ThinkStation P310

Version: 1 | July 16, 2018

Section I: System Overview

P310 SFF
P310 Tower
Description
The single-processor workstation P310 uses a Micro Advanced Technology Extended (MATX) motherboard, with a 210 watt(W) power supply unit (PSU). The motherboard chipset consists of the Intel® PCH supporting error-correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA-C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3-1200V5 family of processors) as well as Core i (i3, i5, i7).
The single-processor workstation P310 uses a Micro Advanced Technology Extended (MATX) motherboard, both 250 watt (W), and an optional 400 watt (W) power supply unit (PSU). The motherboard chipset consists of the Intel® PCH supporting error-correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA-C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3-1200V5 family of processors) as well as Core i processors (i3, i5, i7).

Operating Systems

P310 SFF
P310 Tower
Preloaded
Supported

Motherboard

Form Factor

P310 SFF
P310 Tower
Board Size
248,,
248mm
Layout

Motherboard Core

P310 SFF
P310 Tower
Processor Support
Socket Type
Memory Support
QPI (GTPS)
Voltage Regulator
Chipset (PCH)
HW Monitor
Flash
Super I/O
Clock
Audio
Ethernet
SAS

Memory

P310 SFF
P310 Tower
Slots
Channels
Type
ECC Support
Speed
Max DIMM Size
Max System Memory

Ethernet

P310 SFF
P310 Tower
Vendor
Count
EEPROM
Speeds
Functions
Connectors

Audio

P310 SFF
P310 Tower
Vendor
Type
Internal Speaker
Connectors
Chipset
Stereo Conversion
High Definition Stereo Support
Number of Channels
Number of Bits/Audio Resolution
Sampling Rate (Recording/Playback)
Signal to Noise Ratio
Wavetable Voices
Analog Audio
Dolby Digital
THX
Digital Out (S/PDIF)
Speaker Power Rating

Video

P310 SFF
P310 Tower
Onboard
Adapter
Multi-GPU Support
Type
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name

Storage

P310 SFF
P310 Tower
Floppy
IDE
SATA
eSATA

Slots

P310 SFF
P310 Tower
Slot 1
Slot 2
Slot 3
PCI Express x4: Yes
Available Slots: 1 Half Height
PIN Count: 164 pins connectors
Data Bus Width: 8GB/s per Direction ; duplex 1GB/s
Voltage: 12V
Power (Max): 45W
PCI Express x4: Yes
Available Slots: 1 Full Height
PIN count: 164 pins connectors
Data Bus Width: 8GB/s per Direction ; duplex 1GB/s
Voltage: 12V
Power (Max): 75W
Slot 4
Slot 5
Slot 6
Slot 7
PCI Express x16: Yes
Available Slots: 1 Half High
PIN Count: 164 pins connectors
Data Bus Width: 8GB/s per Direction; duplex 16GB/s
Voltage: 12V
Power (Max): 45W
PCI Express x16: Yes
Available Slots: 1 Full High
PIN Count: 164 pins connectors
Data Bus Width: 8GB/s per Direction; duplex 16GB/s
Voltage: 12V
Power (Max): 75W
Slot 8

I/O Front Default Ports

P310 SFF
P310 Tower
USB 3.0 Type A
Headset
Headphone
Microphone
9-in-1 Media Card Reader

I/O Front Optional Ports

P310 SFF
P310 Tower
Flex Module
9-in-1 Media Card Reader
29-in-1 Media Card Reader

I/O Rear Default Ports

P310 SFF
P310 Tower
USB 2.0 Type A
USB 3.0 Type A
Display Port
VGA Port
1 standard serial, 1 optional via punching out
Audio In
Audio Out
Microphone
RJ45
2 PS/2

I/O Rear Optional Ports

P310 SFF
P310 Tower
2 PS/2
1 standard serial, 1 optional via punching out
IEEE 1394
eSATA
Parallel Card
Dual USB 3.1 Type C Card
Dual USB 2.0 Type A card
Single/Dual Port Network Card
Single/Dual/Quad Port Network Card

Thermal

P310 SFF
P310 Tower
Temp Sensors
Fans

Power Connectors

P310 SFF
P310 Tower
Main
(1) 10-Pin (2×5) ATX Standard
(1) 10-Pin (2×5) ATX Standard
Memory & CPU
4-Pin
4-Pin
Graphics
None
6-Pin (400W) (None for 250W)

Security

P310 SFF
P310 Tower
TPM
Asset ID
vPro

BIOS

P310 SFF
P310 Tower
Vendor
AMI
AMI

Chassis Information

P310 SFF
P310 Tower
Format
12L Rack Mountable Tower
25L Rack Mountable Tower
Color
PSU
Thermal Solutions
Dimensions
338mm H x 102mm W x 375mm D
425mm H x 175mm W x 431mm D
Weight
SFF(7.9kg(net weight)+1.05kg(carton+paper)+0.36kg(plastic)+0.9375kg(wood) = 10.2475 kg)
TWR(13kg(net weight)+1.3kg(carton+paper)+0.47kg(plastic)+0.9375kg(wood) = 15.7075 kg)

Packaging Parameters without External Speaker

P310 SFF
P310 Tower
Height (mm)
Height (inch)
Width (mm)
Width (inch)
Depth (mm)
Depth (inch)
Weight (kgs)
Weight (lbs)

Security & Serviceability

P310 SFF
P310 Tower
Hardware Maintenance Manual
Drivers & Software
Access Panel
Optical Drive
Hard Drives
Expansion Cards
Processor Socket
Color coded User Touch Points
Color-coordinated Cables and Connectors
Memory
System Board
Green Color Power LED on Front of Computer
Restore CD/DVD/USB Set
Cable Lock Support
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control
Power-On Password
Setup Password
NIC LEDs (integrated)
Security Chip
Access Panel Key Lock
Boot Sequence Control
Padlock Support
Boot without keyboard and/or mouse

Operating Enviornment

Air Temperature
Operating: 10°C to 35°C (50°F to 95°F) Storage: -40°C to 60°C (-40°F to 140°F) in original shipping carton Storage: -10°C to 60°C (14°F to 140°F) without carton
Storage
Humidity
Operating 20% ~ 80% (non-condensing) Non-Operating 20% ~ 90%(non-condensing) Wet Bulb Temperature Operating: 25°C max
Altitude
Operating: -15.2 m to 3048 m (-50 ft to 10 000 ft)
Vibration
With Packaging 1.04 G at 2 to 200 Hz at 1 octave/min Operating: 0.27 G at 5 to 500 Hz at 0.5 octave/min,Ramdom(without LCD panel) Non- operatig 1.04 G at 2 to 200 Hz at 1 octave/min
Shock
Without Package: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec) Operating: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Regulations & Standards

EMC & Safety

EMC
FCC DoC for North America
VCCI certification for Japan
BSMI certification for Taiwan
EU/EFTA CE Mark & DoC
UL/CUL
TUV-GS
IEC60950-1 CB Report/Certificate
Saudi Arabia ICCP(SASO)
China CCC Mark
Hong Kong SAR (CB report)
Argentina S-mark
Singapore – PSB
South Africa – SABS
Russia-GOST/EAC
Mexico-NOM
Kazakhstan -GOST-K /EAC
Belarus-certificate/EAC
Croatia-certificate/CE
Serbia – KVALITET
Ukraine – UKrCEPRO
Energy Star 6.1
PERD(Product Environmental Review Database
China RoHS
EU RoHS
EU WEEE
Japan J-Moss
California RoHS
USA Chemical Emission Test
New York RoHS
Japan Energy Saving
Safety

Environmentals

Energy Star
Energy Star Program Requirements for Computers: Version 6.1 (select models)
EPEAT
EPEAT™ Gold rating (select models)
ErP Lot-3 2013
ErP Lot-3 2013 (Enabled via system setup. Default on for systems shipped to EMEA.)
Hazardous Substances
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE).
Products do not contain Asbestos.
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation.
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week.

Section II: Supported Components

P310 SFF
P310 Tower
Processor
Memory Specifications
Notes

Storage

P310 SFF
P310 Tower
Notes
3.5" SATA Hard Disk Drive (HDD)
3.5" Enterprise SASA Hard Disk Drive (HDD)
3.5" Hybrid Drive
2.5" SAS Hard Disk Drive (HDD)
2.5" SATA Hard Disk Drive (HDD)
2.5" SATA Solid State Drive (SSD)
M.2 (NGFF) PCIe Solid State Drive (SSD)
2.5″ PCIe Solid State Drive (SSD)
PCIe Half Height / Half Length Solid State Drive (SSD)
Intel Optane Memory Technology

RAID

RAID
Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. Max support RAID 0,1,5,10 RAID levels and requirements: RAID 0 (striping) provides increased performance by writing data across multiple drives. RAID 1 (mirroring) provides fault tolerance by writing the data on two drives. RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives. RAID 10 (or RAID 1+0) combines RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.
RAID Levels and Requirements
Optional Hard Disk Drive Controllers
Intel Virtual Raid

Optical Drive/Removable Media

P310 SFF
P310 Tower
DVD-ROM Drive
DVD Burner/CD-RW Rambo Drive
Blu-Ray Burner Drive
DVD Burner/CD-RW Rambo Drive (Slim SATA)
Slim 9.0mm DVD ROM
Media Card Reader
Keyboard
Pointing Devices
Fingerprint Reader
Color Calibrator

Graphics Cards

P310 SFF
P310 Tower
Integrated Graphics
NVIDIA NVS310 (DP, DP)
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DVI Dongle(single link) – LP
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DP Dongle – LP
>NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – LP
Nvidia Quadro K420(DP/DVI) – 2GB DDR3-LP
NVIDIA Quadro K620 (DVI, DP) – 2GB DDR3 – LP
NVIDIA Quadro K1200(miniDP x4) – 4GB GDDR5 – LP
NVIDIA NVS310 (DP, DP)
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DVI Dongle(single link) – HP
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DP Dongle – HP
NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – HP
NVS 810 (miniDPx8) – 4GB DDR3-ATX w/ short ext.
Nvidia Quadro K420(DP/DVI) – 2GB DDR3- HP
NVIDIA Quadro K620 (DVI, DP) – 2GB DDR3 – HP
NVIDIA Quadro K1200(miniDPx4) – 4GB GDDR5 – HP
NVIDIA Quadro K2200(DVI, DP x2) – 4GB GDDR5 – HP
NVIDIA Quadro M2000 (Dp x 4) – 4GB ATX
NVIDIA Quadro M4000(DP x4) – 8GB GDDR5 ATX with short extender – HP
Discrete Graphic Cards
NVIDIA Stereo 3D Bracket

FLEX Components

P310 SFF
P310 Tower
Flex Components

PCIe Adapters

P310 SFF
P310 Tower
Network
Thunderbolt
IEE 1394
USB
Audio Devices
WIFI Cards
WWAN
Express Card
Chassis Materials
Parallel Card
PCIe to M.2 Adapter Card
Front Access Storage Enclosure
Type C

Section III: System Technical Specifications

Power Supply Specifications

P310 SFF
P310 Tower
Power Supply
210W
250W
Power Efficiency
85%
85%
Operating Voltage Range
Rated Voltage Range
Rated Line Frequency
Operating Line Frequency Range
Rated Input Current
Power Supply Fan
ENERGY STAR® qualified (Config Dependent)
80 PLUS Compliant
Built-in Self Test (BIST) LED
Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V)
Aux Power Drop

ThinkStation Power Calculator

P310 SFF
P310 Tower
ThinkStation Power Calculator

BIOS Specifications

Features

WMI Support
Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1)
System Configuration Setup program available at power-on with F1 key
Bootblock Recovery
Recovers system BIOS when Flash ROM corrupted.
Replicated Setup
Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control
Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert
Power-on Error message in event of decrease in system memory
Thermal Alert
Power-on Error message in event of fan failure
Asset Tag
Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video
Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown
System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume Time
Support low power S3 (suspend to RAM) and prompt resume times
ROM Revision Level
System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation
System can be booted without a keyboard
Per-port Control
Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling
Fans dynamically controlled by system BIOS based on temperature.
Security
User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0)
Allows system to be supported from a remote location
Intel(R) TXT
Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory Modes
Supports mirroring, lock step, and sparing memory modes
Windows 10 Ready
Supports Windows 10 requirements – Secure flash, UEFI v 2.3.1 spec

Industry Standard Specification Support

UEFI
Unified Extensible Firmware Interface v2.3.1
ACPI (Advanced Configuration and power Management Interface)
Advanced Configuration and Power Interface v4.0
ASF 2.0
DMTF Alert Standard Format Specification v2.0
ATA (IDE)
None
CD Boot
“El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI
None, support RAID/AHCI
PCI
PCI Express
PCI Express Base Specification 3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification Version 1.2
UHCI
None
USB
Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v2.7.1
XHCI
eXtensible Host Controller Interface for Universal Serial Bus, Revision 3.0

Social and Environmental Responsibility

Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control
Hazardous Substances and Preparation
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall be marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is provided in user manual
Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers (as dependent on the design of the product). Exception: Batteries that are permanently installed for safety, performance, medical or data integrity reasons do not have to be “easily removable
Safety, EMC Connection to the Telephone Network and Labeling
The product complies with legally required safety standards as specified
The product complies with legally required standards for electromagnetic compatibility
If product is intended for connection to a public telecom network or contains a radio transmitter, it complies with legally required standards for radio and telecommunication devices
The product is labeled to show conformance with applicable legal requirements
Product Packaging
Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified in the Montreal Protocol

Manageability

Industry Standard Specifications
This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT
Remote Manageability Software Solutions
Lenovo ThinkStation is supported on the following remote manageability software consoles:
Lenovo ThinkManagement Console
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
Microsoft System Center Configuration Manager
System Software Manager
Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Thin Installer
Service, Support, and Warranty
On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Component Specifications

Display

HDD Specifications

3.5″ SATA Hard Disk Drive (HDD)
3.5″ Enterprise SATA Hard Disk Drive (HDD)
3.5″ Hybrid Drive
2.5″ SAS Hard Disk Drive (HDD)
2.5″ SATA HDD
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid

Storage Device Specifications

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Connector
SATA
SATA
SATA
Transfer Rate (Gb/sec)
600MB/sec
600MB/sec
600MB/sec
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Connector
SATA
SATA
Transfer Rate (Gb/sec)
600MB/sec
600MB/sec

Performance

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Spindle Speed(RPM)
7200
7200
7200
Power off to Spindle Stop(sec)
23 max
23 max
11 max
DC Power to Drive Ready(sec)
30 max
30 max
10 max
Receipt of Start Unit Command to Drive Ready(sec)
30 max
30 max
17 max
Average Latency(msec)
4.16
4.16
4.16
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Spindle Speed(RPM)
7200
7200
Power off to Spindle Stop(sec)
10 max
11 max
DC Power to Drive Ready(sec)
10 max
Receipt of Start Unit Command to Drive Ready(sec)
10 max
Average Latency(msec)
4.16
4.16

Power Management

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Input (VDC)
+5v +- 5%+12v +- 5%
+5v +- 5%+12v +- 5%
+5v +- 5%+12v +- 5%
Typical (Watts)
10.62(6T)
10(6T)
8 max
Idle (Watts)
8(6T)
6.2(6T)
5.4 (Idle 2)
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Input (VDC)
+5v +- 5%+12v +- 5%
+5v +- 5%+12v +- 5%
Typical (Watts)
5.57 max
6.7 max
Idle (Watts)
4.21
4.5 (Idle 2)

Dimensions

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Height (mm – Max)
26.11
26.11
26.1
Width (mm)
101.6
101.6
101.6
Depth (mm – Max)
146.99
146.99
146.99
Weight (grams)
780 max
705 max
626 max
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Height (mm – Max)
20
26.11
Width (mm)
101.6
101.6
Depth (mm – Max)
146.99
146.99
Weight (grams)
415 max
535

Temperature

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Operating(C) Ambient
5 to 60
5 to 60
0 to 60
Operating(C) Base Casting
Non-Operating(C) Ambient
-40 to 70
-40 to 70
-40 to 70
Gradient(C per Hour)
20 max
20 max
30 max
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Operating(C) Ambient
0 to 60
0 to 60
Operating(C) Base Casting
Non-Operating(C) Ambient
-40 to 70
-40 to 70
Gradient(C per Hour)
30 max
30 max

Shock

3.5 7200 Enterprise 4T/6T (Model:Makara)
3.5 7200 Enterprise 4T/6T (Model:MakaraBP)
3.5″ 7200 2T/3T (Model:Grenada BP-R )
Operating(Gs @ 2ms)
70(read) 40(write)
70(read) 40(write)
70 max
Non-Operating(Gs @ 2ms)
250 6T,300 other
250 6T,300 other
350 max
3.5″ 7200 500G/1T (Model:Pharaoh Oasis)
3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Operating(Gs @ 2ms)
80 max
80 max
Non-Operating(Gs @ 2ms)
300 max
300 max

SSD Specifications

1 TB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD, 6Gb/s, OPAL.2.5″
2.5″ SATA Solid State Drive (SSD)
M.2 (NGFF) PCIe Solid State Drive (SSD)
M.2 PCIe & SATA SSD
PCIe Half Height / Half Length Solid State Drive (SSD)
240GB SATA SSD, 6Gb/s, OPAL. 2.5″
2 TB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
2.5″ SATA Solid State Drive (SSD)
M.2 (NGFF) PCIe Solid State Drive (SSD)
M.2 PCIe & SATA SSD
PCIe Half Height / Half Length Solid State Drive (SSD)
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
2.5″ SATA Solid State Drive (SSD)
M.2 (NGFF) PCIe Solid State Drive (SSD)
M.2 PCIe & SATA SSD
PCIe Half Height / Half Length Solid State Drive (SSD)
PCIe Gen3 x4 NVMe
2.5″ SATA Solid State Drive (SSD)
M.2 (NGFF) PCIe Solid State Drive (SSD)
M.2 PCIe & SATA SSD
PCIe Half Height / Half Length Solid State Drive (SSD)

Solid State Storage Devices

1 TB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD, 6Gb/s, OPAL.2.5″
Supported Types
Dimensions inches/centimeters (W x D x H)
Size
Interface Type
Read/Write IOPS Specifications
Bandwidth Performance
Power Consumption (Max)
Active(AVG)
Idle
Min MTBF
1.5M hours
1.5 M hours
1.2 M hours
Min Sequential Read
560 MB/s
460 MB/s
540 MB/s
Min Sequential Write
510 MB/s
270 MB/s
490 MB/s
Min Random Read (8GB Span)
100000 IOPS
77000 IOPS
41000 IOPS
Min Random Write (8GB Span)
88000 IOPS
60000 IOPS
49000 IOPS
Min Power – Active
150 mW
155 mW
165 mW
Min Power – Idle
70 mW
75 mW
55 mW
Min MTBF
1.5M hours
1.5 M hours
1.2 M hours
Hardware Encryption
240GB SATA SSD, 6Gb/s, OPAL. 2.5″
2 TB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
Supported Types
Dimensions inches/centimeters (W x D x H)
Size
Interface Type
Read/Write IOPS Specifications
Bandwidth Performance
Power Consumption (Max)
Active(AVG)
Idle
Min MTBF
1.2 M hours
1.5M hours
1.5 M hours
Min Sequential Read
540 MB/s
530 MB/s
520 MB/s
Min Sequential Write
490 MB/s
500 MB/s
450 MB/s
Min Random Read (8GB Span)
41000 IOPS
920000 IOPS
92000 IOPS
Min Random Write (8GB Span)
49000 IOPS
83000 IOPS
38000 IOPS
Min Power – Active
165 mW
150 mW
155 mW
Min Power – Idle
55 mW
110 mW
75 mW
Min MTBF
1.2 M hours
1.5M hours
1.5 M hours
Hardware Encryption
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
Supported Types
Dimensions inches/centimeters (W x D x H)
Size
Interface Type
Read/Write IOPS Specifications
Bandwidth Performance
Power Consumption (Max)
Active(AVG)
Idle
Min MTBF
1.5 M hours
1.2 M hours
1.5 M hours
Min Sequential Read
520 MB/s
540 MB/s
520 MB/s
Min Sequential Write
450 MB/s
490 MB/s
440 MB/s
Min Random Read (8GB Span)
92000 IOPS
48000 IOPS
86000 IOPS
Min Random Write (8GB Span)
38000 IOPS
37000 IOPS
53000 IOPS
Min Power – Active
155 mW
165 mW
155 mW
Min Power – Idle
75 mW
55 mW
75 mW
Min MTBF
1.5 M hours
1.2 M hours
1.5 M hours
Hardware Encryption
PCIe Gen3 x4 NVMe
Supported Types
Dimensions inches/centimeters (W x D x H)
Size
Interface Type
Read/Write IOPS Specifications
Bandwidth Performance
Power Consumption (Max)
Active(AVG)
Idle
Min MTBF
Min Sequential Read
Min Sequential Write
Min Random Read (8GB Span)
Min Random Write (8GB Span)
Min Power – Active
Min Power – Idle
Min MTBF
Hardware Encryption

PCIe Add-on Storage Devices

1 TB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD, 6Gb/s, OPAL.2.5″
Interface
Capacity
Power Consumption
Sequential Read
Sequential Write
Random Read (100% Span)
Random Write (100% Span)
Latency – Read
Latency – Write
Power – Active
Power – Idle
Operating Temperature Range
Endurance Rating (Lifetime Writes)
Mean Time Between Failures (MTBF)
240GB SATA SSD, 6Gb/s, OPAL. 2.5″
2 TB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
Interface
Capacity
Power Consumption
Sequential Read
Sequential Write
Random Read (100% Span)
Random Write (100% Span)
Latency – Read
Latency – Write
Power – Active
Power – Idle
Operating Temperature Range
Endurance Rating (Lifetime Writes)
Mean Time Between Failures (MTBF)
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
Interface
Capacity
Power Consumption
Sequential Read
Sequential Write
Random Read (100% Span)
Random Write (100% Span)
Latency – Read
Latency – Write
Power – Active
Power – Idle
Operating Temperature Range
Endurance Rating (Lifetime Writes)
Mean Time Between Failures (MTBF)
PCIe Gen3 x4 NVMe
Interface
PCIe Gen3 x4 NVMe
Capacity
512GB
Power Consumption
5.5W
Sequential Read
2,600 MB/s
Sequential Write
1,500 MB/s
Random Read (100% Span)
Random Write (100% Span)
Latency – Read
Latency – Write
Power – Active
Power – Idle
Operating Temperature Range
Endurance Rating (Lifetime Writes)
Mean Time Between Failures (MTBF)

HDD Controllers

Optical Drive Specifications

Rates

Access Times

Power

Operating Systems Supported

Operating Environment

Graphics Cards

NVS310
NVS315
NVS510
# CUDA Cores
48
48
192
Single Precision
PCIe Gen
2
2
2
Memory Size
512 MB
1 GB
2 GB
Memory BW
14 GB/s
14 GB/s
28.5 GB/s
Slots + Display Connectors
DP
DMS-59
Mini DP
Display Support
2
2
4
Advanced Display
Board Power
Max Power
19.5 W
19.3 W
35 W
Max Resolution
2560 × 1600 at 60Hz (DP)
2560 × 1600 at 60Hz (DP)
3840×2160 at 60Hz (DP)
SLI Support
Form Factor
HH
HH
HH
NVS810
K2200
K1200
# CUDA Cores
1024(512 per GPU)
640
512
Single Precision
1.3 TFLOPs
1 TFLOPs
PCIe Gen
3
2
2
Memory Size
4 GB
4 GB
4 GB
Memory BW
28.8 GB/s
80 GB/s
80 GB/s
Slots + Display Connectors
Mini DP
2x DP + DVI
4x mDP
Display Support
8
4
4
Advanced Display
N/A
N/A
Board Power
68 W
46 W
Max Power
68 W
Max Resolution
4096×2160 at 30Hz (DP)
SLI Support
No
No
Form Factor
FH
FH
LP
K620
K420
M2000
# CUDA Cores
384
192
768
Single Precision
0.8 TFLOPs
0.3 TFLOPs
1.8 TFLOPs
PCIe Gen
2
2
3
Memory Size
2 GB
1 GB
4 GB
Memory BW
29 GB/s
29 GB/s
105.7 GB/s
Slots + Display Connectors
DP + DVI
DP + DVI
4x DP
Display Support
4
4
4
Advanced Display
N/A
N/A
N/A
Board Power
45 W
41 W
75W
Max Power
Max Resolution
SLI Support
No
No
Yes
Form Factor
HH
HH
FH
M4000
# CUDA Cores
1664
Single Precision
2.6 TFLOPs
PCIe Gen
3
Memory Size
8 GB
Memory BW
192 GB/s
Slots + Display Connectors
4x DP
Display Support
4
Advanced Display
SYNC
Board Power
120W
Max Power
Max Resolution
SLI Support
Yes
Form Factor
FH

Integrated Graphics Adapter

NVS310
NVS315
NVS510
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
NVS810
K2200
K1200
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
K620
K420
M2000
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
M4000
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support

Discrete Graphics Adapter

NVS310
NVS315
NVS510
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
NVS810
K2200
K1200
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
K620
K420
M2000
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support
M4000
Type
TGP (GPU + VRAM)
Bus Interface
Display Interface
Video Resolution (max)
Graphics Cover Name
Video Ram Max
Memory type
Memory bit
Memory Bandwidth
VRAM Type
GPU Cuda Cores
DisplayPort Max Resolution & Color Depth
HDMI Max Resolution & Color Depth
DirectX
OpenGL
OpenCL
Optimus
OS Support
Trible Monitor Support
Display Rotation Support
3D Setup & Render Engine
GPU Core Clock
Maximum Color Depth
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Type
Bus Interface
Display Interface
Graphics Chipset
Memory clock frequency(MHz)
Memory size
Memory bit(bit)
Memory BW
Dual Monitor Support
Display Rotation Support
3D Setup & Render Engine
VRAM Type
GPU Cuda Cores
GPU Core frequency(MHz)
Maximum Power Consumption
Operating System Graphics/Video API Support
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)
Thermal
Dimension
Advanced Display
SLI Support

Networking

Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Connector
RJ-45
RJ-45
Controller
Intel, I219-LM
Intel, I219-LM

Intel® Ethernet Connections

Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Data Rates Supported
10/100/1000 BASE-T IEEE 802.3
Controller Details
Controller bus architecture
PCIe, SMBus
Integrated memory
Yes
Data transfer mode
10/100/1000 BASE-T IEEE 802.3
Power consumption
TBD
IEEE Standards Compliance
Yes
Boot ROM Support
Yes
Network Transfer Mode (Full/Half Duplex)
Full/Half Duplex
Network Transfer Rate
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (full-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps
Operating System Driver Support
Win7/Win10/Linux/ DOS
Manageability
AMT 11.0
Manageability Capabilities Alerting
AMT 11.0
Lithography
40 nm
TDP
0.5 W
Operating Temperature Range
0°C to 85°C
# of Ports
Single
Data Rate Per Port
1 Gbps
System Interface Type
NC Sideband Interface
Jumbo Frames Supported
Yes
1000Base-T
Yes
MACsec IEEE 802.1 AE
IEEE 1588
Yes
Supported Under vPro
Yes

Ethernet

Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Connector
Model
Website
10BASE-T (IEEE 802.3 specification conformance)
100BASE-TX (IEEE 802.3 specification conformance)
1000BASE-T (IEEE 802.3 specification conformance)
Auto-Negotiation (IEEE 802.3u)
Intel® vPro™ 2 technology
Intel® Stable Image Platform Program (SIPP)
Intel® Standard Manageablity
Power optimizer platform low-power management systems
Energy Efficient Ethernet1 (IEEE 802.3az)
TCP/UDP checksum and segmentation offload (IPv4 and IPv6)
Receive Side Scaling
Dual Tx and Rx queues
Jumbo Frames (up to 9 KB)
Teaming
Integrated Auto Connect Battery Saver (ACBS) battery savings
Timing and Synchronization (802.1as / 1588)
Integrated Switched Voltage Regulator (iSVR)
Shared Flash with system BIOS
Wake from Deep Sx
Server operating system support
Network proxy/ARP support
32 wake filter support

WLAN

Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Model
Dimensions
Weight
Antenna Diversity
Radio ON/OFF Control
Connector interface
Operating Temperature (Adapter Shield)
Humidity Non-Operating
Operating Systems
Wi-Fi Alliance
IEEE WLAN Standard
Roaming
Bluetooth*
Authentication
Authentication Protocols
Encryption
Regulatory
US Government
Product Safety

WWAN

Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Model
4G LTE
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Category
Frequency Bands
3G
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Frequency Bands
Data Speed
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Peak Download Rate
Peak Upload Rate
Location Solution
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Satellite Systems
Audio Codecs
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
PCM/125
USB Drivers
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Windows 7, 8.1, 10
Linus
Android RIL
Interfaces
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
USB
SIM Interface 1.8V/3V
Control Options
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
APIs, AT Commands
Hardware
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Dimension
Antenna
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Connector: Main, Aux/GNSS, GNSS
Diversity
MIMO
GNSS Bian
Temperature Range
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Industrial Grade
Approvals
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Regulatory
Carrier
Cloud Services
Intel® Ethernet Connection I219-LM
P310 Tower
P310 SFF
Free Unlimited FOTA Upgrdes
Device Management Option
Application Enablement Option
Connectivity Management Option

Other

Media Card Reader

PCIe Add-on Cards

IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 internal port, 1 external port)

Intel® Ethernet Adapters

Acoustics

Configuration Information
Machine Types
Acoustic Noise Emissions Declaration

Color Calibrator

Colorimetric Accuracy

Camera

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