ThinkPad P1 Gen 4

Version: 2.0 | 05/21/2024

SECTION I: SYSTEM OVERVIEW

Description

Reimaged with the user in mind, the ThinkPad ® P1 Gen 4 is the perfect combination of workstation know how, ultra premium design, and true mobility, without sacrificing looks for power.

Hardware Maintenance Manual

X

Drivers & Software

X

CPU

Processor Support

Intel 11th gen Tiger Lake H Series Core i7, i9, and Xeon

Socket Type

BGA

Operating Systems

Preloaded

Windows 10 Pro 64-bit for Workstations (20H2)
Windows 10 Pro 64-bit (20H2)
Windows 10 Home 64-bit (20H2)
Windows 10 Single Language Home 64-bit (20H2)
Ubuntu 64-bit (Version 20.04 LTS, running the 4.15.0-1039-oem kernel)
No Operating System
Windows 10 China Government Edition

Supported

Windows 10 Pro 64-bit for Workstations (20H2)
Windows 10 Pro 64-bit (20H2)
Windows 10 Home 64-bit (20H2)
Windows 10 Single Language Home 64-bit (20H2)
Ubuntu Linux 64-bit (Version 20.04 LTS, running the 4.15.0-1039-oem kernel)
Red Hat (RHEL) 8.4
No Operating System
Windows 10 China Government Edition

Memory

Number of DIMM Slots

2 DIMM sockets

Channels

Single Channel w/ 1DIMM
Dual Channel w/ 2DIMMs

Type

DDR4 SO-DIMM, ECC / non-ECC

ECC Support

Yes

Speed

Up to 3200 MHz on Non-ECC Memory
Up to 3200 MHz on ECC Memory

Max DIMM Size

32GB

Max System Memory

64GB

Min System Memory

8GB

Soldered Memory

None

Storage

Storage Slots

2x M.2 2280-S3 (with UMA, NV T1200, RTX A2000)
1x M.2 2280-S3 (with NV RTX A3/4/5000, GF RTX 3070/80)

SATA

None

PCIe

Solid State Drive, 2x OPAL2 PCIe-NVMe M.2 2280-S3 – TLC

SAS

None

Interface

PCIe Gen 4 or Gen 3

Security

OPAL2 for NVMe SSD

Optional Hard Disk Drive Controllers

None

Disclaimers

NV RTX A3/4/5000 or GF RTX 3070/80 cannot be configured with dual storage

Video

Integrated Graphics

For Intel® i7-11800H
Processor Graphics Intel® UHD Graphics
Utilized via “Hybrid Mode” in BIOS

For Intel® i7-11850H vPro
Processor Graphics Intel® UHD Graphics
Utilized via “Hybrid Mode” in BIOS

For Intel® i9-11950H vPro
Processor Graphics Intel® UHD Graphics
Utilized via “Hybrid Mode” in BIOS

For Intel® Xeon® W-11855M vPro
Processor Graphics Intel® UHD Graphics
Utilized via “Hybrid Mode” in BIOS

Discrete Graphics

NVIDIA T1200, NVIDIA RTX A2000, NVIDIA RTX A3000, NVIDIA RTX A4000, NVIDIA RTX A5000
NVIDIA GeForce RTX 3070, NVIDIA GeForce RTX 3080

Adapter

None

Bus Interface

PEG

Display

Resolutions

WQXGA (QHD+) / WQUXGA (UHD+)

Camera

Resolution

FHD 1080p / IR Camera

Frames per Second

30 fps

Focus

Fixed 50cm

Camera Interface

USB 2.0

IR Camera

Yes, On Select Model

Keyboard

Number of Keys

US : 84 / UK : 85 / JP :89

Numpad

No

Size

100% ISO

Function Key Features

Yes

Backlit

Yes

Keyboard size

Como 2021 Full size KB without NumPad (Bottom loading)

Key stroke

1.5mm

Key pitch

19.05 mm (Vertical & Horizontal)

Keyboard backlight

Yes

Keyboard thickness

4.55mm

Touchpad / Fingerprint Reader

TrackPoint Details

COMO TrackPoint module (t5.55mm)

Finger Print Reader Model

Synaptics Metallica 8×8 FPR, MoC – integrated with Power button

Multi-Touch

Yes

Resolution

1000 ppi

TouchPad/Trackpad thickness

3.3mm

TouchPad/Trackpad type

2 Buttons Clickpad

Trackpad size

115mm x 67.6mm

Trackpad material/finish

Glass surface

I/O – Ports and Connectors

USB

2x USB-A 3.2 (Gen1) (1 powered)

Thunderbolt

2x Thunderbolt 4 (USB-C/DP/PD)
(DP 1.4 for discrete, DP 1.2 for integrated graphics)

HDMI

1x HDMI (2.1/2.0)

Audio Combo Jack

1x Microphone & Headphone Combo Jack (3.5mm)

Media Card Reader

Dedicated MicroSD Card Reader (UHS-II) (MMC,SD,SDHC SDXC)

Smart Card Reader

None

Power Connector

DC-In

Docking Port

Docking Via Thunderbolt 4 / USB-C

VirtualLink

None

Network adapter

RJ-45 via USB-C to Ethernet Adapter

Disclaimers

NV T1200 or Intel UMA come with HDMI 2.0
NV RTX A2/3/4/5000 or GF RTX 3070/80 come with HDMI 2.1

Power Connector

Main

DC-In

USB-C

2x Thunderbolt 4 (USB-C/DP/PD)

Ethernet

Vendor

N/A

Count

N/A

EEPROM

N/A

Speeds

N/A

Functions

N/A

Connectors

RJ-45 via USB-C to Ethernet Adapter

WWAN

Model

Qualcomm Snapdragon X55 5G CAT20 (On Select Model)
Quectel EM05CEFC 4G LTE CAT4 (PRC only)

Disclaimers

NV RTX A3/4/5000 or GF RTX 3070/80 cannot be configured with WWAN
Not WWAN-Ready

Near Field Communications

Model

No NFC Support

Audio

Vendor

Realtek

Type

Intel High Definition Audio (2 channel)

Internal Speaker

2 channel

Connectors

Microphone & Headphone Combo Jack (3.5mm)

Chipset

ALC3306 w/ Smart Amp

Number of Channels

4-channel DAC, 4-channel ADC

Number of Bits/Audio Resolution

16/20/24-bit PCM format

Sampling Rate (Recording/Playback)

44.1k/48k/96k/192kHz sample rate

Signal to Noise Ratio

Mic In: 95dB FSA
Headphone Out@32ohm: 100dB FSA

Analog Audio

None

Dolby Digital

Dolby ATMOS

Digital Out (S/PDIF)

No

Speaker Power Rating

2W@4ohm/ch

Power adapter

Type

Slim 135W AC Adapter

Slim 170W AC Adapter

Slim 230W AC Adapter

Dimensions

200cc (118 x 77 x 22mm)

240cc (142 x 77 x 22mm)

353cc (160 x 87 x 25.4mm)

Weight

Max 370g

Max 475g

Max 815g

Input Voltage

100-240V

100-240V

100-240V

Security

TPM

Version 2.0

Asset ID

Yes

vPro

Intel vPro for WS

Chassis Information

Format

Thin-Light

Color

Deep Black
Carbon Fiber Weave (for UHD+ only)

Thermal Solutions

Internal Dual FAN, Intelligent Cooling
Vapor Chamber (for NV RTX A3/4/5000 or GF RTX 3070/80)

Dimensions

Length
14.15 inches
359.5 millimeters

Width
9.99 inches
253.8 millimeters

Height
Non-Touch
0.69 inches
17.7 millimeters
Touch
0.71 inches
18.2 millimeters

Weight

Non-Touch Model: 4 Cell Battery 1.81kgs/3.99lbs
Touch Model: 4 Cell Battery 1.86kgs/4.10lbs

Packaging Parameters

Height (mm)

235

Height (inch)

9.25

Width (mm)

531

Width (inch)

20.9

Depth (mm)

80

Depth (inch)

3.14

Weight (kgs)

Standard:3.4kgs / Retail:4.1kgs

Weight (lbs)

Standard:7.49lbs / Retail:9.03lbs

Security & Serviceability

Hardware Maintenance Manual

P1 Gen 4 HMM

Drivers & Software

P1 Gen 4 Drivers & Software

Self Healing BIOS

Yes

Access Panel

Removable bottom cover

Number of Screws

7

Swappable Components

Bottom cover, memory module, M.2 solid-state drive, coin-cell battery, TrackPoint pointing cap, SIM Tray

Storage Slots

2 slots

Memory

2 SODIMM slots

Restore CD/DVD/USB Set

None, Restore Media available via Lenovo Customer Support Center

Cable Lock Support

Security-lock slot, Optional Kensington Cable Lock

Power-On Password

Yes

Hard Disk Password

Yes; User and Master hard disk password

Supervisor Password

Yes

NIC LEDs (integrated)

None

Security Chip

Yes (for TPM 2.0)

Access Panel Key Lock

Bottom Cover Tamper Detection

Boot Sequence Control

Yes

Operating Environment

Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Operating: 5°C to 35°C (41°F to 95°F)

Non Operating – Air Temperature

At altitudes up to 2438 m (8000 ft)
– Storage: 5°C to 43°C (41°F to 109°F)

Humidity

Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)
Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)

Corrosive Gas

G1

Particulates

P1

SECTION II: SUPPORTED COMPONENTS

Supported Components

Processor

Intel® Core™ i7-11800H processor (2.3 GHz/8 Core/24M)
Intel® Core™ i7-11850H vPro processor (2.5 GHz/8 Core/24M/vPro)
Intel® Core™ i9-11950H vPro processor (2.6 GHz/8 Core/24M/vPro)
Intel® Xeon™ W-11855M vPro processor (3.2 GHz/6 Core/18M/vPro)

Memory Support

DDR4 3200MHz SO-DIMM

Chipset (PCH)

Mobile Intel® WM590 Chipset

Size of BIOS Flash

32MB

Super I/O

None

Clock

Crystal

Audio

Realtek High Definition Audio

Ethernet

Via bundled or optional USB-C to RJ-45 dongle

Memory

System Capacity Options

8GB
16GB
32GB
64GB

non-ECC

8GB DDR4 3200MHz SoDIMM
16GB DDR4 3200MHz SoDIMM
32GB DDR4 3200MHz SoDIMM

Brand of non-ECC Memory

Samsung
SK Hynix
Micron
Ramaxel

ECC

8GB DDR4 3200MHz ECC SoDIMM
16GB DDR4 3200MHz ECC SoDIMM
32GB DDR4 3200MHz ECC SoDIMM

Brand of ECC Memory

SK Hynix
Samsung

Memory Speed

3200MHz with non-ECC Memory
3200MHz with ECC Memory

Storage

2.5″ SAS Hard Disk Drive (HDD)

None

2.5″ SATA Hard Disk Drive (HDD)

None

2.5″ SATA Solid State Drive (SSD)

None

M.2 (NGFF) PCIe Solid State Drive (SSD)

256GB OPAL2 PCIe 3×4 TLC (M.2 2280-S3)
512GB OPAL2 PCIe 3×4 TLC (M.2 2280-S3)
1TB OPAL2 PCIe 3×4 (M.2 2280-S3)

512GB OPAL2 PCIe 4×4 TLC (M.2 2280-S3)
1TB OPAL2 PCIe 4×4 (M.2 2280-S3)
2TB OPAL2 PCIe 4×4 (M.2 2280-S3)

2.5″ PCIe Solid State Drive (SSD)

None

Brand of Drive

Samsung
Western Digital
Hynix
Kioxia
Micron

Intel Optane Storage Technology

None

RAID

Optional, Selectable in BIOS

RAID Level and Requirements

RAID-0/1

Removeable Media

Media Card Reader Specifications

UHS-II

SECTION III: Supported Component Detail

CPU Specifications

CPU

Intel® Core™ i7-11800H processor (2.3 GHz/8 Core/24M)

Intel® Core™ i7-11850H vPro processor (2.5 GHz/8 Core/24M/vPro)

Intel® Core™ i9-11950H vPro processor (2.6 GHz/8 Core/24M/vPro)

Intel® Xeon™ W-11855M vPro processor (3.2 GHz/6 Core/18M/vPro)

Integrated Graphics

Intel® UHD Graphics

Intel® UHD Graphics

Intel® UHD Graphics

Intel® UHD Graphics

# of Cores

8

8

8

6

# of Threads

16

16

16

12

Processor Base Frequency

2.30 GHz

2.50 GHz

2.60 GHz

3.20 GHz

Max Turbo Frequency

4.60 GHz

4.80 GHz

5.00 GHz

4.90 GHz

Cache

24 MB

24 MB

24 MB

18 MB

TDP

35 – 45 W

35 – 45 W

35 – 45 W

35 – 45 W

Display Specifications

Model

WQXGA Non-Touch

WQUXGA Non-Touch

WQUXGA Touch

Resolution

QHD+ (2560 x 1600)

UHD+ (3840 x 2400)

UHD+ (3840 x 2400)

Diagonal

16″

16″

16″

Aspect Ratio

16:10

16:10

16:10

Backlight

LED

LED

LED

PPI

QHD+: 189

UHD+: 283

UHD+: 283

Active Area

QHD+: 344.68mm x 215.42mm

UHD+: 343.99mm x 214.99mm

UHD+: 343.99mm x 214.99mm

Refresh Rate

Max 60Hz

Max 60Hz

Max 60Hz

Contrast Ratio

QHD+: 1200:1

UHD+: 1500:1

UHD+: 1500:1

Viewing Angle

QHD+: 85/85/85/85 degree

UHD+: 85/85/85/85 degree

UHD+: 85/85/85/85 degree

Color gamut

100% sRGB

100% Adobe

100% Adobe

Brightness

400 nits

600 nits

600 nits

HDR

N/A

HDR400
Dolby Vision

HDR400
Dolby Vision

Color Depth

QHD+: 16.7M (8-bit)

UHD+: 1064M (8-bit + FRC)

UHD+: 1064M (8-bit + FRC)

Interface

QHD+: eDP 1.4

UHD+: eDP 1.4

UHD+: eDP 1.4

Panel ID Recognition

EDID in BIOS Table

EDID in BIOS Table

EDID in BIOS Table

Weight

330g max

330g max

330g max

Color Calibrator

None

X-Rite Pantone Color Calibration
(Windows OS only)

X-Rite Pantone Color Calibration
(Windows OS only)

Panel Technology

IPS, Anti-Glare

IPS, Anti-Glare

IPS, Anti-Reflective/Anti-Smudge

Touch Panel

None

None

Multi-Finger Touch Panel with Pen Controller, Wacom. Pen Tilt support

SSD Specifications

2.5″ SATA Solid State Drive (SSD)

N/A

M.2 (NGFF) PCIe Solid State Drive (SSD)

2x M.2 2280-S3 PCIe

2.5″ PCIe Solid State Drive (SSD)

N/A

Intel Optane Storage Technology

N/A

Solid State Storage Devices

Supported Types

M.2

M.2

Dimensions inches/centimeters (W x D x H)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

22.0 (+-0.15) x 80.0 (+-0.15) x 2.3 (max)

Size

M.2 2280-S3

M.2 2280-S3

Interface Type

PCIe NVMe

PCIe NVMe

Read/Write IOPS Specifications

Read: 250K (512GB/1TB/2TB), 200K (256GB)
Write: 240K (512GB/1TB/2TB), 190K (256GB)
IOPS, 4K Random, 32 q depth, 4 threads

Read: 550K (1TB/2TB), 350K (512GB), 190K (256GB)
Write: 400K (1TB/2TB), 370K (512GB), 200K (256GB)
IOPS, 4K Random, 32 q depth, 8 threads

Bandwidth Performance

PCIe Gen3x4 (8Gb/S)

PCIe Gen4x4 (16Gb/S)

Power Consumption (Max)

5.0W

8.0W

Active(AVG)

5.0W (Sequential read)

8.0W (Sequential read)

Idle

5mW (Low power state)

5mW (Low power state)

Min MTBF

2,000,000 (h)

2,000,000 (h)

Min Sequential Read

3000MB/s (512GB/1TB/2TB), 2900MB/s (256GB)

6400MB/s (1TB/2TB), 6000MB/s (512GB), 5000MB/s (256GB)

Min Sequential Write

1600MB/s (512GB/1TB/2TB), 900MB/s (256GB)

5000MB/s (2TB), 3800MB/s (1TB), 3200MB/s (512GB), 1600MB/s (256GB)

Hardware Encryption

Yes

Yes for OPAL, No for Pyrite

Discrete Graphics Adapter

Laptop GPUs

NVIDIA T1200 with Max-Q Design

NVIDIA RTX A2000 with Max-Q Design

NVIDIA RTX A3000 with Max-P Design

NVIDIA RTX A4000 with Max-Q Design

NVIDIA RTX A5000 with Max-Q Design

NVIDIA GeForce RTX 3070 with Max-Q Design

NVIDIA GeForce RTX 3080 with Max-Q Design

NVIDIA CUDA Processing Cores

1024

2560

4096

5120

6144

5120

6144

NVIDIA RT Cores

N/A

20 (2nd Gen)

32 (2nd Gen)

40 (2nd Gen)

48 (2nd Gen)

40 (2nd Gen)

42 (2nd Gen)

Tensor Cores

N/A

80 (3rd Gen)

128 (3rd Gen)

160 (3rd Gen)

192 (3rd Gen)

160 (3rd Gen)

192 (3rd Gen)

GPU Memory

4GB

4GB

6GB

8GB

16GB

8GB

16GB

Peak Memory Bandwidth

192GB/s

192GB/s

264GB/s

384GB/s

448GB/s

384GB/s

384GB/s

Memory Type

GDDR6

GDDR6

GDDR6

GDDR6

GDDR6

GDDR6

GDDR6

Memory Interface

128-bit

128-bit

192-bit

256-bit

256-bit

256-bit

256-bit

TGP Max Power Consumption

35W

35W

80W

80W

80W

80W

80W

DisplayPort

1.4

1.4

1.4

1.4

1.4

1.4

1.4

Open GL

4.6

4.6

4.6

4.6

4.6

4.6

4.6

Shader Model

7.0

7.0

7.0

7.0

7.0

DirectX

12.1

12 Ultimate

12 Ultimate

12 Ultimate

12 Ultimate

12 Ultimate

12 Ultimate

PCIe Generation

4

4

4

4

4

4

4

Single Precision Floating-Point Performance

3.7

9.3

12.8

17.8

21.7

Tensor Performance

N/A

74.7

102.2

142.5

174.0

NVIDIA FXAA/TXAA Anti-Aliasing

Yes

Yes

Yes

Yes

Yes

Yes

Yes

NVIDIA RTX Desktop Manager

Yes

Yes

Yes

Yes

Yes

Vulkan Support

Yes

Yes

Yes

Yes

Yes

Yes

Yes

NVIDIA Optimus

Yes

Yes

Yes

Yes

Yes

Yes

Yes

3rd Gen Max-Q Technology

Yes

Yes

Yes

Yes

Yes

Yes

Yes

NVENC/NVDEC

Yes

Yes

Yes

Yes

Yes

Yes

Yes

WLAN

Model

Typhoon Peak 2 Intel Wi-Fi 6E AX210 (Gig+) + BT5.2

Antenna Diversity

Supported

MIMO

Supported

Radio ON/OFF Control

Supported

Connector interface

M.2 PCIe

Operating Temperature (Adapter Shield)

0c to +80c

Humidity Non-Operating

50%~90% Rh non condensing (at temperatures of 25c to 35c)

Operating Systems

Microsoft Windows 10, Linux

Wi-Fi Alliance

Wi-Fi CERTIFIED 6, Wi-Fi CERTIFIED a/b/g/n/ac, WMM, WMM-PowerSave, WPA3, Protected Management Frames, Wi-Fi Direct, Wi-Fi Agile Multiband

IEEE WLAN Standard

IEEE 802.11-2016 and select amendments (selected feature coverage)
IEEE 802.11a, b, d, e, g, h, i, k, n, r, u, v, w, ac, ax; Fine Timing Measurement based on 802.11-2016, Wi-Fi Location R2 (802.11az) HW readiness

Roaming

Support seamless roaming between access points

Bluetooth

BT 5.2

Authentication Protocols

802.1X EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0 – MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA’)

Encryption

128-bit AES-CCMP, 256-bit AES-GCMP

Regulatory

For a list of country approvals, please contact your local Intel representatives

US Government

FIPS 140-2

Product Safety

UL,C-UL,CB (IEC 60950-1)

Battery

Dimension

L: 312mm*W: 58.8mm*T 9.4mm

Weight

MAX 343.2g

Type (Chemistry and Cell)

Li-Polymer (4S1P), 4-cell

Voltage

15.52 V

Battery Life

Up to 10.5hrs (Condition: QHD+/i7-11850H vPro/8GB DIMM/1x 256GB SSD/UMA/Hybrid Graphics Mode/Better Battery Mode/MobileMark2018)

Battery Capacity

90Wh

Charging Time

On Charge Time (0- 100%) * 120 min
Off Charge Time (0 – 80%) ** 60 min
Off Charge Time (0 – 100%) ** 120 min

Operating Temperature Range

between 10°C (50°F) and 35°C (95°F)

Warranty

1 Year / 3 Year Available

Coin Cell Battery (Model)

CR2016

SECTION IV: BIOS / Certifications / Standards / Environmental

BIOS Specifications

WMI Support

Yes, if it is BIOS Setup change by WMI.

ROM-Based Setup Utility (F1)

Yes

Bootblock Recovery

No

Replicated Setup

Yes, it supported with SRSETUP tool.

Boot Control

Yes, it means Boot order change.

Discrete Mode

Yes

Memory Change Alert

N/A

Thermal Alert

N/A

Asset Tag

Yes

System/Emergency ROM Flash Recovery with Video

N/A
But FW based ROM flash recovery is supported.

Remote Wakeup/Remote Shutdown

Yes, if Remote wakeup is Wake on LAN from S4/S5.

Keyboard-less Operation

N/A

Per-port Control

Yes, if it is I/O port enable/disable by BIOS Setup.

Adaptive Cooling

Yes, if it is thermal & fan control.

Security

Yes, BIOS password / Hard disk password / Finger print

Intel(R) AMT (includes ASF 2.0)

Yes. If you select vPro model

Intel(R) TXT

Yes. If you select vPro model

Memory Modes

N/A

EMC & Safety

EMC

Published, Certified Existing Reports
EMC – Australia
EMC – Belarus
EMC – Canada
EMC – EU/EFTA
EMC – Japan
EMC – Kazakhstan
EMC – New Zealand
EMC – Russia
EMC – United Kingdom
EMC – USA/Territories

Safety

To access the latest User Guide and Safety and Warranty Guide, go to:
https://support.lenovo.com

Low Halogen Declaration of Conformance
TNOT-2017-0040
Section 9 – Low Halogen Scorecard

Homologation PCRB Compliant
In the following countries: Albania, Algeria, Andorra, Angola, Antigua and Barbuda, Argentina, Armenia, Aruba, Australia, Azerbaijan, Bahamas, Bahrain, Bangladesh, Barbados, Belarus, Belize, Benin, Bermuda, Bolivia, Botswana, Burkina Faso, Burundi, Cambodia, Cameroon, Canada, Cape Verde, Cayman Islands, Central African Republic, Chad, China, Colombia, Comoros, Congo, Costa Rica, Dijbouti, Dominican Republic, Egypt, El Salvador, Eritrea, Ethiopia, EU/EFTA, Fiji, Gabon, Gambia, Georgia, Ghana, Grenada, Guatemala, Guinea, Haiti, Honduras, Hong Kong, India, Indonesia, Israel, Jamaica, Japan, Jordan, Kazakhstan, Kenya, Kuwait, Laos, Lebanon, Liberia, Macau, Madagascar, Malawi, Malaysia, Mali, Mauritania, Mauritius, Mexico, Moldova, Mongolia, Morocco, Mozambique, Namibia, Nepal, New Zealand, Nicaragua, Niger, Nigeria, Oman, Pakistan, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Qatar, Russia, Saudi Arabia, Senegal, Serbia, Seychelles, Sierra Leone, Singapore, South Africa, South Korea, Sri Lanka, Swaziland, Taiwan, Tajikistan, Tanzania, Thailand, Togo, Tunisia, Turkey, Turkmenistan, Uganda, Ukraine, United Arab Emirates, Uruguay, USA/Territories, Uzbekistan, Venezuela, Vietnam, Zambia, Zimbabwe, Brazil – Inmetro 170 Govt Bids, Guinea-Bissau, Lesotho

Environmental

Energy Star

ENERGY STAR® Version 8.0
For more information about ENERGY STAR, go to:
https://www.energystar.gov

EPEAT

EPEAT Certification Available on select models

IT ECO declaration

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration

Hazardous Substances

The latest environmental information about Lenovo products is available at:
https://www.lenovo.com/ecodeclaration
European Union RoHS
This Lenovo product, with included parts (cables, cords, and so on) meets the requirements of Directive
2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic
equipment (“RoHS recast” or “RoHS 2”).
For more information about Lenovo worldwide compliance on RoHS, go to:
https://www.lenovo.com/rohs-communication

Manageability

Industry Standard Specifications

This product meets the following industry standard specifications for manageability functionality:

Remote Manageability Software Solutions

Lenovo ThinkManagement Console
Microsoft System Center Configuration Manager
LANDesk Management Suite for Lenovo Vantage Technologies (www.landesk.com/lenovo)

System Software Manager

Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

System Update
Update Retriever

Service, Support, and Warranty

On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am to 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

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