P360 Ultra

Version: 1.0 | 06/21/2022

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Hardware Maintenance Manual

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Drivers & Software

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Available Whitepapers

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SECTION I: Platform Overview

Description

The new ThinkStation® P360 Ultra features a revolutionary form factor that redefines the power of small—delivering superior performance and flexibility in a chassis less than four liters in total volume.​

CPU

Processor Support

Intel Alder Lake-S Core Series

Socket Type

Socket V (LGA 1700)

Operating Systems

Preloaded

Windows 11 Pro
Windows 11 Home
Windows 10 Pro
Windows 10 IOT LTSC
Ubuntu 20.04 LTS

Supported

Ubuntu 22.04 LTS
Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.6

Memory

Slots

Up to 4 SODIMMs

Channels

Supports up to 4 SODIMM Sockets, 2 Channels

Type

262-pin, 4000MHz ECC and non-ECC SODIMM

ECC Support

Yes, CPU Dependent

Speed

Up to 4000MHz

Max DIMM Size

32GB DDR5 UDIMM

Max System Memory

128GB

Storage

Total Bays/Size

1 x 2.5″

SATA

1 x SATA Connectors, Gen 3

PCIe

2 x M.2 PCIe Connector, Gen 4 Onboard

Disclaimers

1. Additional parts/enclosures may be required for some configurations.

Video

Integrated Graphics

Intel Integrated UHD Graphics 770

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slots

Slot 1

PCIe 4.0 x16, Full Height, Full Length, 75W

Slot 2

PCIe 3.0 x8, Full Height, Half Length, 25W

Front I/O

USB

1 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x Thunderbolt 4 Type-C 40Gb/s

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Rear I/O

USB

4 x USB 3.2 Gen 2 Type-A 10Gb/s

DisplayPort

3 x Standard (CPU dependent)

Ethernet

1 x 2.5GbE – RJ45
1 x 1GbE – RJ45

Optional USB Adapter

Rear USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP

Optional Network Adapter

Intel I350-T2 Dual Port Gigabit Ethernet Adapter

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Vendor

Intel I225
Intel I210

Speeds

10/100/1000/2500Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

2 x RJ45

Disclaimers

Note: Ethernet speeds is port dependent.

Audio

Vendor

Realtek

Type

HD (5.1)

Internal Speaker

Yes

Connectors

1 x Front 3.5mm Jack (Mic & Headphone)

Chipset

ALC897Q

Number of Channels

2 Channels (5.1 via driver selection)

Number of Bits/Audio Resolution

6 Channel DAC supports 16/20/24 bit PCM format for 5.1 audio selection
2 Stereo ADC supports 16/20 bit PCM format

Thermal

Temp Sensors

Ambient Sensor
Storage (M.2) Sensor
DIMM Sensor

Fans

1 x CPU Fan
1 x M.2 Fan
1 x Graphics MXM Fan

Power Specifications

Power Supply

170W

230W

300W

Power Efficiency

90% Efficient @ 50% Load

90% Efficient @ 50% Load

90% Efficient @ 50% Load

Main

20V DC Jack, yellow

20V DC Jack, yellow

20V DC Jack, yellow

Operating Voltage Range

100 – 240V

100 – 240V

100 – 240V

Rated Voltage Range

90-264VAC

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

8.5A

11.5A

15A

Graphics

1 x 8 pin

1 x 8 pin

1 x 8 pin

Power Supply Fan

No

No

No

ENERGY STAR® Qualified (config dependent)

Yes

Yes

Yes

Aux Power Drop

No

No

No

BIOS

Vendor

AMI

Self-Healing BIOS

Yes

Chassis Information

Color

Raven Black

PSU

170W, 230W, and 300W Available, Autosensing

Thermal Solutions

One CPU FAN, One M.2 Fan, and One MXM Graphics Fan

Dimensions

205mm/8.07″ H
223mm/8.78″ D
87mm/3.43″ W

Weight

3.60kg / 7.94lbs

Packaging Dimensions

Height (mm/in)

202mm / 7.95″

Width (mm/in)

87mm / 3.43″

Depth (mm)

223mm / 8.78″

Weight (kgs/lbs)

3.6 kg / 7.94 lbs

Security & Serviceability

TPM

Infineon SLB9670 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 16.x)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

Yes

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Cover Removal

Optical Drive

No

Hard Drives

Tool-less

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 20% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 12192m (-50ft to 40000ft)

Vibration

Package Vibration:
Three axes in use orientation (X, Y & Z-axis), 1.04Grms, 2-200Hz, 15mins/axis, random, packaged for shipment
Operating Vibration:
Random Vibration; 5 to 500 Hz, 0.27 G rms; 30 min/axis, X, Y, Z axes
Non-Operating Vibration:Random Vibration; 2 to 200 Hz, 1.04 G rms; 15 min/face, 6 faces

Shock

Operation Shock: Half-sine wave, 15G/3ms(X,Y), 30G/3ms(Z)
Non-operating Shock: Trapezoidal wave, 45G/11ms

SECTION II: Platform Detail

Board Size

7.24″ x 7.69″ (184.0mm x 195.5mm)

Layout

Custom

Motherboard Core

Processor Support

Intel Alder Lake-S Core Series

Socket Type

Socket V (LGA 1700)

Memory Support

DDR5 up to 4000MHz SODIMM Memory (ECC and non-ECC)

Voltage Regulator

125W TDP Capable

Chipset (PCH)

Intel W680 Chipset

Flash

32MB

Super I/O

Nuvoton NCT6692D

Clock

Intel Native isCLK

Audio

Realtek ALC897Q Codec

Ethernet

Intel I225LM
Intel I210AT

Supported Components

Processor Level

Intel Alder Lake-S – Core

Processor

i9-12900K
i9-12900
i9-12900T
i7-12700K
i7-12700
i7-12700T
i5-12600K
i5-12600
i5-12500
i5-12400
i5-12400T
i3-12300
i3-12100

Memory Type

ECC/non-ECC SODIMMs – 4000MHz

Memory

16GB DDR5 ECC SODIMM PC4-4000

8GB DDR5 non-ECC SODIMM PC4-4000
16GB DDR5 non-ECC SODIMM PC4-4000
32GB DDR5 non-ECC SODIMM PC4-4000

Storage

2.5″ SATA Hard Disk Drive (HDD)

1TB 2.5″ SATA HDD 7200rpm, 6Gb/s, 2.5″ (FIPS certified)
1TB SATA 2.5″ SATA HDD 7200rpm, 6Gb/s, 2.5″ (non-FIPS certified)

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
4096GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL

RAID

RAID Levels and Requirements

NVMe Drives Support RAID 0/1

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.

Keyboard and Pointing Devices

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard

Pointing Devices

Calliope USB Mouse
Fingerprint USB Mouse

PCIe Adapters

Network

Intel I350-T2 Dual Port Gigabit Ethernet Adapter

USB

Rear USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP

WiFi Cards

Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non-vPro)
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX211 vPro)

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel Core i9 12900T ( X.XGHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT32)

Intel Core i5 12400T ( X.XGHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT24)

Intel Core i7 12700T ( X.XGHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT32)

Intel Core i9 12900 ( 2.4GHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)

Intel Core i7 12700 ( 2.1GHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)

Intel Core i5 12600 ( 3.3GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)

# of Cores

16c

6c

12c

16c

12c

6c

# of Threads

24

12

20

24

20

12

Processor Base Frequency

1.40 GHz

1.8GHz

1.4GHz

2.4GHz

2.1GHz

3.3GHz

Max Turbo Frequency

4.9GHz

4.2GHz

4.7GHz

5.1GHz

4.9GHz

4.8GHz

Cache

30M

18M

25M

30M

25M

18M

TDP

35W

35W

65W

65W

65W

65W

CPU Specifications

CPU

Intel Core i3 12300 ( 3.5GHz / 4C / 8T / 12M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT24)

Intel Core i9 12900K( 3.2GHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)

Intel Core i7 12700K( 3.6GHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)

Intel Core i5 12600K( 3.7GHz / 10C / 16T / 20M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)

Intel Core i3 12100( 3.3GHz / 4C / 8T / 12M /DDR4 3200 DDR5 4800/ 60W / Turbo / GT24 )

Intel Core i5 12400 ( 2.5GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800/ 65 W / Turbo / GT24 )

Intel Core i5 12500 ( 3.0GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32 )

# of Cores

4c

16c

12c

10c

4c

6c

6c

# of Threads

8

32

20

16

8

12

12

Processor Base Frequency

3.5GHz

3.2GHz

3.6GHz

3.7Ghz

3.5GHz

2.5GHz

3.0GHz

Max Turbo Frequency

4.4GHz

5.2GHz

5.0GHz

4.9Ghz

4.3GHz

4.4GHz

4.6GHz

Cache

12M

30M

25M

20M

12M

18M

18M

TDP

60W

125W

125W

125W

60W

65W

65W

HDD Specifications

Drive

1TB SATA 2.5″ HDD HDD 7200 rpm, 6Gb/s

3.5″ SATA Hard Disk Drive (HDD)

Not Available

2.5″ SATA Hard Disk Drive (HDD)

Yes

Connector

SATA

Transfer Rate (Gb/sec)

160MB/s OD Read

Spindle Speed (RPM)

7,200

Power Off to Spindle Stop (sec)

NA

DC Power to Drive Ready (sec)

3.5

Average Latency (msec)

4.2

Input (VDC)

5

Typical (Watts)

1.9

Idle (Watts)

0.7

Physical Dimensions

69.85mm x 100.34mm x 7mm

Weight (grams)

90

Operating (C) Ambient

0 to 60

Operating (C) Base Casting

60

Non-Operating (C) Ambient

(-40 to 70)

Gradient (C per Hour)

20

Operating (Gs @ 2ms)

400

Non-Operating (Gs @ 2ms)

1000

Solid State Storage Specifications

Drive

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

NVMe 2280 M.2 4TB PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22 x 80 x 2.38

22 x 80 x 2.38

22 x 80 x 2.38

22 x 80 x 2.38

Interface Type

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

PCIe Gen 4×4

Power Active (AVG)

5.8W

5.8W

5.8W

?

Power Idle

35 mW

35 mW

50mW

50mW

Typical Sequential Read

6000 MB/s

6400 MB/s

6400 MB/s

6400 MB/s

Typical Sequential Write

3200 MB/s

3800 MB/s

5000 MB/s

5000 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

500K IOPS

550K IOPS

550K IOPS

650K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

370K IOPS

400K IOPS

400K IOPS

450K IOPS

Operating Temperature Range

0 to 55°C

0 to 55°C

0 to 55°C

?

Endurance Rating (Lifetime Writes)

150 TB

300 TB

600 TB

?

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

?

Hardware Encryption

AES 256 bit

AES 256 bit

AES 256 bit

?

Integrated Graphics Adapter

Type

Intel® UHD Graphics 770

Display Interface

3 x DP 1.2

Video Resolution (max)

7680 x 4320 @ 60Hz(DP)

Discrete Graphics Adapter

Adapter

Quadro T400 – 4GB GDDR6

Quadro T1000 – 8GB GDDR6

NVIDIA Quadro A2000(DP x4) – 12GB GDDR6

Nvidia RTX A5000 mobile,16GB, 4miniDP,GDDR6

WX3200

RTX 3060

WX3200

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCI Express 4.0×16

PCI Express 4.0×16

PCIe 3.0 x8

PCIe 4.0 x16

PCIe 3.0 x8

Display Interface

3 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

4 x mDP 1.4a

4 x mDP

HDMI*1: 7680*4320@60Hz
DP*3:5120*2880@60Hz

4 x mDP

Graphics Chipset

TU117-850

TU117-875

GP106-850

QN20-E5

Dev team, pls help to fill in

Dev team, pls help to fill in

Memory Clock Frequency (MHz)

5001MHz

5001MHz

6001MHz

1750MHZ

Dev team, pls help to fill in

8000MHz

Dev team, pls help to fill in

Memory Size

4GB GDDR6

8GB GDDR6

12GB GDDR6

16GB GDDR6

4GB GDDR5

12GB GDDR6

4GB GDDR5

Memory Interface

64-bit

128-bit

192-bit

256-bit

128-bit

192-bit

128-bit

Memory Bandwidth

Up to 80GB/s

Up to 160GB/s

Up to 288GB/s

Up to 224GB/s

GPU Cores

CUDA Cores: 640

CUDA Cores: 896

???

???

GPU Core Frequency (MHz)

420MHz (base)/2100MHz (max boost)

1065MHz (base)/2100MHz (max boost)

1493MHz

900MHz

Maximum Power Consumption

30W

50W

75w (Board Power)

115w (Board Power)

55W

170W

55W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz

HDMI*1: 7680*4320@60Hz
DP*3:5120*2880@60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Active Fansink

Active Fansink

Active Fansink

Active Fansink

Active Fansink

Dimension

2.713” H x 6.137” L
Single Slot, Low Profile

2.713” H x 6.137” L
Single Slot, Low Profile

6.6 inches, HHHL double-slot

6.6″ L, single slot

225.55mm*117.5mm*35.8mm

6.6″ L, single slot

Advanced Display

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

SLI/NVLink Support

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

Not Available

Disclaimers

Intel® Ethernet Specifications

Card

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Supplier PN

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Data Rates Supported

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

Controller Details

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Data Transfer Mode

Ethernet

Ethernet

Power Consumption

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Network Transfer Rate

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Manageability

Supported

Supported

Manageability Capabilities Alerting

Supported

Supported

TDP

Firmware Based Thermal Management

Firmware Based Thermal Management

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

# of Ports

2

4

Data Rate Per Port

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

PCIe Gen 2.1

PCIe Gen 2.1

NC Sideband Interface

Not Available

Not Available

Jumbo Frames Supported

Yes

Yes

1000Base-T

Yes

Yes

IEEE 1588

Supported

Supported

Supported Under vPro

Not Available

Not Available

Disclaimers

Ethernet

Model

I350-T2

I350-T4

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Connector

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Website

i350 T2

i350 T4

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

Intel® vPro™

Not Available

Not Available

Intel® Standard Manageablity

Supported

Supported

Power Optimizer Platform Low-power Management Systems

Supported

Supported

Energy Efficient Ethernet

Supported

Supported

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Receive Side Scaling

Supported

Supported

Dual Tx and Rx Queues

Yes

Yes

Jumbo Frames (up to 9KB)

Supported

Supported

Teaming

Supported

Supported

Wake from Deep Sx

Supported

Supported

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Network Proxy/ARP Support

Supported

Supported

Disclaimers

Media Card Reader

Description

Not Available

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v4.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Safety, EMC Connection to the Telephone Network and Labeling

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

Regulations & Standards

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Environmentals

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

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