P340 SFF

Version: 3.0 | 06/10/2024

Product Name

P340 SFF

Product Display Name

ThinkStation P340 Small Form Factor (SFF)

Information Date

2-Feb-21

Hardware Maintenance Manual

Drivers & Software

Available Whitepapers

SECTION I: Platform Overview

Description

Style, Performance, Reliability: Experience cutting edge performance, style, and Lenovo’s unmatched reliability in the P340 SFF, an entry level system perfect for Architecture, Education, and Healthcare. Cutting-edge storage and memory technologies offer a perfect complement to the latest CPU technology and high-end graphics options. And its robust usability, with tool-less component access, ThinkShield security suite, and comprehensive I/O and expansion capabilities make it ideal for both beginning and advanced users looking for a compact powerhouse.

CPU

Processor Support

Intel Comet Lake Xeon W-1200 Series/Core Series

Socket Type

Socket-H4 (LGA 1200)

Operating Systems

Preloaded

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Windows 10 Home 64-bit
Ubuntu 20.04 LTS (configuration specific)

Supported

Ubuntu 20.04 LTS
Red Hat Enterprise Linux 8.2

Memory

Slots

Up to 4 DIMMs

Channels

Supports up to 4 DIMM Sockets, 2 Channels

Type

288-Pin, 1866/2133/2400/2666/2933MHz ECC and non-ECC UDIMM

ECC Support

Yes, CPU Dependent

Speed

Up to 2933MHz

Max DIMM Size

32GB DDR4 UDIMM

Max System Memory

128GB

Storage

Total Bays/Size

1 x 3.5″
1 x 2.5″

SATA

4 x SATA Connectors, Gen 3

PCIe

2 x M.2 PCIe Connectors, Gen 3 Onboard
Additional M.2 NVMe Drives Supported by Single Adapters

Disclaimers

Additional parts/enclosures may be required for some configurations

Video

Integrated Graphics

Intel Integrated UHD Graphics 630

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slots

Slot 1

PCIe 3.0 x16, Half Height, Full Length, 75W, With Latch

Slot 2

PCIe 3.0 x1, Half Height, Half Length, 25W

Slot 3

PCIe 3.0 x4, Half Height, Half Length, 45W, With Latch (x16 Physically)

Front I/O

USB

2 x USB 3.2 Gen 2 Type-A
2 x USB 3.2 Gen 1 Type-A
1 x USB 3.2 Gen 1 Type-C

Audio

1 x Audio Jack (3.5mm)
1x Microphone Jack (3.5mm)

Media Card Reader

Optional: Front 3-in-1 Media Card Reader (USB 2.0)

Rear I/O

USB

2 x USB 2.0 Type-A
2 x USB 3.2 Type-A

Audio

1 x Rear (Line Out); Retaskable to 5.1

DisplayPort

2 x Standard (CPU dependent)
Optional 1 x Rear Port (CPU dependent)

HDMI

Optional 1 x Rear Port (CPU dependent)

Serial Port

1 x Standard
Optional 1 x Rear Port

Ethernet

1 x 1GbE – RJ45

PS/2

Optional 2 x PS/2

Parallel Port

Optional 1 x Rear Bracket

Optional USB Adapter

Dual Type-C ports USB 3.1
Dual Type-A ports USB 2.0

Optional Network Adapter

Bitland BN8E88 Single Port Gigabit Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-F2 Dual Port Fiber Adapter
Intel I350-T4 Quad Port Ethernet Adapter
Aquantia Single Port 10G Ethernet Adapter

Ethernet

Vendor

Intel Jacksonville I219LM

Speeds

10/100/1000Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Audio

Vendor

Realtek

Type

HD (5.1)

Internal Speaker

Yes

Connectors

2 x Front 3.5mm Jacks (Mic & Headphone) 1 x Rear 3.5mm Jacks (Line Out)

Chipset

ALC623-CG

Number of Channels

2 Channels (5.1 via driver selection)

Number of Bits/Audio Resolution

6 Channel DAC supports 16/20/24 bit PCM
2 Stereo ADC supports 16/20 bit PCM

Thermal

Temp Sensors

Ambient Sensor
VR Sensor
M.2 Sensor

Fans

1 x CPU Fans
1 x Front Fans (optional)
1 x Power Supply Fan (internal)
1 x ODD Bay Fans (optional)

Power Specifications

Power Supply

310W

380W

Power Efficiency

92% Efficient @ 50% Load

92% Efficient @ 50% Load

Main

C14

C14

Operating Voltage Range

100 – 240V

100 – 240V

Rated Voltage Range

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

4A

5A

Graphics

Not Available

Not Available

Power Supply Fan

Yes

Yes

ENERGY STAR® Qualified (config dependent)

Yes

Yes

80 PLUS Compliant

Yes

Yes

Built-in Self Test (BIST) LED

No

No

Aux Power Drop

No

No

BIOS

Vendor

AMI

Chassis Information

Color

Raven Black

PSU

380W and 310W Available, Autosensing, 80 PLUS Platinum Qualified

Thermal Solutions

Two System Fans Standard (1 front, 1 rear), One Fan per CPU, One PSU Fan

Dimensions

92.5mm/3.64″ H
309.7mm/12.19″ D
339.5mm/13.37″ W

Weight

5.65kg / 12.46lbs

Packaging Dimensions

Height (mm/in)

530mm / 20.87″

Width (mm/in)

395mm / 15.55″

Depth (mm)

195mm / 7.68″

Weight (kgs/lbs)

8.26kg / 18.21lbs

Security & Serviceability

TPM

Infineon SLB9670 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 14.X)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Tool-less

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 45G, 11ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time

SECTION II: Platform Detail

Board Size

10.51″ x 9.72″ (267mm x 247mm)

Layout

Custom ATX

Motherboard Core

Processor Support

Intel Comet Lake Xeon W-1200 Series/Core Series

Socket Type

Socket-H4 (LGA 1200)

Memory Support

DDR4 up to 2933MHz UDIMM Memory (ECC and non-ECC)

Voltage Regulator

125W TDP Capable

Chipset (PCH)

Intel W480 Chipset

Flash

32MB

Super I/O

Nuvoton NCT6686D-L

Clock

Intel Native isCLK

Audio

Realtek ALC623-CG Codec

Ethernet

Intel Jacksonville I219LM

Supported Components

Processor Level

Intel Comet Lake – Xeon

Intel Comet Lake – Core

Processor

W-1290
W-1270
W-1250

i9-10900
i7-10700
i5-10600
i5-10500
i5-10400
i3-10320
i3-10300
i3-10100

Memory Type

ECC UDIMMs – 2933MHz

non-ECC UDIMMs – 2933MHz

Memory

8GB DDR4 ECC UDIMM PC4-2933
16GB DDR4 ECC UDIMM PC4-2933
32GB DDR4 ECC UDIMM PC4-2933

4GB DDR4 non-ECC UDIMM PC4-2933
8GB DDR4 non-ECC UDIMM PC4-2933
16GB DDR4 non-ECC UDIMM PC4-2933
32GB DDR4 non-ECC UDIMM PC4-2933

Storage

3.5″ SATA Hard Disk Drive (HDD)

1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)

2.5″ SATA Hard Disk Drive (HDD)

1TB 2.5″ SATA HDD 7200rpm (FIPS certified)

2.5″ SATA Solid State Drive (SSD)

512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL

M.2 PCIe Solid State Drive (SSD)

256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, NON-OPAL
2048GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL

Intel Optane Storage Technology

16GB M.2 Optane Memory

RAID

RAID Levels and Requirements

Supported RAID 0/1

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.

Optical Drive/Removable Media

DVD-ROM Drive

Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Slim DVD Burner/CD-RW Drive

Blu-Ray Burner Drive

Slim Blu-Ray ODD DVD Burner

Media Card Reader Specifications

Optional Front 3-in-1 USB 2.0 Media Card Reader

Keyboard and Pointing Devices

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard
Traditional PS/2 Keyboard

Pointing Devices

Calliope USB Mouse
PS/2 Optical Mouse
Fingerprint USB Mouse

PCIe Adapters

Network

Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIe ASF

Thunderbolt

Rear Thunderbolt PCIe Adapter

USB

Rear Dual Port USB 2.0 PCIe Adapter

WiFi Cards

 Intel PCIe WiFi Card With BT External Antenna Kit (AX201)

PCIe to M.2 Adapter Card

PCIe x4 to M.2 Adapter (for NVMe SSD)

SECTION III: Supported Component Detail

CPU Specifications Part 1

CPU

Intel Xeon W-1290

Intel Xeon W-1270

Intel Xeon W-1250

Intel Core i9-10900

Intel Core i7-10700

# of Cores

10c

8c

6c

10c

8c

# of Threads

20

16

12

20

16

Processor Base Frequency

3.2GHz

3.4GHz

3.3GHz

2.8GHz

2.9GHz

Max Turbo Frequency

5.0GHz

4.9GHz

4.7GHz

5.1GHz

4.8GHz

Cache

20M

16M

12M

20M

16M

TDP

80W

80W

80W

65W

65W

CPU Specifications Part 2

CPU

Intel Core i5-10600

Intel Core i5-10500

Intel Core i5-10400

Intel Core i3-10320

Intel Core i3-10300

# of Cores

6c

6c

6c

4c

4c

# of Threads

12

12

12

8

8

Processor Base Frequency

3.3GHz

3.1GHz

2.9GHz

3.8GHz

3.7GHz

Max Turbo Frequency

NA

NA

NA

NA

NA

Cache

12M

12M

12M

8M

8M

TDP

65W

65W

65W

65W

65W

CPU Specifications Part 3

CPU

Intel Core i3-10100

# of Cores

4c

# of Threads

8

Processor Base Frequency

3.6GHz

Max Turbo Frequency

NA

Cache

8M

TDP

65W

HDD Specifications Part 1

Drive

1TB SATA – 7200rpm, 6Gb/s, 2.5″

1TB SATA – 7200rpm, 6Gb/s, 3.5″

1TB SATA – 7200rpm, 6Gb/s, 3.5″ Enterprise

2TB SATA – 7200rpm, 6Gb/s, 3.5″

4TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Not Available

Yes

Yes

Yes

Yes

2.5″ SATA Hard Disk Drive (HDD)

Yes

Not Available

Not Available

Not Available

Not Available

Connector

SATA

SATA

SATA

SATA

SATA

Transfer Rate (Gb/sec)

160MB/s OD Read

Average Data Rate, Read/Write 156MB/s

Average Data Rate, Read/Write 156MB/s

Sustained Data Transfer Rate 216-226MB/s

Spindle Speed (RPM)

7,200

7,200

7,200

7,200

7,200

Power Off to Spindle Stop (sec)

NA

NA

NA

NA

NA

DC Power to Drive Ready (sec)

3.5

<10.0

<17.0

<17.0

<17.0

Average Latency (msec)

4.2

4.16

4.16

4.16

4.16

Input (VDC)

5

5

5

5

5

Typical (Watts)

1.9

6.19

10.09

6.7

11.33

Idle (Watts)

0.7

4.6

4.86

4.5

5.45

Physical Dimensions

69.85mm x 100.34mm x 7mm

101.6mm x 146.99mm x 19.88mm

101.85mm x 147mm x 26.1mm

101.6mm x 146.99mm x 26.1mm

101.85mm x 147mm x 26.1mm

Weight (grams)

90

420

620

535

650

Operating (C) Ambient

0 to 60

0 to 60

5 to 60

0 to 60

5 to 60

Operating (C) Base Casting

60

60

60

60

60

Non-Operating (C) Ambient

(-40 to 70)

(-40 to 70)

(-40 to 70)

(-40 to 70)

(-40 to 70)

Gradient (C per Hour)

20

20

20

20

20

Operating (Gs @ 2ms)

400

70

Read 70 Gs / Write 40 Gs

80

Read 70 Gs / Write 40 Gs

Non-Operating (Gs @ 2ms)

1000

350

300

300

300

HDD Specifications Part 2

Drive

6TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Yes

2.5″ SATA Hard Disk Drive (HDD)

Not Available

Connector

SATA

Transfer Rate (Gb/sec)

Sustained Data Transfer Rate 216-226MB/s

Spindle Speed (RPM)

7,200

Power Off to Spindle Stop (sec)

NA

DC Power to Drive Ready (sec)

<17.0

Average Latency (msec)

4.16

Input (VDC)

5

Typical (Watts)

1318

Idle (Watts)

6.21

Physical Dimensions

101.85mm x 147mm x 26.1mm

Weight (grams)

716

Operating (C) Ambient

5 to 60

Operating (C) Base Casting

60

Non-Operating (C) Ambient

(-40 to 70)

Gradient (C per Hour)

20

Operating (Gs @ 2ms)

Read 70 Gs / Write 40 Gs

Non-Operating (Gs @ 2ms)

250

Solid State Storage Specifications Part 1

Drive

512GB SATA3 – SSD, 6Gb/s, 2.5″ Non-OPAL

512 GB SATA3 – SSD, 6Gb/s, 2.5″ OPAL

1024 GB SATA3 – SSD, 6Gb/s, 2.5″ OPAL

NVMe 2280 M.2 256GB PCIe SSD (OPAL)

NVMe 2280 M.2 512GB PCIe SSD (OPAL)

Dimensions Millimeters (W x D x H)

70 x 100 x 7.0

70 x 100 x 7.0

70 x 100 x 7.0

22 x 80 x 3

22 x 80 x 3

Interface Type

SATA-III

SATA-III

SATA-III

PCIe Gen 3×4

PCIe Gen 3×4

Power Active (AVG)

1.9W

1.9W

2.2W

5.0W

5.0W

Power Idle

50 mW

50 mW

50 mW

50 mW

50 mW

Typical Sequential Read

540 MB/s

540 MB/s

540 MB/s

3000 MB/s

3100 MB/s

Typical Sequential Write

500 MB/s

500 MB/s

500 MB/s

1600 MB/s

2700 MB/s

Operating Temperature Range

0 to 55°C

0 to 55°C

0 to 55°C

0 to 55°C

0 to 55°C

Endurance Rating (Lifetime Writes)

150 TB

150 TB

300 TB

85 TB

150 TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

2.0M POH

2.0M POH

Hardware Encryption

Not Available

AES 256 bit

AES 256 bit

AES 256 bit

AES 256 bit

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32.  Random measurements are with 4 threads and queue-depth 32.

Solid State Storage Specifications Part 1

Drive

NVMe 2280 M.2 1TB PCIe SSD (OPAL)

NVMe 2280 M.2 2TB PCIe SSD (OPAL)

NVMe 2280 M.2 1TB PCIe SSD (non-OPAL)

Dimensions Millimeters (W x D x H)

22 x 80 x 3

22 x 80 x 3

22 x 80 x 3

Interface Type

PCIe Gen 3×4

PCIe Gen 3×4

PCIe Gen 3×4

Power Active (AVG)

5.0W

5.0W

5.0W

Power Idle

50 mW

50 mW

50 mW

Typical Sequential Read

3200 MB/s

3200 MB/s

3000 MB/s

Typical Sequential Write

2900 MB/s

2700 MB/s

1600 MB/s

Operating Temperature Range

0 to 55°C

0 to 55°C

0 to 55°C

Endurance Rating (Lifetime Writes)

300 TB

600 TB

300 TB

Mean Time Between Failures (MTBF)

2.0M POH

2.0M POH

2.0M POH

Hardware Encryption

AES 256 bit

AES 256 bit

Not Available

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32.  Random measurements are with 4 threads and queue-depth 32.

Optical Drive Specifications Part 1

Description

9mm Slim DVD ROM Drive (SATA)- No OS/Linux

9mm Slim DVD ROM Drive (SATA)- Win10

9mm Slim DVD Burner/CD-RW Drive (SATA)- No OS/Linux

9mm Slim DVD Burner/CD-RW Drive (SATA)- Win10

9mm Slim Blu-Ray ODD DVD Burner (SATA)- No OS/Linux

Interface Type

SATA 1.5 Gb/s

SATA 1.5 Gb/s

SATA 1.5 Gb/s

SATA 1.5 Gb/s

SATA 1.5 Gb/s

Dimensions

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

Disc Capacity

NA

NA

NA

NA

NA

Type

DVDROM

DVDROM

DVDWriter

DVDWriter

BD Rambo

External Dimensions

NA

NA

NA

NA

NA

Speed

NA

NA

NA

NA

NA

Bay Type

9.0mm Tray

9.0mm Tray

9.0mm Tray

9.0mm Tray

9.0mm Tray

Color

Business Black or without bezel

Business Black or without bezel

Business Black or without bezel

Business Black or without bezel

Business Black or without bezel

Removable

No

No

No

No

No

Internal Buffer Size

0.5MB Min

0.5MB Min

0.5MB Min

0.5MB Min

4MB

Writes

NA

NA

8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW

8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW

6x BD-R / 2x BD-RE
8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
5XDVD-RAM
24XCD-R / 16XCD-RW

Reads

8XDVD-ROM / 24XCD-ROM

8XDVD-ROM / 24XCD-ROM

8XDVD-ROM / 24XCD-ROM

8XDVD-ROM / 24XCD-ROM

6x BD-ROM /8x DVD-ROM / 5x DVD-RAM / 24x CD-ROM

Source

DC Power 5V

DC Power 5V

DC Power 5V

DC Power 5V

DC Power 5V

DC Power Requirements

+5V±5%

+5V±5%

+5V±5%

+5V±5%

+5V±5% Ripple less than 100mVp-p

DC Current

Max 2.5A@5v

Max 2.5A@5v

Max 2.5A@5v

Max 2.5A@5v

Max 2A@5v

Operating Systems Supported

All Windows OS

All Windows OS

All Windows OS

All Windows OS

All Windows OS

Temperature

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Relative Humidity

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Optical Drive Specifications Part 2

Description

9mm Slim Blu-Ray ODD DVD Burner (SATA)- Win10

Interface Type

SATA 1.5 Gb/s

Dimensions

128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)

Disc Capacity

NA

Type

BD Rambo

External Dimensions

NA

Speed

NA

Bay Type

9.0mm Tray

Color

Business Black or without bezel

Removable

No

Internal Buffer Size

4MB

Writes

6x BD-R / 2x BD-RE
8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
5XDVD-RAM
24XCD-R / 16XCD-RW

Reads

6x BD-ROM /8x DVD-ROM / 5x DVD-RAM / 24x CD-ROM

Source

DC Power 5V

DC Power Requirements

+5V±5% Ripple less than 100mVp-p

DC Current

Max 2A@5v

Operating Systems Supported

All Windows OS

Temperature

Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC

Relative Humidity

Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)

Integrated Graphics Adapter

Type

Intel UHD Graphics 630

Display Interface

1x DP 1.2, 1x HDMI 1.4

Video Resolution (max)

4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)

Discrete Graphics Adapter

Adapter

Quadro P400

Quadro P620

Quadro P1000

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

Display Interface

3 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4

Graphics Chipset

Pascal

Pascal

Pascal

Memory Clock Frequency (MHz)

1003MHz

1252MHz

1253MHz

Memory Size

2GB GDDR5

2GB GDDR5

4GB GDDR5

Memory Interface

64-bit

128-bit

128-bit

Memory Bandwidth

Up to 32GB/s

Up to 80GB/s

Up to 82GB/s

GPU Cores

CUDA Cores: 256

CUDA Cores: 512

CUDA Cores: 640

GPU Core Frequency (MHz)

1228MHz

1266MHz

1266MHz

Maximum Power Consumption

30W

40W

47W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

3 x 4096×2160 @ 60Hz
1 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Dimension

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

Advanced Display

Not Available

Not Available

Not Available

SLI/NVLink Support

Not Available

Not Available

Not Available

Ethernet Specifications Group 1 Part 1

Card

Intel I210-T1 Single Port Gigabit Ethernet Adapter (Springville)

Intel I350-T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)

Intel I350-T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)

Bitland BN8E88 1000M PCIex1 noASF – FH/LP

Intel® I350-F2 Dual Ports PCIex4 Gigabit Ethernet Adapter

Supplier PN

I210T1, MM# 941033

I350T2G1P20, MM# 928941

I350T4G1P20, MM# 928942

1218-00934/1218-00933

Coming Soon

Data Rates Supported

10/100/1000Mbps copper

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

10M, 100M, and 1000M

10/100/1000Mbps (Fiber),

Controller Details

Intel® Ethernet Controller I210

Intel Ethernet Controller I350

Intel Ethernet Controller I351

REALTEK RTL8168E-VB-CG

Coming Soon

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

PCI Express 1.1 2.5GT/s

Coming Soon

Data Transfer Mode

Ethernet

Ethernet

Ethernet

Ethernet

Ethernet

Power Consumption

0.81W

Copper:
I350-T2 V2= 4.4W
Fiber:
I350-F2= 5.5W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

RTL8168E=0.53W

I350-F2= 5.5W

IEEE Standards Compliance

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.1P Layer 2 Priority Encoding
IEEE 802.1Q VLAN tagging
IEEE 802.3az Draft 3.2 (EEE)

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Boot ROM Support

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Supported

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Supported

Supported

Supported

Network Transfer Rate

1,000Mbps Full Duplex

1,000Mbps Full Duplex

1,000Mbps Full Duplex

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Operating System Driver Support

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Win10

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Manageability

Supported

Supported

Supported

Supported

Supported

Manageability Capabilities Alerting

Supported

Supported

Supported

Supported

Supported

TDP

Firmware Based Thermal Management

Firmware Based Thermal Management

Firmware Based Thermal Management

Not Available

Firmware Based Thermal Management

Operating Temperature Range

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

O ℃, 50 ℃ (32 ° F to 122 ° F)

0°C to 55°C (32°F to 131°F)

# of Ports

1

2

4

1

1

Data Rate Per Port

10/100/1000Mbps (copper)

10/100/1000Mbps (copper), 1000Mbps (fiber)

10/100/1000Mbps (copper), 1000Mbps (fiber)

10M, 100M, and 1000M

10/100/1000Mbps (fiber)

System Interface Type

PCIe Gen 2.1

PCIe Gen 2.1

PCIe Gen 2.1

PCI Express 1.1

PCIe Gen 2.1

NC Sideband Interface

Not Available

Not Available

Not Available

Not Available

Not Available

Jumbo Frames Supported

Yes

Yes

Yes

Yes

Yes

1000Base-T

Yes

Yes

Yes

Yes

Yes

MACsec IEEE 802.1 AE

Coming Soon

Coming Soon

Coming Soon

Coming Soon

Coming Soon

IEEE 1588

Supported

Supported

Supported

Not Available

Supported

Supported Under vPro

Not Available

Not Available

Not Available

Not Available

Not Available

Ethernet Specifications Group 1 Part 2

Model

i210-T1

I350-T2

I350-T4

Bitland BN8E88 1000M PCIex1 noASF – FH/LP

Intel® I350-F2 Dual Ports PCIex4 Gigabit Ethernet Adapter

Connector

RJ-45 Copper

2 x Ports RJ-45 Copper

4 x Ports RJ-45 Copper

1 Port RJ-45

LC Fiber Optic

Website

i210 T1

i350 T2

i350 T4

IC Datasheet

Coming Soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

Auto-Negotiation with Next Page capability

IEEE* 802.3* Auto-negotiaton

Intel® vPro™

Not Available

Not Available

Not Available

Not Available

Not Available

Intel® Stable Image Platform Program (SIPP)

Coming Soon

Coming Soon

Coming Soon

Not Available

Coming Soon

Intel® Standard Manageablity

Supported

Supported

Supported

Not Available

Supported

Power Optimizer Platform Low-power Management Systems

Supported

Supported

Supported

Supported

Supported

Energy Efficient Ethernet

Supported

Supported

Supported

Supported

Supported

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Supported

Supported

Receive Side Scaling

Supported

Supported

Supported

Supported

Supported

Dual Tx and Rx Queues

Yes

Yes

Yes

Not Available

Yes

Jumbo Frames (up to 9KB)

Supported

Supported

Supported

Supported

Supported

Teaming

Supported

Supported

Supported

Supported

Supported

Wake from Deep Sx

Supported

Supported

Supported

Supported

Supported

Server Operating System Support

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Network Proxy/ARP Support

Supported

Supported

Supported

Supported

Supported

Ethernet Specifications Group 2 Part 1

Card

Aquantia PCIex4 10GbE AQN-107 Gigabit Ethernet Adapter

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Supplier PN

AQN-107-124-SBL

Coming Soon

Data Rates Supported

10G/5G/2.5G/1G/100Mbps

Coming Soon

Controller Details

AQC107

Coming Soon

Controller Bus Architecture

PCIe Gen3

Coming Soon

Data Transfer Mode

Ethernet

Coming Soon

Power Consumption

Coming Soon

Coming Soon

IEEE Standards Compliance

IEEE802.3an
10GBASE-T/5GBASE-T/2.5GBASE-T/1000BASE-T/100BASE-TX

Coming Soon

Boot ROM Support

PXE boot
UEFI boot

Coming Soon

Network Transfer Mode (Full/Half Duplex)

Supported

Coming Soon

Network Transfer Rate

10Gbps Full Duplex

Coming Soon

Operating System Driver Support

Microsoft® Windows® 10, 8.1, 8, 7 (32/64-bit), and Linux 3.2. 3.10, 3.12,
4.2, and 4.4 drivers

Coming Soon

Manageability

Coming Soon

Coming Soon

Manageability Capabilities Alerting

Coming Soon

Coming Soon

TDP

Coming Soon

Coming Soon

Operating Temperature Range

0°C – 108°C

Coming Soon

# of Ports

1

Coming Soon

Data Rate Per Port

10G/5G/2.5G/1G/100Mbps

Coming Soon

System Interface Type

PCIe Gen3 x4

Coming Soon

NC Sideband Interface

Coming Soon

Coming Soon

Jumbo Frames Supported

Yes

Coming Soon

1000Base-T

Yes

Coming Soon

MACsec IEEE 802.1 AE

Supported

Coming Soon

IEEE 1588

Supported

Coming Soon

Supported Under vPro

Not Available

Coming Soon

Ethernet Specifications Group 2 Part 2

Model

Aquantia PCIex4 10GbE AQN-107 Gigabit Ethernet Adapter

2 x 2 AX WiFi with BT (M.2) vPro AX201-TWR/SFF

Connector

1xRJ45

Coming Soon

Website

Coming Soon

Coming Soon

Auto-Negotiation

IEEE* 802.3* Auto-negotiaton

Coming Soon

Intel® vPro™

Coming Soon

Coming Soon

Intel® Stable Image Platform Program (SIPP)

Coming Soon

Coming Soon

Intel® Standard Manageablity

Coming Soon

Coming Soon

Power Optimizer Platform Low-power Management Systems

Coming Soon

Coming Soon

Energy Efficient Ethernet

Supported

Coming Soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Coming Soon

Receive Side Scaling

Supported

Coming Soon

Dual Tx and Rx Queues

Coming Soon

Coming Soon

Jumbo Frames (up to 9KB)

Supported(Up to 16KB)

Coming Soon

Teaming

Coming Soon

Coming Soon

Wake from Deep Sx

Coming Soon

Coming Soon

Server Operating System Support

Microsoft® Windows® 10, 8.1, 8, 7 (32/64-bit), and Linux 3.2. 3.10, 3.12,
4.2, and 4.4 drivers

Coming Soon

Network Proxy/ARP Support

Supported

Coming Soon

Media Card Reader

Description

Media Card reader (3 in 1) TWR

Interface Type

USB2.0

Form Factor

USB 2.0 Mass Storage Device

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery with Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

Supervisor, SMP and Power-On Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock, BIOS Guard, Boot Guard

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.2

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
Universal Serial Bus v3.2

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

Batteries

UN38.3/ MSDS

Safety, EMC Connection to the Telephone Network and Labeling

Not applicable

Safety, EMC Connection to the Telephone Network and Labeling

Industry Standard Specifications

not applicable

Remote Manageability Software Solutions

not applicable

System Software Manager

Lenovo ThinkStation supports software management tools by Lenovo Vantage.

Regulations & Standards

EMC & Safety

FCC/IC
VCCI
BSMI
KC
RCM
TUV-GS
cTUVus
IEC60950-1&IEC62368 CB Report/Certificate
Saudi Arabia EQM
Kuwait KUCAS
China CCC Mark
Singapore PSB
South Africa SABS
Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC
Morocco-CM
Mexico-NOM
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
China SRRC
Indonesia-SDPPI
Malaysia-SIRIM
Philippines-NTC

Environmentals

Energy Star

ENERGY STAR 8.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

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