ThinkStation P330 Tiny

Version: 1 | 10/29/2019

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Hardware Maintenance Manual

Drivers & Software

SECTION I: Platform Overview

Description

The world’s smallest workstation, empowering you for great things. Engineered to go where others can’t, the ThinkStation® P330 Tiny combines simple and efficient design with the professional power of a workstation.

CPU

Processor Support

Intel Coffee Lake Core

Socket Type

Socket-H4 (LGA 1151)

Operating Systems

Preloaded

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Ubuntu 18.04 LTS (configuration specific)
Ubuntu 16.04 LTS (configuration specific)

Supported

Windows 10 Home 64-bit
Ubuntu 18.04 LTS
Ubuntu 16.04 LTS
Red Hat Enterprise Linux 7.5

Memory

Slots

Up to 2 SODIMMs

Channels

Supports up to 2 SODIMM Sockets, 2 Channels

Type

260-Pin, 2400/2666MHz non-ECC SODIMM

ECC Support

No

Speed

Up to 2666MHz

Max DIMM Size

32GB DDR4 SODIMM

Max System Memory

64GB

Disclaimers

Storage

Total Bays/Size

1 x 2.5″

SATA

1 x SATA Connectors, Gen 3

PCIe

2 x M.2 PCIe Connector Onboard

Disclaimers

Additional parts/enclosures may be required for some configurations

Video

Integrated Graphics

Intel Integrated UHD Graphics 630

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x8 Routed From CPU

Slots

Front I/O

USB

1 x USB 3.1 Gen 1 Type-A
1 x USB 3.1 Gen 1 Type-C

Audio

1 x Microphone Jack (3.5mm)
1 x Combo Audio/Microphone Jack (3.5mm)

Rear I/O

USB

2 x USB 3.1 Gen 2 Type-A
2 x USB 3.1 Gen 1 Type-A

DisplayPort

1 x Standard
Optional 1 x Rear Port

HDMI

1 x Standard
Optional 1 x Rear Port

VGA Port

Optional 1 x Rear Port

Serial Port

Optional 2 x Rear Port

Ethernet

1 x 1GbE – RJ45

Optional USB Adapter

Single Type-C + DP Port
Dual USB 3.0 Gen 2 Type-A

Optional Network Adapter

Intel I350-T4 Dual Port Gigabit Ethernet Adapter

Ethernet

Vendor

Intel Jacksonville I219LM

Speeds

10/100/1000Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Audio

Vendor

Realtek

Type

Integrated Audio

Internal Speaker

Yes

Connectors

1 x Rear 3.5mm Jacks (Line Out)

Chipset

ALC233VB

Number of Channels

2 Channels

Number of Bits/Audio Resolution

2 Stereo ADC Supports 16/20 bit PCM

Thermal

Temp Sensors

Ambient Sensor
VR1 Sensor
PCIe Sensor
M.2 Sensor

Fans

1 x CPU Fans

Power Specifications

Power Supply

135W

Power Efficiency

88% Efficient @ 50% Load

Operating Voltage Range

100 – 240V

Rated Voltage Range

90-264VAC

Rated Line Frequency

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

Rated Input Current

6.75A

BIOS

Vendor

AMI

Chassis Information

Color

Raven Black

PSU

135W Power Brick
Dimensions: 145*65*30mm

Weight:
Delta, ADL135NDC3A, around 463.4g
Liteon, ADL135NLC3A, around 490.8g

Thermal Solutions

One System Fan Standard

Dimensions

36.5mm/1.437″ W x 182.9mm/7.2″ D x 179mm/7.047″ H

Weight

1.32kg / 2.91lbs

Packaging Dimensions

Height (mm/in)

490mm / 19.29″

Width (mm/in)

141mm / 5.55″

Depth (mm)

268mm / 10.55″

Weight (kgs/lbs)

2.848kg / 6.28lbs

Security & Serviceability

TPM

Infineon SLB9670VQ2.0FW7.63 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 12.X)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Hard Drives

Tool-less

Expansion Cards

Retained With Screws

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time

SECTION II: Platform Detail

Board Size

6.75″ x 6.89″ (171.5mm x 175mm)

Layout

Custom ATX

Motherboard Core

Processor Support

Intel Coffee Lake Core

Socket Type

Socket-H4 (LGA 1151)

Memory Support

DDR4 up to 2666MHz SODIMM Memory

Voltage Regulator

65W TDP Capable

Chipset (PCH)

Intel Q370 Chipset

Flash

16MB

Super I/O

Nuvoton NCT6686D-L

Clock

Intel Native isCLK

Audio

Realtek ALC233VB Codec

Ethernet

Intel Jacksonville I219LM

Supported Components

Processor Level

Intel Coffee Lake Core

Processor

i9-9900T
i7-9700T
i7-8700T
i5-9600T
i5-9500T
i5-9400T
i5-8600T
i5-8500T
i5-8400T
i3-9300T
i3-9100T
i3-8300T
i3-8100T
i7-8700
i5-9600
i5-9500
i5-9400
i5-8600
i5-8500
i5-8400
i3-9320
i3-9300
i3-9100
i3-8300
i3-8100

Memory Type

SODIMM 2666 MHz

Memory

4GB 2666MHz DDR4 SDRAM SODIMM
8GB 2666MHz DDR4 SDRAM SODIMM
16GB 2666MHz DDR4 SDRAM SODIMM
32GB 2666MHz DDR4 SDRAM SODIMM

Storage

2.5″ SATA Hard Disk Drive (HDD)

500GB 2.5″ SATA HDD 7200rpm (FIPS certified)
1TB 2.5″ SATA HDD 7200rpm

2.5″ SATA Solid State Drive (SSD)

256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL

M.2 PCIe Solid State Drive (SSD)

128GB M.2 PCIe SSD, Gen 3 x4, NVMe
256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL

Intel Optane Storage Technology

16GB M.2 Optane Memory

RAID

RAID Levels and Requirements

Supported RAID 0/1

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.

Optical Drive/Removable Media

DVD-ROM Drive

Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Slim DVD Burner/CD-RW Drive

Keyboard and Pointing Devices

Keyboard

Traditional USB Keyboard
Calliope USB Wireless Keyboard

Pointing Devices

Calliope USB Mouse
Calliope USB Wireless Mouse
Fingerprint USB Mouse

PCIe Adapters

Network

Intel I350-T4 Quad Port Gigabit Ethernet Adapter

Thunderbolt

Rear Thunderbolt PCIe Adapter

USB

2 Port USB Expansion Card (USB3.0) PCIe x1 Gen 2

WiFi Cards

Intel PCIe WiFi Card With BT External Antenna Kit (9560 AC)

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel i9-9900T

Intel i7-9700T

Intel i7-8700T

Intel i5-9600T

Intel i5-9500

# of Cores

8

8

6

6

6

# of Threads

16

8

12

6

6

Processor Base Frequency

2.1GHz

2GHz

2.4GHz

2.3GHz

3GHz

Max Turbo Frequency

4.4GHz

4.3GHz

4GHz

3.9GHz

4.4GHz

Cache

16MB

12MB

12MB

9MB

9MB

TDP

35W

35W

35W

35W

65W

CPU Specifications

CPU

Intel i5-9500T

Intel i5-8500

Intel i5-8500T

Intel i5-9400

Intel i5-9400T

# of Cores

6

6

6

6

6

# of Threads

6

6

6

6

6

Processor Base Frequency

2.2GHz

3GHz

2.1GHz

2.9GHz

1.8GHz

Max Turbo Frequency

3.7GHz

4.1GHz

3.5GHz

4.1GHz

3.4GHz

Cache

9MB

9MB

9MB

9MB

9MB

TDP

35W

65W

35W

65W

35W

CPU Specifications

CPU

Intel i5-8400T

Intel i3-9300

Intel i3-9300T

Intel i3-8300

Intel i3-8300T

# of Cores

6

4

4

4

4

# of Threads

6

4

4

4

4

Processor Base Frequency

1.7GHz

3.7GHz

3.2GHz

3.70GHz

3.2GHz

Max Turbo Frequency

3.3GHz

4.3GHz

3.8GHz

Not Available

Not Available

Cache

9MB

8MB

8MB

8MB

8MB

TDP

35W

62W

35W

62W

35W

CPU Specifications

CPU

Intel i3-9100

Intel i3-9100T

Intel i3-8100

Intel i3-8100T

# of Cores

4

4

4

4

# of Threads

4

4

4

4

Processor Base Frequency

3.6GHz

3.1GHz

3.6GHz

3.1GHz

Max Turbo Frequency

4.2GHz

3.7GHz

Not Available

Not Available

Cache

6MB

6MB

6MB

6MB

TDP

65W

35W

65W

35W

Integrated Graphics Adapter

Type

Intel UHD Graphics 630

Display Interface

1 x DP, 1 x HDMI 1.4

Video Resolution (max)

4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)

Discrete Graphics Adapter

Adapter

Quadro P620

Quadro P1000

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

Display Interface

4 x mDP 1.4

4 x mDP 1.4

Graphics Chipset

Pascal

Pascal

Memory Clock Frequency (MHz)

1252MHz

1253MHz

Memory Size

2GB GDDR5

4GB GDDR5

Memory Interface

128-bit

128-bit

Memory Bandwidth

Up to 80GB/s

Up to 82GB/s

GPU Cores

CUDA Cores: 512

CUDA Cores: 640

GPU Core Frequency (MHz)

1266MHz

1266MHz

Maximum Power Consumption

40W

47W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Dimension

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery with Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.7 Device Guard Support Spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.0

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0

PCI

PCI Local Bus v3.0
PC Firmware Specification 3.1

PCI Express

PCI Express Base Specification 3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification Version 2.0

UHCI

Universal Host Controller Interface Design Guide, Revision 1.1

USB

Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v2.8.0

XHCI

eXtensible Host Controller Interface for Universal Serial Bus.

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

Regulations & Standards

EMC & Safety

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Environmentals

Energy Star

ENERGY STAR® Version 7.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

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