P8

Version: 4.0 | 05/29/2024

Product Name

P8

Product Display Name

ThinkStation P8

Information Date

13-Nov-23

Hardware Maintenance Manual

Drivers & Software

Available Whitepapers

SECTION I: Platform Overview

Description

The bold Lenovo ThinkStation P8 is a force to be reckoned with and brings together breakthrough compute architecture with an optimized thermal design in a versatile, Aston Martin inspired chassis. The ThinkStation P8 is the leading AMD Ryzen™ Threadripper™ PRO 7000 WX-Series processor powered workstation delivering game-changing power and speed with the largest core count professional workstation up to 96 cores and up to 5.3GHz. Perfect for those who demand more power for multi-threaded applications and intense (high demand) workloads with professional manageability and enterprise-class services & support.

CPU

Processor Support

AMD Storm Peak Workstation Processor (Ryzen Threadripper PRO)

Socket Type

TR5/SP6

Disclaimers

Threadripper Pro CPUs support AMD vendor lock.

Operating Systems

Preloaded

Windows 11 Pro 64-bit for Workstation
Ubuntu 22.04 LTS (configuration specific)

Supported

Red Hat Enterprise Linux 9.3
Ubuntu 22.04 LTS

Disclaimers

Memory

Slots

Up to 8 DIMMs

Channels

8 Memory Channels

Type

DDR5, 288-Pin, ECC RDIMM and 3DS RDIMM

ECC Support

Yes

Speed

Up to 5200MHz*

Max DIMM Size

64GB DDR5 ECC RDIMM
128GB DDR5 ECC 3DS-RDIMM

Max System Memory

1TB**

Disclaimers

*Actual Memory Speed is dependent on system configuration.
**Configuration dependent, supported through special bids.

Storage

Total Bays/Size

3 (2 std, 1 optional)

SATA

3x SATA 3.0 Connectors

Onboard M.2

3x M.2 NVMe 2280/22110 PCIe Connectors Onboard (Gen5)

Front Access Storage Bay

1x M.2 NVMe 2280 PCIe (Gen5) in Flex access tray

Bay 1 Capability

Any one of the following (must match Bay 2):
3.5″ SATA Drive
Dual M.2 NVMe 2280/22110 Adapter*
15mm U.3 PCIe SSD 2.5″ (Gen4)*

Bay 2 Capability

Any one of the following (must match Bay 1):
3.5″ SATA Drive
Dual M.2 NVMe 2280/22110 Adapter*
15mm U.3 PCIe SSD 2.5″ (Gen4)*

Bay 3 (Optional) Capability

3.5″ SATA Drive**

PCIe (M.2)

 

Disclaimers

Note: Bays 1 and 2 must use the same type of storage
*Requires additional parts.
**Bay 3 inclusion dependent on system configuration. See Storage Whitepaper for details on the available usage options.

Video

Integrated Graphics

Not Available

Discrete Graphics

Nvidia T400(3x MiniDP) – 4GB GDDR6
Nvidia T1000(4x MiniDP) – 8GB GDDR6
Nvidia RTX A4000 (4x DP) – 16GB GDDR6
Nvidia RTX A6000(4x DP) – 48GB GDDR6
Nvidia RTX 4000 Ada (4x DP) – 20GB GDDR6
Nvidia RTX 4500 Ada (4x DP) – 24GB GDDR6
Nvidia RTX 5000 Ada(4x DP) – 32GB GDDR6
Nvidia RTX 6000 Ada (4x DP) – 48GB GDDR6
2 x NVIDIA RTX A6000 with NVLink
NVIDIA Quadro SYNC II card
AMD Radeon PRO W6400 (2x DP), 4GB GDDR6
AMD Radeon PRO W7600 (4x DP), 8GB GDDR6
AMD Radeon PRO W7900 (3x DP,1x MiniDP), 48GB GDDR6

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slots

Slot 1

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 2

PCIe 5.0 x8, Full Height, Full Length, 25W, Open Ended

Slot 3

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 4

PCIe 5.0 x8, Full Height, Full Length, 25W, Open Ended

Slot 5

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 6

PCIe 5.0 x16, Full Height, Full Length, 75W

Slot 7

PCIe 4.0 x8, Full Height, Half Length, 25W, Open Ended

Disclaimers

 

Front I/O

USB

2x USB-C 3.2 Gen 2 (10Gbps)*
2x USB-A 3.2 Gen 2 (10Gbps)*

Audio

1x 3.5mm Combo Headphone Jack (Headphone + Mic in)

Media Card Reader

USB 3.0 15-in-1 Media card reader supporting SD UHS-II (Optional)

Flex Bay

1x Front access drive bay
Supports either M.2 or 15-in-1 Media Card Reader

Disclaimers

*Basic front IO panel (excludes 2x USB-C and 2x USB-A ports) is supported
Note: Actual USB throughput will vary depending on the type and quantity of USB devices used.

Rear I/O

USB

1x USB-C 3.2 Gen 2×2 (20Gbps)
3x USB-A 3.2 Gen 2 (10Gbps)
2x USB-A 2.0 (480Mbps)

Audio

2x 3.5mm Jacks (Line out, Line-in retasked as Mic)

DisplayPort

As Supported by GPU

HDMI

As Supported by GPU

DVI

 

VirtualLink

 

VGA Port

 

Serial Port

Optional Serial COM port, via cable

Ethernet

1 x 1GbE – RJ45 with DASH
1 x 10GbE – RJ45

PS/2

Optional PS/2 (2 port) PCIe adapter

IEEE 1394

 

Alternative Rear Power Button

Yes

Parallel Port

 

Optional USB Adapter

 

Optional Network Adapter

Intel I350-T2 Dual Port Gigabit PCIe Ethernet Adapter
Intel I350-T4 Quad Port Gigabit PCIe Ethernet Adapter
Broadcom 5720 Dual Port Gigabit PCIe Ethernet Adapter
Broadcom 5719 Quad Port Gigabit PCIe Ethernet Adapter
Intel X550-T2 Dual Port 10-Gigabit PCIe Ethernet Adapter
RZ616 WIFI6e PCIe M.2 2230 Module with Internal Antennas

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Vendor

Aquantia 10 GbE AQC113-B1-C
Realtek 1 GbE RTL8111EPP (DASH capable)

Speeds

10/100/1000/10000Mbps Aquantia AQC113-B1-C
10/100/1000Mbps Realtek RTL8111EPP

Functions

PXE, WOL, Jumbo Frames
ASF

Connectors

2 x RJ45

Disclaimers

Note: Network speeds listed are theoretical.

Audio

Vendor

Realtek

Type

HD (2.0)

Internal Speaker

1 x 1.5 watt 4 ohm

Connectors

2x Rear 3.5mm Jacks (Line Out, Line In retasked as Mic)
1x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset

Realtek ALC897Q-VA2-CG Codec (rear)
Realtek ALC4032 (front)

Number of Channels

Rear Audio: 2 Channels
Front Audio: 2 Channels

Disclaimers

Note: Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Thermal

Temp Sensors

Ambient Cabled Sensor – Thermistor, MB Header cabled to chassis front bezel
PCIe Zone 1 Sensor – Thermistor
PCIe Zone 2 Sensor – Thermistor
PCIe Zone 3 Sensor – Thermistor
DIMM Right Sensor – Thermistor located at rear of DIMM bank
DIMM Left Sensor – Thermistor located at rear of DIMM bank
Storage (M.2) Sensor1 – Thermistor located between M.2 Slot 1 and Slot 2
Storage (M.2) Sensor2 – Thermistor located near M.2 Slot 3

Fans

Dual Fan CPU heatsink
1x Fan for PCIe slots 1-4
2x Front CPU Fan (configuration dependent)
1x Front Flex Bay Fan (configuration dependent)
1x Fan for PCIe slots 5-7
1x HDD Fan (configuration dependent)
1x Rear Fan
2x PSU Fan (inside PSU)
2x Memory Duct Fan

Disclaimers

Power Specifications

Power Supply

1000W / 1400W

Power Efficiency

92% Efficient @ 50% Load

Main

C14 socket to std C13 line cord

Operating Voltage Range

100 – 240V (autosensing)

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

1000W: 6A-12A
1400W: 9A-15A

Graphics Power

Up to 3x 12VHPWR*

Power Supply Fan

Yes

ENERGY STAR® Qualified (config dependent)

Yes

80 PLUS Compliant

Yes

Built-in Self Test (BIST) LED

Yes

Disclaimers

Note: Power Output of 1400W PSU Limited to 1125W for 100-111.9 Input Voltage.
*Quantity of Graphics power cables is configuration dependent
*See Power Configuration Whitepaper for additional details.

BIOS

Vendor

AMI

Disclaimers

Chassis Information

Color

Storm Gray

PSU

One Fixed 1400W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
or
One Fixed 1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions

Dual Fan CPU heatsink
1x Fan for PCIe slots 1-4
2x Front CPU Fan (configuration dependent)
1x Front Flex Bay Fan (configuration dependent)
1x Fan for PCIe slots 5-7
1x HDD Fan (configuration dependent)
1x Rear Fan
2x PSU Fan (inside PSU)
2x Memory Duct Fan

Dimensions

435mm / 17.1″ H
175mm / 6.9″ W
508mm / 20″ D

Weight

22.7 kg / 50.0 lbs (max config)

Disclaimers

 

Packaging Dimensions

Height (mm/in)

618mm / 24.23″

Width (mm/in)

324mm / 12.8″

Depth (mm/in)

695mm / 27.4″

Weight (kgs/lbs)

25.9 kg / 57.1 lbs (max config)

Disclaimers

Security & Serviceability

TPM

Infineon SPI TPM SLB9672VU2.0 TPM 2.0

Asset ID

Yes, 1024 x 8bit

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

Yes

Boot Sequence Control

Yes

Padlock Support

No

Boot Without Keyboard and/or Mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

No

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Retained with Screws*

Color Coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained with Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Download Recovery Service
or available through Lenovo Support.

Disclaimers

*CPU Heatsink assembly and force frame require a T20 bit.

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level

Vibration

Operating: Random 5~500Hz 0.27Grms, 30minutes 3 axes (X,Y,Z)
Non-Operating: Random 2~200Hz 1.04Grms, 15minutes 6 faces (±X,±Y,±Z)

Shock

Operating: X,Y axis: ±15G/3ms Z axis: ±30G/3ms
Operating (Rack mounted): X,Y,Z axis: ±15G/3ms
Non-operating target: Trapezoidal shock, 35g average, 11ms

Disclaimers

Extended operating temperatures are possible – please contact your Lenovo Rep

SECTION II: Platform Detail

Board Size

15″ x 11.57″ (381mm x 293.8mm)

Layout

Lenovo Custom Extended eATX

Disclaimers

 

Motherboard Core

Processor Support

AMD Storm Peak Workstation Processor

Socket Type

Socket TR5/SP6

Memory Support

DDR5 up to 5200MHz RDIMM / 3DS RDIMM Memory

CPU-CPU Interconnect

 

Voltage Regulator

SVI3 VR Controller – 350W TDP Capable

Chipset (PCH)

AMD 600 Series Chipset Workstation Segment, Pro class version

Flash

2 x 64MB

Super I/O

1x Microchip MEC1723N-L0P-I/LJ (WFBGA-176pin)

Clock

External Clock

Audio

Rear Codec: Realtek ALC897Q-VA2-CG on Motherboard by Rear I/O
Front Codec: Realtek ALC4032 on FPIO

Ethernet

Aquantia 10Gb AQC113-B1-C
Realtek 1Gb RTL8111EPP with DASH

SAS

 

Disclaimers

 

Supported Components

Processor Level

AMD Stormpeak Workstation Processor

Processor

AMD Threadripper Pro 7995WX
AMD Threadripper Pro 7985WX
AMD Threadripper Pro 7975WX
AMD Threadripper Pro 7965WX
AMD Threadripper Pro 7955WX
AMD Threadripper Pro 7945WX

Memory Type

RDIMM / 3DS-RDIMM – 4800MHz

Memory

16GB DDR5 ECC RDIMM PC5-4800
32GB DDR5 ECC RDIMM PC5-4800
64GB DDR5 ECC RDIMM PC5-4800
128GB DDR5 ECC 3DS-RDIMM PC5-4800

Disclaimers

Note: Support for 8 x 128GB 3DS-RDIMMs is configuration dependant, supported through special bids.

Storage

3.5″ SATA Hard Disk Drive (HDD)

2TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)
12TB SATA – 7200rpm, 6Gb/s, 3.5″ (Enterprise Class)

2.5″ SAS Hard Disk Drive (HDD)

 

2.5″ SATA Hard Disk Drive (HDD)

 

2.5″ SATA Solid State Drive (SSD)

 

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
1TB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
2TB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0
4TB M.2 PCIe – SSD, 2280, Gen4 (x4), NVMe, TLC, OPAL2.0

U.2/U.3 PCIe Solid State Drive (SSD)

15.3TB U.3 PCIe – SSD, 15mm, Gen4 (x4), NVMe, 2.5″ OPAL2.0

PCIe Add-in-Card Solid State Drive (SSD)

 

Intel Optane Storage Technology

 

Disclaimers

 

RAID

RAID Capabilities

Onboard M.2 RAID via AMD CPU – supports up to RAID 0, 1, 5
Internal NVMe RAID via AMD CPU – supports up to RAID 0, 1, 5, 10*
Internal NVMe RAID via Broadcom RAID Controller – supports up to RAID 0, 1, 5, 10*
SATA RAID via Onboard AMD SATA Controller – supports up to RAID 0, 1, 5

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Optional Hard Disk Drive Controllers

 

Intel VROC

 

Disclaimers

*Additional hardware required
Note: See Section 3 for details on supported Broadcom RAID Controller

Optical Drive/Removable Media

 

DVD-ROM Drive

 

DVD Burner/CD-RW Drive

 

Blu-Ray Burner Drive

 

Media Card Reader Specifications

 

Disclaimers

 

Keyboard and Pointing Devices

Keyboard

USB Traditional Keyboard
PS/2 Traditional Keyboard
Smart Card Keyboard
USB Calliope Keyboard

Pointing Devices

USB Fingerprint Mouse
USB Calliope Mouse
PS/2 Black Optical Mouse

Disclaimers

 

Expansion Bays

External Access Bays

Front access M.2 drive bay

Internal Expansion Bays

Optional internal 3.5″ drive bay

PCIe Adapters

Network

Intel I350-T2 Dual Port Gigabit PCIe Ethernet Adapter
Intel I350-T4 Quad Port Gigabit PCIe Ethernet Adapter
Broadcom 5720 Dual Port Gigabit PCIe Ethernet Adapter
Broadcom 5719 Quad Port Gigabit PCIe Ethernet Adapter
Intel X550-T2 Dual Port 10-Gigabit PCIe Ethernet Adapter

Thunderbolt

 

USB

 

WiFi Cards

 Mediatek PCIe WiFi6e Card With BT5 Internal Antenna Kit (RZ616)

PS/2

PS/2 (2-Port) PCIe adapter

Com port

Serial COM port cable with 5V transceiver

Other

 

SECTION III: Supported Component Detail

CPU Specifications Group 1

CPU

AMD Threadripper Pro 7945WX

AMD Threadripper Pro 7955WX

AMD Threadripper Pro 7965WX

AMD Threadripper Pro 7975WX

AMD Threadripper Pro 7985WX

# of Cores

12

16

24

32

64

# of Threads

24

32

48

64

128

Processor Base Frequency

4.7GHz

4.5GHz

4.2GHz

4.0GHz

3.2GHz

Max Turbo Frequency

5.3GHz

5.3GHz

5.3GHz

5.3GHz

5.1GHz

Cache

76MB

80MB L3

152MB

160MB L3

320MB

TDP

350W

350W

350W

350W

350W

AMD Spec Link

AMD Ryzen™ Threadripper™ PRO 7945WX

AMD Ryzen™ Threadripper™ PRO 7955WX

AMD Ryzen™ Threadripper™ PRO 7965WX

AMD Ryzen™ Threadripper™ PRO 7975WX

AMD Ryzen™ Threadripper™ PRO 7985WX

Disclaimers

CPU Specifications Group 2

CPU

AMD Threadripper Pro 7995WX

# of Cores

96

# of Threads

192

Processor Base Frequency

2.5GHz

Max Turbo Frequency

5.1GHz

Cache

480MB

TDP

350W

AMD Spec Link

AMD Ryzen™ Threadripper™ PRO 7995WX

Disclaimers

HDD Specifications

Drive

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

1TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″

6TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″

12TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Yes

Yes

Yes

Yes

Coming Soon

2.5″ SATA Hard Disk Drive (HDD)

Not Available

Not Available

Not Available

Not Available

Coming Soon

Connector

SATA

SATA

SATA

SATA

Coming Soon

Transfer Rate (Gb/sec)

Average data rate, read/write 156MB/s

Average data rate, read/write 156MB/s

Sustained data transfer rate 216 – 226MB/s

Sustained data transfer rate 216 – 226MB/s

Coming Soon

Spindle Speed (RPM)

7,200

7,200

7,200

7,200

Coming Soon

DC Power to Drive Ready (sec)

<10.0

<17.0

<17.0

<17.0

Coming Soon

Average Latency (msec)

4.16

4.16

4.16

4.16

Coming Soon

Input (VDC)

5

5

5

5

Coming Soon

Typical (Watts)

6.19

6.7

8.13

8.13

Coming Soon

Idle (Watts)

4.6

4.5

6.21

6.21

Coming Soon

Physical Dimensions

101.6mm x 146.99mm x 19.88mm

101.6mm x 146.99mm x 26.1mm

101.85mm x 147mm x 26.1mm

101.85mm x 147mm x 26.1mm

Coming Soon

Weight (grams)

420

535

705

705

Coming Soon

Operating (C) Ambient

0 to 60

0 to 60

5 to 60

5 to 60

Coming Soon

Operating (C) Base Casting

60

60

60

60

Coming Soon

Non-Operating (C) Ambient

(-40 to 70)

(-40 to 70)

(-40 to 70)

(-40 to 70)

Coming Soon

Gradient (C per Hour)

20

20

20

20

Coming Soon

Operating (Gs @ 2ms)

70

80

Read 70 Gs / Write 40 Gs

Read 70 Gs / Write 40 Gs

Coming Soon

Non-Operating (Gs @ 2ms)

350

300

250

250

Coming Soon

Disclaimers

Solid State Storage Specifications

Drive

512GB M.2 PCIe – SSD, 2280, Gen4Px4, NVMe, TLC, OPAL2.0

1TB M.2 PCIe – SSD, 2280, Gen4Px4, NVMe, TLC, OPAL2.0

2TB M.2 PCIe – SSD, 2280, Gen4Px4, NVMe, TLC, OPAL2.0

4TB M.2 PCIe – SSD, 2280, Gen4Px4, NVMe, TLC, OPAL2.0

Dimensions Millimeters (W x D x H)

22 x 80 x 2.3

22 x 80 x 2.3

22 x 80 x 2.3

70 x 100 x 7.0

Interface Type

PCIe Gen 3.0 x4 NVMe

PCIe Gen 3.0 x4 NVMe

PCIe Gen 3.0 x4 NVMe

SATA-III

Power Active (AVG)

5W

5W

5W

6W

Power Idle

50mW

50mW

50mW

50mW

Typical Sequential Read

3000MB/s

3200MB/s

3200MB/s

7000MB/s

Typical Sequential Write

1300MB/s

1600MB/s

1600MB/s

5800MB/s

Operating Temperature Range

0 to 55°C

0 to 55°C

0 to 55°C

0 to 55°C

Endurance Rating (Lifetime Writes)

85TB

150TB

300TB

600TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

2.0M POH

Hardware Encryption

AES 256 bit

AES 256 bit

AES 256 bit

AES 256 bit

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32.  Random measurements are with 4 threads and queue-depth 32.

HDD Controllers

PCI Bus

PCH Integrated

PCI Modes

SATA 3.0

RAID Levels

0/1/5/10

Data Transfer Rates

6Gb/s

Internal Connectors

2 x MiniSAS HD (2 ports each) + 3 x SATA

Disclaimers

Optical Drive Specifications

Operating Systems Supported

Windows 11 Pro High End DPK (Preload)
Windows 11 Pro 64 DG to Windows 10 Pro 64 normal path special bid
Windows 10 IOT Enterprise 64 2021 LTSC
Ubuntu Linux V22.04 World Wide Multiple Language Custom Preload

Temperature

10° – 35°C (50° – 95°F)

Relative Humidity

10%-80% (non-condensing)

Maximum Wet Bulb Temperature

25°C max

Disclaimers

Disclaimers

Discrete Graphics Adapter Group 1

Adapter

T400

T1000

RTX A4000

RTX A6000

RTX 6000 Ada

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 4.0 x16

PCIe 4.0 x16

PCI Express 4.0×16

Display Interface

3 x mDP 1.4

4 x mDP 1.4

4 x DP 1.4a

4 x DP 1.4a

4 x DP 1.4a

Graphics Chipset

Turing

Turing

Ampere

Ampere

Ada Lovelace

Memory Clock Frequency (MHz)

Coming Soon

1250 MHz

1750 MHz

2000 MHz

2500 MHz

Memory Size

2GB GDDR6

4GB GDDR6

16GB GDDR6

48GB GDDR6

48GB GDDR6 ECC

Memory Interface

64-bit

128-bit

256-bit

384-bit

384-bit

Memory Bandwidth

80GB/s

160GB/s

448 GB/s

Up to 768GB/s

960 GB/s

GPU Cores

CUDA Cores: 384

CUDA Cores: 896

CUDA Cores: 6,144
Tensor Cores: 192
RT Cores: 48

CUDA Cores: 10,752
Tensor Cores: 336
RT Cores: 84

CUDA Cores: 18,176
Tensor Cores: 568
RT Cores: 142

GPU Core Frequency (MHz)

Coming Soon

1395MHz

1560MHz

1800MHz

2505MHz

Maximum Power Consumption

30W

50W

140W

300W

300W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

Coming Soon

Coming Soon

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Thermal Solution

Active

Active

Active

Active

Active

Dimension

2.7″ H x 6.1″ L
Single Slot

2.7″ H x 6.1″ L
Single Slot

4.4″ H x 9.5″ L
Single Slot

4.4″ H x 10.5″ L
Dual Slot, Full Height

4.4″ H x 10.5″ L
Dual Slot, Full Height

Advanced Display

Coming Soon

Coming Soon

SYNC 2

SYNC 2

Coming Soon

SLI/NVLink Support

Coming Soon

Coming Soon

Coming Soon

NVLink

No

Disclaimers

Discrete Graphics Adapter Group 2

Adapter

Nvidia RTX 5000 Ada

Nvidia RTX 4500 Ada

Nvidia RTX 4000 Ada

AMD Radeon PRO W6400

AMD Radeon PRO W7600

Bus Interface

PCI Express 4.0×16

PCIe 4.0 x16

PCIe 4.0 x16

PCIe 4.0 x4

PCIe 4.0 x8

Display Interface

4 x DP 1.4a

4 x DP 1.4a

4 x DP 1.4a

2x DP 1.4a

4x DP 1.4a

Graphics Chipset

Ada Lovelace

Ada Lovelace

Ada Lovelace

RDNA 2.0

RDNA 3.0

Memory Clock Frequency (MHz)

 2250 MHz

 2250 MHz

 1750 MHz

2000 MHz

2250MHz

Memory Size

32GB GDDR6 ECC

24GB GDDR6 ECC

20GB GDDR6 ECC

4GB GDDR6

8GB GDDR6

Memory Interface

256bit

192bit

160bit

64bit

128bit

Memory Bandwidth

576 GB/s

432GB/s

360 GB/s

128.0 GB/s

288.0 GB/s

GPU Cores

CUDA Cores: 12,800
Tensor Cores: 400
RT Cores: 100

CUDA Cores: 7,680
Tensor Cores: 240
RT Cores: 60

CUDA Cores: 6,144
Tensor Cores: 192
RT Cores: 48

Shading units: 768
RT Cores: 12

Coming Soon

GPU Core Frequency (MHz)

2550MHz

2580MHz

2175MHz

2321MHz

2440MHz

Maximum Power Consumption

250W

210W

130W

50W

130W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

4 x 4096×2160 @ 120Hz
4 x 5120×2880 @ 60Hz
2 x 7680×4320 @ 60Hz

Coming Soon

Coming Soon

Thermal Solution

Active

Active

Active

Coming Soon

Coming Soon

Dimension

4.4″ H x 10.5″ L
Dual Slot

4.4″ H x 10.5″ L
Dual Slot

4.4″ H x 9.5″ L
SingleSlot

Coming Soon

4.5″ H x 9.5″ L
SingleSlot

Advanced Display

Coming Soon

SYNC 2

Coming Soon

Coming Soon

Coming Soon

SLI/NVLink Support

No

No

No

Coming Soon

Coming Soon

Disclaimers

Discrete Graphics Adapter Group 3

Adapter

AMD Radeon PRO W7900

Bus Interface

PCIe 4.0 x16

Display Interface

3x DP 2.1, 1x Mini DP2 .1

Graphics Chipset

RDNA 3.0

Memory Clock Frequency (MHz)

2250MHz

Memory Size

48GB GDDR6

Memory Interface

384bit

Memory Bandwidth

864.0 GB/S

GPU Cores

Coming Soon

GPU Core Frequency (MHz)

2495MHz

Maximum Power Consumption

295W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

Coming Soon

Thermal Solution

Coming Soon

Dimension

4.3″ H x 11″ L
TripleSlot

Advanced Display

Coming Soon

SLI/NVLink Support

Coming Soon

Disclaimers

Ethernet Specifications Group 1 Part 1

Card

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel X550-T2 ethernet converged network adapter

Broadcom 5720 2-Ports Ethernet Adapter

Broadcom 5719 4-Ports Ethernet Adapter

Supplier PN

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

MM#928955

Coming Soon

Coming Soon

Data Rates Supported

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

100/1000Mbps and 10Gbps Copper

Coming Soon

Coming Soon

Controller Details

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Intel Ethernet Controller X540

Coming Soon

Coming Soon

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Coming Soon

Coming Soon

Data Transfer Mode

Ethernet

Ethernet

Ethernet

Coming Soon

Coming Soon

Power Consumption

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

X540-T2:
10Gps= 17.4W
1Gbps= 9.5W
100Mbps=6.6W
X540-T1:
10Gbps=10.8W
1Gbps= 7.7W
100Mbps= 6.4W

Coming Soon

Coming Soon

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3 100/1000/10GBASE-T

Coming Soon

Coming Soon

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Coming Soon

Coming Soon

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Supported

Coming Soon

Coming Soon

Network Transfer Rate

1,000Mbps Full Duplex

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Coming Soon

Coming Soon

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Windows ServerLinux, FreeBSD

Coming Soon

Coming Soon

Manageability

Supported

Supported

Supported

Coming Soon

Coming Soon

Manageability Capabilities Alerting

Supported

Supported

Supported

Coming Soon

Coming Soon

TDP

Firmware Based Thermal Management

Firmware Based Thermal Management

Firmware Based Thermal Management

Coming Soon

Coming Soon

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

Coming Soon

Coming Soon

# of Ports

2

4

2

Coming Soon

Coming Soon

Data Rate Per Port

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

100/1,000Mbps, 10Gbps

Coming Soon

Coming Soon

System Interface Type

PCIe Gen 2.1

PCIe Gen 2.1

PCIe Gen 2.1

Coming Soon

Coming Soon

NC Sideband Interface

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Jumbo Frames Supported

Yes

Yes

Yes

Coming Soon

Coming Soon

1000Base-T

Yes

Yes

Yes

Coming Soon

Coming Soon

IEEE 1588

Supported

Supported

Not Available

Coming Soon

Coming Soon

Supported Under vPro

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Disclaimers

Disclaimers

Ethernet Specifications Group 2 Part 1

Card

NVIDIA ConnectX-6 25G 2-Ports Adapter

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Supplier PN

Coming Soon

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Data Rates Supported

Coming Soon

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

Controller Details

Coming Soon

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Controller Bus Architecture

Coming Soon

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Data Transfer Mode

Coming Soon

Ethernet

Ethernet

Power Consumption

Coming Soon

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

IEEE Standards Compliance

Coming Soon

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

Coming Soon

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

Coming Soon

Supported

Supported

Network Transfer Rate

Coming Soon

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Operating System Driver Support

Coming Soon

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Manageability

Coming Soon

Supported

Supported

Manageability Capabilities Alerting

Coming Soon

Supported

Supported

TDP

Coming Soon

Firmware Based Thermal Management

Firmware Based Thermal Management

Operating Temperature Range

Coming Soon

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

# of Ports

Coming Soon

2

4

Data Rate Per Port

Coming Soon

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

Coming Soon

PCIe Gen 2.1

PCIe Gen 2.1

NC Sideband Interface

Coming Soon

Not Available

Not Available

Jumbo Frames Supported

Coming Soon

Yes

Yes

1000Base-T

Coming Soon

Yes

Yes

IEEE 1588

Coming Soon

Supported

Supported

Supported Under vPro

Coming Soon

Not Available

Not Available

Disclaimers

Disclaimers

r

Description

9-in-1 (USB 2.0)

Disclaimers

SECTION IV: BIOS/Certifications/Standards/Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery With Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and Power management Interface)

Advanced Configuration and Power Interface v6.1

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

Regulations & Standards

EMC & Safety

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Environmentals

Energy Star

ENERGY STAR® v7.0

EPEAT

EPEAT® Silver Certification Available on Select Models

Greenguard

Greenguard

RoHS

RoHS Compliant

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification

9.0

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

Back to top Back to top