ThinkStation P330 SFF G1 (Archived)

Version: 1 | 10/29/2019

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Hardware Maintenance Manual

Drivers & Software

SECTION I: Platform Overview

Description

POWER OF A WORKSTATION PRICE OF A DESKTOP Mission-critical tasks require superior reliability and powerful performance; the ThinkStation® P330 leads on both counts and does it with exceptional all-around value.

CPU

Processor Support

Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium

Socket Type

Socket-H4 (LGA 1151)

Operating Systems

Preloaded

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Ubuntu 16.04 LTS (configuration specific)

Supported

Windows 10 Home 64-bit
Ubuntu 16.04 LTS
Red Hat Enterprise Linux 7.5

Memory

Slots

Up to 4 DIMMs

Channels

Supports up to 4 DIMM Sockets, 2 Channels

Type

288-Pin, 1866/2133/2400/2666MHz ECC and non-ECC UDIMM

ECC Support

Yes, CPU Dependent

Speed

Up to 2666MHz

Max DIMM Size

16GB DDR4 UDIMM

Max System Memory

64GB

Storage

Total Bays/Size

1 x 3.5″
1 x 2.5″

SATA

4 x SATA Connectors, Gen 3

PCIe

1 x M.2 PCIe Connector Onboard
Additional M.2 NVMe Drives Supported by Single Adapters

eSATA

1 x eSATA Connector, Gen 3

Disclaimers

Additional parts/enclosures may be required for some configurations

Video

Integrated Graphics

Intel Integrated UHD Graphics 630

Discrete Graphics

PCIe Add-In-Card, Details in Section Below

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Slots

Slot 1

PCIe 3.0 x16, Full Height, Full Length, 45W, With Latch

Slot 2

PCIe 2.0 x1, Full Height, Full Length, 25W

Slot 3

PCIe 3.0 x4, Full Height, Full Length, 75W, With Latch

Front I/O

USB

2 x USB 3.1 Gen 2 Type-A
2 x USB 3.1 Gen 1 Type-A
1 x USB 3.1 Gen 1 Type-C

Audio

1 x Combo Audio/Microphone Jack (3.5mm)

Media Card Reader

Optional: Front 7-in-1 Media Card Reader (USB 2.0)

Flex Module

One 5.25″ Flex Bays, Supports the Following:
• Up to one 5.25” to 3.5″ HDD Kit
• Up to one 5.25″ Front Access Storage Enclosure
• Up to one 5.25″ Flex module for one or more of the following options: 9.0mm optical/front eSATA/front Thunderbolt/front USB 3.1 Gen 1 Type-C
Note: 1. Only one can be supported from the following: dual Thunderbolt ports
2. Up to two ports are suppported from 1394, eSATA, and USB Type-C

Disclaimers

Not all components above available concurrently in a single Flex Module.

Rear I/O

USB

2 x USB 2.0 Type-A
2 x USB 3.1 Gen 1 Type-A

Audio

1 x Rear (Line Out); Retaskable to 5.1

DisplayPort

2 x Standard (CPU dependent)
Optional 1 x Rear Port (CPU dependent)

HDMI

Optional 1 x Rear Port (CPU dependent)

Serial Port

1 x Standard
Optional 1 x Rear Port

Ethernet

1 x 1GbE – RJ45

PS/2

Optional 2 x PS/2

Parallel Port

Optional 1 x Rear Bracket

Optional USB Adapter

Dual Type-C ports USB 3.1
Dual Type-A ports USB 2.0

Optional Network Adapter

Bitland BN8E88 Single Port Gigabit Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Aquantia Single Port 10G Ethernet Adapter
Aquantia Single Port 5G Ethernet Adapter
PCI-E 1 x WiFi Card With BT HP External Antenna Kit (9560 AC)

Ethernet

Vendor

Intel Jacksonville I219LM

Speeds

10/100/1000Mbps

Functions

PXE, ASF, WOL, Jumbo Frames, Teaming

Connectors

1 x RJ45

Audio

Vendor

Realtek

Type

HD (5.1)

Internal Speaker

Yes

Connectors

1 x Rear 3.5mm Jacks (Line Out)

Chipset

ALC233

Number of Channels

2 Channels

Number of Bits/Audio Resolution

6 Channel DAC supports 16/20/24 bit PCM
2 Stereo ADC supports 16/20 bit PCM

Thermal

Temp Sensors

Ambient Sensor
VR1 Sensor
PCIe Sensor
MB Sensor

Fans

1 x CPU Fans
1 x Rear Fan
1 x Front Fans
1 x Power Supply Fan (internal)
1 x ODD Bay Fans (optional)

Power Specifications

Power Supply

210W

260W

Power Efficiency

85% Efficient @ 50% Load

92% Efficient @ 50% Load

Main

C14

C14

Operating Voltage Range

100 – 240V

100 – 240V

Rated Voltage Range

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

3A

4A

Power Supply Fan

Yes

Yes

ENERGY STAR® Qualified (config dependent)

Yes

Yes

80 PLUS Compliant

Yes

Yes

Built-in Self Test (BIST) LED

Yes

Yes

Aux Power Drop

No

No

BIOS

Vendor

AMI

Chassis Information

Color

Raven Black

PSU

260W and 210W Available, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

Thermal Solutions

Two System Fans Standard (1 front, 1 rear), One Fan per CPU, One PSU Fan

Dimensions

88.9mm/3.5″ W x 292.1mm/11.5″ D x 339.725mm/13.375″ H

Weight

7.6kg / 16.76lbs

Packaging Dimensions

Height (mm/in)

530mm / 20.87″

Width (mm/in)

195mm / 7.68″

Depth (mm)

395mm / 15.55″

Security & Serviceability

TPM

Infineon SLB9670VQ2.0FW7.63 TPM 2.0

Asset ID

Yes, 1024 x 8bit

vPro

Intel vPro for WS (AMT 12.X)

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

No

Boot Sequence Control

Yes

Padlock Support

No

Boot without keyboard and/or mouse

Yes

Access Panel

Tool-less Side Cover Removal

Optical Drive

Tool-less

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Tool-less

Color coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained With Screws

Restore CD/DVD/USB Set

Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

Air Temperature

Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)

Storage

Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude

Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)

Vibration

Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

Shock

Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time

SECTION II: Platform Detail

Board Size

10.51″ x 9.65″ (267mm x 245mm)

Layout

Custom ATX

Motherboard Core

Processor Support

Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium

Socket Type

Socket-H4 (LGA 1151)

Memory Support

DDR4 up to 2666MHz UDIMM Memory (ECC and non-ECC)

Voltage Regulator

95W TDP Capable

Chipset (PCH)

Intel C246 Chipset

Flash

16MB

Super I/O

Nuvoton NCT6686D-L

Clock

Intel Native isCLK

Audio

Realtek ALC233 Codec

Ethernet

Intel Jacksonville I219LM

Supported Components

Processor Level

Intel Coffee Lake – Xeon

Intel Coffee Lake – Core

Processor

E-2176G
E-2174G
E-2146G
E-2144G
E-2136
E-2134
E-2126G
E-2124G
E-2124
E-2104G

i7-8700
i5-8600
i5-8500
i5-8400
i3-8300
i3-8100

Memory Type

ECC UDIMMs – 2666MHz

non-ECC UDIMMs – 2666MHz

Memory

8GB PC4-2666MHz DDR4 ECC UDIMM
16GB PC4-2666MHz DDR4 ECC UDIMM

4GB PC4-2666MHz DDR4 non-ECC UDIMM
8GB PC4-2666MHz DDR4 non-ECC UDIMM
16GB PC4-2666MHz DDR4 non-ECC UDIMM

Storage

3.5″ SATA Hard Disk Drive (HDD)

1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)

2.5″ SATA Hard Disk Drive (HDD)

500GB 2.5″ SATA HDD 7200rpm (FIPS certified)

2.5″ SATA Solid State Drive (SSD)

256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL

M.2 PCIe Solid State Drive (SSD)

256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL

Intel Optane Storage Technology

32GB M.2 Optane Memory

RAID

RAID Levels and Requirements

Supported RAID 0/1/5/10

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.

Optical Drive/Removable Media

DVD-ROM Drive

Slim DVD-ROM Drive

DVD Burner/CD-RW Drive

Slim DVD Burner/CD-RW Drive

Blu-Ray Burner Drive

Slim Blu-Ray ODD DVD Burner

Media Card Reader Specifications

Optional Front 7-in-1 USB 2.0 Media Card Reader

Keyboard and Pointing Devices

Keyboard

Calliope USB Keyboard
Traditional USB Keyboard
Traditional PS/2 Keyboard
Calliope USB Wireless Keyboard

Pointing Devices

Calliope USB Mouse
Calliope Wireless Mouse
PS/2 Optical Mouse
Fingerprint USB Mouse

PCIe Adapters

Network

Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIe ASF FH
Aquantia 5G Ethernet Adapter (single port)

Thunderbolt

Rear Thunderbolt PCIe Adapter

USB

2 Port USB Expansion Card (USB3.0) PCIe x1
Rear Dual Port USB 3.1 Type-C PCIe Adapter

WiFi Cards

Intel PCIe WiFi Card With BT External Antenna Kit (9560 AC)

PCIe to M.2 Adapter Card

PCIe x4 to M.2 Adapter (for NVMe SSD)

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel Xeon E-2276G

Intel Xeon E-2274G

Intel Xeon E-2246G

Intel Xeon E-2244G

Intel Xeon E-2226G

# of Cores

6

4

6

4

6

# of Threads

12

8

12

8

6

Processor Base Frequency

3.8GHz

4GHz

3.6GHz

3.8GHz

3.4GHz

Max Turbo Frequency

4.9GHz

4.9GHz

4.8GHz

4.8GHz

4.7GHz

Cache

12MB

8MB

12MB

8MB

12MB

TDP

80W

83W

80W

71W

80W

CPU Specifications

CPU

Intel Xeon E-2224G

Intel Xeon E-2236

Intel Xeon E-2234

Intel Xeon E-2224

Intel i7-9700

# of Cores

4

6

4

4

8

# of Threads

4

12

8

4

8

Processor Base Frequency

3.5GHz

3.4GHz

3.6GHz

3.4GHz

3GHz

Max Turbo Frequency

4.7GHz

4.8GHz

4.8GHz

4.6GHz

4.7GHz

Cache

8MB

12MB

8MB

8MB

12MB

TDP

71W

80W

71W

71W

65W

CPU Specifications

CPU

Intel i5-9500

Intel i5-8500

Intel i5-9400

Intel i3-9300

Intel i3-8300

# of Cores

6

6

6

4

4

# of Threads

6

6

6

4

4

Processor Base Frequency

3GHz

3GHz

2.9GHz

3.7GHz

3.7GHz

Max Turbo Frequency

4.4GHz

4.1GHz

4.1GHz

4.3GHz

Not Available

Cache

9MB

9MB

9MB

8MB

8MB

TDP

65W

65W

65W

62W

62W

CPU Specifications

CPU

Intel i3-9100

# of Cores

4

# of Threads

4

Processor Base Frequency

3.6GHz

Max Turbo Frequency

4.2GHz

Cache

6MB

TDP

65W

Intel ARK Spec Link

HDD Specifications

Drive

500GB SATA – 7200rpm, 6Gb/s, 2.5″

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ SATA Hard Disk Drive (HDD)

Not Available

Yes

Yes

2.5″ SATA Hard Disk Drive (HDD)

Yes

Not Available

Not Available

Connector

SATA

SATA

SATA

Transfer Rate (Gb/sec)

160MB/s OD Read

Average Data Rate, Read/Write 156MB/s

Average Data Rate, Read/Write 156MB/s

Spindle Speed (RPM)

7,200

7,200

7,200

Power Off to Spindle Stop (sec)

NA

NA

NA

DC Power to Drive Ready (sec)

3.5

<10.0

<17.0

Average Latency (msec)

4.2

4.16

4.16

Input (VDC)

5

5

5

Typical (Watts)

1.9

6.19

6.7

Idle (Watts)

0.7

4.6

4.5

Physical Dimensions

69.85mm x 100.34mm x 7mm

101.6mm x 146.99mm x 19.88mm

101.6mm x 146.99mm x 26.1mm

Weight (grams)

90

420

535

Operating (C) Ambient

0 to 60

0 to 60

0 to 60

Operating (C) Base Casting

60

60

60

Non-Operating (C) Ambient

(-40 to 70)

(-40 to 70)

(-40 to 70)

Gradient (C per Hour)

20

20

20

Operating (Gs @ 2ms)

400

70

80

Non-Operating (Gs @ 2ms)

1000

350

300

Integrated Graphics Adapter

Type

Intel UHD Graphics 630

Display Interface

1x DP, 1x HDMI 1.4

Video Resolution (max)

4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)

Discrete Graphics Adapter

Adapter

Quadro P400

Quadro P600

Quadro P620

Quadro P1000

Bus Interface

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

PCIe 3.0 x16

Display Interface

3 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4

4 x mDP 1.4

Graphics Chipset

Pascal

Pascal

Pascal

Pascal

Memory Clock Frequency (MHz)

1003MHz

1002MHz

1252MHz

1253MHz

Memory Size

2GB GDDR5

2GB GDDR5

2GB GDDR5

4GB GDDR5

Memory Interface

64-bit

128-bit

128-bit

128-bit

Memory Bandwidth

Up to 32GB/s

Up to 64GB/s

Up to 80GB/s

Up to 82GB/s

GPU Cores

CUDA Cores: 256

CUDA Cores: 384

CUDA Cores: 512

CUDA Cores: 640

GPU Core Frequency (MHz)

1228MHz

1329MHz

1266MHz

1266MHz

Maximum Power Consumption

30W

40W

40W

47W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

3 x 4096×2160 @ 60Hz
1 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz

Thermal Solution

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Ultra-quiet Active Fansink

Dimension

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

2.713” H x 5.7” L
Single Slot, Low Profile

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text only interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery with Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.7

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v6.1

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6)

CD Boot

El Torito Bootable CD-Rom Format Specification, v1.0

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v3.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.2.1

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

Regulations & Standards

EMC & Safety

FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test

Environmentals

Energy Star

ENERGY STAR® v7.0

EPEAT

EPEAT Certification Available on Select Models

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

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