P360 Tiny

Product Name

P360 Tiny

Product Display Name

ThinkStation P360 Tiny

Information Date

1-Sep-22

Hardware Maintenance Manual

P360 Tiny HMM

Drivers & Software

P360 Tiny Drivers & Software

Available Whitepapers

Description

Engineered to go where others can’t, the ThinkStation P360 Tiny combines simple and efficient design with the professional power of a workstation. The industry’s smallest workstation, at less than one-liter total volume, offers uncompromising performance in a form factor that is 96% smaller than a traditional desktop.

Processor Support

Intel Alder Lake Core Series

Socket Type

Socket-H (LGA 1700)

Preloaded

Windows 11 Pro
Windows 11 Home
Ubuntu 20.04 LTS

Supported

Ubuntu 22.04 LTS
Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.6

Slots

Up to 2 SODIMMs

Channels

Supports up to 2 SODIMM Sockets, 2 Channels

Type

262-pin, 4800MHz non-ECC SODIMM

ECC Support

No

Speed

Up to 4800MHz

Max DIMM Size

32GB DDR5 SODIMM

Max System Memory

64GB

PCIe

2 x M.2 PCIe Connectors, Gen 4 Onboard

Integrated Graphics

Intel Integrated UHD Graphics 770

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x8 Gen 4 Routed From CPU

USB

2 x USB 3.2 Gen 2 Type-A 10Gb/s
1 x USB 3.2 Gen 2 Type-C 20Gb/s

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

USB

2 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x USB 3.2 Gen 1 Type-A 5Gb/s

Audio

NA

DisplayPort

1 x Standard
Optional 2 x Rear Port

HDMI

1 x Standard
Optional 2 x Rear Port

Type-C

Optional 1 x Rear Port

VirtualLink

NA

VGA Port

Optional 2 x Rear Port

Serial Port

Optional 2 x Rear Port

Ethernet

1 x Standard
Optional 1 x Rear Port

PS/2

NA

IEEE 1394

NA

eSATA

NA

Parallel Port

NA

Optional USB Adapter

Optional Single Type-C + DP Port

Optional Network Adapter

Intel I350-T2 Quad Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Vendor

Intel Jacksonville I219LM

Speeds

10/100/1000Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Vendor

Realtek

Type

Integrated Audio

Internal Speaker

Yes

Connectors

Mic + Headphone combo jack

Chipset

ALC256

Number of Channels

2 Channels

Number of Bits/Audio Resolution

2 Channels of DAC support 24-bit PCM format
2 Channels of ADC support 16-bit PCM format

Temp Sensors

Ambient Sensor
VR Sensor
M.2 Sensor

Fans

1 x CPU Fans

Power Supply

170W

230W

Power Efficiency

89% Efficient @ 50% Load

Operating Voltage Range

100 – 240V

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

2.5A

3.5A

Graphics

No

Power Supply Fan

No

ENERGY STAR® Qualified (config dependent)

Yes

Aux Power Drop

No

Vendor

AMI

Self-Healing BIOS

Yes

Color

Raven Black

PSU

230W Power Brick (Chicony, A18-230P1A)
Dimensions: 169.545*87.3125*25.4mm
Weight: 680.389g

Slim 170W Power Brick (Delta, ADP-170CB)
Dimensions: 150*77*22mm
Weight: 457g

Thermal Solutions

One System Fan Standard

Dimensions

37mm / 1.5″ H
182.9mm / 7.2″ D
179mm / 7.047″ W

Weight

1.4kg / 3.84lbs

Height (mm/in)

141mm / 5.6″

Width (mm/in)

268mm / 10.6″

Depth (mm)

490mm / 19.3″

Weight (kgs/lbs)

2.8kg / 6 lbs

TPM

Infineon SLB9670, FW 7.85, TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 14.x)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Optional via External ODD Box

Hard Drives

Tool-less

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 20% to 80% (non-condensing)
Relative Humidity Storage/Transit: 20% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min
Operating Vibration:
Random,0.27G at 5-500 Hz, 0.5 octave/min
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min

Shock

Operating Shock: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)
Rack Operation Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)
Non-operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Board Size

6.75″ x 6.89″ (171.5mm x 175mm)

Layout

Custom ATX

Processor Support

Intel Alder Lake Core

Socket Type

Socket H (LGA 1700)

Memory Support

DDR5 up to 4800MHz SODIMM Memory (non-ECC)

Voltage Regulator

65W TDP Capable

Chipset (PCH)

Intel Q670 Chipset

Flash

32MB

Super I/O

Nuvoton NCT6692D

Clock

Intel Native isCLK

Audio

Realtek ALC233VB Codec

Ethernet

Intel Jacksonville I219LM

Processor Level

Intel Alder Lake – Core

Processor

i9-12900
i9-12900T
i7-12700
i7-12700T
i5-12600
i5-12600T
i5-12500
i5-12500T
i5-12400
i5-12400T
i3-12300
i3-12300T
i3-12100
i3-12100T

Memory Type

SODIMM 4800 MHz

Memory

8GB 4800MHz DDR5 SDRAM SODIMM
16GB 4800MHz DDR5 SDRAM SODIMM
32GB 4800MHz DDR5 SDRAM SODIMM

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

DVD-ROM Drive

Optional via External ODD Box – Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Optional via External ODD Box – Slim DVD Burner/CD-RW Drive

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard

Pointing Devices

Calliope USB Mouse
Fingerprint USB Mouse

Network

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Thunderbolt

Rear Thunderbolt PCIe Adapter

WiFi Cards

Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non-vPro)
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX211 vPro)
Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RTL8852BE non-vPro)
Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RZ616 non-vPro)

CPU

Intel i9-12900 2.4GHz/16C/24T/30M 65W DDR5 4800 vPro

Intel i7-12700 2.1GHz/12C/20T/25M 65W DDR5 4800 vPro

Intel i5-12600 3.3GHz/6C/12T/18M 65W DDR5 4800 vPro

Intel i5-12500 3.0GHz/6C/12T/18M 65W DDR5 4800 vPro

Intel i5-12400 2.5GHz/6C/12T/18M 65W DDR5 4800

# of Cores

16

12

6

# of Threads

24

20

12

Processor Base Frequency

2.4G

2.1G

3.3G

3.0G

2.5G

Max Turbo Frequency

5.1G(1-core)

4.9G(1-core)

4.8G(1-core)

4.6G(1-core)

4.4G(1-core)

Cache

30M

25M

18M

TDP

65W

CPU

Intel i3-12300 3.5GHz/4C/8T/12M 60W DDR5 4800

Intel i3-12100 3.3GHz/4C/8T/12M 60W DDR5 4800

Intel i9-12900T 1.4GHz/16C/24T/30M 35W DDR5 4800 vPro

Intel i7-12700T 1.4GHz/12C/20T/25M 35W DDR5 4800 vPro

Intel i5-12600T 2.1GHz/6C/12T/18M 35W DDR5 4800 vPro

# of Cores

4

16

12

6

# of Threads

8

24

20

12

Processor Base Frequency

3.5G

3.3G

1.4G

2.1G

Max Turbo Frequency

4.4G(1-core)

4.3G(1-core)

4.8G(1-core)

4.7G(1-core)

4.6G(1-core)

Cache

12M

35M

25M

18M

TDP

60W

35W

CPU

Intel i5-12500T 2.0GHz/6C/12T/18M 35W DDR5 4800 vPro

Intel i5-12400T 1.8GHz/6C/12T/18M 35W DDR5 4800

Intel i3-12300T 2.3GHz/4C/8T/12M 35W DDR5 4800

Intel i3-12100T 2.2GHz/4C/8T/12M 35W DDR5 4800

# of Cores

6

4

# of Threads

12

8

Processor Base Frequency

2.0G

1.8G

2.3G

2.2G

Max Turbo Frequency

4.4G(1-core)

4.2G(1-core)

4.1G(1-core)

Cache

18M

12M

TDP

35W

Drive

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22x80x2.38mm

Interface Type

PCIe Gen 4×4

Power Active (AVG)

5.8W

Power Idle

35mW

Typical Sequential Read

6000 MB/s

6400 MB/s

Typical Sequential Write

3200 MB/s

3800 MB/s

5000 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

500K IOPS

550K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

370K IOPS

400K IOPS

Operating Temperature Range

0 to 70°C

Endurance Rating (Lifetime Writes)

150 TB

300 TB

600 TB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

Description

9mm Slim DVD ROM Drive

9mm Slim DVD Burner/CD-RW Drive

Interface Type

SATA 1.5 Gb/s

Dimensions

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm（Without Bezel-W x H x D)

Disc Capacity

NA

Type

DVDROM

DVDWriter

External Dimensions

NA

Speed

NA

Bay Type

9.0mm Tray

Color

Business Black or without bezel

Removable

No

Internal Buffer Size

0.5MB Min

Writes

NA

8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW

Reads

8XDVD-ROM / 24XCD-ROM

Source

DC Power 5V

DC Power Requirements

+5V±5%

DC Current

Max 2.5A@5v

Operating Systems Supported

All Windows OS

Temperature

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Relative Humidity

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Type

Intel® UHD Graphics 770

Display Interface

1x DP 1.2, 1x HDMI 2.0

Video Resolution (max)

4096×2304 @ 60Hz (DP) ,4096×2160@60Hz (HDMI)

Adapter

Nvidia T600(miniDP x4) – 4GB GDDR6

Nvidia T1000(miniDP x4) – 4GB GDDR6 Tiny LP

Nvidia T1000 – 8GB GDDR6 Tiny LP

Nvidia T400 （miniDPX3）4GB

RTX 3060

Bus Interface

PCI Express 3.0 ×8

PCIe 4.0 x16

Display Interface

Four mini-DisplayPort connectors

Three mini-DisplayPort connectors

HDMI*1: 7680*4320@60Hz
DP*3：5120*2880@60Hz

Graphics Chipset

TU117-850

TU117-875

TU117-825

Memory Clock Frequency (MHz)

5001MHz

8000MHz

Memory Size

4GB

8GB

4GB

12GB GDDR6

Memory Interface

128bit

128 bit

64bit

192-bit

Memory Bandwidth

Up to 160GB/s

32.4 Gbps

GPU Cores

640

896

384

GPU Core Frequency (MHz)

Base:735 MHz
Max Boost:2100 MHz

Base:1065 MHz
Boost:1395 MHz
Max Boost:2100 MHz

Base:420 MHz
Boost:1425 MHz
Max Boost:2100 MHz

Maximum Power Consumption

40W

50W

30W

170W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
•7680 × 4320 × 24 bpp at 120 Hz
•7680 × 4320 × 24 bpp at 60 Hz
•5120 × 2880 × 24 bpp at 60 Hz
HDMI™ 2.0b
Maximum resolution:
•7680 × 4320 × 24 bpp at 30 Hz
Simultaneous display support
Up to four simultaneous displays

HDMI*1: 7680*4320@60Hz
DP*3：5120*2880@60Hz

Thermal Solution

Active

Ultra-quiet Active Fansink

Active

Active Fansink

Dimension

2.713 inches × 6.137 inches, single-slot

225.55mm*117.5mm*35.8mm

Advanced Display

Not Available

SLI/NVLink Support

Not Available

Disclaimers

Adapter

WX3200

Bus Interface

PCIe 3.0 x8

Display Interface

4 x mDP

Graphics Chipset

Dev team, pls help to fill in

Memory Clock Frequency (MHz)

Dev team, pls help to fill in

Memory Size

4GB GDDR5

Memory Interface

128-bit

Maximum Power Consumption

55W

Thermal Solution

Active Fansink

Dimension

6.6″ L, single slot

Advanced Display

Not Available

SLI/NVLink Support

Not Available

Disclaimers

Card

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 Non-vPro PCIE M.2 2230 Module (CNVi)

2X2 AX RTL8852BE WIFI 6 +BT5.1 PCIE M.2 WW

2X2 AX Foxconn RZ616 WIFI6e +BT5.x PCIE M.2 2230 module

Supplier PN

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Coming soon

Data Rates Supported

10/100/1000Mbps (Copper)

5G/2.4G WIFI

6G/5G/2.4G WIFI

Controller Details

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Coming soon

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe Gen3

Data Transfer Mode

Ethernet

Wireless +BT

Power Consumption

Copper:
I350-T2 V2= 4.4W

Copper:
I350T4V2= 5W

Coming soon

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

802.11 abgn+acR2 +ax MIMO 2X2

802.11 abgn+acR2 +axR2 MIMO 2X2

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Core boot
UEFI boot

Network Transfer Mode (Full/Half Duplex)

Supported

Network Transfer Rate

1,000Mbps Full Duplex

Coming soon

Operating System Driver Support

Windows 10/11, Linux, Free BSD, XEN,Vmware

Windows 10/11, Linux

Manageability

Supported

Coming soon

Manageability Capabilities Alerting

Supported

Coming soon

TDP

Firmware Based Thermal Management

Coming soon

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

0°C – 80°C

# of Ports

2

4

Data Rate Per Port

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

PCIe Gen 2.1

PCIe Gen3 x4

NC Sideband Interface

Not Available

Coming soon

Jumbo Frames Supported

Yes

Coming soon

1000Base-T

Yes

Coming soon

IEEE 1588

Supported

Coming soon

Supported Under vPro

Not Available

No

Model

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)

2X2 AX RTL8852BE WIFI 6 +BT5.1 PCIE M.2 WW

2X2 AX Foxconn RZ616 WIFI6e +BT5.x PCIE M.2 2230 module

Connector

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Coming soon

Website

i350 T2

i350 T4

Coming soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.11ax* Auto-negotiaton

Intel® vPro™

Not Available

Coming soon

Intel® Standard Manageablity

Supported

Coming soon

Power Optimizer Platform Low-power Management Systems

Supported

Coming soon

Energy Efficient Ethernet

Supported

Coming soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Receive Side Scaling

Supported

Coming soon

Dual Tx and Rx Queues

Yes

Coming soon

Jumbo Frames (up to 9KB)

Supported

Coming soon

Teaming

Supported

Coming soon

Wake from Deep Sx

Supported

Coming soon

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Coming soon

Network Proxy/ARP Support

Supported

Coming soon

Card

Intel AX211 Wi-Fi 6E 2*2ax+BT5.x vPro CNVi PCIE M.2 module

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Supplier PN

Coming Soon

Coming soon

Data Rates Supported

6G/5G/2.4G WIFI

Coming soon

Controller Details

Coming Soon

Coming soon

Controller Bus Architecture

PCIe Gen3

Coming soon

Data Transfer Mode

Wireless +BT

Coming soon

Power Consumption

Coming Soon

Coming soon

IEEE Standards Compliance

802.11 abgn+acR2 +axR2 MIMO 2X2

Coming soon

Boot ROM Support

Core boot
UEFI boot

Coming soon

Network Transfer Mode (Full/Half Duplex)

Supported

Coming soon

Network Transfer Rate

Coming Soon

Coming soon

Operating System Driver Support

Windows 10/11, Linux

Coming soon

Manageability

Coming Soon

Coming soon

Manageability Capabilities Alerting

Coming Soon

Coming soon

TDP

Coming Soon

Coming soon

Operating Temperature Range

0°C – 80°C

Coming soon

# of Ports

Coming soon

Data Rate Per Port

Coming soon

System Interface Type

PCIe Gen3 x4

Coming soon

NC Sideband Interface

Coming Soon

Coming soon

Jumbo Frames Supported

Coming Soon

Coming soon

1000Base-T

Coming Soon

Coming soon

IEEE 1588

Coming Soon

Coming soon

Supported Under vPro

Yes

Coming soon

Disclaimers

Model

Intel AX211 Wi-Fi 6E 2*2ax+BT5.x vPro CNVi PCIE M.2 module

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Connector

Coming soon

Website

Coming soon

Auto-Negotiation

IEEE* 802.11ax* Auto-negotiaton

Coming soon

Intel® vPro™

Coming soon

Intel® Standard Manageablity

Coming soon

Power Optimizer Platform Low-power Management Systems

Coming soon

Energy Efficient Ethernet

Coming soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Coming soon

Receive Side Scaling

Coming soon

Dual Tx and Rx Queues

Coming soon

Jumbo Frames (up to 9KB)

Coming soon

Teaming

Coming soon

Wake from Deep Sx

Coming soon

Server Operating System Support

Coming soon

Network Proxy/ARP Support

Coming soon

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v4.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cmÂ²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification

9.0

Table of Contents

SECTION I: Platform Overview

CPU

Operating Systems

Memory

Storage

Video

Front I/O

Rear I/O

Ethernet

Audio

Thermal

Power Specifications

BIOS

Chassis Information

Packaging Dimensions

Security & Serviceability

Operating Environment

SECTION II: Platform Detail

Motherboard Core

Supported Components

Storage

Optical Drive/Removable Media

Keyboard and Pointing Devices

PCIe Adapters

SECTION III: Supported Component Detail

CPU Specifications Part 1

CPU Specifications Part 2

CPU Specifications Part 3

Solid State Storage Specifications

Optical Drive Specifications

Integrated Graphics Adapter

Discrete Graphics Adapter Part 1

Discrete Graphics Adapter Part 2

Ethernet Specifications Group 1 Part 1

Ethernet Specifications Group 1 Part 2

Ethernet Specifications Group 2 Part 1

Ethernet Specifications Group 2 Part 2

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

Industry Standard Specification Support

Social and Environmental Responsibility

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Network and Labeling

Regulations & Standards

Environmentals