P5 Gen 2

Version: 1.0 | 03/16/2026

Product Name

Product Display Name

ThinkStation P5 Gen 2

Information Date

16-Mar-26

Hardware Maintenance Manual

TBD

Drivers & Software

TBD

Available Whitepapers

TBD

SECTION I: Platform Overview

Description

Engineered for ultimate versatility, the ThinkStation P5 Gen 2 is the all-around industry workhorse for professionals that demand scalable, future-proof solutions in mission-critical environments.

CPU

Processor Support

Intel Granite Rapids Mainstream Workstation Processor

MB Spec Page 9

Socket Type

Socket-E2 (LGA-4710)

MB Spec Page 9

Disclaimers

Operating Systems

Preloaded

Windows 11 Pro for Workstations
Ubuntu 24.04 LTS (configuration specific)

Ubuntu preload estimated to be ready by 7/2/2026

Supported

Ubuntu 24.04 LTS
Red Hat Enterprise Linux 10.2

Confirmed with Mark Pearson Ubuntu and RHEL versions that are planning to be supported.

Check to see RHEL 10 will be supported?
Check on Rocky Linux support/

Disclaimers

Memory

Slots

8

System Spec line 130

Channels

4

System Spec line 129

Type

PC5-6400 ECC RDIMM

System Spec line 123

ECC Support

Yes

Speed

Up to 6400 MT/s (1 DIMM per channel)1
Up to 5200 MT/s (2 DIMMs per channel)1

System Spec line 132-133

Max DIMM Size

128GB DDR5 ECC RDIMM

System Spec line 152

Max System Memory

1TB

System Spec line 164

Disclaimers

1Memory speed is dependent on the CPU and number of DIMMs per channel being utilized.

Carryover comment

Storage

Total Bays/Size

2 x Standard SATA HDD Bays1
2 x Optional via ThinkStation Enterprise Dual Drive Internal Enclosure (EDDIE)
1 x Optional via 3.5″ SATA HDD Bay

Need to check with rest of team to see how/what we want to list here in regards to SATA HDD options.

Check shell fit sata power/data cables

SATA

4 x SATA 3.0 (6 Gb/s) Connectors

System Spec line 289-293

PCIe (M.2)

2 x M.2 NVMe 2280/221102 PCIe 5.0 x4 Connectors Onboard
2 x Optional via M.2 NVMe 2280 PCIe 5.0 x4 Front Access Drive Bay
4 x Optional via ThinkStation PCIe 5.0 x16 Quad M.2 SSD Adapter (Medina Gen 5)3

Check M.2 size on Medina II adaper… see psref for the Medina II adapter here: https://psref.lenovo.com/accessory/4XH1S82999

PCIe (U.3)

Removing this from Tech Specs as this is CERTS ONLY

Disclaimers

Note: See Storage Whitepaper for details on the available usage options.
1One dual-drop SATA power cable and one single SATA data cable are shell fit.
2There are no certified 22110 M.2 NVMe drives at this time.
3The Medina Gen 5 Adapter supports multiple M.2 drive sizes, but only 2280 M.2 drives are officially supported at this time.

Video

Integrated Graphics

Not Available

Discrete Graphics

Nvidia RTX Pro 6000 Blackwell Max-Q Workstation Edition (DP x4) – 96GB, GDDR7, PCIe 5.0, Dual-Slot (300W)
Nvidia RTX Pro 5000 Blackwell (DP 2.1 x4) – 72GB, GDDR7, PCIe 5.0, Dual-Slot (300W)
Nvidia RTX Pro 5000 Blackwell (DP 2.1 x4) – 48GB, GDDR7, PCIe 5.0, Dual-Slot (300W)
Nvidia RTX Pro 4500 Blackwell (DP 2.1 x4) – 32GB, GDDR7, PCIe 5.0, Dual-Slot (200W)
Nvidia RTX Pro 4000 Blackwell (DP 2.1 x4) – 24GB, GDDR7, PCIe 5.0, Single-Slot (140W)
Nvidia RTX Pro 2000 Blackwell (MiniDP 2.1 x4) – 16GB, GDDR7, PCIe 5.0, Dual-Slot (70W)
Nvidia RTX A1000 (MiniDP 1.4a x4) – 8GB, GDDR6, PCIe 4.0, Single-Slot (50W)
Nvidia RTX A400 (MiniDP 1.4a x4) – 4GB, GDDR6, PCIe 4.0, Single-Slot (50W)

Multi-GPU Support

Yes

Type

PCIe Add-In-Card

Bus Interface

PCIe x16

Disclaimers

Slots

Slot 1

PCIe 5.0 x16, Full Height, Full Length, 75W, CPU

System Spec Line 552

Slot 2

PCIe 4.0 x4, Full Height, Full Length, 25W, Open Ended, PCH

System Spec Line 560

Slot 3

PCIe 5.0 x16, Full Height, Full Length, 75W, CPU

System Spec Line 568

Slot 4

PCIe 4.0 x4, Full Height, Full Length, 25W, Open Ended, CPU

System Spec Line 576

Slot 5

PCIe 5.0 x8, Full Height, Full Length, 25W, Open Ended, CPU

System Spec Line 584

Slot 6

PCIe 4.0 x4, Full Height, Full Length, 25W, Open Ended, PCH

System Spec Line 592

Disclaimers

Front I/O

USB

Optional: Front Panel I/O Ports:
1 x USB-A 3.2 Gen 2×1 (10Gbps), 4.5W
1 x USB-A 3.2 Gen 2×1 (10Gbps), 10.5W supports BC1.2
2 x USB-C 3.2 Gen 2×1 (10Gbps), 15W per port

System Spec Line 659
MB Spec Page 16

Audio

1 x Headphone / Microphone Combo Jack (3.5mm)

MB Spec Page 15

Media Card Reader

Optional:15-in-1 Media Card Reader1

System Spec Line 432

Flex Bay

Optional: Front access dual M.2 drive enclosure1

System Spec Line 428

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
1Only one optional Media Card Reader or Front access dual M.2 drive enclosure supported.

Carryover comment

Rear I/O

USB

2 x USB-A 2.0 (480Mbps), 2.5W per port
2 x USB-A 3.2 Gen 2×1, (10Gbps), 4.5W per port
1 x USB-C 3.2 Gen 2×2 (20Gbps), 15W
1 x USB-C 3.2 Gen 2×1 (10Gbps), 15W
1 x USB-A 3.2 Gen 2×1, (10Gbps), 15W (internal)

System Spec Line 660
MB Spec Page 16

Audio

2 x 3.5mm Jacks (Line Out, Line In retasked as Mic)

MB Spec Page 14

Serial Port

Optional: 1 x Serial (via cable)
Optional: 4 x Serial (via 4-port serial expansion card, PCIe x1)

System Spec Line 676

Ethernet

1 x Intel Foxville I226-LM – 2.5 Gigabit Ethernet – RJ45

System Spec Line 714

PS/2

Optional: ThinkStation Dual PS/2 Port PCIe x1 Adapter

System Spec Line 677, AVL nomenclature

Optional USB Adapter

ThinkStation USB4 Dual Port PCIe 4.0 x4 Adapter

Check PSREF to match description

Optional Network Adapter

Realtek RTL8125BGS Single Port 2.5Gigabit PCIe 2.1 x1 Ethernet Adapter
Intel I210-T1 Single Port Gigabit PCIe 2.1 x1 Ethernet Adapter
Intel I350-T4 Quad Port Gigabit PCIe 2.1 x4 Ethernet Adapter
Intel E610-T4 Quad Port 10Gigabit PCIe 4.0 x8 Ethernet Adapter
Intel E810-XXVDA2 Dual Port 25Gigabit PCIe 4.0 x8 Ethernet Adapter1
Intel Wi-Fi 7 BE200, 802.11be 2×2 Wi-Fi + Bluetooth 5.4, Intel vPro Technology Support

System Spec Line 717 – 727

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
Note: Network speeds listed are theoretical.
1The Intel E810-XXVDA2 requires 2 x SFP28 transceivers.

Carryover comment

Ethernet

Vendor

Intel Foxville I226-LM – 2.5 Gigabit Ethernet Controller (vPro, AMT)

System Spec Line 714, MB Spec Page 14

Speeds

10/100/1000/2500 Mbps

Functions

PXE, WOL, Jumbo Frames

Connectors

1 x RJ45

Disclaimers

Note: Network speeds listed are theoretical.

Carryover comment

Audio

Vendor

Realtek

Type

High Definition (HD) Audio

Internal Speaker

1 x 1.5 watt 4 ohm

Connectors

2 x Rear 3.5mm Jacks (Line Out, Line In can retasked as Mic)
1 x Front 3.5mm Global Headset Jack (Headphone + Mic in)

Chipset

Realtek ALC897Q on MB (rear)1
Realtek ALC4032 on FPIO (front)

MB Spec page 10

Number of Channels

Rear Audio: 2 Channels
Front Audio: 2 Channels

MB Spec page 15

Number of Bits/Audio Resolution

Rear Codec:
10 Channel DAC Supports 16/20/24-bit PCM
2 Stereo ADC Supports 16/20/24-bit PCM
Front Codec:
One stereo DAC supports 8/16/22.05/24/32/44.1/48/96/176.4/192KHz Sample Rate, 16/24-bit
One stereo ADC supports 8/16/22.05/24/32/44.1/48/96KHz Sample Rate, 16/24-bit

Carryover comment

Disclaimers

1Audio Codec ALC897Q can support 7.1 channel, but motherboard only has 2 rear jacks – MIC in and Line out, only 2 channel for Line out.

Carryover comment

Thermal

Temp Sensors

Ambient Cabled Sensor – Thermistor, Motherboard Header cabled to chassis front bezel
PCIe Zone 1 Sensor – Thermistor
PCIe Zone 2 Sensor – Thermistor
PCIe Zone 3 Sensor – Thermistor
M.2 Zone 1 Sensor – Thermistor
Vcore Thermal Sensor 1 – Thermistor
Vcore Thermal Sensor 2 – Thermistor

MB Spec page 25

Fans

1 x Front Fan – 4-pin header with 4-pin key
1 x Storage Bay Fan – 4-pin header with 4-pin key
1 x Rear Fan – 4-pin header with 4-pin key
1 x CPU Fan – 4-pin header with 3-pin key
1 x Flex Bay Fan – 4-pin header with 4-pin key
2 x Memory Fans – 4-pin header with 3-pin key
PSU Fans – provided by PSU vendor

MB Spec Page 26

Power Specifications

Power Supply

750W

1000W

1400W PSU listed as “Test Only”

Power Efficiency

92% Efficient @ 50% Load

92% Efficient @ 50% Load

Main

C14 socket to std C13 line cord

C14 socket to std C13 line cord

Operating Voltage Range

100 – 240V (autosensing)

100 – 240V (autosensing)

Rated Voltage Range

90-264VAC

90-264VAC

Rated Line Frequency

47Hz / 63Hz

47Hz / 63Hz

Operating Line Frequency Range

50Hz / 60Hz

50Hz / 60Hz

Rated Input Current

10A

12A

Graphics

1 x 8-pin (6+2) PCIe1

Up to 4 x 8-pin (6+2) PCIe1 or 2 x 16-pin (12VHPWR) PCIe1

Power Supply Fan

Yes

Yes

ENERGY STAR® Qualified (config dependent)

Yes

Yes

80 PLUS Compliant

Yes

Yes

Built-in Self Test (BIST) LED

Yes

Yes

Aux Power Drop

Yes

Yes

Disclaimers

Note: See Power Configuration Whitepaper for additional details.
1Quantity of Graphics power cables are configuration dependent

Carryover comment

BIOS

Vendor

AMI

Disclaimers

Chassis Information

Color

Storm Gray

System Spec Line 809

PSU

750W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified
1000W, Autosensing, 92% PSU, 80 PLUS Platinum Qualified

This matches PSRef P5 Gen 2 draft from Linus.

Thermal Solutions

1 x Front Fan
1 x Storage Bay Fan
1 x Rear Fan
1 x CPU Fan
1 x Flex Bay Fan
2 x Memory Fans
PSU Fans – provided by PSU vendor

System Spec Line 819, copy from line 94 with some tweaks.

Dimensions

440mm/17.3″ H (with feet)
453.9mm/17.9″ D
165mm/6.5″ W

System Spec Line 813

Weight

19kg /41.9lbs (maximum configuration)

Match PSREF

Disclaimers

Packaging Dimensions

Height (mm/in)

600mm / 23.62″

Carryover from P5 Gen 1

Width (mm/in)

295mm / 11.61″

Carryover from P5 Gen 1

Depth (mm)

571mm / 22.48″

Carryover from P5 Gen 1

Weight (kgs/lbs)

21.5kg /47.4lbs

System Spec Line 815

Disclaimers

Security & Serviceability

TPM

Infineon SLB9672 (TPM 2.0, SPI, CC, and FIPS 140-2 certified) FW15.23 or latest
Co-layout with NSING TCM NS350 IC

MB Spec page 10

Asset ID

Yes, 1024 x 8bit

vPro

Yes

Cable Lock Support

Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control

Yes

Power-On Password

Yes

Setup Password

Yes

NIC LEDs (integrated)

Yes

Access Panel Key Lock

Yes, Optional Key Lock for Side Panel (Common or Random)

System Spec Line 818

Boot Sequence Control

Yes

Padlock Support

Yes

Boot Without Keyboard and/or Mouse

Yes

Access Panel

Tool-less Side Cover Removal

Hard Drives

Tool-less

Expansion Cards

Tool-less

Processor Socket

Tool-less1

Color Coded User Touch Points

Yes

Color-coordinated Cables and Connectors

Yes

Memory

Tool-less

System Board

Retained with Phillips Head Screws

Restore CD/DVD/USB Set

Not Included, Recovery Media available via Lenovo Download Recovery Service or Lenovo Support.

Disclaimers

1CPU Heatsink assembly requires a T30 bit.

Operating Environment

Air Temperature

Operating Temperature: 10⁰C to 35⁰C (50⁰F to 95⁰F)

System Spec Line 886

Storage

Storage Temperature (in original shipping carton): -40⁰C to 60⁰C (-40⁰F to 140⁰F)
Storage Temperature (without carton): -10⁰C to 60⁰C (14⁰F to 140⁰F)

System Spec Line 887-887

Humidity

Relative Humidity Operating: 10% to 80% (non-condensing)
Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
Wet Bulb Temperature Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

System Spec Line 891-895

Altitude

Upper limits decrease 1°C (1.8°F) per 300 m (1000 ft) above sea level

System Spec Line 889

Vibration

Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z)
Non-Operating Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)

System Spec Line 904-907

Shock

Operating: X,Y axis: +- 15G/3ms Z axis: +- 30G/3ms
Operating (Rack mounted): X,Y,Z axis: +- 15G/3ms
Non-operating target: Trapezoidal shock, 35g average, 11ms

System Spec Line 897-902

Disclaimers

Note: Extended operating temperatures are possible – please contact your Lenovo Rep.

Carryover comment

SECTION II: Platform Detail

Board Size

11.3″ x 10″ (287.02mm x 254mm)

MB Spec Page 10

Layout

Lenovo Custom Extended eATX MB

MB Spec Page 10

Disclaimers

Motherboard Core

Processor Support

Intel Granite Rapids Workstation Processor

MB Spec Page 10

Socket Type

Socket-E2 (LGA 4710)

MB Spec Page 10

Memory Support

PC5-6400 ECC RDIMM

System Spec Line 123

Voltage Regulator

Intel VR14.0 – 300W TDP Capable

MB spec page 10

Chipset (PCH)

Intel Arrow Lake S (ARL-S) W890 PCH

MB spec page 10

Flash

2 x 64Mb (soldered)

MB spec page 10

Super I/O

One MEC1743

MB spec page 10

Clock

Intel External Clock design

MB spec page 10

Audio

Rear Codec: HDA ALC897Q on MB (Rear I/O)
Front Codec: USB2.0 ALC4032 (FPIO)

MB Spec page 10

Ethernet

Intel 2.5Gb Foxville Base-T MAC/PHY I226-LM/V (vPro, AMT)

MB Spec page 14

Disclaimers

 

Supported Components

Processor Level

Intel Xeon 600 Series Processors

Intel nomenclature

Processor

Intel Xeon 678X 300W 128L 48C 96T 192MB 2.4GHz DDR5
Intel Xeon 676X 275W 128L 32C 64T 144MB 2.8GHz DDR5
Intel Xeon 674X 270W 128L 28C 56T 144MB 3.0GHz DDR5
Intel Xeon 658X 250W 128L 24C 48T 144MB 3.0GHz DDR5
Intel Xeon 656 210W 128L 20C 40T 72MB 2.9GHz DDR5
Intel Xeon 654 200W 128L 18C 36T 72MB 3.1GHz DDR5
Intel Xeon 638 180W 80L 16C 32T 72MB 3.2GHz DDR5
Intel Xeon 636 170W 80L 12C 24T 48MB 3.5GHz DDR5
Intel Xeon 634 150W 80L 12C 24T 48MB 2.7GHz DDR5

System Spec Line 31-41

Memory Type

PC5-6400 ECC RDIMM

System Spec Line 123

Memory

16GB DDR5 ECC RDIMM PC5-6400 MT/s
32GB DDR5 ECC RDIMM PC5-6400 MT/s
64GB DDR5 ECC RDIMM PC5-6400 MT/s
128GB DDR5 ECC RDIMM PC5-6400 MT/s

System Spec Lines 149-152

Disclaimers

Note: Lenovo does not support CPU overclocking on ThinkStation platforms.

Carryover comment

Storage

3.5″ SATA Hard Disk Drive (HDD)

2TB SATA – 5400rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6GB/s, Enterprise, 3.5″
10TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″
12TB SATA – 7200rpm, 6Gb/s, Enterprise, 3.5″

AVL v0.2.6

2.5″ SAS Hard Disk Drive (HDD)

 

2.5″ SATA Hard Disk Drive (HDD)

 

2.5″ SATA Solid State Drive (SSD)

 

M.2 PCIe Solid State Drive (SSD)

512GB M.2 PCIe – SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0
1TB M.2 PCIe – SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0
2TB M.2 PCIe – SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0
4TB M.2 PCIe – SSD, 2280, Gen5 (x4), NVMe, TLC, OPAL2.0

AVL v0.2.6

U.2 PCIe Solid State Drive (SSD)

 

PCIe Add-in-Card Solid State Drive (SSD)

 

Intel Optane Storage Technology

 

Disclaimers

Note: Additional Storage Devices Certified.

Carryover comment

RAID

RAID Requirements

NVMe RAID via VROC Controller
SATA RAID via Intel RSTe
Optional: SATA RAID via RAID 940-8i RAID Controller

Notes

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.

Optional Hard Disk Drive Controllers

Optional: RAID 940-8i RAID controller – supports 0/1/5

Intel VROC

Standard: Onboard Intel RSTe SATA RAID – supports 0/1/5/10
Optional: Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10
Optional: Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10

Optical Drive/Removable Media

DVD-ROM Drive

none

DVD Burner/CD-RW Drive

none

Blu-Ray Burner Drive

none

Media Card Reader Specifications

Optional: 15-in-1 Media Card Reader Support
SD slot
1.Secure Digital Card (SD)
Mini SD (requires adapter)
Micro SD (requires adapter)
2.Secure Digital High Capacity (SDHC)
Mini SD High Capacity (requires adapter)
Micro SD High Capacity (requires adapter)
3.SD Extended Capacity Memory Card (SDXC)
Micro SD Extended Capacity (requires adapter)
4.SD Ultra High Speed II (SD UHSII)
5.MultiMediaCard(MMC)
RS-MMC (requires adapter)
MMC-Micro (requires adapter)
CF slot
6.CompactFlash Type I
7.CompactFlash Type II
8.Microdrive
MS slot
9.Memory Stick
Memory Stick Micro (requires adapter)
10.Memory Stick Duo
11.Memory Stick PRO
12.Memory Stick PRO Duo
13.Memory Stick PRO-HG Duo
Memory Stick HG Micro (requires adapter)
14.Memory Stick XC Duo
Memory Stick XC Micro (requires adapter)
15.Memory Stick XC-HG Duo
Memory Stick XC-HG Micro (requires adapter)

Carryover comment from P5 Gen 1.

Disclaimers

Keyboard and Pointing Devices

Keyboard

USB Calliope AI Keyboard
USB Traditional AI Keyboard
USB Smart Card AI Keyboard

System Specs Line 828-831

Pointing Devices

USB Calliope Mouse

System Specs Line 835

Disclaimers

Expansion Bays

5.25″ External Access Bays

Optional: Front access dual M.2 drive bay
or
Optional:15-in-1 Media Card Reader

Disclaimers

Note: Only one optional device supported.

PCIe Adapters

Network

Realtek RTL8125BGS Single Port 2.5Gigabit PCIe 2.1 x1 Ethernet Adapter
Intel I210-T1 Single Port Gigabit PCIe 2.1 x1 Ethernet Adapter
Intel I350-T4 Quad Port Gigabit PCIe 2.1 x4 Ethernet Adapter
Intel E610-T4 Quad Port 10Gigabit PCIe 4.0 x8 Ethernet Adapter
Intel E810-XXVDA2 Dual Port 25Gigabit PCIe 4.0 x8 Ethernet Adapter1

System Spec Line 717 – 727

WiFi Cards

Intel Wi-Fi 7 BE200, 802.11be 2×2 Wi-Fi + Bluetooth 5.4, Intel vPro Technology Support

PS/2

ThinkStation Dual PS/2 Port PCIe 3.0 x1 Adapter

Com port

Serial COM port cable with 5V transceiver
4-Port Serial Expansion Card PCIe 3.0 x1 Adapter

PCIe to M.2 Adapter Card

ThinkStation PCIe 5.0 x16 Quad M.2 SSD Adapter (Medina Gen 5)

Disclaimers

Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.
Note: Network speeds listed are theoretical.
1The Intel E810-XXVDA2 requires 2 x SFP28 transceivers.

SECTION III: Supported Component Detail

CPU Specifications Group 1

CPU

Intel Xeon 678X 300W 128L 48C 96T 192MB 2.4GHz DDR5

Intel Xeon 676X 275W 128L 32C 64T 144MB 2.8GHz DDR5

Intel Xeon 674X 270W 128L 28C 56T 144MB 3.0GHz DDR5

Intel Xeon 658X 250W 128L 24C 48T 144MB 3.0GHz DDR5

Intel Xeon 656 210W 128L 20C 40T 72MB 2.9GHz DDR5

# of Cores

48

32

28

24

20

# of Threads

96

64

56

48

40

Processor Base Frequency

2.4 GHz

2.8 GHz

3.0 GHz

3.0 GHz

2.9 GHz

Max Turbo Frequency

4.9 GHz

4.9 GHz

4.9 GHz

4.9 GHz

4.8 GHz

Cache

192 MB

144 MB

144 MB

144 MB

72 MB

TDP

300 W

275 W

270 W

250 W

210 W

Intel ARK Spec Link

Intel® Xeon® 678X

Intel® Xeon® 676X

Intel® Xeon® 674X

Intel® Xeon® 658X

Intel® Xeon® 656

Disclaimers

CPU Specifications Group 2

CPU

Intel Xeon 654 200W 128L 18C 36T 72MB 3.1GHz DDR5

Intel Xeon 638 180W 80L 16C 32T 72MB 3.2GHz DDR5

Intel Xeon 636 170W 80L 12C 24T 48MB 3.5GHz DDR5

Intel Xeon 634 150W 80L 12C 24T 48MB 2.7GHz DDR5

# of Cores

18

16

12

12

# of Threads

36

32

24

24

Processor Base Frequency

3.1 GHz

3.2 GHz

3.5 GHz

2.7 GHz

Max Turbo Frequency

4.8 GHz

4.8 GHz

4.7 GHz

4.6 GHz

Cache

72 MB

72 MB

48 MB

48 MB

TDP

200 W

180 W

170 W

150 W

Intel ARK Spec Link

Intel® Xeon® 654

Intel® Xeon® 638

Intel® Xeon® 636

Intel® Xeon® 634

Disclaimers

HDD Specifications

Drive

2TB SATA – 5400rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

4TB SATA – 7200rpm, 6Gb/s, 3.5″ Enterprise

10TB SATA – 7200rpm, 6Gb/s, 3.5″ Enterprise

12TB SATA – 7200 RPM 6Gb/s 3.5″ Enterprise

3.5″ SATA Hard Disk Drive (HDD)

Coming Soon

Yes

Yes

Yes

Yes

2.5″ SAS Hard Disk Drive (HDD)

Coming Soon

NA

NA

NA

NA

2.5″ SATA Hard Disk Drive (HDD)

Coming Soon

NA

NA

NA

NA

Connector

Coming Soon

SATA

SATA

SATA

SATA

Transfer Rate (Gb/sec)

Coming Soon

Average Data Rate, Read/Write 156MB/s

Sustained Data Transfer Rate 216-226MB/s

TBD

Max Sustained Data Transfer Rate 268MB/s

Spindle Speed (RPM)

Coming Soon

7,200

7,200

TBD

7,200

Power Off to Spindle Stop (sec)

Coming Soon

NA

NA

TBD

NA

DC Power to Drive Ready (sec)

Coming Soon

<20.0

<30.0

TBD

<30.0

Average Latency (msec)

Coming Soon

4.16

4.16

TBD

4.16

Input (VDC)

Coming Soon

5 & 12

5 & 12

TBD

5 & 12

Typical (Watts)

Coming Soon

6.8Max

9.5(Max)

TBD

8(Max)

Idle (Watts)

Coming Soon

3.9Max

5.2(Max)

TBD

5.3(Max)

Physical Dimensions

Coming Soon

101.6mm x 147mm x 26.1mm

101.85mm x 147mm x 26.1mm

TBD

101.85mm x 147mm x 26.1mm

Weight (grams)

Coming Soon

<495

<715

TBD

<715

Operating (C) Ambient

Coming Soon

0 to 55

5 to 55

TBD

5 to 55

Operating (C) Base Casting

Coming Soon

<60

<60

TBD

<60

Non-Operating (C) Ambient

Coming Soon

(-40 to 70)

(-40 to 70)

TBD

(-40 to 70)

Gradient (C per Hour)

Coming Soon

20

20

TBD

20

Operating (Gs @ 2ms)

Coming Soon

80(Read/Write)

Read 70 / Write 40

TBD

50 (Read/Write)

Non-Operating (Gs @ 2ms)

Coming Soon

350

250

TBD

250

Disclaimers

*Some parameters may vary depending on the actual configuration.

Solid State Storage Specifications Group 1

Drive

512GB M.2 PCIe – SSD, 2280, Gen5Px4, NVMe, TLC, OPAL2.0

1TB M.2 PCIe – SSD, 2280, Gen5Px4, NVMe, TLC, OPAL2.0

2TB M.2 PCIe – SSD, 2280, Gen5Px4, NVMe, TLC, OPAL2.0

4TB M.2 PCIe – SSD, 2280, Gen5Px4, NVMe, TLC, OPAL2.0

Dimensions Millimeters (W x D x H)

22mm x 80mm x 2.38mm

22mm x 80mm x 2.38mm

22mm x 80mm x 2.38mm

22mm x 80mm x 2.38mm

Interface Type

PCIe Gen5

PCIe Gen5

PCIe Gen5

PCIe Gen5

Power Active (AVG)

7.5W Read/5.7W Write

8.3W Read/7.9W Write

8.6W Read/8.5W Write

8.6W Read/8.5W Write

Power Idle

50mW

50mW

50mW

50mW

Typical Sequential Read

11000 MB/s

14000 MB/s

14000 MB/s

14000 MB/s

Typical Sequential Write

5500 MB/s

11000 MB/s

12000 MB/s

12000 MB/s

Operating Temperature Range

0C to 70C

0C to 70C

0C to 70C

0C to 70C

Endurance Rating (Lifetime Writes)

200 TBW

400 TBW

800 TBW

1600 TBW

Mean Time Between Failures (MTBF)

2.0 million hours

2.0 million hours

2.0 million hours

2.0 million hours

Hardware Encryption

OPAL

OPAL

OPAL

OPAL

Disclaimers

SSD performance measured with Crystal Disk Mark version 6.0.2 with the default 1000 MB data set.  Sequential measurements are with 1 Thread, Queue-Depth 32.  Random measurements are with 4 threads and queue-depth 32.

HDD Controllers

 

Disclaimers

Optical Drive Specifications

 

Relative Humidity

 

Maximum Wet Bulb Temperature

 

Disclaimers

Integrated Graphics Adapter

 

Disclaimers

Discrete Graphics Adapter Group 1

Adapter

NVIDIA RTX A400

NVIDIA RTX A1000

NVIDIA RTX PRO 2000 Blackwell

NVIDIA RTX PRO 4000 Blackwell

NVIDIA RTX Pro 4500 Blackwell

Bus Interface

PCIe 4.0 x8

PCIe 4.0 x8

PCIe 5.0 x 8

PCIe 5.0 x16

PCIe 5.0 x16

Display Interface

4x mDP 1.4a

4x mDP 1.4a

4x DP 2.1b

4x DP 2.1b

4x DP 2.1b

Graphics Chipset

GA107 (Ampere)

GA107 (Ampere)

GB206 (Blackwell)

GB203 (Blackwell)

GB203 (Blackwell)

Memory Clock Frequency (MHz)

1500 MHz

1500 MHz

1125 MHz

1750 MHz

1750 MHz

Memory Size

4 GB GDDR6 with ECC

8 GB GDDR6 with ECC

16 GB GDDR7 with ECC

24 GB GDDR7 with ECC

32 GB GDDR7 with ECC

Memory Interface

64-bit

128-bit

128-bit

192-bit

256-bit

Memory Bandwidth

96 GB/s

192 GB/s

288 GB/s

672 GB/s

896 GB/s

GPU Cores

CUDA Cores: 768
Tensor Cores: 24
RT Cores: 6

CUDA Cores: 2,304
Tensor Cores: 72
RT Cores: 18

CUDA Cores: 4.352
Tensor Cores: 136
RT Cores: 34

CUDA Cores: 8,960
Tensor Cores: 280
RT Cores: 70

CUDA Cores: 10,496
Tensor Cores: 328
RT Cores: 82

GPU Core Frequency (MHz)

1762 MHz

1462 MHz

1957 MHz

2055 MHz

2407 MHz

Maximum Power Consumption

50 W

50 W

70 W

140 W

200 W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4x 4096 x 2160 @ 120 Hz
4x 5120 x 2880 @ 60 Hz

4x 4096 x 2160 @ 120Hz
4x 5120 x 2880 @ 60Hz
2x 7680 x 4320 @ 30Hz

4x 3840 x 2160 @ 165 Hz
2x 3840 x 2160 @ 360 Hz
2x 7680 x 4320 @ 100 Hz

4x 3840 x 2160 @ 165 Hz
2x 7680 x 4320 @ 100 Hz

4x 3840 x 2160 @ 165 Hz
2x 7680 x 4320 @ 100 Hz

Thermal Solution

Active

Active

Active

Active

Active

Dimension

2.7” H x 6.4” L, single slot

2.7” H x 6.4” L, single slot

2.7” H x 6.6” L, dual slot

4.4” H x 9.5” L, single slot, full height

4.4” H x 10.5” L, dual slot, full height

Advanced Display

NA

NA

NA

RTX PRO Sync

RTX PRO Sync

SLI/NVLink Support

NA

NA

NA

NA

NA

Disclaimers

Discrete Graphics Adapter Group 2

Adapter

NVIDIA RTX Pro 5000 Blackwell

NVIDIA RTX PRO 6000 Blackwell Max-Q Workstation Edition

AMD Radeon PRO W6400

Bus Interface

PCIe 5.0 x16

PCIe 5.0 x16

PCIe 4.0 x4

Display Interface

4x DP 2.1b

4x DP 2.1b

2x DP 1.4a

Graphics Chipset

GB202 (Blackwell)

GB202 (Blackwell)

RDNA 2.0

Memory Clock Frequency (MHz)

1750 MHz

1750 MHz

2000 MHz

Memory Size

48 GB GDDR7 with ECC

96 GB GDDR7 with ECC

4 GB GDDR6

Memory Interface

384-bit

512-bit

64-bit

Memory Bandwidth

1344 GB/s

1792 GB/s

128 GB/s

GPU Cores

CUDA Cores: 14,080
Tensor Cores: 440
RT Cores: 110

CUDA Cores: 24,064
Tensor Cores: 752
RT Cores: 188

Stream Processors: 768
RT Cores: 12

GPU Core Frequency (MHz)

2377 MHz

2280 MHz

2321 MHz

Maximum Power Consumption

300 W

300 W

50 W

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)

4x 3840 x 2160 @ 165 Hz
2x 7680 x 4320 @ 100 Hz

4x 4096 x 2160 @ 120 Hz
4x 5120 x 2880 @ 60 Hz
2x 7680 x 4320 @ 60 Hz

2x 3840×2160
2x 5120×2880
1x 7680×4320

Thermal Solution

Active

Active

Active

Dimension

4.4” H x 10.5” L, dual slot, full height

4.4” H x 10.5” L, dual slot, full height

6.6”L, single slot, half height

Advanced Display

RTX PRO Sync

RTX PRO Sync

NA

SLI/NVLink Support

NA

NA

NA

Disclaimers

Ethernet Specifications Group 1 Part 1

Card

RTL8125BGS 2.5G PCIe Ethernet Adapter​

Intel® I210-T1 Single Port Gigabit Ethernet Adapter​

Intel® I350-T4 Quad Port Gigabit Ethernet Adapter​

ThinkSystem Intel® E610-T4 10GBASE-T 4-port PCIe Ethernet Adapter​

Intel® E810-XXVDA2 10/25GbE SFP28 2-Port PCIe Ethernet Adapter​

Supplier PN

RTL8125BGS-CG

I210T1, MM# 941033

I350T4G1P20, MM# 928942

Coming Soon

Coming Soon

Data Rates Supported

10/100/1000/2500Mbps copper

10/100/1000Mbps copper

10/100/1000Mbps (Copper), 1000Mbps (Fiber)

Coming Soon

Coming Soon

Controller Details

Ethernet Controller RTL8125B

Intel® Ethernet Controller I210

Intel Ethernet Controller I351

Coming Soon

Coming Soon

Controller Bus Architecture

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

PCIe 2.1 (5GT/s)

Coming Soon

Coming Soon

Data Transfer Mode

Ethernet

Ethernet

Ethernet

Coming Soon

Coming Soon

Power Consumption

0.8W

0.81W

Copper:
I350T4V2= 5W
LC-Fiber:
I350F4= 6W

Coming Soon

Coming Soon

IEEE Standards Compliance

IEEE 802.3 10BASE-Te,100/1000/2.5G BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

IEEE 802.3/10BASE-T, 100BASE-TX, 1000BASE-T

Coming Soon

Coming Soon

Boot ROM Support

PXE /UEFI Boot

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgent Software via PXE or BootP, WDMS or UEFI

Coming Soon

Coming Soon

Network Transfer Mode (Full/Half Duplex)

Supported

Supported

Supported

Coming Soon

Coming Soon

Network Transfer Rate

2500Mbps Full Duplex

1,000Mbps Full Duplex

1,000Mbps Full Duplex

Coming Soon

Coming Soon

Operating System Driver Support

Windows 11 64

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Windows 7/8/10, Linux, Free BSD, XEN,Vmware

Coming Soon

Coming Soon

Manageability

Supported

Supported

Coming Soon

Coming Soon

Manageability Capabilities Alerting

Supported

Supported

Coming Soon

Coming Soon

Lithography

Coming Soon

Coming Soon

TDP

Thermal Management

Firmware Based Thermal Management

Firmware Based Thermal Management

Coming Soon

Coming Soon

Operating Temperature Range

-5℃-50℃ (23°F to 122°F)

0°C to 55°C (32°F to 131°F)

0°C to 55°C (32°F to 131°F)

Coming Soon

Coming Soon

# of Ports

1

1

4

Coming Soon

Coming Soon

Data Rate Per Port

10/100/1000/2500Mbps

10/100/1000Mbps (copper)

10/100/1000Mbps (copper), 1000Mbps (fiber)

Coming Soon

Coming Soon

System Interface Type

PCIe Gen 2.1

PCIe Gen 2.1

PCIe Gen 2.1

Coming Soon

Coming Soon

NC Sideband Interface

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Jumbo Frames Supported

Yes

Yes

Yes

Coming Soon

Coming Soon

1000Base-T

Yes

Yes

Yes

Coming Soon

Coming Soon

MACsec IEEE 802.1 AE

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

IEEE 1588

Supported

Supported

Supported

Coming Soon

Coming Soon

Supported Under vPro

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Disclaimers

Ethernet Specifications Group 1 Part 2

Model

RTL8125BGS 2.5G PCIe Ethernet Adapter​

Intel® I210-T1 Single Port Gigabit Ethernet Adapter​

Intel I350-T4 Quad Port Gigabit Ethernet Adapter

ThinkSystem Intel® E610-T4 10GBASE-T 4-port PCIe Ethernet Adapter​

Intel® E810-XXVDA2 10/25GbE SFP28 2-Port PCIe Ethernet Adapter​

Connector

RJPA54-5JE3-M1A-0R

RJ-45 Copper

4 x Ports RJ-45 Copper

Coming Soon

Coming Soon

Website

RTL8125BGS

i210 T1

i350 T4

Coming Soon

Coming Soon

Auto-Negotiation

Supported

IEEE* 802.3* Auto-negotiaton

IEEE* 802.3* Auto-negotiaton

Coming Soon

Coming Soon

Intel® vPro™

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Intel® Standard Manageablity

Not Available

Supported

Supported

Coming Soon

Coming Soon

Power Optimizer Platform Low-power Management Systems

Not Available

Supported

Supported

Coming Soon

Coming Soon

Energy Efficient Ethernet

Supported

Supported

Supported

Coming Soon

Coming Soon

TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)

Supported

Supported

Supported

Coming Soon

Coming Soon

Receive Side Scaling

Supported

Supported

Supported

Coming Soon

Coming Soon

Dual Tx and Rx Queues

Yes

Yes

Yes

Coming Soon

Coming Soon

Jumbo Frames (up to 9KB)

Jumbo Frames (up to 16KB)

Supported

Supported

Coming Soon

Coming Soon

Teaming

Supported

Supported

Supported

Coming Soon

Coming Soon

Integrated Switched Voltage Regulator (iSVR)

Supported

Supported

Not Available

Coming Soon

Coming Soon

Shared Flash with System BIOS

Not Available

Not Available

Not Available

Coming Soon

Coming Soon

Wake from Deep Sx

Supported

Supported

Supported

Coming Soon

Coming Soon

Server Operating System Support

TBD

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Windows Server 2008, 2012, 2016. 2019
Linux (RHEL/SLES), Free BSD, Xen, Vmware

Coming Soon

Coming Soon

Network Proxy/ARP Support

Supported

Supported

Supported

Coming Soon

Coming Soon

Disclaimers

Media Card Reader

Description

UHS-II 15-in-1 USB3.0 MCR

Interface Type

USB 3.0

Form Factor

USB 3.0 Mass Storage Device

Disclaimers

SECTION IV: BIOS/Certifications/Standards/Environmental

BIOS Specifications

WMI Support

Compliant With Microsoft WBEM and the DMTF Common Information Model

ROM-Based Setup Utility (F1)

System Configuration Setup Program (text and GUI interface) Available at Power-on With F1 Key

Bootblock Recovery

Recovers System BIOS if the Flash ROM Becomes Corrupted

Replicated Setup

Saves System Configuration Settings to a File That Can Then be Used to Replicate the Settings to Other Systems

Boot Control

Boot Control Available Through ROM-based Setup Utility or With F12 Key at Power-on

Memory Change Alert

Power-on Error Message in the Event of a Decrease in System Memory

Thermal Alert

Power-on Error message in the Event of a Fan Failure

Asset Tag

Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field

System/Emergency ROM Flash Recovery With Video

Supports Process to Recover the System BIOS if the Flash ROM Becomes Corrupted

Remote Wakeup/Remote Shutdown

System Admin Can Power On/Off a Client Computer from a Remote Location to Provide Maintenance

Quick Resume Time

Supports Low Power S3 (suspend to RAM) and Prompt Resume Times

ROM Revision Level

System UEFI (BIOS) Version Reported in SMBIOS Type 0 Structure and in BIOS Setup

Keyboard-less Operation

System Can be Booted Without a Keyboard

Per-port Control

Allows I/O Ports to be Individually Enabled/Disabled Through ROM-based Setup or WMI Interface

Adaptive Cooling

Offers Multiple Settings for Fan Control Ranging Between Better Performance and Better Acoustics

Security

User and Administrator Passwords Can Protect Boot and ROM-based Setup
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support

Intel(R) AMT (includes ASF 2.0)

Allows System to be Supported from a Remote Location

Intel(R) TXT

Provides a Security Foundation to Build Protections Against Software Based Attacks

Memory Modes

Supports Mirroring, Lock Step, and Sparing Memory Modes

Windows 10 Ready

TBD

Industry Standard Specification Support

UEFI

Unified Extensible Firmware Interface v2.9

ACPI (Advanced Configuration and Power management Interface)

Advanced Configuration and Power Interface v6.5

ASF 2.0

DMTF Alert Standard Format Specification v2.0

ATA (IDE)

NA

CD Boot

NA

EHCI

Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0

PCI

NA (No PCI slot)

PCI Express

PCI Express Base Specification v5.0

SATA

Serial ATA Revision 3.0 Specification

TPM

Trusted Computing Group TPM Specification v2.0

UHCI

Universal Host Controller Interface Design Guide, Revision v1.1

USB

Universal Serial Bus Revision v1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0

SMBIOS

DMTF System Management Spec v3.7

XHCI

XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous Substances and Preparation

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week”

Batteries

Not Available

Safety, EMC Connection to the Telephone Network and Labeling

Not Applicable, no Connection to a Telephone Network

Acoustic Noise Emissions Declaration

LWAd(bels) Idle

Coming Soon

LWAd(bels) Oper

Coming Soon

Safety, EMC Connection to the Telephone Network and Labeling

System Software Manager

Lenovo ThinkStation Supports Software Management Tools by Lenovo Vantage

Regulations & Standards

EMC & Safety

Coming Soon

Environmentals

Energy Star

ENERGY STAR® v9.0

EPEAT

EPEAT1.0 GOLD

Greenguard

Greenguard

RoHS

RoHS Compliant

ErP Lot-3 2013

Yes

Hazardous Substances

• Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week”

TCO Certification

TCO 10

Disclaimers

EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.

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