Lenovo ThinkStation: PCs & Tablets
P330 Tiny
Version: 2.0 | 06/10/2024
Product Name
P330 Tiny
Product Display Name
ThinkStation P330 Tiny
Information Date
29-Oct-19
Hardware Maintenance Manual
Drivers & Software
Available Whitepapers
Description
The world’s smallest workstation, empowering you for great things. Engineered to go where others can’t, the ThinkStation® P330 Tiny combines simple and efficient design with the professional power of a workstation.
Processor Support
Intel Coffee Lake Core
Socket Type
Socket-H4 (LGA 1151)
Preloaded
Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Ubuntu 18.04 LTS (configuration specific)
Ubuntu 16.04 LTS (configuration specific)
Supported
Windows 10 Home 64-bit
Ubuntu 18.04 LTS
Ubuntu 16.04 LTS
Red Hat Enterprise Linux 7.5
Slots
Up to 2 SODIMMs
Channels
Supports up to 2 SODIMM Sockets, 2 Channels
Type
260-Pin, 2400/2666MHz non-ECC SODIMM
ECC Support
No
Speed
Up to 2666MHz
Max DIMM Size
32GB DDR4 SODIMM
Max System Memory
64GB
Disclaimers
Total Bays/Size
1 x 2.5″
SATA
1 x SATA Connectors, Gen 3
PCIe
2 x M.2 PCIe Connector Onboard
Disclaimers
Additional parts/enclosures may be required for some configurations
Integrated Graphics
Intel Integrated UHD Graphics 630
Discrete Graphics
PCIe Add-In-Card, Details in Section Below
Multi-GPU Support
Yes
Type
PCIe Add-In-Card
Bus Interface
PCIe x8 Routed From CPU
USB
1 x USB 3.1 Gen 1 Type-A
1 x USB 3.1 Gen 1 Type-C
Audio
1 x Microphone Jack (3.5mm)
1 x Combo Audio/Microphone Jack (3.5mm)
USB
2 x USB 3.1 Gen 2 Type-A
2 x USB 3.1 Gen 1 Type-A
DisplayPort
1 x Standard
Optional 1 x Rear Port
HDMI
1 x Standard
Optional 1 x Rear Port
VGA Port
Optional 1 x Rear Port
Serial Port
Optional 2 x Rear Port
Ethernet
1 x 1GbE – RJ45
Optional USB Adapter
Single Type-C + DP Port
Dual USB 3.0 Gen 2 Type-A
Optional Network Adapter
Intel I350-T4 Dual Port Gigabit Ethernet Adapter
Vendor
Intel Jacksonville I219LM
Speeds
10/100/1000Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
1 x RJ45
Vendor
Realtek
Type
Integrated Audio
Internal Speaker
Yes
Connectors
1 x Rear 3.5mm Jacks (Line Out)
Chipset
ALC233VB
Number of Channels
2 Channels
Number of Bits/Audio Resolution
2 Stereo ADC Supports 16/20 bit PCM
Temp Sensors
Ambient Sensor
VR1 Sensor
PCIe Sensor
M.2 Sensor
Fans
1 x CPU Fans
Power Supply
135W
Power Efficiency
88% Efficient @ 50% Load
Operating Voltage Range
100 – 240V
Rated Voltage Range
90-264VAC
Rated Line Frequency
47Hz / 63Hz
Operating Line Frequency Range
50Hz / 60Hz
Rated Input Current
6.75A
Vendor
AMI
Color
Raven Black
PSU
135W Power Brick
Dimensions: 145*65*30mm
Weight:
Delta, ADL135NDC3A, around 463.4g
Liteon, ADL135NLC3A, around 490.8g
Thermal Solutions
One System Fan Standard
Dimensions
36.5mm/1.437″ W x 182.9mm/7.2″ D x 179mm/7.047″ H
Weight
1.32kg / 2.91lbs
Height (mm/in)
490mm / 19.29″
Width (mm/in)
141mm / 5.55″
Depth (mm)
268mm / 10.55″
Weight (kgs/lbs)
2.848kg / 6.28lbs
TPM
Infineon SLB9670VQ2.0FW7.63 TPM 2.0
Asset ID
Yes, 1024 x 8bit
vPro
Intel vPro for WS (AMT 12.X)
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
No
Boot Sequence Control
Yes
Padlock Support
No
Boot without keyboard and/or mouse
Yes
Access Panel
Tool-less Side Cover Removal
Hard Drives
Tool-less
Expansion Cards
Retained With Screws
Processor Socket
Tool-less
Color coded User Touch Points
Yes
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained With Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Customer Support Center
Air Temperature
Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage
Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity
Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
Altitude
Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)
Vibration
Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock
Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time
Board Size
6.75″ x 6.89″ (171.5mm x 175mm)
Layout
Custom ATX
Processor Support
Intel Coffee Lake Core
Socket Type
Socket-H4 (LGA 1151)
Memory Support
DDR4 up to 2666MHz SODIMM Memory
Voltage Regulator
65W TDP Capable
Chipset (PCH)
Intel Q370 Chipset
Flash
16MB
Super I/O
Nuvoton NCT6686D-L
Clock
Intel Native isCLK
Audio
Realtek ALC233VB Codec
Ethernet
Intel Jacksonville I219LM
Processor Level
Intel Coffee Lake Core
Processor
i9-9900T
i7-9700T
i7-8700T
i5-9600T
i5-9500T
i5-9400T
i5-8600T
i5-8500T
i5-8400T
i3-9300T
i3-9100T
i3-8300T
i3-8100T
i7-8700
i5-9600
i5-9500
i5-9400
i5-8600
i5-8500
i5-8400
i3-9320
i3-9300
i3-9100
i3-8300
i3-8100
Memory Type
SODIMM 2666 MHz
Memory
4GB 2666MHz DDR4 SDRAM SODIMM
8GB 2666MHz DDR4 SDRAM SODIMM
16GB 2666MHz DDR4 SDRAM SODIMM
32GB 2666MHz DDR4 SDRAM SODIMM
2.5″ SATA Hard Disk Drive (HDD)
500GB 2.5″ SATA HDD 7200rpm (FIPS certified)
1TB 2.5″ SATA HDD 7200rpm
2.5″ SATA Solid State Drive (SSD)
256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
M.2 PCIe Solid State Drive (SSD)
128GB M.2 PCIe SSD, Gen 3 x4, NVMe
256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
Intel Optane Storage Technology
16GB M.2 Optane Memory
RAID Levels and Requirements
Supported RAID 0/1
Notes
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.
DVD-ROM Drive
Slim DVD-ROM Drive
DVD Burner/CD-RW Drive
Slim DVD Burner/CD-RW Drive
Keyboard
Traditional USB Keyboard
Calliope USB Wireless Keyboard
Pointing Devices
Calliope USB Mouse
Calliope USB Wireless Mouse
Fingerprint USB Mouse
Network
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Thunderbolt
Rear Thunderbolt PCIe Adapter
USB
2 Port USB Expansion Card (USB3.0) PCIe x1 Gen 2
WiFi Cards
Intel PCIe WiFi Card With BT External Antenna Kit (9560 AC)
CPU
Intel i9-9900T
Intel i7-9700T
Intel i7-8700T
Intel i5-9600T
Intel i5-9500
# of Cores
8
8
6
6
6
# of Threads
16
8
12
6
6
Processor Base Frequency
2.1GHz
2GHz
2.4GHz
2.3GHz
3GHz
Max Turbo Frequency
4.4GHz
4.3GHz
4GHz
3.9GHz
4.4GHz
Cache
16MB
12MB
12MB
9MB
9MB
TDP
35W
35W
35W
35W
65W
Intel ARK Spec Link
Intel i9-9900T
Intel i7-9700T
Intel i7-8700T
Intel i5-9600T
Intel i5-9500
CPU
Intel i5-9500T
Intel i5-8500
Intel i5-8500T
Intel i5-9400
Intel i5-9400T
# of Cores
6
6
6
6
6
# of Threads
6
6
6
6
6
Processor Base Frequency
2.2GHz
3GHz
2.1GHz
2.9GHz
1.8GHz
Max Turbo Frequency
3.7GHz
4.1GHz
3.5GHz
4.1GHz
3.4GHz
Cache
9MB
9MB
9MB
9MB
9MB
TDP
35W
65W
35W
65W
35W
Intel ARK Spec Link
Intel i5-9500T
Intel i5-8500
Intel i5-8500T
Intel i5-9400
Intel i5-9400T
CPU
Intel i5-8400T
Intel i3-9300
Intel i3-9300T
Intel i3-8300
Intel i3-8300T
# of Cores
6
4
4
4
4
# of Threads
6
4
4
4
4
Processor Base Frequency
1.7GHz
3.7GHz
3.2GHz
3.70GHz
3.2GHz
Max Turbo Frequency
3.3GHz
4.3GHz
3.8GHz
Not Available
Not Available
Cache
9MB
8MB
8MB
8MB
8MB
TDP
35W
62W
35W
62W
35W
Intel ARK Spec Link
Intel i5-8400T
Intel i3-9300
Intel i3-9300T
Intel i3-8300
Intel i3-8300T
CPU
Intel i3-9100
Intel i3-9100T
Intel i3-8100
Intel i3-8100T
Intel i7-9700
# of Cores
4
4
4
4
8
# of Threads
4
4
4
4
8
Processor Base Frequency
3.6GHz
3.1GHz
3.6GHz
3.1GHz
3.00 GHz
Max Turbo Frequency
4.2GHz
3.7GHz
Not Available
Not Available
4.70 GHz
Cache
6MB
6MB
6MB
6MB
12 MB
TDP
65W
35W
65W
35W
65 W
Intel ARK Spec Link
Intel i3-9100
Intel i3-9100T
Intel i3-8100
Intel i3-8100T
Intel i7-9700
CPU
Intel i9-9900
# of Cores
8
# of Threads
16
Processor Base Frequency
3.10 GHz
Max Turbo Frequency
5.00 GHz
Cache
16 MB
TDP
65 W
Intel ARK Spec Link
Intel i9-9900
Drive
M.2 256GB PCIe SSD (OPAL)
M.2 512GB PCIe SSD (OPAL)
M.2 1TB PCIe SSD (OPAL)
Dimensions Millimeters (W x D x H)
22 x 80 x 3
22 x 80 x 3
22 x 80 x 3
Interface Type
PCIe Gen 3×4
PCIe Gen 3×4
PCIe Gen 3×4
Power Active (AVG)
5.0W
5.0W
5.0W
Power Idle
50 mW
50 mW
50 mW
Typical Sequential Read
3000 MB/s
3000 MB/s
3000 MB/s
Typical Sequential Write
1500 MB/s
2400 mB/s
2700 MB/s
Operating Temperature Range
0 to 55°C
0 to 55°C
0 to 55°C
Endurance Rating (Lifetime Writes)
85 TB
150 TB
300 TB
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
2.0M POH
Hardware Encryption
AES 256 bit
AES 256 bit
AES 256 bit
Disclaimers
SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Type
Intel UHD Graphics 630
Display Interface
1 x DP 1.2, 1 x HDMI 1.4
Video Resolution (max)
4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)
Adapter
Quadro P620
Quadro P1000
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
Display Interface
4 x mDP 1.4
4 x mDP 1.4
Graphics Chipset
Pascal
Pascal
Memory Clock Frequency (MHz)
1252MHz
1253MHz
Memory Size
2GB GDDR5
4GB GDDR5
Memory Interface
128-bit
128-bit
Memory Bandwidth
Up to 80GB/s
Up to 82GB/s
GPU Cores
CUDA Cores: 512
CUDA Cores: 640
GPU Core Frequency (MHz)
1266MHz
1266MHz
Maximum Power Consumption
40W
47W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Dimension
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
WMI Support
Compliant With Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1)
System Configuration Setup Program (text only interface) Available at Power-on With F1 Key
Bootblock Recovery
Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup
Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control
Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert
Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert
Power-on Error message in the Event of a Fan Failure
Asset Tag
Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery with Video
Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown
System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
Quick Resume Time
Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level
System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
Keyboard-less Operation
System Can be Booted Without a Keyboard
Per-port Control
Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface
Adaptive Cooling
Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security
User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
Intel(R) AMT (includes ASF 2.0)
Allows System to be Supported from a Remote Location
Intel(R) TXT
Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks
Windows 10 Ready
Supports Windows 10 Requirements for Secure Flash, UEFI v 2.7 Device Guard Support Spec
UEFI
Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v6.0
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot
El Torito Bootable CD-Rom Format Specification, v1.0
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI
PCI Local Bus v3.0
PC Firmware Specification 3.1
PCI Express
PCI Express Base Specification 3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification Version 2.0
UHCI
Universal Host Controller Interface Design Guide, Revision 1.1
USB
Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v2.8.0
XHCI
eXtensible Host Controller Interface for Universal Serial Bus.
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
Not Available
Safety, EMC Connection to the Telephone Network and Labeling
Not Applicable, no Connection to a Telephone Network
System Software Manager
Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
EMC & Safety
FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test
Energy Star
ENERGY STAR® Version 7.0
EPEAT
EPEAT Certification Available on Select Models
ErP Lot-3 2013
Yes
Hazardous Substances
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week
