ThinnkPad P52

Version: 1 | 06/17/2020

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Hardware Maintenance Manual

Drivers & Software

SECTION I: SYSTEM OVERVIEW

Description

The ThinkPad® P52 sets the standard for mobile workstations,
combining the legacy of ThinkPad build-quality and cutting-edge
technology. Flexible and powerful enough to offer increased
performance within traditional ISV workflows, AR and VR content
creation, or deployment of mobile AI, users now have legendary
ThinkPad build-quality combined with pioneering technology.
The addition of the new NVIDIA® Quadro® P3200 GPU and
Intel® Xeon® hexa-core CPU, along with a 100% Adobe color gamut
4K UHD display, double the memory and increased PCIe storage,
delivers next-level power and performance in a compact 15-inch
chassis.
The ThinkPad® P52 protects your work and your investment by
adding multiple layers of both biometric and encryption security
enhancements.
With a mix of ports supporting all your needs, the addition of a
second Thunderbolt port supports the display of 8K video and now
allows users to take advantage of the ThinkPad® Thunderbolt
Workstation Dock.

CPU

Processor Support

Intel 8th gen Coffee Lake H Series Core i7
Intel 8th gen Coffee Lake H Series Core i9
Intel 8th gen Coffee Lake H Series Xeon

Socket Type

BGA

Operating Systems

Preloaded

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Windows 10 Home 64-bit
Windows 10 Single Language Home 64-bit
Windows 10 Home Chinese Language Edition 64-bit
Ubuntu Linux
No Operating System

Supported

Windows 10 Pro 64-bit for Workstations
Windows 10 Pro 64-bit
Windows 10 Home 64-bit
Windows 10 Single Language Home 64-bit
Windows 10 Home Chinese Language Edition 64-bit
Ubuntu Linux
No Operating System

Memory

Number of DIMM Slots

Up to 4 DIMM sockets: Top x2; Bot x2

Channels

Single Channel w/ 1DIMM
Dual Channel w/ 2DIMMs

Type

DDR4, SO-DIMM, ECC non-ECC

ECC Support

Yes

Speed

Up to 2666 MHz

Max DIMM Size

32GB

Max System Memory

128GB

Min System Memory

8GB

Soldered Memory

None

Storage

Storage Slots

3 slots

SATA

1x 2.5″ SATA HDD

PCIe

Solid State Drive, OPAL2 PCIe-NVMe M.2 2280-S3 – TLC

SAS

HDD
500GB 7200
1TB 7200
2TB 5400
SSD
256GB OPAL2 TLC PCIe-NVMe
512GB OPAL2 TLC PCI2-NVMe
1024GB OPAL2 TLC PCIe-NVMe
512GB OPAL2 MLC PCIe-NVMe
16GB Optane PCIe M.2

Interface

500GB FIPS140-2 7200rpm 7mm

Security

Optional, Selectable in BIOS

Optional Hard Disk Drive Controllers

RAID 0/1

Video

Integrated Graphics

For Intel® i7-8750H
Processor Graphics Intel® UHD Graphics 630
Utilized via “Hybrid Mode” in BIOS

For Intel® i7-8850H
Processor Graphics Intel® UHD Graphics 630
Utilized via “Hybrid Mode” in BIOS

For Intel® i9-8950HK
Processor Graphics Intel® UHD Graphics 630
Utilized via “Hybrid Mode” in BIOS

For Intel® Xeon® E-2176M Processor
Processor Graphics Intel® UHD Graphics P630
Utilized via “Hybrid Mode” in BIOS

Discrete Graphics

NVIDIA Quadro P1000, P2000, P3200

Adapter

None

Bus Interface

PEG

Display

Resolutions

FHD / UHD

Camera

Resolution

HD 720p / IR Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes

Keyboard

Number of Keys

US : 105 / UK : 106 / JP : 110

Numpad

Yes

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

Como 2018 Full size KB with NumPad (Top loading)

Key stroke

1.8mm

Key pitch

19.05 mm(Vertical & Horizontal)

Keyboard backlight

Optional

Keyboard thickness

4.55mm

Touchpad / Fingerprint Reader

TrackPoint Details

COMO TrackPoint module (t5.55mm)

Finger Print Reader Model

Synaptics Metallica 8×8 FPR, MoC

Multi-Touch

Yes

Resolution

1000 ppi

TouchPad/Trackpad thickness

0.8mm +/- 0.1mm

TouchPad/Trackpad type

TouchPad

Trackpad size

99mm x 58.4mm

Trackpad material/finish

Mylar surface

I/O – Ports and Connectors

USB

3 x USB 3.0 (1x Powered)

Thunderbolt

Thunderbolt 3, 2 ports (USB Type-C)

HDMI

1x HDMI (2.0), DP1.4

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated Media Card Reader (UHS-II)

Smart Card Reader

1x Smart Card Reader

Power Connector

DC-In

Docking Port

Docking Via Thunderbolt 3 / USB-C

VirtualLink

None

Network adapter

Gigabit Ethernet (RJ45)

Power Connector

Main

DC-In

USB-C

2x Thunderbolt 3 (USB-C/DP/PD)

Ethernet

Vendor

Intel

Count

x1

EEPROM

BIOS/MEFW SPI ROM
TBT FW SPI ROM

Speeds

10/100/1000 Mbps

Functions

Wake On LAN
MAC Address Pass Through
PXE Boot
Flash Over LAN

Connectors

RJ45

WWAN

Model

M.2 3042 S3 (optional)
Fibocom L850 LTE, UMTS/HSPA+
US,CA: Sierra EM7565 LTE (HSPA+/GSM/EDGE)
EMEA: Sierra EM7565 LTE (HSPA+/GSM/EDGE)
ANZ: Sierra EM7565 LTE (HSPA+/GSM/EDGE)

Near Field Communications

Model

Foxconn P/N T77H747.01 (NXP NPC300)

Audio

Vendor

Realtek

Type

Intel High Definition Audio (2 channel)

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3286

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1K/48K/96K/192KHz sample rate

Signal to Noise Ratio

Mic In: 95dB FSA
Headphone Out@32ohm: 100dB FSA

Analog Audio

None

Dolby Digital

Dolby DAX3

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Power adapter

Type

170W AC Adapter

Dimensions

350cc (155 x 76 x 30)

Input Voltage

100-240V

Security

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Chassis Information

Format

Clamshell

Color

Midnight Black

Thermal Solutions

Internal Dual FAN, Intelligent Cooling

Dimensions

Length
14.86 inches
377.4 millimeters

Width
9.93 inches
252.3 millimeters

Height
0.96 inches (front)
24.5mm (front)
1.16 inches (rear)
29.4mm (rear)
1.29 (rear w/ feet)
32.7mm (rear w/ feet)

Weight

with 6 cell 90WHr Battery, Min 5.4 lbs / 2.45kg Max 5.98 lbs/2.715 kg

Packaging Parameters

Height (mm)

341

Width (mm)

97

Depth (mm)

493

Security & Serviceability

Self Healing BIOS

No

Access Panel

Removeable bottom cover

Number of Screws

See Hardware Maintenance Manual for Details

Swappable Components

Bottom cover, memory module, M.2 solid-state drive, speaker assembly, coin-cell battery, TrackPoint pointing cap, keyboard, WLAN Card, WWAN Card, Power Button Cable, Hinge Caps, LCD Unit, Chassis Assembly, Dummy Smart Card Reader, System Board,

Storage Slots

3 slots

Memory

4 SODIMM slots

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

None

Security Chip

Yes (for TMP 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating Environment

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

SECTION II: SUPPORTED COMPONENTS

Supported Components

Processor

Intel® Core™ i7-8750H processor (2.2 GHz/6 Core/9M)
Intel® Core™ i7-8850H vPro processor (2.6 GHz/6 Core/9M/V-Pro)
Intel® Core™ i9-8950HK processor (2.9 GHz/6 Core/12M/)
Intel® Xeon™ E-2176M v7 vPro processor (2.7 GHz/6 Core/12M/V-Pro)

Memory Support

DDR4 2666MHz SO-DIMM

Chipset (PCH)

Mobile Intel® CM246 Chipset

Size of BIOS Flash

8MB for Non-vPro model, 16MB for vPro model

Super I/O

None

Clock

Crystal

Audio

Realtek High Definition Audio

Ethernet

Intel® Ethernet Connection I219

Memory

System Capacity Options

8GB
16GB
32GB
64GB
128GB

non-ECC

8GB DDR4 2666 SoDIMM
16GB DDR4 2666 SoDIMM
32GB DDR4 2666 non-ECC SoDIMM

Brand of non-ECC Memory

Samsung
SK Hynix
Micron

ECC

8GB DDR4 2666 ECC SoDIMM
16GB DDR4 2666 ECC SoDIMM
32GB DDR4 2666 ECC SoDIMM

Brand of ECC Memory

SK Hynix
Samsung

Memory clock frequency(MHz)

2666 MHz

Storage

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

500GB 7200rpm 7mm HDD
1TB 7200rpm 7mm HDD
2TB 5400rpm 7mm HDD
500GB FIPS140-2 7200rpm 7mm

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

256GB SATA (M.2 2280)
256GB Opal 2 PCIe TLC NVMe 3X2 (M.2 2280)
512GB Opal 2 PCIe TLC NVMe 3X2 (M.2 2280)
512GB Opal 2 PCIe MLC NVMe 3X2 (M.2 2280)
1TB Opal 2 PCIe TLC NVMe 3X2 (M.2 2280)
2TB Opal 2 PCIe TLC NVMe 3X2 (M.2 2280)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Seagate
Samsung
Toshiba
Intel

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Removeable Media

Media Card Reader Specifications

UHS-II

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel® Core™ i7-8750H processor (2.2 GHz/6 Core/9M)

Intel® Core™ i7-8850H vPro processor (2.6 GHz/6 Core/9M/V-Pro)

Intel® Core™ i9-8950HK processor (2.9 GHz/6 Core/12M/)

Intel® Xeon™ E-2176M v7 vPro processor (2.7 GHz/6 Core/12M/V-Pro)

Integrated Graphics

Intel® UHD Graphics 630

Intel® UHD Graphics 630

Intel® UHD Graphics 630

Intel® UHD Graphics 630

# of Cores

6

6

6

6

# of Threads

12

12

12

16

Processor Base Frequency

2.20 GHz

2.60 GHz

2.90 GHz

2.70 GHz

Max Turbo Frequency

4.10 GHz

4.30 GHz

4.80 GHz

4.40 GHz

Cache

9 MB

9 MB

12 MB

12 MB

TDP

35 – 45 W

35 – 45 W

45 W

35 – 45 W

Display Specifications

Model

FHD

UHD with Touch

Resolution

FHD (1920 x 1080)

4K UHD (3840 x 2160)

Diagonal

15.6″

15.6″

Aspect Ratio

Ratio 16:9

Ratio 16:9

Backlight

LED

LED

PPI

FHD : 141

UHD : 282

Active Area

FHD : 344.16mm x 193.59mm

UHD : 344.2176mm x 193.6224

Refresh Rate

Max 60Hz

Max 60Hz

Contrast Ratio

FHD : Typ 700

UHD : Typ 1000

Viewing Angle (*1)

FHD: 80/80/80/80 degree

UHD: 85/85/85/85 degree

Color gamut

FHD 72% NTSC

UHD 100% Adobe

Brightness

250 nits for FHD w/o touch

300 nits for UHD w/ touch (LCD itself brightness is 400 nits)

Color Depth

FHD: Native 262K (RGB 6-bit + FRC)

UHD: Native 16M (RGB 8-bit data driver)

Interface

FHD: eDP 1.2

UHD: eDP 1.3

Panel ID Recognition

EDID in BIOS Table

EDID in BIOS Table

Weight

FHD: 360g

UHD: 370g

Color Calibrator

None

None

Panel Technology

IPS, Matte

IPS, Anti-Glare

Touch Panel

None

10-Finger Touch Panel with Pen Controller, Wacom. Pen Tilt support.

HDD Specifications

2.5″ SATA Hard Disk Drive (HDD)

Yes

HDD Storage Device Specifications

Connector

SATA

Transfer Rate (Gb/sec)

6.0Gb/s

HDD Performance

Spindle Speed(RPM)

5400RPM&7200RPM

Power off to Spindle Stop(sec)

10 max

DC Power to Drive Ready(sec)

No Power to ATA Command Accept(seconds)
500G/1TB(1 Platter) – 3
2TB(2 Platter) – 4

Receipt of Start Unit Command to Drive Ready(sec)

Standby to Ready(seconds) 3 Max
Unloaded to Ready(seconds) 1 Max

Average Latency(msec)

10 Max

HDD Power Management

Input (VDC)

12V

Typical (Watts)

  5400–> 5.0, 7200–> 5.5 (Spind up)(Max)

Idle (Watts)

  5400–> 1.1, 7200–> 1.3 (Typcial)

HDD Dimensions

Height (mm – Max)

7.0 +/- 0.2

Width (mm)

69.85 +/- 0.25

Depth (mm – Max)

100.2 +/- 0.25

Weight (grams)

5400rpm – 95 Max
7200rpm – 95 Max

HDD Temperature

Operating(C) Ambient

0 to 55

Operating(C) Base Casting

Surface Temperature (disk enclosure side):
60C for 5400RPM
63C for 7200RPM
Surface Temperature (card side of device):
63C

Non-Operating(C) Ambient

-40 to 65

Gradient(C per Hour)

20 max

HDD Shock

Operating(Gs @ 2ms)

350

Non-Operating(Gs @ 2ms)

N/A (1000G/1ms)

SSD Specifications

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280 PCIe & SATA

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Solid State Storage Devices

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280

Interface Type

PCIe NVMe

Read/Write IOPS Specifications

Read: 250K (512GB/1TB/2TB), 200K (256GB)
Write: 240K (512GB/1TB/2TB), 190K (256GB)
IOPS, 4K Random, 32 q depth, 4 threads

Bandwidth Performance

PCIe Gen3x4 (8Gb/S)

Power Consumption (Max)

5.0W

Active(AVG)

5.0W (Sequential read)

Idle

5mW (Low power state)

Min MTBF

2,000,000 (h)

Min Sequential Read

3000MB/s (512GB/1TB/2TB), 2900MB/s (256GB)

Min Sequential Write

1600MB/s (512GB/1TB/2TB), 900MB/s (256GB)

Hardware Encryption

Yes

Discrete Graphics Adapter

GPU Name

Quadro P1000

Quadro P2000

Quadro P3200

CUDA Processing Cores

512

768

1792

GPU Memory

4 GB

4 GB

6 GB

Memory Bandwidth

96 GBps

96 GBps

169 GBps

Memory Type

GDDR5

GDDR5

GDDR5

Memory Interface

128-bit

128-bit

192-bit

TGP Max Power Consumption

40W

50W

78W

Display Port

1.4

1.4

1.4

OpenGL

4.5

4.5

4.5

Shader Model

5

5

5.1

DirectX

12

12

12

PCIe Generation

3

3

3

Floating-Point Performance

1.6

2.4

5.3

VR Ready

No

No

Yes

Simultaneous Multi-Projection

Yes

Yes

Yes

NVIDIA FXAA/TXAA Antialiasing

Yes

Yes

Yes

NVIDIA nView Display Management Technology

Yes

Yes

Yes

GPU Direct for Video

No

No

No

Vulkan Support

Yes

Yes

Yes

NVIDIA Optimus

Yes

Yes

Yes

WLAN

Model

Intel Wireless AC-9560 (2×2 11ac w/ 160MHz channels) and Bluetooth 5.0 vPro

Connector: Main, Aux/GNSS, GNSS

ANT1: Wi-Fi (chain A) + BT; ANT2: Wi-Fi (chain B)

Antenna Diversity

Supported

MIMO

Supported

GNSS Bian

N/A

Radio ON/OFF Control

Supported

Connector interface

M.2 CNVio

Operating Temperature (Adapter Shield)

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 10*, Linux*(limited feature support), Chrome*

Wi-Fi Alliance

Wi-Fi CERTIFIED* a/b/g/n/ac with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Miracast* as Source, and Wi-Fi Direct (For Microsoft Windows* only)

IEEE WLAN Standard

IEEE 802.11a/b/g/n/ac, 802.11d,802.11e, 802.11h, 802.11i, 802.11w, 802.11r, 802.11k, 802.11v, pending OS support; Fine Timing Measurement based on 802.11-2016

Roaming

Support seamless roaming between access points

Bluetooth*

BT5.0

Authentication

WPA* and WPA2*, 802.1X (EAP-TLS, TTLS, PEAP, EAP-SIM, EAP-AKA, EAP-AKA’)

Authentication Protocols

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

Encryption

64-bit and 128-bit WEP, TKIP, 128-bit AES-CCMP, 128-bit and 256-bit AES-GCMP

Regulatory

All compliance

US Government

FIPS12, FISMA

Product Safety

UL,C-UL,CB (IEC 60950-1)

Battery

Dimension

L: 82.4mm*W: 206mm*T 17.73mm

Weight

MAX 460g

Type (Chemistry and Cell)

Li-Polymer (3S2P), 6-cell

Voltage

11.25V

Battery Life

Up to 6.1 Hr+ MM14 Max battery life (dGPU mode, max battery config.)
Up to 8.9 Hr+ MM14 Max battery life (Optimus mode, max battery config.)

Battery Capacity

90Wh

Charging Time

No Quick charge capability
On Charge Time (0- 100%) * 131min
Off Charge Time (0 – 80%) ** 65 min
Off Charge Time (0 – 100%) ** 125 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year

Coin Cell Battery (Model)

CR2032-J056(MHLF)

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

N/A

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

Yes

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

Yes, if Remote wakeup is Wake on LAN from S4/S5.
I don’t know the Remote shutdown situation.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

N/A

EMC & Safety

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories

Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Izod Test – EPEAT Compliant

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Environmentals

Energy Star

ENERGY STAR® Version 7.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Manageability

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

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