P330 HMM

P330 Drivers & Software

POWER OF A WORKSTATION PRICE OF A DESKTOP Mission-critical tasks require superior reliability and powerful performance; the ThinkStation® P330 leads on both counts and does it with exceptional all-around value.

Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium

Socket-H4 (LGA 1151)

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Ubuntu 16.04 LTS (configuration specific)

Windows 10 Home 64-bit
Ubuntu 16.04 LTS
Red Hat Enterprise Linux 7.5

Up to 4 DIMMs

Supports up to 4 DIMM Sockets, 2 Channels

288-Pin, 1866/2133/2400/2666MHz ECC and non-ECC UDIMM

Yes, CPU Dependent

Up to 2666MHz

16GB DDR4 UDIMM

64GB

1 x 3.5″
1 x 2.5″

4 x SATA Connectors, Gen 3

1 x M.2 PCIe Connector Onboard
Additional M.2 NVMe Drives Supported by Single Adapters

1 x eSATA Connector, Gen 3

Additional parts/enclosures may be required for some configurations

Intel Integrated UHD Graphics 630

PCIe Add-In-Card, Details in Section Below

Yes

PCIe Add-In-Card

PCIe x16

PCIe 3.0 x16, Full Height, Full Length, 45W, With Latch

PCIe 2.0 x1, Full Height, Full Length, 25W

PCIe 3.0 x4, Full Height, Full Length, 75W, With Latch

2 x USB 3.1 Gen 2 Type-A
2 x USB 3.1 Gen 1 Type-A
1 x USB 3.1 Gen 1 Type-C

1 x Combo Audio/Microphone Jack (3.5mm)

Optional: Front 7-in-1 Media Card Reader (USB 2.0)

One 5.25″ Flex Bays, Supports the Following:
• Up to one 5.25” to 3.5″ HDD Kit
• Up to one 5.25″ Front Access Storage Enclosure
• Up to one 5.25″ Flex module for one or more of the following options: 9.0mm optical/front eSATA/front Thunderbolt/front USB 3.1 Gen 1 Type-C
Note: 1. Only one can be supported from the following: dual Thunderbolt ports
2. Up to two ports are suppported from 1394, eSATA, and USB Type-C

Not all components above available concurrently in a single Flex Module.

2 x USB 2.0 Type-A
2 x USB 3.1 Gen 1 Type-A

1 x Rear (Line Out); Retaskable to 5.1

2 x Standard (CPU dependent)
Optional 1 x Rear Port (CPU dependent)

Optional 1 x Rear Port (CPU dependent)

1 x Standard
Optional 1 x Rear Port

1 x 1GbE – RJ45

Optional 2 x PS/2

Optional 1 x Rear Bracket

Dual Type-C ports USB 3.1
Dual Type-A ports USB 2.0

Bitland BN8E88 Single Port Gigabit Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Aquantia Single Port 10G Ethernet Adapter
Aquantia Single Port 5G Ethernet Adapter
PCI-E 1 x WiFi Card With BT HP External Antenna Kit (9560 AC)

Intel Jacksonville I219LM

10/100/1000Mbps

PXE, ASF, WOL, Jumbo Frames, Teaming

1 x RJ45

Realtek

HD (5.1)

Yes

1 x Rear 3.5mm Jacks (Line Out)

ALC233

2 Channels

6 Channel DAC supports 16/20/24 bit PCM
2 Stereo ADC supports 16/20 bit PCM

Ambient Sensor
VR1 Sensor
PCIe Sensor
MB Sensor

1 x CPU Fans
1 x Rear Fan
1 x Front Fans
1 x Power Supply Fan (internal)
1 x ODD Bay Fans (optional)

210W

260W

85% Efficient @ 50% Load

92% Efficient @ 50% Load

C14

C14

100 – 240V

100 – 240V

90-264VAC

90-264VAC

47Hz / 63Hz

47Hz / 63Hz

50Hz / 60Hz

50Hz / 60Hz

3A

4A

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

No

No

AMI

Raven Black

260W and 210W Available, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Two System Fans Standard (1 front, 1 rear), One Fan per CPU, One PSU Fan

339.725mm/13.375″ H x 292.1mm/11.5″ D x 88.9mm/3.5″ W

7.6kg / 16.76lbs

530mm / 20.87″

195mm / 7.68″

395mm / 15.55″

Infineon SLB9670VQ2.0FW7.63 TPM 2.0

Yes, 1024 x 8bit

Intel vPro for WS (AMT 12.X)

Yes, Optional Kensington Cable Lock

Yes

Yes

Yes

Yes

No

Yes

No

Yes

Tool-less Side Cover Removal

Tool-less

Tool-less

Tool-less

Tool-less

Yes

Yes

Tool-less

Retained With Screws

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time

10.51″ x 9.65″ (267mm x 245mm)

Custom ATX

Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium

Socket-H4 (LGA 1151)

DDR4 up to 2666MHz UDIMM Memory (ECC and non-ECC)

95W TDP Capable

Intel C246 Chipset

16MB

Nuvoton NCT6686D-L

Intel Native isCLK

Realtek ALC233 Codec

Intel Jacksonville I219LM

Intel Coffee Lake – Xeon

Intel Coffee Lake – Core

E-2176G
E-2174G
E-2146G
E-2144G
E-2136
E-2134
E-2126G
E-2124G
E-2124
E-2104G

i7-8700
i5-8600
i5-8500
i5-8400
i3-8300
i3-8100

ECC UDIMMs – 2666MHz

non-ECC UDIMMs – 2666MHz

8GB PC4-2666MHz DDR4 ECC UDIMM
16GB PC4-2666MHz DDR4 ECC UDIMM

4GB PC4-2666MHz DDR4 non-ECC UDIMM
8GB PC4-2666MHz DDR4 non-ECC UDIMM
16GB PC4-2666MHz DDR4 non-ECC UDIMM

1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)

500GB 2.5″ SATA HDD 7200rpm (FIPS certified)

256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL

256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL

32GB M.2 Optane Memory

Supported RAID 0/1/5/10

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.

Slim DVD-ROM Drive

Slim DVD Burner/CD-RW Drive

Slim Blu-Ray ODD DVD Burner

Optional Front 7-in-1 USB 2.0 Media Card Reader

Calliope USB Keyboard
Traditional USB Keyboard
Traditional PS/2 Keyboard
Calliope USB Wireless Keyboard

Calliope USB Mouse
Calliope Wireless Mouse
PS/2 Optical Mouse
Fingerprint USB Mouse

Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIe ASF FH
Aquantia 5G Ethernet Adapter (single port)

Rear Thunderbolt PCIe Adapter

2 Port USB Expansion Card (USB3.0) PCIe x1
Rear Dual Port USB 3.1 Type-C PCIe Adapter

Intel PCIe WiFi Card With BT External Antenna Kit (9560 AC)

PCIe x4 to M.2 Adapter (for NVMe SSD)

Intel Xeon E-2276G

Intel Xeon E-2274G

Intel Xeon E-2246G

Intel Xeon E-2244G

Intel Xeon E-2226G

6

4

6

4

6

12

8

12

8

6

3.8GHz

4GHz

3.6GHz

3.8GHz

3.4GHz

4.9GHz

4.9GHz

4.8GHz

4.8GHz

4.7GHz

12MB

8MB

12MB

8MB

12MB

80W

83W

80W

71W

80W

Intel Xeon E-2276G

Intel Xeon E-2274G

Intel Xeon E-2246G

Intel Xeon E-2244G

Intel Xeon E-2226G

Intel Xeon E-2224G

Intel Xeon E-2236

Intel Xeon E-2234

Intel Xeon E-2224

Intel i7-9700

4

6

4

4

8

4

12

8

4

8

3.5GHz

3.4GHz

3.6GHz

3.4GHz

3GHz

4.7GHz

4.8GHz

4.8GHz

4.6GHz

4.7GHz

8MB

12MB

8MB

8MB

12MB

71W

80W

71W

71W

65W

Intel Xeon E-2224G

Intel Xeon E-2236

Intel Xeon E-2234

Intel Xeon E-2224

Intel i7-9700

Intel i5-9500

Intel i5-8500

Intel i5-9400

Intel i3-9300

Intel i3-8300

6

6

6

4

4

6

6

6

4

4

3GHz

3GHz

2.9GHz

3.7GHz

3.7GHz

4.4GHz

4.1GHz

4.1GHz

4.3GHz

Not Available

9MB

9MB

9MB

8MB

8MB

65W

65W

65W

62W

62W

Intel i5-9500

Intel i5-8500

Intel i5-9400

Intel i3-9300

Intel i3-8300

Intel i3-9100

4

4

3.6GHz

4.2GHz

6MB

65W

Intel i3-9100

500GB SATA – 7200rpm, 6Gb/s, 2.5″

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

Not Available

Yes

Yes

Yes

Not Available

Not Available

SATA

SATA

SATA

160MB/s OD Read

Average Data Rate, Read/Write 156MB/s

Average Data Rate, Read/Write 156MB/s

7,200

7,200

7,200

NA

NA

NA

3.5

<10.0

<17.0

4.2

4.16

4.16

5

5

5

1.9

6.19

6.7

0.7

4.6

4.5

69.85mm x 100.34mm x 7mm

101.6mm x 146.99mm x 19.88mm

101.6mm x 146.99mm x 26.1mm

90

420

535

0 to 60

0 to 60

0 to 60

60

60

60

(-40 to 70)

(-40 to 70)

(-40 to 70)

20

20

20

400

70

80

1000

350

300

Intel UHD Graphics 630

1x DP, 1x HDMI 1.4

4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)

Quadro P400

Quadro P600

Quadro P620

Quadro P1000

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

3 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4

Pascal

Pascal

Pascal

Pascal

1003MHz

1002MHz

1252MHz

1253MHz

2GB GDDR5

2GB GDDR5

2GB GDDR5

4GB GDDR5

64-bit

128-bit

128-bit

128-bit

Up to 32GB/s

Up to 64GB/s

Up to 80GB/s

Up to 82GB/s

CUDA Cores: 256

CUDA Cores: 384

CUDA Cores: 512

CUDA Cores: 640

1228MHz

1329MHz

1266MHz

1266MHz

30W

40W

40W

47W

3 x 4096×2160 @ 60Hz
1 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

Compliant With Microsoft WBEM and the DMTF Common Information Model

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Recovers System BIOS if the Flash ROM Becomes Corrupted

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Power-on Error Message in the Event of a Decrease in System Memory

Power-on Error message in the Event of a Fan Failure

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

System Can be Booted Without a Keyboard

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

Allows System to be Supported from a Remote Location

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Supports Mirroring, Lock Step, and Sparing Memory Modes

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Unified Extensible Firmware Interface v2.7

Advanced Configuration and Power Interface v6.1

DMTF Alert Standard Format Specification v2.0

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

El Torito Bootable CD-Rom Format Specification, v1.0

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

NA (No PCI slot)

PCI Express Base Specification v3.0

Serial ATA Revision 3.0 Specification

Trusted Computing Group TPM Specification v2.0

Universal Host Controller Interface Design Guide, Revision v1.1

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

DMTF System Management Spec v3.2.1

XHCI SPEC Revision v1.2

Lenovo is a member of an eco declaration system that enforces regular independent quality control

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Not Available

Not Applicable, no Connection to a Telephone Network

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

ENERGY STAR® v7.0

EPEAT Certification Available on Select Models

Yes

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week