Lenovo ThinkStation: PCs & Tablets
P360 Ultra
Version: 5.0 | 06/05/2024
Product Name
P360
Product Display Name
ThinkStation P360 Ultra Small Form Factor
Information Date
1-Sep-22
Hardware Maintenance Manual
Drivers & Software
Description
The new ThinkStation® P360 Ultra features a revolutionary form factor that redefines the power of small—delivering superior performance and flexibility in a chassis less than four liters in total volume.
Processor Support
Intel Alder Lake-S Core Series
Socket Type
Socket V (LGA 1700)
Preloaded
Windows 11 Pro
Windows 11 Home
Ubuntu 20.04 LTS
Supported
Ubuntu 22.04 LTS
Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.6
Slots
Up to 4 SODIMMs
Channels
Supports up to 4 SODIMM Sockets, 2 Channels
Type
262-pin, 4000MHz ECC and non-ECC SODIMM
ECC Support
Yes, CPU Dependent
Speed
Up to 4000MHz
Max DIMM Size
32GB DDR5 UDIMM
Max System Memory
128GB
Total Bays/Size
1 x 2.5″
SATA
1 x SATA Connectors, Gen 3
PCIe
2 x M.2 PCIe Connector, Gen 4 Onboard
Disclaimers
1. Additional parts/enclosures may be required for some configurations.
Integrated Graphics
Intel Integrated UHD Graphics 770
Discrete Graphics
PCIe Add-In-Card, Details in Section Below
Multi-GPU Support
Yes
Type
PCIe Add-In-Card
Bus Interface
PCIe x16
Slot 1
PCIe 4.0 x16, Low Profile, Full Length, 75W
Slot 2
PCIe 3.0 x8 (x4 Lanes), Low Profile, Half Length, 25W
USB
1 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x Thunderbolt 4 Type-C 40Gb/s
Audio
1 x Combo Audio/Microphone Jack (3.5mm)
Disclaimers
Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
USB
4 x USB 3.2 Gen 2 Type-A 10Gb/s
DisplayPort
3 x Standard (CPU dependent)
Ethernet
1 x 2.5GbE – RJ45
1 x 1GbE – RJ45
Optional USB Adapter
Rear USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP
Optional Network Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Disclaimers
Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
Vendor
Intel I225
Intel I210
Speeds
10/100/1000/2500Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
2 x RJ45
Disclaimers
Note: Ethernet speeds is port dependent.
Vendor
Realtek
Type
HD (5.1)
Internal Speaker
Yes
Connectors
1 x Front 3.5mm Jack (Mic & Headphone)
Chipset
ALC897Q
Number of Channels
2 Channels (5.1 via driver selection)
Number of Bits/Audio Resolution
6 Channel DAC supports 16/20/24 bit PCM format for 5.1 audio selection
2 Stereo ADC supports 16/20 bit PCM format
Temp Sensors
Ambient Sensor
Storage (M.2) Sensor
DIMM Sensor
Fans
1 x CPU Fan
1 x M.2 Fan
1 x Graphics MXM Fan
Power Supply
170W
230W
300W
Power Efficiency
90% Efficient @ 50% Load
90% Efficient @ 50% Load
90% Efficient @ 50% Load
Main
20V DC Jack, yellow
20V DC Jack, yellow
20V DC Jack, yellow
Operating Voltage Range
100 – 240V
100 – 240V
100 – 240V
Rated Voltage Range
90-264VAC
90-264VAC
90-264VAC
Rated Line Frequency
47Hz / 63Hz
47Hz / 63Hz
47Hz / 63Hz
Operating Line Frequency Range
50Hz / 60Hz
50Hz / 60Hz
50Hz / 60Hz
Rated Input Current
8.5A
11.5A
15A
Power Supply Fan
No
No
No
ENERGY STAR® Qualified (config dependent)
Yes
Yes
Yes
Aux Power Drop
No
No
No
Vendor
AMI
Self-Healing BIOS
Yes
Color
Raven Black
PSU
170W, 230W, and 300W Available, Autosensing
Thermal Solutions
One CPU FAN, One M.2 Fan, and One MXM Graphics Fan
Dimensions
205mm/8.07″ H
223mm/8.78″ D
87mm/3.43″ W
Weight
3.60kg / 7.94lbs
Height (mm/in)
202mm / 7.95″
Width (mm/in)
87mm / 3.43″
Depth (mm)
223mm / 8.78″
Weight (kgs/lbs)
3.6 kg / 7.94 lbs
TPM
Infineon SLB9670 TPM 2.0
Asset ID
Yes, 1024 x 8bit
vPro
Intel vPro for WS (AMT 16.x)
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
No
Boot Sequence Control
Yes
Padlock Support
Yes
Boot without keyboard and/or mouse
Yes
Access Panel
Tool-less Cover Removal
Optical Drive
No
Hard Drives
Tool-less
Expansion Cards
Retained With Screws
Processor Socket
Tool-less
Color coded User Touch Points
Yes
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained With Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Customer Support Center
Air Temperature
Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage
Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity
Relative Humidity Operating: 20% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Altitude
Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 12192m (-50ft to 40000ft)
Vibration
Package Vibration:
Three axes in use orientation (X, Y & Z-axis), 1.04Grms, 2-200Hz, 15mins/axis, random, packaged for shipment
Operating Vibration:
Random Vibration; 5 to 500 Hz, 0.27 G rms; 30 min/axis, X, Y, Z axes
Non-Operating Vibration:Random Vibration; 2 to 200 Hz, 1.04 G rms; 15 min/face, 6 faces
Shock
Operation Shock: Half-sine wave, 15G/3ms(X,Y), 30G/3ms(Z)
Non-operating Shock: Trapezoidal wave, 45G/11ms
Board Size
7.24″ x 7.69″ (184.0mm x 195.5mm)
Layout
Custom
Processor Support
Intel Alder Lake-S Core Series
Socket Type
Socket V (LGA 1700)
Memory Support
DDR5 up to 4000MHz SODIMM Memory (ECC and non-ECC)
Voltage Regulator
125W TDP Capable
Chipset (PCH)
Intel W680 Chipset
Flash
32MB
Super I/O
Nuvoton NCT6692D
Clock
Intel Native isCLK
Audio
Realtek ALC897Q Codec
Ethernet
Intel I225LM
Intel I210AT
Processor Level
Intel Alder Lake-S – Core
Processor
i9-12900K
i9-12900
i9-12900T
i7-12700K
i7-12700
i7-12700T
i5-12600K
i5-12600
i5-12500
i5-12400
i5-12400T
i3-12300
i3-12100
Memory Type
ECC/non-ECC SODIMMs – 4000MHz
Memory
16GB DDR5 ECC SODIMM PC4-4000
8GB DDR5 non-ECC SODIMM PC4-4000
16GB DDR5 non-ECC SODIMM PC4-4000
32GB DDR5 non-ECC SODIMM PC4-4000
2.5″ SATA Hard Disk Drive (HDD)
1TB 2.5″ SATA HDD 7200rpm, 6Gb/s, 2.5″ (FIPS certified)
1TB SATA 2.5″ SATA HDD 7200rpm, 6Gb/s, 2.5″ (non-FIPS certified)
M.2 PCIe Solid State Drive (SSD)
512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
4096GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
RAID Levels and Requirements
NVMe Drives Support RAID 0/1
Notes
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.
Keyboard
Calliope USB Keyboard
Traditional USB Keyboard
Pointing Devices
Calliope USB Mouse
Fingerprint USB Mouse
Network
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
USB
Rear USB 3.2 Gen2x2 Type-C PCIe x4 Adapter – LP
2-Port USB Expansion Card (USB3.0) PCIe x1 – LP
4-Port Serial Expansion Card PCIe x1- LP
WiFi Cards
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non-vPro)
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX211 vPro)
CPU
Intel Core i9 12900T ( X.XGHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT32)
Intel Core i5 12400T ( X.XGHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT24)
Intel Core i7 12700T ( X.XGHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 35W / Turbo / GT32)
Intel Core i9 12900 ( 2.4GHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)
Intel Core i7 12700 ( 2.1GHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)
# of Cores
16c
6c
12c
16c
12c
# of Threads
24
12
20
24
20
Processor Base Frequency
1.40 GHz
1.8GHz
1.4GHz
2.4GHz
2.1GHz
Max Turbo Frequency
4.9GHz
4.2GHz
4.7GHz
5.1GHz
4.9GHz
Cache
30M
18M
25M
30M
25M
TDP
35W
35W
65W
65W
65W
CPU
Intel Core i5 12600 ( 3.3GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32)
Intel Core i3 12300 ( 3.5GHz / 4C / 8T / 12M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT24)
Intel Core i9 12900K( 3.2GHz / 16C / 24T / 30M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)
Intel Core i7 12700K( 3.6GHz / 12C / 20T / 25M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)
Intel Core i5 12600K( 3.7GHz / 10C / 16T / 20M / DDR4 3200 DDR5 4800 / 125W / Turbo / GT32)
# of Cores
6c
4c
16c
12c
10c
# of Threads
12
8
32
20
16
Processor Base Frequency
3.3GHz
3.5GHz
3.2GHz
3.6GHz
3.7Ghz
Max Turbo Frequency
4.8GHz
4.4GHz
5.2GHz
5.0GHz
4.9Ghz
Cache
18M
12M
30M
25M
20M
TDP
65W
60W
125W
125W
125W
CPU
Intel Core i3 12100( 3.3GHz / 4C / 8T / 12M /DDR4 3200 DDR5 4800/ 60W / Turbo / GT24 )
Intel Core i5 12400 ( 2.5GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800/ 65 W / Turbo / GT24 )
Intel Core i5 12500 ( 3.0GHz / 6C / 12T / 18M / DDR4 3200 DDR5 4800 / 65W / Turbo / GT32 )
# of Cores
4c
6c
6c
# of Threads
8
12
12
Processor Base Frequency
3.5GHz
2.5GHz
3.0GHz
Max Turbo Frequency
4.3GHz
4.4GHz
4.6GHz
Cache
12M
18M
18M
TDP
60W
65W
65W
Drive
1TB SATA 2.5″ HDD HDD 7200 rpm, 6Gb/s
3.5″ SATA Hard Disk Drive (HDD)
Not Available
2.5″ SATA Hard Disk Drive (HDD)
Yes
Connector
SATA
Transfer Rate (Gb/sec)
160MB/s OD Read
Spindle Speed (RPM)
7,200
Power Off to Spindle Stop (sec)
NA
DC Power to Drive Ready (sec)
3.5
Average Latency (msec)
4.2
Input (VDC)
5
Typical (Watts)
1.9
Idle (Watts)
0.7
Physical Dimensions
69.85mm x 100.34mm x 7mm
Weight (grams)
90
Operating (C) Ambient
0 to 60
Operating (C) Base Casting
60
Non-Operating (C) Ambient
(-40 to 70)
Gradient (C per Hour)
20
Operating (Gs @ 2ms)
400
Non-Operating (Gs @ 2ms)
1000
Drive
NVMe 2280 M.2 512GB PCIe SSD (OPAL)
NVMe 2280 M.2 1TB PCIe SSD (OPAL)
NVMe 2280 M.2 2TB PCIe SSD (OPAL)
NVMe 2280 M.2 4TB PCIe SSD (OPAL)
Dimensions Millimeters (W x D x H)
22 x 80 x 2.38
22 x 80 x 2.38
22 x 80 x 2.38
22 x 80 x 2.38
Interface Type
PCIe Gen 4×4
PCIe Gen 4×4
PCIe Gen 4×4
PCIe Gen 4×4
Power Active (AVG)
5.8W
5.8W
5.8W
?
Power Idle
35 mW
35 mW
50mW
50mW
Typical Sequential Read
6000 MB/s
6400 MB/s
6400 MB/s
6400 MB/s
Typical Sequential Write
3200 MB/s
3800 MB/s
5000 MB/s
5000 MB/s
Burst Random Read (4K Queue Depth 32/8 thread);
500K IOPS
550K IOPS
550K IOPS
650K IOPS
Burst Random Write (4K Queue Depth 32/8 thread)
370K IOPS
400K IOPS
400K IOPS
450K IOPS
Operating Temperature Range
0 to 55°C
0 to 55°C
0 to 55°C
?
Endurance Rating (Lifetime Writes)
150 TB
300 TB
600 TB
?
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
2.0M POH
?
Hardware Encryption
AES 256 bit
AES 256 bit
AES 256 bit
?
Type
Intel® UHD Graphics 770
Display Interface
3 x DP 1.2
Video Resolution (max)
7680 x 4320 @ 60Hz（DP）
Adapter
Quadro T400 – 4GB GDDR6
Quadro T1000 – 8GB GDDR6
NVIDIA Quadro A2000(DP x4) – 12GB GDDR6
Nvidia RTX A5000 mobile,16GB, 4miniDP,GDDR6
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
PCI Express 4.0×16
PCI Express 4.0×16
Display Interface
3 x mDP 1.4a
4 x mDP 1.4a
4 x mDP 1.4a
4 x mDP 1.4a
Graphics Chipset
TU117-850
TU117-875
GP106-850
QN20-E5
Memory Clock Frequency (MHz)
5001MHz
5001MHz
6001MHz
1750MHZ
Memory Size
4GB GDDR6
8GB GDDR6
12GB GDDR6
16GB GDDR6
Memory Interface
64-bit
128-bit
192-bit
256-bit
Memory Bandwidth
Up to 80GB/s
Up to 160GB/s
Up to 288GB/s
Up to 224GB/s
GPU Cores
CUDA Cores: 640
CUDA Cores: 896
???
???
GPU Core Frequency (MHz)
420MHz (base)/2100MHz (max boost)
1065MHz (base)/2100MHz (max boost)
1493MHz
900MHz
Maximum Power Consumption
30W
50W
75w (Board Power)
115w (Board Power)
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz
7680 x 4320 x 24 bpp @ 120Hz
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz
DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz
DP1.4a: 7680*4320*24bpp/120Hz
(Requires two DisplayPort 1.4a links and DSC compression)
HDPC: 2.2
7680 x 4320 x 24 bpp @ 60Hz
7680 x 4320 x 36 bpp @ 60Hz
5120 x 3200 x 24 bpp @ 60Hz
5120 x 2880 x 24 bpp @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Active Fansink
Active Fansink
Dimension
2.713” H x 6.137” L
Single Slot, Low Profile
2.713” H x 6.137” L
Single Slot, Low Profile
6.6 inches, HHHL double-slot
Advanced Display
Not Available
Not Available
Not Available
Not Available
SLI/NVLink Support
Not Available
Not Available
Not Available
Not Available
Card
Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)
Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)
2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF
Supplier PN
I350T2G1P20, MM# 928941
I350T4G1P20, MM# 928942
Data Rates Supported
10/100/1000Mbps (Copper), 1000Mbps (Fiber)
10/100/1000Mbps (Copper), 1000Mbps (Fiber)
Controller Details
Intel Ethernet Controller I350
Intel Ethernet Controller I351
Controller Bus Architecture
PCIe 2.1 (5GT/s)
PCIe 2.1 (5GT/s)
Data Transfer Mode
Ethernet
Ethernet
Power Consumption
Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W
Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W
IEEE Standards Compliance
IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T
IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T
Boot ROM Support
PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI
PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI
Network Transfer Mode (Full/Half Duplex)
Supported
Supported
Network Transfer Rate
1,000Mbps Full Duplex
1,000Mbps Full Duplex
Operating System Driver Support
Windows 7/8/10, Linux, Free BSD, XEN,Vmware
Windows 7/8/10, Linux, Free BSD, XEN,Vmware
Manageability
Supported
Supported
Manageability Capabilities Alerting
Supported
Supported
TDP
Firmware Based Thermal Management
Firmware Based Thermal Management
Operating Temperature Range
0°C to 55°C (32°F to 131°F)
0°C to 55°C (32°F to 131°F)
# of Ports
2
4
Data Rate Per Port
10/100/1000Mbps (copper), 1000Mbps (fiber)
10/100/1000Mbps (copper), 1000Mbps (fiber)
System Interface Type
PCIe Gen 2.1
PCIe Gen 2.1
NC Sideband Interface
Not Available
Not Available
Jumbo Frames Supported
Yes
Yes
1000Base-T
Yes
Yes
IEEE 1588
Supported
Supported
Supported Under vPro
Not Available
Not Available
Disclaimers
Model
I350-T2
I350-T4
2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF
Connector
2 x Ports RJ-45 Copper
4 x Ports RJ-45 Copper
Website
i350 T2
i350 T4
Auto-Negotiation
IEEE* 802.3* Auto-negotiaton
IEEE* 802.3* Auto-negotiaton
Intel® vPro™
Not Available
Not Available
Intel® Standard Manageablity
Supported
Supported
Power Optimizer Platform Low-power Management Systems
Supported
Supported
Energy Efficient Ethernet
Supported
Supported
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)
Supported
Supported
Receive Side Scaling
Supported
Supported
Dual Tx and Rx Queues
Yes
Yes
Jumbo Frames (up to 9KB)
Supported
Supported
Teaming
Supported
Supported
Wake from Deep Sx
Supported
Supported
Server Operating System Support
Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware
Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware
Network Proxy/ARP Support
Supported
Supported
Description
Not Available
WMI Support
Compliant with Microsoft WBEM and the DMTF common information model
ROM-Based Setup Utility (F1)
System configuration setup program (text/graphic interface) available at power-on with F1 key
Bootblock Recovery
Recovers system BIOS if the flash ROM is corrupted
Replicated Setup
Saves system configuration settings to a file that can then be used to replicate the settings to other systems
Boot Control
Boot control available through ROM-based setup utility or with F12 key at power-on
Memory Change Alert
Power-on error message in the event of a decrease in system memory
Thermal Alert
Power-on error message in the event of a fan failure
Asset Tag
Supports ability to set SMBIOS type 2 baseboard asset tag field
System/Emergency ROM Flash Recovery with Video
Supports process to recover the system BIOS if the flash ROM is corrupted
Remote Wakeup/Remote Shutdown
System admin can power on/off a client computer from a remote location to provide maintenance
Quick Resume Time
Supports low power S3 (suspend to RAM) and prompt resume times
ROM Revision Level
System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup
Keyboard-less Operation
System can be booted without a keyboard
Per-port Control
Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling
Offers multiple settings for fan control ranging between better performance and better acoustics
Security
Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support
Intel(R) AMT (includes ASF 2.0)
Allows system to be supported from a remote location
Intel(R) TXT
Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks
Memory Modes
Supports mirroring, lock step, and sparing memory modes
Windows 10 Ready
Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec
UEFI
Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v6.2
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot
El Torito Bootable CD-Rom Format Specification, v1.0
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI
PCI Local Bus v3.0
PC Firmware Specification 3.1
PCI Express
PCI Express Base Specification v4.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification v2.0
UHCI
Universal Host Controller Interface Design Guide, Revision v1.1
USB
Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2
SMBIOS
DMTF System Management Spec v3.2.1
XHCI
XHCI SPEC Revision v1.2
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/
Batteries
UN38.3,MSDS
Safety, EMC Connection to the Telephone Network and Labeling
Not applicable
LWAd(bels) Idle
3.1
LWAd(bels) Oper
3.7
Industry Standard Specifications
not applicable
Remote Manageability Software Solutions
not applicable
System Software Manager
Lenovo ThinkStation supports software management tools by Lenovo Vantage.
EMC & Safety
FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC
Energy Star
ENERGY STAR 8.0
EPEAT
EPEAT Certification Available on Select Models
ErP Lot-3 2013
Yes
Hazardous Substances
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week
TCO Certification
9.0
