Version: 2.0 | 06/10/2024
Product Name
P340 Tiny
Product Display Name
ThinkStation P340 Tiny
Information Date
1-Sep-22
Hardware Maintenance Manual
Drivers & Software
Available Whitepapers
Description
Innovative, Intelligent, and Inspiring: Go big with the P340 Tiny. The industry’s smallest workstation, at less than one liter in total volume, offers uncompromising performance in a form factor that is 96% smaller than a traditional desktop. Display it on your desk, mount it behind your display, or carry it with you between locations while you experience the ultimate flexibility with a system that focuses on power, functionality, and configurability. Perfect for finance, higher education, architecture and engineering, and more, the P340 Tiny supports the fastest CPU, memory, and storage on the market, passes 18 MIL-STD tests8 and features an optional dust filter for the ultimate in robust computing.
Processor Support
Intel Comet Lake Core
Socket Type
Socket-H4 (LGA 1200)
Preloaded
Windows 10 Pro 64-bit
Windows 10 Home 64-bit
Ubuntu 20.04 LTS (configuration specific)
Supported
Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.2
Slots
Up to 2 SODIMMs
Channels
Supports up to 2 SODIMM Sockets, 2 Channels
Type
260-Pin, 2933MHz non-ECC SODIMM
ECC Support
No
Speed
Up to 2933MHz
Max DIMM Size
32GB DDR4 SODIMM
Max System Memory
64GB
Total Bays/Size
1 x 2.5″
PCIe
2 x M.2 PCIe Connectors, Gen 3 Onboard
Disclaimers
Additional parts/enclosures may be required for some configurations
Integrated Graphics
Intel Integrated UHD Graphics 630
Discrete Graphics
PCIe Add-In-Card, Details in Section Below
Multi-GPU Support
Yes
Type
PCIe Add-In-Card
Bus Interface
PCIe x8 Gen 3 Routed From CPU
USB
1 x USB 3.2 Gen 2 Type-A
1 x USB 3.2 Gen 1 Type-C
Audio
1 x Combo Audio/Microphone Jack (3.5mm)
USB
2 x USB 3.2 Gen 2 Type-A
2 x USB 3.2 Gen 1 Type-A
DisplayPort
1 x Standard
Optional 1 x Rear Port
HDMI
1 x Standard
Optional 1 x Rear Port
VGA Port
Optional 1 x Rear Port
Serial Port
Optional 2 x Rear Port
Ethernet
1 x 1GbE – RJ45
Optional USB Adapter
Single Type-C + DP Port
Optional Network Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Vendor
Intel Jacksonville I219LM
Speeds
10/100/1000Mbps
Functions
PXE, ASF, WoL, Jumbo Frames, Teaming
Connectors
1 x RJ45
Vendor
Realtek
Type
Integrated Audio
Internal Speaker
Yes
Connectors
Mic + Headphone combo jack
Chipset
ALC233VB
Number of Channels
2 Channels
Number of Bits/Audio Resolution
2 Channels of DAC support 24-bit PCM format
Temp Sensors
Ambient Sensor
VR Sensor
M.2 Sensor
Fans
1 x CPU Fans
Power Supply
170W/230W
Power Efficiency
89% Efficient @ 50% Load
Operating Voltage Range
100 – 240V
Rated Voltage Range
90-264VAC
Rated Line Frequency
47Hz / 63Hz
Operating Line Frequency Range
50Hz / 60Hz
Rated Input Current
6.75A
Graphics
No
Power Supply Fan
No
ENERGY STAR® Qualified (config dependent)
Yes
Aux Power Drop
No
Vendor
AMI
Color
Raven Black
PSU
230W Power Brick (Chicony, A18-230P1A)
Dimensions: 200*100*25.4mm
Weight: 878.8g
170W Power Brick (Delta, ADP-170CB)
Dimensions: 155*76*30mm
Weight: 586.7g
Thermal Solutions
One System Fan Standard
Dimensions
179mm/7.047″ H
182.9mm/7.2″ D
36.5mm/1.437″ W
Weight
1.32kg / 2.91lbs
Height (mm/in)
179mm / 7″
Width (mm/in)
37mm / 1.5″
Depth (mm)
182.9mm / 7.2″
Weight (kgs/lbs)
1.4kg / 3lbs
TPM
Infineon SLB9670, FW 7.85, TPM 2.0
Asset ID
Yes, 1024 x 8bit
vPro
Intel vPro for WS (AMT 14.X)
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
No
Boot Sequence Control
Yes
Padlock Support
No
Boot without keyboard and/or mouse
Yes
Access Panel
Tool-less Side Cover Removal
Hard Drives
Tool-less
Expansion Cards
Retained With Screws
Processor Socket
Tool-less
Color coded User Touch Points
Yes
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained With Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Customer Support Center
Air Temperature
Operating: 5⁰C to 35⁰C (41⁰F to 95⁰F)
Storage
Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 40⁰C (14⁰F to 104⁰F) Without Carton
Humidity
Relative Humidity Operating: 10% to 90% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
Altitude
Operating: 0m to 3048m (0ft to 10000ft)
Storage: 0m to 12192m (0ft to 40000ft)
Vibration
Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock
Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 45G, 11ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time
Board Size
6.75″ x 6.89″ (171.5mm x 175mm)
Layout
Custom ATX
Processor Support
Intel Comet Lake Core
Socket Type
Socket-H4 (LGA 1200)
Memory Support
DDR4 up to 2933MHz SODIMM Memory
Voltage Regulator
65W TDP Capable
Chipset (PCH)
Intel Q470 Chipset
Flash
32MB
Super I/O
Nuvoton NCT6686D-L
Clock
Intel Native isCLK
Audio
Realtek ALC233VB Codec
Ethernet
Intel Jacksonville I219LM
Processor Level
Intel Comet Lake Core
Processor
i9-10900
i7-10700
i5-10600
i5-10500
i5-10400
i3-10320
i3-10300
i3-10100
i9-10900T
i7-10700T
i5-10600T
i5-10500T
i5-10400T
i3-10300T
i3-10100T
Memory Type
SODIMM 2933 MHz
Memory
4GB 2933MHz DDR4 SDRAM SODIMM
8GB 2933MHz DDR4 SDRAM SODIMM
16GB 2933MHz DDR4 SDRAM SODIMM
32GB 2933MHz DDR4 SDRAM SODIMM
M.2 PCIe Solid State Drive (SSD)
256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
Notes
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.
DVD-ROM Drive
Slim DVD-ROM Drive
DVD Burner/CD-RW Drive
Slim DVD Burner/CD-RW Drive
Keyboard
Traditional USB Keyboard
Calliope Wireless Keyboard
Pointing Devices
Calliope USB Mouse
Calliope Wireless Mouse
Fingerprint USB Mouse
Network
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Thunderbolt
Rear Thunderbolt PCIe Adapter
WiFi Cards
Intel PCIe WiFi Card With BT External Antenna Kit (Intel AX201 vPro)
Intel PCIe WiFi Card With BT External Antenna Kit (Intel 9560 non-vPro)
Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RTL8822CE non-vPro)
CPU
Intel i3-10320
Intel i3-10100
Intel i3-10300
Intel i5-10400
Intel i5-10500
# of Cores
4c
4c
4c
6c
6c
# of Threads
8
8
8
12
12
Processor Base Frequency
3.8GHz
3.6GHz
3.7GHz
2.9GHz
3.1GHz
Max Turbo Frequency
NA
NA
NA
NA
NA
Cache
8M
8M
8M
12M
12M
TDP
65W
65W
65W
65W
65W
CPU
Intel i5-10600
Intel i7-10700
Intel i9-10900
Intel i3-10100T
Intel i3-10300T
# of Cores
6c
8c
10c
4c
4c
# of Threads
12
16
20
8
8
Processor Base Frequency
3.3GHz
2.9GHz
2.8GHz
3.0GHz
3.0GHz
Max Turbo Frequency
NA
4.8GHz
5.1GHz
NA
NA
Cache
12M
16M
20M
8M
8M
TDP
65W
65W
65W
35W
35W
CPU
Intel i5-10400T
Intel i5-10500T
Intel i5-10600T
Intel i7-10700T
Intel i9-10900T
# of Cores
6c
6c
6c
8c
10c
# of Threads
12
12
12
16
20
Processor Base Frequency
2.0GHz
2.3GHz
2.4GHz
2.0GHz
1.9GHz
Max Turbo Frequency
NA
NA
NA
4.5Ghz
4.6GHz
Cache
12M
12M
12M
16M
20M
TDP
35W
35W
35W
35W
35W
Drive
NVMe 2280 M.2 256GB PCIe SSD (OPAL)
NVMe 2280 M.2 512GB PCIe SSD (OPAL)
NVMe 2280 M.2 1TB PCIe SSD (OPAL)
NVMe 2280 M.2 2TB PCIe SSD (OPAL)
Dimensions Millimeters (W x D x H)
22 x 80 x 3
22 x 80 x 3
22 x 80 x 3
22 x 80 x 3
Interface Type
PCIe Gen 3×4
PCIe Gen 3×4
PCIe Gen 3×4
PCIe Gen 3×4
Power Active (AVG)
5.0W
5.0W
5.0W
5.0W
Power Idle
50 mW
50 mW
50 mW
50 mW
Typical Sequential Read
3000 MB/s
3100 MB/s
3200 MB/s
3200 MB/s
Typical Sequential Write
1600 MB/s
2700 MB/s
2900 MB/s
2700 MB/s
Operating Temperature Range
0 to 55°C
0 to 55°C
0 to 55°C
0 to 55°C
Endurance Rating (Lifetime Writes)
85 TB
150 TB
300 TB
600 TB
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
2.0M POH
2.0M POH
Hardware Encryption
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
Disclaimers
SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Description
9mm Slim DVD ROM Drive (SATA)- Win10
9mm Slim DVD Burner/CD-RW Drive (SATA)- No OS/Linux
Interface Type
SATA 1.5 Gb/s
SATA 1.5 Gb/s
Dimensions
128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)
128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)
Disc Capacity
NA
NA
Type
DVDROM
DVDWriter
External Dimensions
NA
NA
Speed
NA
NA
Bay Type
9.0mm Tray
9.0mm Tray
Color
Business Black or without bezel
Business Black or without bezel
Removable
No
No
Internal Buffer Size
0.5MB Min
0.5MB Min
Writes
NA
8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW
Reads
8XDVD-ROM / 24XCD-ROM
8XDVD-ROM / 24XCD-ROM
Source
DC Power 5V
DC Power 5V
DC Power Requirements
+5V±5%
+5V±5%
DC Current
Max 2.5A@5v
Max 2.5A@5v
Operating Systems Supported
All Windows OS
All Windows OS
Temperature
Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC
Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC
Relative Humidity
Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)
Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)
Type
Intel UHD Graphics 630
Display Interface
1 x DP 1.2, 1 x HDMI 1.4
Video Resolution (max)
4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)
Adapter
Quadro P620
Quadro P1000
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
Display Interface
4 x mDP 1.4
4 x mDP 1.4
Graphics Chipset
Pascal
Pascal
Memory Clock Frequency (MHz)
1252MHz
1253MHz
Memory Size
2GB GDDR5
4GB GDDR5
Memory Interface
128-bit
128-bit
Memory Bandwidth
Up to 80GB/s
Up to 82GB/s
GPU Cores
CUDA Cores: 512
CUDA Cores: 640
GPU Core Frequency (MHz)
1266MHz
1266MHz
Maximum Power Consumption
40W
47W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Dimension
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
Card
Intel Jefferson Peak 2 9560 2*2ac+BT5.0 PCIE Non-vPro M.2 Module (CNVi)
Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)
Foxconn RTL8822CE 2*2ac+BT5.0 PCIE M.2 WLAN module
Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)
Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)
Supplier PN
9560.NGWG.NV MM# 957715
AX201.NGWG MM# 985841
T99H152.00
I350T2G1P20, MM# 928941
I350T4G1P20, MM# 928942
Data Rates Supported
5G/2.4G WIFI
5G/2.4G WIFI
5G/2.4G WIFI
10/100/1000Mbps (Copper), 1000Mbps (Fiber)
10/100/1000Mbps (Copper), 1000Mbps (Fiber)
Controller Details
Coming Soon
Coming Soon
Coming Soon
Intel Ethernet Controller I350
Intel Ethernet Controller I351
Controller Bus Architecture
PCIe Gen3
PCIe Gen3
PCIe Gen3
PCIe 2.1 (5GT/s)
PCIe 2.1 (5GT/s)
Data Transfer Mode
Wireless +BT
Wireless +BT
Wireless +BT
Ethernet
Ethernet
Power Consumption
Coming Soon
Coming Soon
Coming Soon
Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W
Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W
IEEE Standards Compliance
802.11 abgn+acR2 MIMO 2X2 +MU-MIMO
802.11 abgn+acR2 +ax MIMO 2X2
802.11a/b/g/n/ac
IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T
IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T
Boot ROM Support
UEFI boot
Core boot
UEFI boot
Coming Soon
PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI
PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI
Network Transfer Mode (Full/Half Duplex)
Supported
Supported
Coming Soon
Supported
Supported
Network Transfer Rate
Coming Soon
Coming Soon
Coming Soon
1,000Mbps Full Duplex
1,000Mbps Full Duplex
Operating System Driver Support
Windows 8.1, Windows 10, Linux, Chrome
Windows 10, Linux, Chrome
Windows 10
Windows 7/8/10, Linux, Free BSD, XEN,Vmware
Windows 7/8/10, Linux, Free BSD, XEN,Vmware
Manageability
Coming Soon
Coming Soon
Coming Soon
Supported
Supported
Manageability Capabilities Alerting
Coming Soon
Coming Soon
Coming Soon
Supported
Supported
TDP
Coming Soon
Coming Soon
Coming Soon
Firmware Based Thermal Management
Firmware Based Thermal Management
Operating Temperature Range
0°C – 80°C
0°C – 80°C
0°C – 70°C
0°C to 55°C (32°F to 131°F)
0°C to 55°C (32°F to 131°F)
# of Ports
Coming Soon
Coming Soon
Coming Soon
2
4
Data Rate Per Port
Coming Soon
Coming Soon
Coming Soon
10/100/1000Mbps (copper), 1000Mbps (fiber)
10/100/1000Mbps (copper), 1000Mbps (fiber)
System Interface Type
PCIe Gen3 x4
PCIe Gen3 x4
PCIe Gen3 x4
PCIe Gen 2.1
PCIe Gen 2.1
NC Sideband Interface
Coming Soon
Coming Soon
Coming Soon
Not Available
Not Available
Jumbo Frames Supported
Coming Soon
Coming Soon
Coming Soon
Yes
Yes
1000Base-T
Coming Soon
Coming Soon
Coming Soon
Yes
Yes
IEEE 1588
Coming Soon
Coming Soon
Coming Soon
Supported
Supported
Supported Under vPro
Not Available
Yes
Not Available
Not Available
Not Available
Model
Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)
Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)
Intel Wi-Fi 6 AX201 2*2ax+BT5.0 vPro PCIE M.2 2230 Module (CNVi)
Intel Jefferson Peak 2 9560 2*2ac+BT5.0 PCIE Non-vPro M.2 Module (CNVi)
Foxconn RTL8822CE 2*2ac+BT5.0 PCIE M.2 WLAN module
Connector
2 x Ports RJ-45 Copper
4 x Ports RJ-45 Copper
Coming Soon
Coming Soon
Coming Soon
Website
i350 T2
i350 T4
Coming Soon
Coming Soon
Coming Soon
Auto-Negotiation
IEEE* 802.3* Auto-negotiaton
IEEE* 802.3* Auto-negotiaton
IEEE* 802.11ax* Auto-negotiaton
IEEE* 802.11ac* Auto-negotiaton
IEEE* 802.11ac* Auto-negotiaton
Intel® vPro™
Not Available
Not Available
Coming Soon
Coming Soon
Coming Soon
Intel® Stable Image Platform Program (SIPP)
Coming Soon
Coming Soon
Coming Soon
Intel® Standard Manageablity
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Power Optimizer Platform Low-power Management Systems
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Energy Efficient Ethernet
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)
Supported
Supported
Supported
Supported
Supported
Receive Side Scaling
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Dual Tx and Rx Queues
Yes
Yes
Coming Soon
Coming Soon
Coming Soon
Jumbo Frames (up to 9KB)
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Teaming
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Wake from Deep Sx
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
Server Operating System Support
Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware
Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware
Windows 10, Linux, Chrome
Windows 8.1, Windows 10, Linux, Chrome
Windows 10
Network Proxy/ARP Support
Supported
Supported
Coming Soon
Coming Soon
Coming Soon
WMI Support
Compliant with Microsoft WBEM and the DMTF common information model
ROM-Based Setup Utility (F1)
System configuration setup program (text/graphic interface) available at power-on with F1 key
Bootblock Recovery
Recovers system BIOS if the flash ROM is corrupted
Replicated Setup
Saves system configuration settings to a file that can then be used to replicate the settings to other systems
Boot Control
Boot control available through ROM-based setup utility or with F12 key at power-on
Memory Change Alert
Power-on error message in the event of a decrease in system memory
Thermal Alert
Power-on error message in the event of a fan failure
Asset Tag
Supports ability to set SMBIOS type 2 baseboard asset tag field
System/Emergency ROM Flash Recovery with Video
Supports process to recover the system BIOS if the flash ROM is corrupted
Remote Wakeup/Remote Shutdown
System admin can power on/off a client computer from a remote location to provide maintenance
Quick Resume Time
Supports low power S3 (suspend to RAM) and prompt resume times
ROM Revision Level
System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup
Keyboard-less Operation
System can be booted without a keyboard
Per-port Control
Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling
Offers multiple settings for fan control ranging between better performance and better acoustics
Security
Supervisor, user and power-on passwords can protect boot and ROM-based setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– BIOS Guard, Boot Guard Support
Intel(R) AMT (includes ASF 2.0)
Allows system to be supported from a remote location
Intel(R) TXT
Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks
Memory Modes
Supports mirroring, lock step, and sparing memory modes
Windows 10 Ready
Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec
UEFI
Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v6.2
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot
El Torito Bootable CD-Rom Format Specification, v1.0
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI
PCI Local Bus v3.0
PC Firmware Specification 3.1
PCI Express
PCI Express Base Specification v3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification v2.0
UHCI
Universal Host Controller Interface Design Guide, Revision v1.1
USB
Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2
SMBIOS
DMTF System Management Spec v3.2.1
XHCI
XHCI SPEC Revision v1.2
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/
Batteries
UN38.3,MSDS
Safety, EMC Connection to the Telephone Network and Labeling
Not applicable
LWAd(bels) Idle
3.1
LWAd(bels) Oper
3.7
Industry Standard Specifications
not applicable
Remote Manageability Software Solutions
not applicable
System Software Manager
Lenovo ThinkStation supports software management tools by Lenovo Vantage.
EMC & Safety
FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC
Energy Star
ENERGY STAR 8.0
EPEAT
EPEAT Certification Available on Select Models
ErP Lot-3 2013
Yes
Hazardous Substances
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week