Version: 2.0 | 06/10/2024
Product Name
P330 SFF
Product Display Name
ThinkStation P330 SFF
Information Date
2-Feb-21
Hardware Maintenance Manual
Drivers & Software
Available Whitepapers
Description
POWER OF A WORKSTATION PRICE OF A DESKTOP Mission-critical tasks require superior reliability and powerful performance; the ThinkStation® P330 leads on both counts and does it with exceptional all-around value.
Processor Support
Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium
Socket Type
Socket-H4 (LGA 1151)
Preloaded
Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Ubuntu 18.04 LTS (configuration specific)
Supported
Windows 10 Home 64-bit
Ubuntu 18.04 LTS
Red Hat Enterprise Linux 8.0
Slots
Up to 4 DIMMs
Channels
Supports up to 4 DIMM Sockets, 2 Channels
Type
288-Pin, 1866/2133/2400/2666MHz ECC and non-ECC UDIMM
ECC Support
Yes, CPU Dependent
Speed
Up to 2666MHz
Max DIMM Size
32GB DDR4 UDIMM
Max System Memory
128GB
Total Bays/Size
1 x 3.5″
1 x 2.5″
SATA
4 x SATA Connectors, Gen 3
PCIe
1 x M.2 PCIe Connector Onboard
Additional M.2 NVMe Drives Supported by Single Adapters
eSATA
1 x eSATA Connector, Gen 3
Disclaimers
Additional parts/enclosures may be required for some configurations
Integrated Graphics
Intel Integrated UHD Graphics 630
Discrete Graphics
PCIe Add-In-Card, Details in Section Below
Multi-GPU Support
Yes
Type
PCIe Add-In-Card
Bus Interface
PCIe x16
Slot 1
PCIe 3.0 x16, Half Height, Full Length, 75W, With Latch
Slot 2
PCIe 2.0 x1, Half Height, Full Length, 25W
Slot 3
PCIe 3.0 x4, Half Height, Full Length, 25W, With Latch
USB
2 x USB 3.1 Gen 2 Type-A
2 x USB 3.1 Gen 1 Type-A
1 x USB 3.1 Gen 1 Type-C
Audio
1 x Combo Audio/Microphone Jack (3.5mm)
Media Card Reader
Optional: Front 7-in-1 Media Card Reader (USB 2.0)
Flex Module
One 5.25″ Flex Bays, Supports the Following:
• Up to one 5.25” to 3.5″ HDD Kit
• Up to one 5.25″ Front Access Storage Enclosure
• Up to one 5.25″ Flex module for one or more of the following options: 9.0mm optical/front eSATA/front Thunderbolt/front USB 3.1 Gen 1 Type-C
Note: 1. Only one can be supported from the following: dual Thunderbolt ports
2. Up to two ports are suppported from 1394, eSATA, and USB Type-C
Disclaimers
Not all components above available concurrently in a single Flex Module.
USB
2 x USB 2.0 Type-A
2 x USB 3.1 Gen 1 Type-A
Audio
1 x Rear (Line Out); Retaskable to 5.1
DisplayPort
2 x Standard (CPU dependent)
Optional 1 x Rear Port (CPU dependent)
HDMI
Optional 1 x Rear Port (CPU dependent)
Serial Port
1 x Standard
Optional 1 x Rear Port
Ethernet
1 x 1GbE – RJ45
PS/2
Optional 2 x PS/2
Parallel Port
Optional 1 x Rear Bracket
Optional USB Adapter
Dual Type-C ports USB 3.1
Dual Type-A ports USB 2.0
Optional Network Adapter
Bitland BN8E88 Single Port Gigabit Ethernet Adapter
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Aquantia Single Port 10G Ethernet Adapter
Aquantia Single Port 5G Ethernet Adapter
PCIe WiFi Card With BT HP External Antenna Kit (9560 AC)
Vendor
Intel Jacksonville I219LM
Speeds
10/100/1000Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
1 x RJ45
Vendor
Realtek
Type
HD (5.1)
Internal Speaker
Yes
Connectors
1 x Rear 3.5mm Jacks (Line Out)
Chipset
ALC233
Number of Channels
2 Channels
Number of Bits/Audio Resolution
6 Channel DAC supports 16/20/24 bit PCM
2 Stereo ADC supports 16/20 bit PCM
Temp Sensors
Ambient Sensor
VR1 Sensor
PCIe Sensor
MB Sensor
Fans
1 x CPU Fans
1 x Rear Fan
1 x Front Fans
1 x Power Supply Fan (internal)
1 x ODD Bay Fans (optional)
Power Supply
210W
260W
Power Efficiency
85% Efficient @ 50% Load
92% Efficient @ 50% Load
Main
C14
C14
Operating Voltage Range
100 – 240V
100 – 240V
Rated Voltage Range
90-264VAC
90-264VAC
Rated Line Frequency
47Hz / 63Hz
47Hz / 63Hz
Operating Line Frequency Range
50Hz / 60Hz
50Hz / 60Hz
Rated Input Current
3A
4A
Power Supply Fan
Yes
Yes
ENERGY STAR® Qualified (config dependent)
Yes
Yes
80 PLUS Compliant
Yes
Yes
Built-in Self Test (BIST) LED
Yes
Yes
Aux Power Drop
No
No
Vendor
AMI
Color
Raven Black
PSU
260W and 210W Available, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
Thermal Solutions
Two System Fans Standard (1 front, 1 rear), One Fan per CPU, One PSU Fans
Dimensions
88.9mm/3.5″ W x 292.1mm/11.5″ D x 339.725mm/13.375″ H
Weight
6.0kg / 13.2lbs
Height (mm/in)
530mm / 20.87″
Width (mm/in)
195mm / 7.68″
Depth (mm)
395mm / 15.55″
TPM
Infineon SLB9670VQ2.0FW7.63 TPM 2.0
Asset ID
Yes, 1024 x 8bit
vPro
Intel vPro for WS (AMT 12.X)
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Yes
Power-On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Access Panel Key Lock
No
Boot Sequence Control
Yes
Padlock Support
No
Boot without keyboard and/or mouse
Yes
Access Panel
Tool-less Side Cover Removal
Optical Drive
Tool-less
Hard Drives
Tool-less
Expansion Cards
Tool-less
Processor Socket
Tool-less
Color coded User Touch Points
Yes
Color-coordinated Cables and Connectors
Yes
Memory
Tool-less
System Board
Retained With Screws
Restore CD/DVD/USB Set
Not Included, Restore Media Available via Lenovo Customer Support Center
Air Temperature
Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F)
Storage
Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity
Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
Altitude
Operating: -15.2m to 3048m (-50ft to 10000ft)
Storage: -15.2m to 10668m (-50ft to 35000ft)
Vibration
Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock
Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half-sine Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,-Y, +Z ,-Z), Filter 300Hz, Each Side Shock One Time
Board Size
10.51″ x 9.65″ (267mm x 245mm)
Layout
Custom ATX
Processor Support
Intel Coffee Lake Xeon E3-1200 Series/Core/Pentium
Socket Type
Socket-H4 (LGA 1151)
Memory Support
DDR4 up to 2666MHz UDIMM Memory (ECC and non-ECC)
Voltage Regulator
95W TDP Capable
Chipset (PCH)
Intel C246 Chipset
Flash
16MB
Super I/O
Nuvoton NCT6686D-L
Clock
Intel Native isCLK
Audio
Realtek ALC233 Codec
Ethernet
Intel Jacksonville I219LM
Processor Level
Intel Coffee Lake – Xeon
Intel Coffee Lake – Core
Processor
E-2288G
E-2286G
E-2278G
E-2276G
E-2274G
E-2246G
E-2244G
E-2226G
E-2224G
E-2236
E-2234
E-2224
E-2174G
i9-9900
i7-9700
i5-9600
i5-9500
i5-9400F
i5-9400
I3-9300
I3-9100
i7-8700
i5-8600
i5-8500
i5-8400
i3-8300
i3-8100
Memory Type
ECC UDIMMs – 2666MHz
non-ECC UDIMMs – 2666MHz
Memory
8GB PC4-2666MHz DDR4 ECC UDIMM
16GB PC4-2666MHz DDR4 ECC UDIMM
4GB PC4-2666MHz DDR4 non-ECC UDIMM
8GB PC4-2666MHz DDR4 non-ECC UDIMM
16GB PC4-2666MHz DDR4 non-ECC UDIMM
32GB PC4-2666MHz DDR4 non-ECC UDIMM
3.5″ SATA Hard Disk Drive (HDD)
1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class)
2.5″ SATA Hard Disk Drive (HDD)
500GB 2.5″ SATA HDD 7200rpm (FIPS certified)
2.5″ SATA Solid State Drive (SSD)
256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
M.2 PCIe Solid State Drive (SSD)
256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
Intel Optane Storage Technology
32GB M.2 Optane Memory
RAID Levels and Requirements
Supported RAID 0/1
Notes
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1.
DVD-ROM Drive
Slim DVD-ROM Drive
DVD Burner/CD-RW Drive
Slim DVD Burner/CD-RW Drive
Blu-Ray Burner Drive
Slim Blu-Ray ODD DVD Burner
Media Card Reader Specifications
Optional Front 7-in-1 USB 2.0 Media Card Reader
Keyboard
Calliope USB Keyboard
Traditional USB Keyboard
Traditional PS/2 Keyboard
Calliope USB Wireless Keyboard
Pointing Devices
Calliope USB Mouse
Calliope Wireless Mouse
PS/2 Optical Mouse
Fingerprint USB Mouse
Network
Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIe ASF FH
Aquantia 5G Ethernet Adapter (single port)
Aquantia 10G Ethernet Adapter (single port)
Thunderbolt
Rear Thunderbolt PCIe Adapter
USB
2 Port USB Expansion Card (USB3.0) PCIe x1
Rear Dual Port USB 3.1 Type-C PCIe Adapter
WiFi Cards
Intel PCIe WiFi Card With BT External Antenna Kit (9560 AC)
PCIe to M.2 Adapter Card
PCIe x4 to M.2 Adapter (for NVMe SSD)
CPU
Intel Xeon E-2276G
Intel Xeon E-2274G
Intel Xeon E-2246G
Intel Xeon E-2244G
Intel Xeon E-2226G
# of Cores
6
4
6
4
6
# of Threads
12
8
12
8
6
Processor Base Frequency
3.8GHz
4GHz
3.6GHz
3.8GHz
3.4GHz
Max Turbo Frequency
4.9GHz
4.9GHz
4.8GHz
4.8GHz
4.7GHz
Cache
12MB
8MB
12MB
8MB
12MB
TDP
80W
83W
80W
71W
80W
Intel ARK Spec Link
Intel Xeon E-2276G
Intel Xeon E-2274G
Intel Xeon E-2246G
Intel Xeon E-2244G
Intel Xeon E-2226G
CPU
Intel Xeon E-2224G
Intel Xeon E-2236
Intel Xeon E-2234
Intel Xeon E-2224
Intel i7-9700
# of Cores
4
6
4
4
8
# of Threads
4
12
8
4
8
Processor Base Frequency
3.5GHz
3.4GHz
3.6GHz
3.4GHz
3GHz
Max Turbo Frequency
4.7GHz
4.8GHz
4.8GHz
4.6GHz
4.7GHz
Cache
8MB
12MB
8MB
8MB
12MB
TDP
71W
80W
71W
71W
65W
Intel ARK Spec Link
Intel Xeon E-2224G
Intel Xeon E-2236
Intel Xeon E-2234
Intel Xeon E-2224
Intel i7-9700
CPU
Intel i5-9500
Intel i5-8500
Intel i5-9400
Intel i3-9300
Intel i3-8300
# of Cores
6
6
6
4
4
# of Threads
6
6
6
4
4
Processor Base Frequency
3GHz
3GHz
2.9GHz
3.7GHz
3.7GHz
Max Turbo Frequency
4.4GHz
4.1GHz
4.1GHz
4.3GHz
Not Available
Cache
9MB
9MB
9MB
8MB
8MB
TDP
65W
65W
65W
62W
62W
Intel ARK Spec Link
Intel i5-9500
Intel i5-8500
Intel i5-9400
Intel i3-9300
Intel i3-8300
CPU
Intel i3-9100
# of Cores
4
# of Threads
4
Processor Base Frequency
3.6GHz
Max Turbo Frequency
4.2GHz
Cache
6MB
TDP
65W
Intel ARK Spec Link
Intel i3-9100
Drive
500GB SATA – 7200rpm, 6Gb/s, 2.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ SATA Hard Disk Drive (HDD)
Not Available
Yes
Yes
2.5″ SATA Hard Disk Drive (HDD)
Yes
Not Available
Not Available
Connector
SATA
SATA
SATA
Transfer Rate (Gb/sec)
160MB/s OD Read
Average Data Rate, Read/Write 156MB/s
Average Data Rate, Read/Write 156MB/s
Spindle Speed (RPM)
7,200
7,200
7,200
Power Off to Spindle Stop (sec)
NA
NA
NA
DC Power to Drive Ready (sec)
3.5
<10.0
<17.0
Average Latency (msec)
4.2
4.16
4.16
Input (VDC)
5
5
5
Typical (Watts)
1.9
6.19
6.7
Idle (Watts)
0.7
4.6
4.5
Physical Dimensions
69.85mm x 100.34mm x 7mm
101.6mm x 146.99mm x 19.88mm
101.6mm x 146.99mm x 26.1mm
Weight (grams)
90
420
535
Operating (C) Ambient
0 to 60
0 to 60
0 to 60
Operating (C) Base Casting
60
60
60
Non-Operating (C) Ambient
(-40 to 70)
(-40 to 70)
(-40 to 70)
Gradient (C per Hour)
20
20
20
Operating (Gs @ 2ms)
400
70
80
Non-Operating (Gs @ 2ms)
1000
350
300
Drive
256GB SATA3 – SSD, 6Gb/s, 2.5″ OPAL
512 GB SATA3 – SSD, 6Gb/s, 2.5″ OPAL
1024 GB SATA3 – SSD, 6Gb/s, 2.5″ OPAL
512GB SATA3 – SSD, 6Gb/s, 2.5″ Non-OPAL
M.2 256GB PCIe SSD (OPAL)
Dimensions Millimeters (W x D x H)
70 x 100 x 7.0
70 x 100 x 7.0
70 x 100 x 7.0
70 x 100 x 7.0
22 x 80 x 3
Interface Type
SATA-III
SATA-III
SATA-III
SATA-III
PCIe Gen 3×4
Power Active (AVG)
1.8W
1.9W
2.2W
1.9W
5.0W
Power Idle
50 mW
50 mW
50 mW
50 mW
50 mW
Typical Sequential Read
540 MB/s
540 MB/s
540 MB/s
540 MB/s
3000 MB/s
Typical Sequential Write
500 MB/s
500 MB/s
500 MB/s
500 MB/s
1500 MB/s
Operating Temperature Range
0 to 55°C
0 to 55°C
0 to 55°C
0 to 55°C
0 to 55°C
Endurance Rating (Lifetime Writes)
85TB
150TB
300TB
150 TB
85 TB
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
2.0M POH
2.0M POH
2.0M POH
Hardware Encryption
AES 256 bit
AES 256 bit
AES 256 bit
Not Available
AES 256 bit
Disclaimers
SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Drive
M.2 512GB PCIe SSD (OPAL)
M.2 1TB PCIe SSD (OPAL)
M.2 2TB PCIe SSD (OPAL)
Dimensions Millimeters (W x D x H)
22 x 80 x 3
22 x 80 x 3
22 x 80 x 3
Interface Type
PCIe Gen 3×4
PCIe Gen 3×4
PCIe Gen 3×4
Power Active (AVG)
5.0W
5.0W
5.0W
Power Idle
50 mW
50 mW
50 mW
Typical Sequential Read
3000 MB/s
3000 MB/s
3000 MB/s
Typical Sequential Write
2400 mB/s
2700 MB/s
3000 MB/s
Operating Temperature Range
0 to 55°C
0 to 55°C
0 to 55°C
Endurance Rating (Lifetime Writes)
150 TB
300 TB
600 TB
Mean Time Between Failures (MTBF)
2.0M POH
2.0M POH
2.0M POH
Hardware Encryption
AES 256 bit
AES 256 bit
AES 256 bit
Disclaimers
SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set. Sequential measurements are with 1 Thread, Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Description
9.0mm Slim DVD ROM
9.0mm Slim DVD Writer
9.0mm Slim UHD BD
SATA 1.5 Gb/s
SATA 1.5 Gb/s
SATA 1.5 Gb/s
Interface Type
128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)
128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)
128±0.4×9.0 ±0.4×127±0.4(Max)
Unit:mm(Without Bezel-W x H x D)
Dimensions
NA
NA
NA
Disc Capacity
DVDROM
DVDWriter
BD Rambo
Type
NA
NA
NA
External Dimensions
NA
NA
NA
Speed
9.0mm Tray
9.0mm Tray
9.0mm Tray
Bay Type
Business Black or without bezel
Business Black or without bezel
Business Black or without bezel
Color
No
No
No
Removable
0.5MB Min
0.5MB Min
4MB
Internal Buffer Size
NA
8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
24XCD-R / 16XCD-RW
6x BD-R / 2x BD-RE
8XDVD+R / 8XDVD+RW / 6XDVD+R DL
8XDVD-R / 6XDVD-RW / 6XDVD-R DL
5XDVD-RAM
24XCD-R / 16XCD-RW
Writes
8XDVD-ROM / 24XCD-ROM
8XDVD-ROM / 24XCD-ROM
6x BD-ROM /8x DVD-ROM / 5x DVD-RAM / 24x CD-ROM
Reads
DC Power 5V
DC Power 5V
DC Power 5V
Source
+5V±5%
+5V±5%
+5V±5% Ripple less than 100mVp-p
DC Power Requirements
Max 2.5A@5v
Max 2.5A@5v
Max 2A@5v
DC Current
All Windows OS
All Windows OS
All Windows OS
Operating Systems Supported
Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC
Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC
Operating: 5ºC to 45 ºC
Non-Operating:-30ºC to 60ºC
Temperature
Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)
Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)
Operating >
Read: 15 % to 85 % (Non-Condensing)
Write 15 % to 80 % (Depend on the Temperature)
Storage/Transportation>
10 % to 80 % (Non-Condensing)
Type
Intel UHD Graphics 630
Display Interface
1x DP 1.2, 1x HDMI 1.4
Video Resolution (max)
4096×2304 @ 60Hz (DP), 4096×2304 @ 24Hz (HDMI)
Adapter
Quadro P400
Quadro P600
Quadro P620
Quadro P1000
Bus Interface
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
PCIe 3.0 x16
Display Interface
3 x mDP 1.4
4 x mDP 1.4
4 x mDP 1.4
4 x mDP 1.4
Graphics Chipset
Pascal
Pascal
Pascal
Pascal
Memory Clock Frequency (MHz)
1003MHz
1002MHz
1252MHz
1253MHz
Memory Size
2GB GDDR5
2GB GDDR5
2GB GDDR5
4GB GDDR5
Memory Interface
64-bit
128-bit
128-bit
128-bit
Memory Bandwidth
Up to 32GB/s
Up to 64GB/s
Up to 80GB/s
Up to 82GB/s
GPU Cores
CUDA Cores: 256
CUDA Cores: 384
CUDA Cores: 512
CUDA Cores: 640
GPU Core Frequency (MHz)
1228MHz
1329MHz
1266MHz
1266MHz
Maximum Power Consumption
30W
40W
40W
47W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)
3 x 4096×2160 @ 60Hz
1 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
4 x 4096×2160 @ 60Hz
4 x 5120×2880 @ 60Hz
Thermal Solution
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Ultra-quiet Active Fansink
Dimension
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
2.713” H x 5.7” L
Single Slot, Low Profile
WMI Support
Compliant With Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1)
System Configuration Setup Program (text only interface) Available at Power-on With F1 Key
Bootblock Recovery
Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup
Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems
Boot Control
Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on
Memory Change Alert
Power-on Error Message in the Event of a Decrease in System Memory
Thermal Alert
Power-on Error message in the Event of a Fan Failure
Asset Tag
Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery with Video
Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown
System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance
Quick Resume Time
Supports Low Power S3 (suspend to RAM) and Prompt Resume Times
ROM Revision Level
System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup
Keyboard-less Operation
System Can be Booted Without a Keyboard
Per-port Control
Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface
Adaptive Cooling
Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics
Security
User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock
Intel(R) AMT (includes ASF 2.0)
Allows System to be Supported from a Remote Location
Intel(R) TXT
Intel(R) Trusted Execution Technology Provides a Security Foundation to Build Protections Against Software Based Attacks
Memory Modes
Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready
Supports Windows 10 Requirements for Secure Flash, UEFI v 2.6 Device Guard Support Spec
UEFI
Unified Extensible Firmware Interface v2.7
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v6.1
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot
El Torito Bootable CD-Rom Format Specification, v1.0
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI
NA (No PCI slot)
PCI Express
PCI Express Base Specification v3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification v2.0
UHCI
Universal Host Controller Interface Design Guide, Revision v1.1
USB
Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v3.2.1
XHCI
XHCI SPEC Revision v1.2
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
Not Available
Safety, EMC Connection to the Telephone Network and Labeling
Not Applicable, no Connection to a Telephone Network
System Software Manager
Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage
EMC & Safety
FCC DoC for North America
VCCI Certification for Japan
BSMI Certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330)
UL-GS(P920,P720,P520,P520c), TUV-GS(P330)
IEC60950-1 CB Report/Certificate
Saudi Arabia SASO
Kuwait KUCAS
China CCC Mark
Hong Kong SAR (CB report)
Singapore PSB
South Africa SABS
Russia-EAC
Morocco-CM
Mexico-NOM
Kazakhstan-EAC
Belarus-EAC
Serbia KVALITET
Ukraine UKrCEPRO
India-BIS
USA Chemical Emission Test
Energy Star
ENERGY STAR® v7.0
EPEAT
EPEAT Certification Available on Select Models
ErP Lot-3 2013
Yes
Hazardous Substances
• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week