P350 Tiny

Product Name

P350 Tiny

Product Display Name

ThinkStation P350 Tiny

Information Date

8-Mar-22

Hardware Maintenance Manual

P350 Tiny HMM

Drivers & Software

P350 Tiny Drivers & Software

Description

Engineered to go where others can’t, the ThinkStation® P350 Tiny combines simple and efficient design with the professional power of a workstation.

Processor Support

Intel Rocket Lake Core

Socket Type

Socket-H4 (LGA 1200)

Preloaded

Windows 10 Pro 64-bit
Windows 10 Home 64-bit
Ubuntu 20.04 LTS (configuration specific)

Supported

Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.3

Slots

Up to 2 SODIMMs

Channels

Supports up to 2 SODIMM Sockets, 2 Channels

Type

260-Pin, 3200MHz non-ECC SODIMM

ECC Support

No

Speed

Up to 3200MHz

Max DIMM Size

32GB DDR4 SODIMM

Max System Memory

64GB

PCIe

2 x M.2 PCIe Connectors, Gen 4 Onboard

Integrated Graphics

Intel Integrated UHD Graphics 750

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x8 Gen 3 Routed From CPU

USB

2 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x USB 3.2 Gen 1 Type-A 5Gb/s
1 x USB 3.2 Gen 2 Type-C 10Gb/s

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

USB

2 x USB 3.2 Gen 2 Type-A 10Gb/s
2 x USB 3.2 Gen 1 Type-A 5Gb/s

DisplayPort

1 x Standard
Optional 1 x Rear Port

HDMI

1 x Standard
Optional 1 x Rear Port

VGA Port

Optional 1 x Rear Port

Serial Port

Optional 2 x Rear Port

Ethernet

1 x 1GbE – RJ45

Optional USB Adapter

Optional Single Type-C + DP Port

Optional Network Adapter

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Vendor

Intel Jacksonville I219LM

Speeds

10/100/1000Mbps

Functions

PXE, ASF, WoL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Vendor

Realtek

Type

Integrated Audio

Internal Speaker

Yes

Connectors

Mic + Headphone combo jack

Chipset

Realtek ALC233VB

Number of Channels

2 Channels

Number of Bits/Audio Resolution

2 Channels of DAC support 24-bit PCM format
2 Channels of ADC support 16-bit PCM format

Temp Sensors

Ambient Sensor
VR Sensor
M.2 Sensor

Fans

1 x CPU Fans

Power Supply

170W

230W

Power Efficiency

89% Efficient @ 50% Load

Operating Voltage Range

100 – 240V

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

2.5A

3.5A

Graphics

No

Power Supply Fan

No

ENERGY STAR® Qualified (config dependent)

Yes

Aux Power Drop

No

Vendor

AMI

Self-Healing BIOS

Yes

Color

Raven Black

PSU

230W Power Brick (Chicony, A18-230P1A)
Dimensions: 200*100*25.4mm
Weight: 878.8g

Slim 170W Power Brick (Delta, ADP-170CB)
Dimensions: 150*77*22mm
Weight: 457g

Thermal Solutions

One System Fan Standard

Dimensions

36.5mm/1.437″ H
182.9mm/7.2″ D
179mm/7.047″ W

Weight

1.25kg / 2.756lbs

Height (mm/in)

179mm / 7″

Width (mm/in)

37mm / 1.5″

Depth (mm)

182.9mm / 7.2″

Weight (kgs/lbs)

1.4kg / 3lbs

TPM

Infineon SLB9670, FW 7.85, TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 14.x)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Optional via External ODD Box

Hard Drives

Tool-less

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min
Operating Vibration:
Random,0.27G at 5-500 Hz, 0.5 octave/min
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 1 octave/min

Shock

Operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)
Non-operating Shock: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)

Board Size

6.75″ x 6.89″ (171.5mm x 175mm)

Layout

Custom ATX

Processor Support

Intel Rocket Lake Core

Socket Type

Socket-H4 (LGA 1200)

Memory Support

DDR4 up to 3200MHz SODIMM Memory

Voltage Regulator

65W TDP Capable

Chipset (PCH)

Intel Q570 Chipset

Flash

32MB

Super I/O

Nuvoton NCT6692D

Clock

Intel Native isCLK

Audio

Realtek ALC233VB Codec

Ethernet

Intel Jacksonville I219LM

Processor Level

Intel Rocket Lake Core

Processor

i9-11900
i7- 11700
i5-11600
i5-11500
i5-11400
i3-10325
i3-10305
i3-10105
i9-11900T
i7-11700T
i5-11600T
i5-11500T
i5-11400T
i3-10305T
i3-10105T

Memory Type

SODIMM 3200 MHz

Memory

4GB 3200MHz DDR4 SDRAM SODIMM
8GB 3200MHz DDR4 SDRAM SODIMM
16GB 3200MHz DDR4 SDRAM SODIMM
32GB 3200MHz DDR4 SDRAM SODIMM

M.2 PCIe Solid State Drive (SSD)

256GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL
2048GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

DVD-ROM Drive

Optional via External ODD Box – Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Optional via External ODD Box – Slim DVD Burner/CD-RW Drive

Keyboard

Traditional USB Keyboard
Calliope Wireless Keyboard

Pointing Devices

Calliope USB Mouse
Calliope Wireless Mouse
Fingerprint USB Mouse

Network

Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Thunderbolt

Rear Thunderbolt PCIe Adapter

WiFi Cards

Intel PCIe WiFi Card With BT External Antenna Kit (Intel AX201 vPro)
Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non-vPro)
Intel PCIe WiFi Card With BT External Antenna Kit (Intel 9560 non-vPro)
Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RTL8822CE non-vPro)

CPU

Intel Core i9-11900

Intel Core i7-11700

Intel Core i5-11600

Intel Core i5-11500

Intel Core i5-11400

# of Cores

8c

6c

# of Threads

16

12

Processor Base Frequency

2.5GHz

2.8GHz

2.7GHz

2.6GHz

Max Turbo Frequency

5.2GHz

4.9GHz

4.8GHz

4.6GHz

4.4GHz

Cache

16M

12M

TDP

65W

CPU

Intel Core i3-10325

Intel Core i3-10305

Intel Core i3-10105

Intel i9-11900T

Intel i7-11700T

# of Cores

4c

8c

# of Threads

8

16

Processor Base Frequency

3.9GHz

3.8GHz

3.7GHz

1.5GHz

1.4GHz

Max Turbo Frequency

4.7GHz

4.5GHz

4.4GHz

4.9GHz

4.6GHz

Cache

8M

6M

16M

TDP

65W

35W

CPU

Intel i5-11600T

Intel i5-11500T

Intel i5-11400T

Intel i3-10305T

Intel i3-10105T

# of Cores

6c

4c

# of Threads

12

8

Processor Base Frequency

1.7GHz

1.5GHz

1.3GHz

3.0GHz

Max Turbo Frequency

4.1GHz

3.9GHz

3.7GHz

4.0Ghz

3.9GHz

Cache

12M

8M

6M

TDP

35W

Disclaimers

Drive

NVMe 2280 M.2 256GB PCIe SSD (OPAL)

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

22x80x2.38mm

Interface Type

PCIe Gen 4×4

Power Active (AVG)

5.8W

Power Idle

35mW

Typical Sequential Read

5000 MB/s

6000 MB/s

6400 MB/s

Typical Sequential Write

1600 MB/s

3200 MB/s

3800 MB/s

5000 MB/s

Burst Random Read (4K Queue Depth 32/8 thread);

250K IOPS

500K IOPS

550K IOPS

Burst Random Write (4K Queue Depth 32/8 thread)

200K IOPS

370K IOPS

400K IOPS

Operating Temperature Range

0 to 70°C

Endurance Rating (Lifetime Writes)

85 TB

150 TB

300 TB

600 TB

Mean Time Between Failures (MTBF)

2.0M POH

Hardware Encryption

AES 256 bit

Disclaimers

HDD Controllers

PCI Bus

PCI Modes

Data Transfer Rates

Disclaimers

Description

9mm Slim DVD ROM Drive (SATA)- Win10

9mm Slim DVD Burner/CD-RW Drive (SATA)- No OS/Linux

Interface Type

SATA 1.5 Gb/s

Dimensions

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm（Without Bezel-W x H x D)

Disc Capacity

NA

Type

DVDROM

DVDWriter

External Dimensions

NA

Speed

NA

Bay Type

9.0mm Tray

Color

Business Black or without bezel

Removable

No

Internal Buffer Size

0.5MB Min

Writes

NA

8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW

Reads

8XDVD-ROM / 24XCD-ROM

Source

DC Power 5V

DC Power Requirements

+5V±5%

DC Current

Max 2.5A@5v

Operating Systems Supported

All Windows OS

Temperature

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Relative Humidity

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Maximum Wet Bulb Temperature

Disclaimers

Type

Intel® UHD Graphics 750

Intel UHD Graphics 630

Display Interface

1x DP 1.2, 1x HDMI 2.0

1x DP 1.2, 1x HDMI 1.4

Video Resolution (max)

4096×2304 @ 60Hz (DP) ,4096×2160@60Hz (HDMI)

4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)

Disclaimers

Adapter

Quadro T600

Quadro P1000

NNVIDIA T1000 (miniDP x4) – 4GB GDDR6 Tiny LP

Bus Interface

PCI Express 3.0 ×8

PCIe 3.0 x16

PCI Express 3.0 ×8

Display Interface

Four mini-DisplayPort connectors

4 x mDP 1.4

Four mini-DisplayPort connectors

Graphics Chipset

TU117-850

Pascal

TU117-875

Memory Clock Frequency (MHz)

5001MHz

1253MHz

5001MHz

Memory Size

4GB

4GB GDDR5

4GB

Memory Interface

128bit

128-bit

128bit

Memory Bandwidth

Up to 160GB/s

Up to 82GB/s

32.4 Gbps

GPU Cores

640

CUDA Cores: 640

896

GPU Core Frequency (MHz)

Base:735 MHz
Boost:2100 MHz

1266MHz

Base:1065 MHz
Boost:1395 MHz
Max Boost:2100 MHz

Maximum Power Consumption

40W

47W

50W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

DisplayPort 1.4a
Maximum pixel clock: 2660M Pixels per second
Maximum bandwidth: 32.4 Gbps
Example of maximum resolutions with CVT-RB timings:
•7680 × 4320 × 24 bpp at 120 Hz
•7680 × 4320 × 24 bpp at 60 Hz
•5120 × 2880 × 24 bpp at 60 Hz
HDMI™ 2.0b
Maximum resolution:
•7680 × 4320 × 24 bpp at 30 Hz
Simultaneous display support
Up to four simultaneous displays

Thermal Solution

Active

Ultra-quiet Active Fansink

Dimension

2.713 inches × 6.137 inches, single-slot

2.713” H x 5.7” L
Single Slot, Low Profile

2.713 inches × 6.137 inches, single-slot

Disclaimers

Card

Intel Jefferson Peak 2 9560 2*2ac+BT5.0 PCIE Non-vPro M.2 Module (CNVi)

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)

Foxconn RTL8822CE 2*2ac+BT5.0 PCIE M.2 WLAN module

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Supplier PN

9560.NGWG.NV MM# 957715

AX201.NGWG MM# 985841

T99H152.00

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

Data Rates Supported

5G/2.4G WIFI

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

Controller Details

Coming Soon

Intel Ethernet Controller I350

Intel Ethernet Controller I351

Controller Bus Architecture

PCIe Gen3

PCIe 2.1 (5GT/s)

Data Transfer Mode

Wireless +BT

Ethernet

Power Consumption

Coming Soon

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

IEEE Standards Compliance

802.11 abgn+acR2 MIMO 2X2 +MU-MIMO

802.11 abgn+acR2 +ax MIMO 2X2

802.11a/b/g/n/ac

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

UEFI boot

Core boot
UEFI boot

Coming Soon

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

Supported

Coming Soon

Supported

Network Transfer Rate

Coming Soon

1,000Mbps Full Duplex

Operating System Driver Support

Windows 8.1, Windows 10, Linux, Chrome

Windows 10, Linux, Chrome

Windows 10

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Manageability

Coming Soon

Supported

Manageability Capabilities Alerting

Coming Soon

Supported

TDP

Coming Soon

Firmware Based Thermal Management

Operating Temperature Range

0°C – 80°C

0°C – 70°C

0°C to 55°C (32°F to 131°F)

# of Ports

Coming Soon

2

4

Data Rate Per Port

Coming Soon

10/100/1000Mbps (copper), 1000Mbps (fiber)

System Interface Type

PCIe Gen3 x4

PCIe Gen 2.1

NC Sideband Interface

Coming Soon

Not Available

Jumbo Frames Supported

Coming Soon

Yes

1000Base-T

Coming Soon

Yes

IEEE 1588

Coming Soon

Supported

Supported Under vPro

Not Available

Yes

Not Available

Disclaimers

Model

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)

Intel Jefferson Peak 2 9560 2*2ac+BT5.0 PCIE Non-vPro M.2 Module (CNVi)

Foxconn RTL8822CE 2*2ac+BT5.0 PCIE M.2 WLAN module

Connector

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

Coming Soon

Website

i350 T2

i350 T4

Coming Soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.11ax* Auto-negotiaton

IEEE* 802.11ac* Auto-negotiaton

Intel® vPro™

Not Available

Coming Soon

Intel® Standard Manageablity

Supported

Coming Soon

Power Optimizer Platform Low-power Management Systems

Supported

Coming Soon

Energy Efficient Ethernet

Supported

Coming Soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Receive Side Scaling

Supported

Coming Soon

Dual Tx and Rx Queues

Yes

Coming Soon

Jumbo Frames (up to 9KB)

Supported

Coming Soon

Teaming

Supported

Coming Soon

Wake from Deep Sx

Supported

Coming Soon

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows 10, Linux, Chrome

Windows 8.1, Windows 10, Linux, Chrome

Windows 10

Network Proxy/ARP Support

Supported

Coming Soon

Disclaimers

WMI Support

Compliant with Microsoft WBEM and the DMTF common information model

ROM-Based Setup Utility (F1)

System configuration setup program (text/graphic interface) available at power-on with F1 key

Bootblock Recovery

Recovers system BIOS if the flash ROM is corrupted

Replicated Setup

Saves system configuration settings to a file that can then be used to replicate the settings to other systems

Boot Control

Boot control available through ROM-based setup utility or with F12 key at power-on

Memory Change Alert

Power-on error message in the event of a decrease in system memory

Thermal Alert

Power-on error message in the event of a fan failure

Asset Tag

Supports ability to set SMBIOS type 2 baseboard asset tag field

System/Emergency ROM Flash Recovery with Video

Supports process to recover the system BIOS if the flash ROM is corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from a remote location to provide maintenance

Quick Resume Time

Supports low power S3 (suspend to RAM) and prompt resume times

ROM Revision Level

System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup

Keyboard-less Operation

System can be booted without a keyboard

Per-port Control

Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface

Adaptive Cooling

Offers multiple settings for fan control ranging between better performance and better acoustics

Security

Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows system to be supported from a remote location

Intel(R) TXT

Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks

Memory Modes

Supports mirroring, lock step, and sparing memory modes

Windows 10 Ready

Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification v4.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cmÂ²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3,MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

LWAd(bels) Idle

3.1

LWAd(bels) Oper

3.7

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification

9.0

Table of Contents

SECTION I: Platform Overview

CPU

Operating Systems

Memory

Storage

Video

Front I/O

Rear I/O

Ethernet

Audio

Thermal

Power Specifications

BIOS

Chassis Information

Packaging Dimensions

Security & Serviceability

Operating Environment

SECTION II: Platform Detail

Motherboard Core

Supported Components

Storage

Optical Drive/Removable Media

Keyboard and Pointing Devices

PCIe Adapters

SECTION III: Supported Component Detail

CPU Specifications Part 1

CPU Specifications Part 2

CPU Specifications Part 3

Solid State Storage Specifications

Optical Drive Specifications

Integrated Graphics Adapter

Discrete Graphics Adapter

Ethernet Specifications Group 1 Part 1

Ethernet Specifications Group 1 Part 2

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

Industry Standard Specification Support

Social and Environmental Responsibility

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Network and Labeling

Regulations & Standards

Environmentals