5 5600 / 35W / Turbo / GT32)

Intel Core i9 13900 ( 2.0GHz / 24C / 32T / 32M /DDR5 5600 / 65W / Turbo / GT32)

Intel Core i7 13700T ( 1.4GHz / 16C / 24T / 30M /DDR5 5600 / 35W / Turbo / GT32)

Intel Core i7 13700 ( 2.1GHz / 16C / 24T / 30M /DDR5 5600 / 65W / Turbo / GT32)

Intel Core i5 13600T ( 1.8GHz / 14C / 20T / 24M /DDR5 4800 / 35W / Turbo / GT32)

Intel Core i5 13600 ( 2.7GHz / 14C / 20T / 24M /DDR5 4800 / 65W / Turbo / GT32)

Intel Core i5 13500T ( 1.6GHz / 14C / 20T / 24M /DDR5 4800 / 35W / Turbo / GT32)

Intel Core i5 13500 ( 2.5GHz / 14C / 20T / 24M /DDR5 4800 / 65W / Turbo / GT32)

Intel Core i5 13400T ( 1.3GHz / 10C / 16T / 20M /DDR5 4800 / 35W / Turbo / GT24)

Intel Core i5 13400 ( 2.5GHz / 10C / 16T / 20M /DDR5 4800 / 65W / Turbo / GT24)

Intel Core i3 13100T ( 2.5GHz / 4C / 8T / 12M /DDR5 4800 / 35W / Turbo / GT24)

Intel Core i3 13100 ( 3.4GHz / 4C / 8T / 12M /DDR5 4800 / 60W / Turbo / GT24)

Intel Core i5 14400 (

Intel Core i5 14400T ( 1.5GHz / 10C / 16T / 20M /DDR5 4800 / 35W / Turbo / GT24)

Intel Core i9 14900 ( 2.0GHz / 24C / 32T / 36M /DDR5 5600 / 65W / Turbo / GT32)

Intel Core i7 14700 ( 2.1GHz / 20C / 28T / 33M /DDR5 5600 / 65W / Turbo / GT32)

Intel Core i9 14900T ( 1.1GHz / 24C / 32T / 36M /DDR5 5600 / 35W / Turbo / GT32)

Intel Core i7 14700T ( 1.3GHz / 20C / 28T / 33M /DDR5 5600 / 35W / Turbo / GT32)

Intel Core i5 14600 ( 2.7GHz / 14C / 20T / 24M /DDR5 4800 / 65W / Turbo / GT32)

Intel Core i5 14500 ( 2.6GHz / 14C / 20T / 24M /DDR5 4800 / 65W / Turbo / GT32)

Intel Core i5 14600T ( 1.8GHz / 14C / 20T / 24M /DDR5 4800 / 35W / Turbo / GT32)

Intel Core i5 14500T ( 1.7GHz / 14C / 20T / 24M /DDR5 4800 / 35W / Turbo / GT32)

Intel Core i3 14100 ( 3.5GHz / 4C / 8T / 12M /DDR5 4800 / 60W / Turbo / GT24)

Intel Core i3 14100T ( 2.7GHz / 4C / 8T / 12M /DDR5 4800 / 35W / Turbo / GT24)

# of Cores

24C

24C

16C

16C

14C

14C

14C

14C

10C

10C

4C

4C

10C

10C

24C

20C

24C

20C

14C

14C

14C

14C

4C

4C

# of Threads

32

32

24

24

20

20

20

20

16

16

8

8

16

16

32

28

32

28

20

20

20

20

8

8

Processor Base Frequency

1.1 GHz

2.0GHz

1.4GHz

2.1GHz

1.8GHz

2.7GHz

1.6GHz

2.5GHz

1.3GHz

2.5GHz

2.5GHz

3.4GHz

2.5GHz

1.5GHz

2.0GHz

2.1GHz

1.1 GHz

1.3GHz

2.7GHz

2.6GHz

1.8GHz

1.7GHz

3.5GHz

2.7GHz

Max Turbo Frequency

5.3GHz

5.6GHz

4.9GHz

5.2GHz

4.8GHz

5.0GHz

4.6GHz

4.8GHz

4.4GHz

4.6GHz

4.2GHz

4.5GHz

4.7GHz

4.5GHz

5.8GHz

5.4GHz

5.5GHz

5.2GHz

5.2GHz

5.0GHz

5.1GHz

4.8GHz

4.7GHz

4.4GHz

Cache

36M

36M

30M

30M

24M

24M

24M

24M

20M

20M

12M

12M

20M

20M

36M

33M

36M

33M

24M

24M

24M

24M

12M

12M

TDP

35W

65W

35W

65W

35W

65W

35W

65W

35W

65W

35W

60W

65W

35W

65W

65W

35W

35W

65W

65W

35W

35W

60W

35W

Disclaimers

 

 

 

 

 

 

 

 

 

 

 

 

Solid State Storage Specifications

Drive

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22x80x2.38mm

22x80x2.38mm

22x80x2.38mm

Interface Type

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

Power Active (AVG)

5.8W

5.8W

5.8W

Power Idle

35mW

35mW

35mW

Typical Sequential Read

6000 MB/s

6400 MB/s

6400 MB/s

Typical Sequential Write

3200 MB/s

3800 MB/s

5000 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

500K IOPS

550K IOPS

550K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

370K IOPS

400K IOPS

400K IOPS

Operating Temperature Range

0 to 70°C

0 to 70°C

0 to 70°C

Endurance Rating (Lifetime Writes)

150 TB

300 TB

600 TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

Hardware Encryption

AES 256 bit

AES 256 bit

AES 256 bit

Optical Drive Specifications

Description

9mm Slim DVD ROM Drive
Discontinued January 2024

9mm Slim DVD Burner/CD-RW Drive
Discontinued January 2024

Interface Type

SATA 1.5 Gb/s

SATA 1.5 Gb/s

Dimensions

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

Disc Capacity

NA

NA

Type

DVDROM

DVDWriter

External Dimensions

NA

NA

Speed

NA

NA

Bay Type

9.0mm Tray

9.0mm Tray

Color

Business Black or without bezel

Business Black or without bezel

Removable

No

No

Internal Buffer Size

0.5MB Min

0.5MB Min

Writes

NA

8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW

Reads

8XDVD-ROM / 24XCD-ROM

8XDVD-ROM / 24XCD-ROM

Source

DC Power 5V

DC Power 5V

DC Power Requirements

+5V±5%

+5V±5%

DC Current

Max 2.5A@5v

Max 2.5A@5v

Operating Systems Supported

All Windows OS

All Windows OS

Temperature

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Relative Humidity

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Disclaimers

Note: This part was discontinued January 2024

Note: This part was discontinued January 2024

Integrated Graphics Adapter

Type

Intel® UHD Graphics 770/730

Display Interface

1x DP 1.2, 1x HDMI 2.0

Video Resolution (max)

4096×2304 @ 60Hz (DP) ,4096×2160@60Hz (HDMI)

Discrete Graphics Adapter

Adapter

Nvidia T400 (miniDPX3)4GB

Nvidia T1000(miniDP x4) – 4GB GDDR6 Tiny LP
Discontinued

Nvidia T1000 – 8GB GDDR6 Tiny LP

Bus Interface

PCI Express 3.0 ×8

PCI Express 3.0 ×8

PCI Express 3.0 ×8

Display Interface

Three mini-DisplayPort connectors

Four mini-DisplayPort connectors

Four mini-DisplayPort connectors

Graphics Chipset

TU117-825

TU117-875

TU117-875

Memory Clock Frequency (MHz)

5001MHz

5001MHz

5001MHz

Memory Size

4GB

4GB

8GB

Memory Interface

64bit

128bit

128 bit

Memory Bandwidth

32.4 Gbps

32.4 Gbps

32.4 Gbps

GPU Cores

384

896

896

GPU Core Frequency (MHz)

Base:420 MHz
Boost:1425 MHz
Max Boost:2100 MHz

Base:1065 MHz
Boost:1395 MHz
Max Boost:2100 MHz

Base:1065 MHz
Boost:1395 MHz
Max Boost:2100 MHz

Maximum Power Consumption

30W

50W

50W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
•7680 × 4320 × 24 bpp at 120 Hz
•7680 × 4320 × 24 bpp at 60 Hz
•5120 × 2880 × 24 bpp at 60 Hz
HDMI™ 2.0b
Maximum resolution:
•7680 × 4320 × 24 bpp at 30 Hz
Simultaneous display support
Up to four simultaneous displays

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
•7680 × 4320 × 24 bpp at 120 Hz
•7680 × 4320 × 24 bpp at 60 Hz
•5120 × 2880 × 24 bpp at 60 Hz
HDMI™ 2.0b
Maximum resolution:
•7680 × 4320 × 24 bpp at 30 Hz
Simultaneous display support
Up to four simultaneous displays

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
•7680 × 4320 × 24 bpp at 120 Hz
•7680 × 4320 × 24 bpp at 60 Hz
•5120 × 2880 × 24 bpp at 60 Hz
HDMI™ 2.0b
Maximum resolution:
•7680 × 4320 × 24 bpp at 30 Hz
Simultaneous display support
Up to four simultaneous displays

Thermal Solution

Active

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Dimension

2.713 inches × 6.137 inches, single-slot

2.713 inches × 6.137 inches, single-slot

2.713 inches × 6.137 inches, single-slot

Advanced Display

Coming Soon

Coming Soon

Coming Soon

SLI/NVLink Support

Coming Soon

Coming Soon

Coming Soon

Disclaimers

Note: This part was discontinued January 2024

Ethernet Specifications

Card

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 Non-vPro PCIE M.2 2230 Module (CNVi)

2X2 AX RTL8852BE WIFI 6 +BT5.1 PCIE M.2 WW

Intel AX211 Wi-Fi 6E 2*2ax+BT5.x vPro CNVi PCIE M.2 module

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Supplier PN

Coming soon

Coming soon

Coming Soon

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Data Rates Supported

5G/2.4G WIFI

5G/2.4G WIFI

6G/5G/2.4G WIFI

10/100/1000Mbps (Copper)

10/100/1000Mbps (Copper)

Controller Details

Coming soon

Coming soon

Coming Soon

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Controller Bus Architecture

PCIe Gen3

PCIe Gen3

PCIe Gen3

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Data Transfer Mode

Wireless +BT

Wireless +BT

Wireless +BT

Ethernet

Ethernet

Power Consumption

Coming soon

Coming soon

Coming Soon

Copper:
I350-T2 V2= 4.4W

Copper:
I350T4V2= 5W

IEEE Standards Compliance

802.11 abgn+acR2 +ax MIMO 2X2

802.11 abgn+acR2 +ax MIMO 2X2

802.11 abgn+acR2 +axR2 MIMO 2X2

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

Core boot
UEFI boot

Core boot
UEFI boot

Core boot
UEFI boot

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Supported

Supported

Supported

Network Transfer Rate

Coming soon

Coming soon

Coming Soon

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Operating System Driver Support

Windows 10/11, Linux

Windows 10/11, Linux

Windows 10/11, Linux

Windows 10/11, Linux, Free BSD, XEN,Vmware

Windows 10/11, Linux, Free BSD, XEN,Vmware

Manageability

Coming soon

Coming soon

Coming Soon

Supported

Supported

Manageability Capabilities Alerting

Coming soon

Coming soon

Coming Soon

Supported

Supported

TDP

Coming soon

Coming soon

Coming Soon

Firmware Based Thermal Management

Firmware Based Thermal Management

Operating Temperature Range

0°C – 80°C

0°C – 80°C

0°C – 80°C

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

# of Ports

2

4

Data Rate Per Port

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

PCIe Gen3 x4

PCIe Gen3 x4

PCIe Gen3 x4

PCIe Gen 2.1

PCIe Gen 2.1

NC Sideband Interface

Coming soon

Coming soon

Coming Soon

Not Available

Not Available

Jumbo Frames Supported

Coming soon

Coming soon

Coming Soon

Yes

Yes

1000Base-T

Coming soon

Coming soon

Coming Soon

Yes

Yes

IEEE 1588

Coming soon

Coming soon

Coming Soon

Supported

Supported

Supported Under vPro

No

No

Yes

Not Available

Not Available

Ethernet Specifications Continued

Model

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)

2X2 AX RTL8852BE WIFI 6 +BT5.1 PCIE M.2 WW

Intel AX211 Wi-Fi 6E 2*2ax+BT5.x vPro CNVi PCIE M.2 module

Connector

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Coming soon

Coming soon

Coming soon

Website

i350 T2

i350 T4

Coming soon

Coming soon

Coming soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

IEEE* 802.11ax* Auto-negotiaton

IEEE* 802.11ax* Auto-negotiaton

IEEE* 802.11ax* Auto-negotiaton

Intel® vPro™

Not Available

Not Available

Coming soon

Coming soon

Coming soon

Intel® Standard Manageablity

Supported

Supported

Coming soon

Coming soon

Coming soon

Power Optimizer Platform Low-power Management Systems

Supported

Supported

Coming soon

Coming soon

Coming soon

Energy Efficient Ethernet

Supported

Supported

Coming soon

Coming soon

Coming soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Supported

Supported

Supported

Receive Side Scaling

Supported

Supported

Coming soon

Coming soon

Coming soon

Dual Tx and Rx Queues

Yes

Yes

Coming soon

Coming soon

Coming soon

Jumbo Frames (up to 9KB)

Supported

Supported

Coming soon

Coming soon

Coming soon

Teaming

Supported

Supported

Coming soon

Coming soon

Coming soon

Wake from Deep Sx

Supported

Supported

Coming soon

Coming soon

Coming soon

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Coming soon

Coming soon

Coming soon

Network Proxy/ARP Support

Supported

Supported

Coming soon

Coming soon

Coming soon

BIOS Specifications

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v4.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

Acoustic Noise Emissions Declaration

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Safety, EMC Connection to the Telephone Network and Labeling

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

Regulations & Standards

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Environmentals

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

Materials Used

System
35% PCC recycled plastic in Front and Rear Bezel
Packaging
Carton: 90% Recycled and/or FSC certified content3
Cushion: 90% Recycled EPE

TCO Certification

9.0

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

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