P16v i Gen 2

Product Name

P16v i Gen 2

Product Display Name

P16v i Gen 2

Information Date

23-Apr-24

Description

Built for power users who require the flexibility of working anywhere at anytime, the Lenovo ThinkPad P16v i Gen 2 closes the gap in price and performance between entry-level and high-end workstations and offers the power you need to handle large workflows and multitask with ease.

Processor Support

Intel Core Ultra Meteor Lake H Series (45W) Core 7 and 9

Socket Type

BGA

Preloaded

Windows 11 Pro 64-bit (23H2)
Windows 11 Home 64-bit (23H2)
Windows 11 Home Single Language 64-bit (23H2)
Windows 11 Home Chinese Language (PRC only) 64-bit (23H2)
Ubuntu Linux 64-bit (Version 22.04 LTS)
No Operating System

Supported

Ubuntu Linux 22.04 Cert
Red Hat Enterprise Linux (RHEL) 9.4

Number of DIMM Slots

Up to 2 SoDIMM sockets

Channels

Single Channel w/ 1DIMM
Dual Channel w/ 2DIMMs

Type

DDR5 SoDIMM

ECC Support

No

Speed

Up to 5600MHz

Max DIMM Size

48GB

Max System Memory

96GB

Min System Memory

8GB

Soldered Memory

None

Disclaimers

No ECC memory on P16v i Gen 2

Storage Slots

2 x M.2 2280

SATA

No

PCIe

Solid State Drive, OPAL2 PCIe-NVMe M.2 2280S3 – TLC

SAS

No

Interface

PCIe

Security

OPAL

Optional Hard Disk Drive Controllers

No

Disclaimers

Dual slot storage is available with all CPU & GPU options

Integrated Graphics

Processor Graphics Intel® Arc Graphics
Utilized via “Hybrid Mode” in BIOS

Discrete Graphics

NV RTX 500 Ada, 1000 Ada, 2000 Ada, 3000 Ada

Adapter

None

Bus Interface

PCI Express 4.0

Resolutions

WUXGA (FHD+) / WQUXGA (UHD+)

Resolution

FHD 1080p or 5MP+IR Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes

Number of Keys

US : 105 / UK : 106 / JP : 110

Numpad

Yes

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

CS23 KYB with numberpad

Key stroke

1.5mm

Key pitch

19.05mm

Keyboard backlight

Yes

Keyboard thickness

Standard

TrackPoint Details

CS22 TL TrackPoint (t=4.8mm)

Finger Print Reader Model

9.45*3.29 FPR, MoC with LED

Multi-Touch

Yes

Resolution

1000 ppi

TrackPad/TouchPad thickness

3.4mm

TrackPad/TouchPad type

TrackPad

TrackPad size

115mm x 67.6mm

TrackPad material/finish

Glass like mylar surface

USB

1x USB-A (5Gbps)

Thunderbolt

2x USB-C® (Thunderbolt™ 4)

HDMI

1x HDMI 2.1

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated SD Express 7.0 Card Reader (Backwards compatible with UHS-I & UHS-II) (MMC,SD,SDHC SDXC)

Smart Card Reader

Yes (optional)

Power Connector

DC-In

Docking Port

Docking Via USB-C® (Thunderbolt™ 4)

VirtualLink

None

Network adapter

Full size RJ-45 port

Disclaimers

HDMI 2.1: Up to 8K/60Hz

Main

DC-In

USB-C

1x USB-C® (Thunderbolt™ 4)

Vendor

Intel

Count

1

EEPROM

No

Speeds

1G

Functions

Ethernet Connection I219

Connectors

Full size RJ-45 port

Model

4G: Quectel EM160R-GL w/ QC X24 4G LTE CAT16
5G: Quectel RM520N-GL w/ QC SDX62 sub-6GHz

Disclaimers

WWAN support country dependent

Model

Foxconn NXP NPC300 NFC

Vendor

Realtek

Type

Intel High Definition Audio

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3287

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1K/48K/96K/192KHz sample rate

Signal to Noise Ratio

Mic In: 90dB FSA
Headphone Out@32ohm: 97dB FSA

Analog Audio

None

Dolby Digital

Dolby Audio Premium SW Support

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Type

Slim 135W AC Adapter

Slim 170W AC Adapter

Dimensions

(126 x 77 x 22mm)

(150 x 77 x 22mm)

Weight

Max 370g

Max 385g

Input Voltage

100-240V

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Format

Clamshell

Color

Black

Thermal Solutions

Internal Dual FAN, Intelligent Cooling

Dimensions

Length
14.37 inches
365.00 millimeters

Width
10.32 inches
262.00 millimeters

Height
0.97 inches
24.66 millimeters

Weight

4.90lbs/2.22kg

Height (mm)

26.5, MKT : 24.66

Height (inch)

1.04, MKT : 0.97

Width (mm)

356

Width (inch)

14.02

Depth (mm)

261.92

Depth (inch)

10.32

Weight (kgs)

start from 2.26 kg

Weight (lbs)

start from 4.99 lbs

Hardware Maintenance Manual

P16v Gen 2 HMM

must add link

Drivers & Software

P16v Gen 2 Drivers & Software

must add link

Self Healing BIOS

Yes

Access Panel

Removeable bottom cover

Number of Screws

9

Swappable Components

Bottom cover, memory module, M.2 solid-state drive, speaker assembly, coin-cell battery, TrackPoint pointing cap

Storage Slots

2 slots

Memory

2 SoDIMM slots

System Board

FR4

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

Yes

Security Chip

Yes (for TMP 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

Processor

Intel® Core™ Ultra 7 155H processor (E-cores up to 3.8 GHz P-cores up to 4.8 GHz)
Intel® Core™ Ultra 7 165H processor (E-cores up to 3.8 GHz P-cores up to 5.0 GHz)
Intel® Core™ Ultra 9 185H processor (E-cores up to 3.8 GHz P-cores up to 5.1 GHz)

Memory Support

DDR5 5600MHz SoDIMM

Chipset (PCH)

None

Size of BIOS Flash

64MB

Super I/O

None

Clock

Crystal

Audio

Realtek High Definition Audio

Ethernet

Full size RJ-45 port

System Capacity Options

8GB
16GB (16GB*1 or 8GB*2)
32GB (32GB*1 or 16GB*2)
48GB
96GB (48GB*2)

Memory Types

8GB DDR5 5600MHz SoDIMM
16GB DDR5 5600MHz SoDIMM
32GB DDR5 5600MHz SoDIMM
48GB DDR5 5600MHz SoDIMM

Brand of Memory

Samsung
SK Hynix
Micron
Ramaxel

Memory clock frequency(MHz)

Up to 5600MHz

Disclaimers

No ECC memory on P16v i Gen 2

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

256GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
512GB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Value TLC (M.2 2280-S3)

512GB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)
2TB OPAL2 PCIe 4×4 Performance TLC (M.2 2280-S3)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
Micron
Hynix
Kioxia
Union Memory

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Media Card Reader Specifications

SD Express 7.0 UHS-II

CPU

Intel® Core™ Ultra 7 155H processor (E-cores up to 3.8 GHz P-cores up to 4.8 GHz)

Intel® Core™ Ultra 7 165H processor (E-cores up to 3.8 GHz P-cores up to 5.0 GHz)

Intel® Core™ Ultra 9 185H processor (E-cores up to 3.8 GHz P-cores up to 5.1 GHz)

Integrated Graphics

Intel® Arc Graphics

# of Cores

6 P-cores and 8 E-cores

# of Threads

22

Processor Base Frequency

P-cores up to 1.4 GHz / E-cores up to 900 MHz

P-cores up to 2.3 GHz / E-cores up to 1.8 GHz

Max Turbo Frequency

E-cores up to 3.8 GHz / P-cores up to 4.8 GHz

E-cores up to 3.8 GHz / P-cores up to 5.0 GHz

E-cores up to 3.8 GHz / P-cores up to 5.1 GHz

Cache

24 MB

TDP

45 W

Model

WUXGA Non-Touch

WUXGA On-Cell Touch

WUXGA Non-Touch

WQUXGA Non-Touch

Resolution

FHD+ (1920 x 1200)

UHD+ (3840 x 2400)

Diagonal

16″

Aspect Ratio

Ratio 16:10

Backlight

LED

PPI

141.5 (Pixel Pitch:0.17952mm x 0.17952mm )

283 (Pixel Pitch: 0.09mm x 0.09mm)

Active Area

344.68 x 215.42

344.678 x 215.424

Refresh Rate

60Hz

60 Hz

60Hz

Contrast Ratio

800:1 (TYP)

1200:1 (TYP)

1400:1 (TYP)

Viewing Angle (*1)

85/85/85/85 degree

Color gamut

45% NTSC

100% sRGB

100% DCI-P3

Brightness

300nit

400nit

800nit, HDR 400

Color Depth

16.7M

1064M

Interface

eDP 1.2

eDP 1.4

Panel ID Recognition

EDID in BIOS Table

Weight

max 410g

Max 410g

max 325g

max 330g

Color Calibrator

None

X-Rite Factory Color Calibration

Panel Technology

IPS, Anti-Glare

Touch Panel

None

Yes

None

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280 PCIe

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Supported Types

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280 S3

M.2 2280-S3

Interface Type

PCIe NVMe

Read/Write IOPS Specifications

Read: 600K (2TB, 1TB),450K(512GB), 250K (256GB)
Write: 500K (2TB, 1TB,512GB), 400K (256GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Read: 700K (2TB), 600K(1TB),350K(512GB),
Write: 600K (2TB, 1TB,512GB)
IOPS, 4K Random, 8 threads, queue depth of 32, data set size of 1GB.

Bandwidth Performance

PCIe Gen4x4 Value

PCIe Gen4x4 Performance

Power Consumption (Max)

3.0A (duration for 10 us)

Active(AVG)

5W

8W

Idle

5mW (L1.2)

Min MTBF

2,000,000 (h)

Min Sequential Read

5000MB/s (2TB/1TB),4800MB/s (512GB),4000MB/s (256GB)

6400MB/s (2TB/1TB/512GB)

Min Sequential Write

4500MB/s (2TB), 4000MB/s (1TB/512GB), 2000MB/s (256GB)

5000MB/s (2TB), 4400MB/s (1TB), 4000MB/s (512GB),

Hardware Encryption

Yes

Laptop GPUs

NVIDIA RTX 500 Ada Laptop GPU

NVIDIA RTX 1000 Ada Laptop GPU

NVIDIA RTX 2000 Ada Laptop GPU

NVIDIA RTX 3000 Ada Laptop GPU

NVIDIA CUDA Processing Cores

2048

2560

3072

4608

NVIDIA RT Cores

16 (3rd Gen)

20 (3rd Gen)

24 (3rd Gen)

36 (3rd Gen)

Tensor Cores

64 (4th Gen)

80 (4th Gen)

96 (4th Gen)

144 (4th Gen)

GPU Memory

4GB

6GB

8GB

Peak Memory Bandwidth

128 GB/s

192 GB/s

256 GB/s

Memory Type

GDDR6

Memory Interface

64-bit

96-bit

128-bit

DisplayPort

1.4a

Open GL

4.6

Shader Model

7

DirectX

12 Ultimate

PCIe Generation

4

Single Precision Floating-Point Performance

9.2

12.1

14.5

19.9

Tensor Performance

147.4

193

231.6

318.6

NVIDIA FXAA/TXAA Anti-Aliasing

Yes

NVIDIA RTX Desktop Manager

No

Vulkan Support

Yes

NVIDIA Optimus

Yes

NVIDIA Max-Q Technology

Yes

NVENC/NVDEC

Yes

Model

Garfield Peak 2 Intel Wi-Fi 6E AX211 (Gig+) + BT5.3 (HW Ready)

Connector: Main, Aux/GNSS, GNSS

ANT1:AUX WiFi + BT; ANT2: Main WiFi

Antenna Diversity

Supported

MIMO

Supported

GNSS Bian

N/A

Radio ON/OFF Control

Supported

Connector interface

CNVi

Operating Temperature (Adapter Shield)

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Windows 11, 64-bit*,Microsoft Windows 10*, Linux*(limited feature support), Chrome*

Wi-Fi Alliance

Wi-Fi CERTIFIED* a/b/g/n/ac/ax with wave 2 features, WMM*, WMM-PS*, WPA*, WPA2*, WPS2*, Protected Management Frames, Wi-Fi Miracast* as Source, and Wi-Fi Direct (For Microsoft Windows* only)

IEEE WLAN Standard

IEEE 802.11a/b/g/n/ac/ax, 802.11d,802.11e, 802.11h, 802.11i, 802.11w, 802.11r, 802.11k, 802.11v, pending OS support; Fine Timing Measurement based on 802.11-2016

Roaming

Support seamless roaming between access points

Bluetooth*

Bluetooth 5.3 (HW Ready)

Authentication

WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM, EAP-AKA, EAP-AKA

Authentication Protocols

PAP, CHAP, TLS, MS-CHAP*, MS-CHAPv2

Encryption

64-bit and 128-bit WEP, 128-bit AES-CCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives.

US Government

FIPS, FISMA

Product Safety

UL,C-UL,CB (IEC 60950-1)

Disclaimers

1) 6GHz channel of Wi-Fi 6E is only available with Windows 11
2) Bluetooth may be limited by OS

Dimension

L: 312mm*W: 58.8mm*T 9.4mm

Weight

MAX 349.75g

Type (Chemistry and Cell)

Li-Polymer (4S1P), 4-cell

Voltage

15.52 V

Battery Capacity

90Wh

Charging Time

On Charge Time (0- 100%) * 117 min
Off Charge Time (0 – 80%) ** 56 min
Off Charge Time (0 – 100%) ** 115 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2032

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

No

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A

Remote Wakeup/Remote Shutdown

Only support WOL when system is connected with Dock.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

N/A

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – China
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – South Korea
EMC – Taiwan
EMC – USA/Territories
Not Applicable / Not Required
EMC – Israel
EMC – Moldova
EMC – Serbia
EMC – Turkey
EMC – Uzbekistan
EMC – Vietnam

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Energy Star

ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Silver Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at: https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am â€“ 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Materials Used

90% Recycled Magnesium C Cover
85% PCC Plastic Key Caps on Keyboard
90% PCC Plastic Speaker Enclosure
90% PCC Plastic Battery Pack Enclosure
30% PCC Plastic SIM Tray
30% PCC Plastic 135W Slim AC Adapter
30% PCC Plastic 170W Slim AC Adapter
Low Temperature Solder (SSD, memory, fingerprint reader module, TrackPad)
Plastic free packaging with 90% recycled and/or FSC certified content (standard)

TCO Certification

TCO 9.0

Disclaimers

1. EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.
2. Product packaging shall contain, on average, a minimum total percentage of 90% by weight of any combination of the following materials: Recycled content, biobased plastic, non-wood biobased fiber material, and/or sustainably forested material

Table of Contents

SECTION I: SYSTEM OVERVIEW

CPU

Operating Systems

Memory

Storage

Video

Display

Camera

Keyboard

TrackPad / Fingerprint Reader

I/O – Ports and Connectors

Power Connector

Ethernet

WWAN

Near Field Communications

Audio

Power adapter

Security

Chassis Information

Packaging Parameters

Security & Serviceability

Operating Environment

SECTION II: SUPPORTED COMPONENTS

Supported Components

Memory

Storage

Removeable Media

SECTION III: Supported Component Detail

Display Specifications

SSD Specifications

Solid State Storage Devices

Discrete Graphics Adapter

WLAN

Battery

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

EMC & Safety

Environmentals

Manageability