PDFVersion: 2.0 Dec 6, 2016

ThinkStation P910

Product Overview

The ThinkStation P910 is high performance dual socket workstation. An Intel® Grantley-based product, the P910 provides excellent performance and quality for applications where processor, memory, graphics, and storage requirements are critical.

The P910 is positioned above two Grantley-based workstations, the single socket P510 and dual socket P710.

Operating Systems

Preloaded

Genuine Windows 10® Professional 64-bit

Genuine Windows 10DG to 7® Professional 64-bit

Genuine Windows 10® 64-bit

Supported

Red Hat Enterprise Linux 7

Motherboard – P910

Form Factor

Board Size 13.15″ x 14.9″ (334mm x 378.5mm)
Layout Custom ATX

Motherboard Core

Processor Support
Intel® Xeon™ Quad Core (Broadwell EP)
Intel® Xeon™ Six Core (Broadwell EP)
Intel® Xeon™ Eight Core (Broadwell EP)
Intel® Xeon™ Ten Core (Broadwell EP)
Intel® Xeon™ Twelve Core (Broadwell EP)
Intel® Xeon™ Fourteen Core (Broadwell EP)
Intel® Xeon™ Sixteen Core (Broadwell EP)
Intel® Xeon™ Twenty-Two Core (Broadwell EP)
Intel® Xeon™ Six Core (Haswell EP)
Socket Type Socket-R3 (LGA 2011)
Memory Support 1600/1866/2133/2400 MHz
QPI (GTPS) 6.4/8.0/9.6 GTPS Links
Voltage Regulator Intel VR12.5 – 145W TDP Capable
Chipset (PCH) Wellsburg (Intel 612)
Flash 16MB + Depoped 16MB
HW Monitor
Super I/O Nuvoton NCT6683D
Clock Wellsburg (Intel 612) Native isCLK
Audio Realtek ALC662
Ethernet Intel Clarkville WGI218LM
SAS Optional via Flex Adapter

Memory

Slots 16 total Slots, 8 per CPU
Channels 4 Channels per CPU
Type DDR4 288-Pin, 1600/1866/2133/2400 MHz RDIMM and LRDIMM support
ECC Support YES
Speed Up to 2400 MHz
Max DIMM Size Up to 32GB RDIMM, 64GB LRDIMM
Max System Memory Up to 1TB LRDIMM (w/ 64GB)

Ethernet

Vendor Intel, Clarkville WGI210AT/WGI218LM
Count 2
EEPROM None for Clarkville
Speeds 10/100/1000 Mbps
Functions PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors (2) x RJ45 on Rear I/O

Audio

Vendor Realtek
Type HD (5.1)
Internal Speaker Yes, using SSM2211 amplifier
Connectors (3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
Global Headphone Jack (Headphone + MIC in
(1) x 2-Pin Internal Speaker Header

Video

Onboard <Not Supported>
Adapter (3) x PCI-E 3.0 16-Lane Slots
Additional adapters may be supported in x4 slots for Spec Bids
Multi-GPU Support BIOS supported, card dependent

Storage

Floppy None
IDE None
SATA/SAS (8) x SATA Connectors, Gen. 3
4 SATA HDD ports connected through 2 Mini SAS HD (X2 electrical, X4 mechanical) (2 HDDs upper bay, 2HDDs lower bay) + 2 SATA Gen 3 for ODDs + 1SATA for Mez Connector
eSATA (1) x eSATA Connector, Gen. 3 (Optional eSATA bracket)

Slots

Slot 1 (Near CPU) PCIe x16, gen 3, with Latch, CPU1,Full Length, FH
Slot 2 PCIe x1, gen 2, Open Ended, CPU1,Full Length, FH ( “Half length with Flex Adapters / Full length without Flex Adapter”)
Slot 3 PCIe x16, gen 3, with Latch, CPU1,Full Length, FH
Slot 4 PCIe x1, gen 2, Open Ended, CPU1,Full Length, FH
Slot 5 (Near Edge) PCIe x4, gen 2, Open Ended, CPU1, Half Length, FH
Slot 6 (Near Edge) PCIe x16, gen 3, with Latch, CPU2, Full Length, FH   ( “Half length with Flex Adapters / Full length without Flex Adapter”)
Slot 7 PCIe x16, gen 3, with Latch, CPU2, Full Length, FH
Slot 8 PCIe x4, gen 2, Open Ended, CPU2, Full Length, FH

Rear I/O

COM (1) x Serial Port (COM1)
eSATA (1) x eSATA Port (Gen. 2), optional via bracket
LPT None
Video <No Onboard Video>
Audio Microphone-In, Line In, Line Out
Ethernet (2) x RJ45
USB 2.0 (4) x USB 2.0 Ports
USB 3.0 (4) x USB 3.0 Ports
Firewire Optional

Internal I/O

USB 2.0 6 Total (4 Rear, 2 Internal to Flex Slot)
USB 3.0 9 total (4 front, 4 rear, 1 internal header for MCR)
PS/2 Yes (2)
Audio 2×7-pin (Mic In, Headphone) Global Version
COM2 None
Clear CMOS 3-Pin Clear CMOS Header
Speaker 2-Pin Internal Speaker Header
Chassis Intrusion 2-Pin Chassis Intrusion Switch Header
Firewire None

Thermal

Temp Sensors Ambient Thermal Sensor – Thermal diode Connected to Super I/O
VR1 Thermal Sensor – Thermal diode Connected to Super I/O
VR2 Thermal Sensor- Thermal diode Connected to Super I/O
PSU Thermal Sensor
Fans CPU Fan 4-pin header with 3-pin key
Rear SYSTEM Fan X2 4-pin header with 4-pin key
Front Fan 4-pin header with 4 pin key
ODD bay Fan X2 4-pin header with 3-pin key
PSU Fan Main PSU power connector

Power Connectors

Main Single Card Edge Connector
Memory & CPU
Graphics

Security

TPM Version 1.2, Infineon SLB9660TT1.3
Asset ID Yes, 1024X8bit, might depoped in future
vPro Intel vPro for WS (AMT 9.x)

BIOS

Vendor AMI

Chassis Summary

Chassis Information

Format 55L Rack Mountable Tower
Dimensions 440mm H x 200mm W x 620mm D (chassis only)446mm H x 200mm W x 620mm D (with rear handle & feet)
Weight 71.3lbs
Color
PSU 1300W 92% Efficient tooless
Thermal Solutions Three (3) system fans standard (2 front, 1 rear)

Physical Security & Serviceability

Access Panel Tool-less side cover removal
Optical Drive Tool-less
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less
Color coded User Touch Points Yes
Color-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Tool-less
Green Color Power LED on Front of Computer Yes
Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via Lenovo Support
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Security Chip Yes
Access Panel Key Lock Optional
Boot Sequence Control Yes
Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal
Boot without keyboard and/or mouse Yes

Operating Environment

Air Temperature

  • Operating: 10°C to 35°C (50°F to 95°F)
  • Storage: -40°C to 60°C (-40°F to 140°F) in original shipping carton
  • Storage: -10°C to 60°C (14°F to 140°F) without carton

Humidity

  • Relative Humidity Operating: 10% to 80% (non-condensing)
  • Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
  • Wet Bulb Temperature Operating: 25°C max
  • Wet Bulb Temperature Non-operating: 40°C max

Altitude

  • Operating: -15.2 m to 3048 m (-50 ft to 10 000 ft)

Regulations and Standards

EMC

  • FCC (DoC)/Canada
  • CE (EMC)
  • VCCI
  • JEIDA
  • C-Tick
  • BSMI
  • CCIB

Safety

  • FCC (DoC)/Canada
  • CE (EMC)
  • VCCI
  • JEIDA
  • C-Tick
  • BSMI
  • CCIB
  • PSB
  • CE (LVD)

Environmentals

Energy Star

  • Energy Star Program Requirements for Computers: Version 6.0 (select models)

EPEAT

  • ErP Lot-6 2014 (via system setup option; default on for systems shipped to EMEA.)

Hazardous Substances

  • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE).
  • Products do not contain Asbestos.
  • Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
  • Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation.
  • Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
  • Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week.

Section II: Supported Components

CPU Specifications

2S Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems but will also work on single CPU systems
Intel Xeon E5-2687W v4 – 12 Cores, 3.0 GHz, 9.6 QPI, 30MB Cache, DDR4-2400, Turbo. HT, 160W
Intel Xeon E5-2699 v4 – 22 Cores, 2.2 GHz, 9.6 QPI, 55MB Cache, DDR4-2400, Turbo, HT, 145W
Intel Xeon E5-2697A v4 – 16 Cores, 2.6 GHz, 9.6 QPI, 40MB Cache, DDR4-2400, Turbo, HT, 145W
Intel Xeon E5-2690 v4 – 14 Cores, 2.6 GHz, 9.6 QPI, 35MB Cache, DDR4-2400, Turbo, HT, 135 W
Intel Xeon E5-2680 v4 – 14 Cores, 2.4 GHz, 9.6 QPI, 35MB Cache, DDR4-2400, Turbo, HT, 120W
Intel Xeon E5-2667 v4 – 8 Cores, 3.2 GHz, 9.6 QPI, 25MB Cache, DDR4-2400, Turbo, HT, 135W
Intel Xeon E5-2660 v4 – 14 Cores, 2.0 GHz, 9.6 QPI, 35MB Cache, DDR4-2400, Turbo, HT, 105W
Intel Xeon E5-2658 v4 – 14 Cores, 2.3 GHz, 9.6 QPI, 35MB Cache, DDR4-2400, Turbo, HT, 105W
Intel Xeon E5-2650 v4 – 12 Cores, 2.2 GHz, 9.6 QPI, 30MB Cache, DDR4-2400, Turbo, HT, 105W
Intel Xeon E5-2643 v4 – 6 Cores, 3.4 GHz, 9.6 QPI, 20MB Cache, DDR4-2400 , Turbo, HT, 135W
Intel Xeon E5-2640 v4 – 10 Cores, 2.4 GHz, 8.0 QPI, 25MB Cache, DDR4-2133 , Turbo, HT, 90W
Intel Xeon E5-2637 v4 – 4 Cores, 3.5 GHz, 9.6 QPI, 15MB Cache, DDR4-2400 , Turbo, HT, 135W
Intel Xeon E5-2630 v4 – 10 Cores, 2.2 GHz, 8.0 QPI, 25MB Cache, DDR4-2133 , Turbo, HT, 85W
Intel Xeon E5-2623 v4 – 4 Cores, 2.6 GHz, 8.0 QPI, 10MB Cache, DDR4-2133 , Turbo, HT, 85W
Intel Xeon E5-2620 v4 – 8 Cores, 2.1 GHz, 8.0 QPI, 20MB Cache, DDR4-2133 , Turbo, HT, 85W
Intel Xeon E5-2609 v4 – 8 Cores, 1.7 GHz, 6.4 QPI, 20MB Cache, DDR4-1866 , 85W
Intel Xeon E5-2603 v4 – 6 Cores, 1.7 GHz, 6.4 QPI, 15MB Cache, DDR4-1866 , 85W
Intel Xeon E5-2620 v3 6 Cores, 2.4GHz, 8.0 QPI, 15MB Cache, DDR4-1866, Turbo, HT, 85W
Intel Xeon E5-2609 v3 – 6 Cores, 1.9GHz, 6.4 QPI, 15MB Cache, DDR4-1600, 85W

Notes

When ordering two processors, the second processor must be the same as the first. Intel processor numbers are not a measurement of higher performance. Processor numbers differentiate features within each processor family, not across different processor families.

Multi core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; not all customers or software applications will necessarily benefit from use of these technologies.

64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations

Memory Specifications

P910

RDIMMs – 2400MHz
8GB DDR4 ECC RDIMM PC4-2400-R 2Rx8
16GB DDR4 ECC RDIMM PC4-2400-R 2Rx4
32GB DDR4 ECC RDIMM PC4-2400-R 2Rx4
LRDIMMs – 2400MHz
64GB DDR4 ECC LRDIMM PC4-2400-L 4Rx4

Storage – Hard Drive/SSD Specifications

3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive (HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ OPAL
512GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
1 TB SATA SSD , 6Gb/s, , 2.5″ Non-OPAL
180GB SATA SSD. 6Gb/s. , 2.5″ OPAL
240GB SATA SSD, 6Gb/s, , 2.5″ OPAL
480GB SATA SSD, 6Gb/s, , 2.5″ OPAL
M.2 (NGFF)  PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe
2.5″ PCIe Solid State Drive (SSD)
400GB PCIe -Intel 750 2.5″ PCIe Gen 3×4 NVMe
PCIe Half Height / Half Length Solid State Drive (SSD)
400GB PCIe – Intel P3700 PCIe Gen 3×4 NVMe,Non-Opal

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. Max support RAID 0,1,5,10

RAID levels and requirements:

  • RAID 0 (striping) provides increased performance by writing data across multiple drives.
  • RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
  • RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives.
  • RAID 10 (or RAID 1+0) combines
  • RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.

Optional Hard Disk Drive Controllers

  • LSI 9364-8i 8-port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module
  • LSI SAS/SATA RAID Flex adapter

Optical Drive/Removable Media

DVD-ROM Drive (SATA)
DVD-ROM Drive – 16x/48x (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
Blu-Ray Burner Drive (SATA)
Blu-Ray Burner Drive w/AACS encryption (SATA)
DVD Burner/CD-RW Rambo Drive (Slim SATA)
DVD Burner/CD-RW Rambo Drive (9.5mm Slim SATA)
Media Card Reader
Front 9 in 1 Media Card reader Standard
Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)

Keyboard

  • Preferred Pro Fullsize Keyboard (USB)
  • Preferred Pro Fullsize Keyboard (PS/2)
  • Smart Card KYB
  • Chicony KUF1256 fingerprint KB Win8
  • Lenovo Slim New F5 USB Keyboard

Pointing Devices

  • Optical Wheel Mouse (1000 DPI), USB – red wheel
  • Lenovo USB Laser Mouse for win7 and win10
  • PS2 black optical mouse with new logo
  • 3DConnexion CadMouse

Graphics Cards

Nvidia Quadro P5000 (DVI-D,4xDP) – 16GB GDDR5 with Long extenderNvidia Quadro P6000 (DVI-D,4xDP) – 24GB GDDR5 with Long extender

Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS315 (with DMS-59 to Dual DVI single link dongle) – 1GB DDR3
Nvidia NVS315 (with DMS-59 to Dual Display Port dongle) – 1GB DDR3
Nvidia NVS 510 (mini DP x 4) – 2GB DDR3
NVS 810 (miniDPx8) – 4GB DDR3-ATX Long Offset Ext Bracket
Nvidia Quadro K420(DP/DVI) – 2GB DDR3- ATX
Nvidia Quadro K620 (DVI, DP) – 2GB DDR3 ATX
NVIDIA Quadro K1200(miniDPx4) – 4GB GDDR5 – HP
Nvidia Quadro K2200 (DVI, DP, DP) – 4GB GDDR5 ATX
Nvidia Quadro M2000 (Dp x 4) – 4GB ATX
Nvidia Quadro M4000 (DP x 4I) – 8GB GDDR5- ATX Long Offset Ext Bracket
Nvidia Quadro M5000 (DVI, DP x 4) – 8GB GDDR5- ATX Long Offset Ext Bracket
Nvidia Quadro M6000 (Dual Link DVI, DPx4) – 24GB GDDR5 – Long Offset Extender
NVIDIA SLI Implementations
2 x Nvidia Quadro M5000 with SLI cable
2 x Nvidia Quadro M6000 with SLI Cable
NVIDIA GPU Computing Processor
NVIDIA Tesla K40C GPU Active Accelerator – 12GB GDDR5 Long Ext
Intel Parallel Coprocessor
Intel Xeon Phi Coprocessor 3120A – 57 Cores, 1.1 GHz, 6GB Cache, 300 W – PCIe x16, with long extender bracket
NVIDIA Stereo 3D Bracket
Nvidia Stereo 3D Connector Bracket

FLEX Components

Flex Bay: Formerly known as ODD bays.  Will support not only ODD, but also HDDs and Flex Module
Flex Module: Module supported in the Flex Bay with several options integrated. Will support slim ODD, High Speed Media Card Reader or 2 universal ports supporting IEEE1394, eSATA, etc…
Flex Connector: Mezzanine connector in the motherboard, that enables expanded storage and I/O.  2 available in P900, 1 available in P500/P700
Flex Tray: New HDD Tray design enables that two drives on a single tray (when used in a blind connect configuration)

PCIe

Network Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIE ASF FH
Thunderbolt Intel Thunderbolt PCIe Add-In-Card
IEE 1394 IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 external, 1 internal port)
USB USB 3.0 PCI Express x1 Adapter
WIFI Card Intel 7260 AC Wifi card
Parallel Card Sunix 1 – Port IEEE1284 Parallel PCI Express x1 Communication card full Height

Section III: System Technical Specifications

Power Supply Specifications

Power Supply 1300W PSU
Operating Voltage Range 90-264VAC
Rated Voltage Range 100-240V
Rated Line Frequency 50/60Hz
Operating Line Frequency Range 47Hz/63Hz
Rated Input Current 15A-9A
Power Supply Fan (2) 60x38mm, 14000rpm max
ENERGY STAR® qualified (Config Dependent) *System level select models
80 PLUS Compliant Yes 80 PLUS Platinum
Built-in Self Test (BIST) LED YES
Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V) YES
Aux Power Drop Quad Drop

Click here to access the ThinkStation Power Calculator.

BIOS Specifications

WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1) System Configuration Setup program available at power-on with F1 key
Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.
Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert Power-on Error message in event of decrease in system memory
Thermal Alert Power-on Error message in event of fan failure
Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume time Support lor power S3 (suspend to RAM) and prompt resume times
ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation System can be booted without a keyboard
Per-port Control Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature. User has ability to provide custom fan control table
Security User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location
Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory modes Supports mirroring, lock step, and sparing memory modes
Windows 8 ready Supports Windows 8 requirements – Secure flash, UEFI v 2.3.1 spec
Industry Standard Specification Support
UEFI Unified Extensible Firmware Interface v2.3.1d
ACPI (Advanced Configuration and power Management Interface) Advanced Configuration and Power Interface v5.0
ASF 2.0 DMTF Alert Standard Format Specification v2.0
ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot “El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI PCI Local Bus v3.0
PC Firmware Specification 3.1
PCI Express PCI Express Base Specification 3.0
SATA Serial ATA Revision 3.0 Specification
TPM Trusted Computing Group TPM Specification Version 1.2
UHCI Universal Host Controller Interface Design Guide, Revision 1.1
USB Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS DMTF System Management Spec v2.8.0

Social and Environmental Responsibility

Quality Control

  • Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation

  • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B2
  • Products do not contain Asbestos
  • Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
  • Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
  • Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
  • Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.6 microgram/cm²/week
  • REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

  • If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead,it shall be marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is provided in user manual
  • Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
  • Batteries and accumulators are easily removable by either users or service providers (as dependent on the design of the product). Exception: Batteries that are permanently installed for safety, performance, medical or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling

  • The product complies with legally required safety standards as specified
  • The product complies with legally required standards for electromagnetic compatibility
  • If product is intended for connection to a public telecom network or contains a radio transmitter, it complies with legally required standards for radio and telecommunication devices
  • The product is labeled to show conformance with applicable legal requirements

Product packaging

  • Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and hexavalent chromium by weight of these together.
  • Plastic packaging material is marked according to ISO 11469 referring ISO 1043
  • The product packaging material is free from ozone depleting substances as specified in the Montreal Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT
Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability software consoles:
Lenovo ThinkManagement Console
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
Microsoft System Center Configuration Manager
System Software Manager Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Thin Installer
Service, Support, and Warranty On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Component Specifications

HDD Specifications

3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive (HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″

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2.5 10K SAS 300G/600G (Model:Thunderbolt) 2.5 15K SAS 600G
(Model:Valkyrie BP)
Connector SAS SAS
Transfer Rate 12Gb 12Gb
Performance
Spindle Speed(RPM) 10,000 +/- 15,000 +/-
Power off to Spindle Stop(sec) 20 sec 20 sec
DC Power to Drive Ready(sec) 20 sec 20 sec
Receipt of Start Unit Command to Drive Ready(sec) 20 sec 20 sec
Average Latency(sec) 2 2
Power Management
Input(VDC) +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5%
Typical(Watts) 6.01 8.03
Idle(Watts) 3.44 5.28
Dimensions
Height(mm – Max) 15 15
Width(mm) 69.85 69.85
Depth(mm – Max) 100.45 100.45
Weight(grams) 199(maximum) 230(maximum)
Temperature
Operating(C) Ambient 5 to 55 5 to 55
Operating(C) Base Casting 60 max 60 max
Non-Operating(C) Ambient -40 to 70 -40 to 70
Gradient(C per Hour) 20 max 20 max
Shock
Operating(Gs @2ms) 25 25
Non-Operating(Gs @2ms) 400 400
3.5 7200 Enterprise 4T/6T (Model:Makara) 3.5 7200 Enterprise 4T/6T (Model:MakaraBP) 3.5″ 7200 2T/3T (Model:Grenada BP-R ) 3.5″ 7200 500G/1T (Model:Pharaoh Oasis) 3.5″ 7200RPM Hybrid2T/1T (Model:Grenada BP2H )
Connector SATA SATA SATA SATA SATA
Transfer Rate (Gb/sec) 600MB/sec 600MB/sec 600MB/sec 600MB/sec 600MB/sec
Performance
Spindle Speed(RPM) 7200 7200 7200 7200 7200
Power off to Spindle Stop(sec) 23 max 23 max 11 max 10 max 11 max
DC Power to Drive Ready(sec) 30 max 30 max 10 max 10 max
Receipt of Start Unit Command to Drive Ready(sec) 30 max 30 max 17 max 10 max
Average Latency(msec) 4.16 4.16 4.16 4.16 4.16
Power Management
Input(VDC) +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5%
Typical(Watts) 10.62(6T) 10(6T) 8 max 5.57 max 6.7 max
Idle(Watts) 8(6T) 6.2(6T) 5.4 (Idle 2) 4.21 4.5 (Idle 2)
Dimensions
Height(mm – Max) 26.11 26.11 26.1 20 26.11
Width(mm) 101.6 101.6 101.6 101.6 101.6
Depth(mm – Max) 146.99 146.99 146.99 146.99 146.99
Weight(grams) 780 max 705 max 626 max 415 max 535
Temprature
Operating(C) Ambient 5 to 60 5 to 60 0 to 60 0 to 60 0 to 60
Operating(C) Base Casting
Non-Operating(C) Ambient -40 to 70 -40 to 70 -40 to 70 -40 to 70 -40 to 70
Gradient(C per Hour) 20 max 20 max 30 max 30 max 30 max
Shock
Operating(Gs @ 2ms) 70(read) 40(write) 70(read) 40(write) 70 max 80 max 80 max
Non-Operating(Gs @ 2ms) 250 6T,300 other 250 6T,300 other 350 max 300 max 300 max

SSD Specifications

2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
180GB SATA SSD. 6Gb/s. , 2.5″ OPAL
240GB SATA SSD, 6Gb/s, , 2.5″ OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ OPAL
480GB SATA SSD, 6Gb/s, , 2.5″ OPAL
512GB SATA SSD, 6Gb/s, , 2.5″ Non-OPAL
1 TB SATA SSD , 6Gb/s, , 2.5″ Non-OPAL
M.2 (NGFF) PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe
2.5″ PCIe Solid State Drive (SSD)
400GB PCIe -Intel 750 2.5″ PCIe Gen 3×4 NVMe
PCIe Half Height / Half Length Solid State Drive (SSD)
400GB PCIe – Intel P3700 PCIe Gen 3×4 NVMe,Non-Opal
180GB SATA SSD. 6Gb/s. OPAL.2.5″ 240GB SATA SSD, 6Gb/s,OPAL. 2.5″ 480GB SATA SSD, 6Gb/s,OPAL. 2.5″ 128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL 256GB SATA SSD, 6Gb/s, 2.5″ OPAL 256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL 512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL 512GB SATA SSD, 6Gb/s, 2.5″ OPAL
Min Sequential Read 540 MB/s 540 MB/s 540 MB/s 460 MB/s 520 MB/s 520 MB/s 520 MB/s 530 MB/s
Min Sequential Write 490 MB/s 490 MB/s 490 MB/s 270 MB/s 450 MB/s 450 MB/s 440 MB/s 495 MB/s
Min Random Read (8GB Span) 41000 IOPS 41000 IOPS 48000 IOPS 77000 IOPS 92000 IOPS 92000 IOPS 86000 IOPS 70000 IOPS
Min Random Write (8GB Span) 49000 IOPS 49000 IOPS 37000 IOPS 60000 IOPS 38000 IOPS 38000 IOPS 53000 IOPS 60000 IOPS
Min Power – Active 165 mW 165 mW 165 mW 155 mW 155 mW 155 mW 155 mW 100 mW
Min Power – Idle 55 mW 55 mW 55 mW 75 mW 75 mW 75 mW 75 mW 40 mW
Min MTBF 1.2 M hours 1.2 M hours 1.2 M hours 1.5 M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours
Hardware Encryption AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit
1 TB SATA SSD , 6Gb/s, 2.5″ Non-OPAL 2 TB  SATA SSD , 6Gb/s, 2.5″ OPAL
Min Sequential Read 560 MB/s 530 MB/s
Min Sequential Write 510 MB/s 500 MB/s
Min Random Read (8GB Span) 100,000 IOPS 920,000 IOPS
Min Random Write (8GB Span) 88,000 IOPS 83,000 IOPS
Min Power – Active 150 mW 150 mW
Min Power – Idle 70 mW 110 mW
Min MTBF 1.5M hours 1.5M hours
Hardware Encryption AES 256 bit AES 256 bit
Interface PCIe Gen3 x4 OPAL NVMe PCIe Gen3 x4 NVMe
Capacity 256GB 512GB
Performance Sequential Read 2,250 MB/s 2,600 MB/s
Sequential Write 1,250 MB/s 1,500 MB/s
Random Read 295,000 IOPS 310,000 IOPS
Random Write 93,000 IOPS 100,000 IOPS
Power Consumption 6.5W 5.5W
400GB PCIe – Intel P3700 400GB PCIe -Intel 750 2.5″
Sequential Read 2700 MB/s 2300 MB/s
Sequential Write 1080 MB/s 1000 MB/s
Random Read (100% Span) 450000 IOPS 450000 IOPS
Random Write (100% Span) 75000 IOPS 200000 IOPS
Latency – Read 20 µs 20 µs
Latency – Write 20 µs 20 µs
Power – Active 12W (write), 9W (read) 12
Power – Idle 4w 4
Operating Temperature Range 0°C to 55°C 0°C to 35°C
Endurance Rating (Lifetime Writes) 10 DWPD 70GB per day
Mean Time Between Failures (MTBF) 2,000,000 Hrs 1.2M hours
Interface PCIe Gen 3×4 PCIe Gen 3×4

HDD Controllers

LSI 9364-8i 8-port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module
LSI SAS/SATA RAID Flex adapter
LSI 9364-8i 8-port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module LSI SAS/SATA RAID Flex adapter
PCI Bus x8 lane PCI Express® 3.0 x8 lane PCI Express® 3.0
PCI Modes
RAID Levels RAID 0, 1, 5, 10, 50 and JBOD mod RAID 0, 1, 5, 10, 50 and JBOD mod
Data Transfer Rates Up to 12Gb/s per port Up to 12Gb/s per port
PCI Card Type
PCI Voltage +3.3V, +12V +3.3V, +12V
PCI Power
Bracket Full Height and Low-Profile Full Height and Low-Profile
Certification Level
Internal Connectors 2 HD Mini-SAS SFF8643 (Vertical mount) 2 HD Mini-SAS SFF8643 (Vertical mount)

Optical Drives Specifications

Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.

DVD-ROM Drive – 16x/48x (SATA) DVD Burner/CD-RW Rambo Drive (SATA) Blu-Ray Burner Drive w/AACS encryption (SATA) DVD Burner/CD-RW Rambo Drive (9.5mm Slim SATA)
Description 5.25-inch, half-height, tray-load 5.25-inch, half-height, tray-load 5.25-inch, half-height, tray-load 9.5mm slim, tray-load
Mounting Orientation Either horizontal or vertical Either horizontal or vertical Either horizontal or vertical Either horizontal or vertical
Interface Type SATA/ATAPI SATA/ATAPI SATA/ATAPI SATA/ATAPI
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in) (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in) (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in) (WxHxD) 128 x 9.5 x 127cm MAX
Disc Capacity DVD-ROM Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB
Access Times
DVD-ROM Single Layer < 140 ms (typical) < 140 ms (typical) < 140 ms (typical) < 160 ms (typical)
CD-ROM Mode 1 < 125 ms (typical) < 125 ms (typical) < 125 ms (typical) < 140 ms (typical)
Full Stroke DVD < 250 ms (seek) < 250 ms (seek) < 250 ms (seek) < 250 ms (seek)
Full Stroke CD < 210 ms (seek) < 210 ms (seek) < 210 ms (seek) < 210 ms (seek)
Power
Source SATA DC power receptacle SATA DC power receptacle SATA DC power receptacle SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p 5 VDC ± 5%-100 mV ripple p-p 5 VDC ± 5%-100 mV ripple p-p 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 10%-200 mV ripple p-p 12 VDC ± 10%-200 mV ripple p-p 12 VDC ± 10%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, < 1600 mA 5 VDC – <1000 mA typical, < 1600 mA 5 VDC – <1100 mA typical, < 2000 mA 5 VDC – <1000 mA typical, < 1500 mA
maximum maximum maximum maximum
12 VDC – < 1000 mA typical, < 2000 mA 12 VDC – < 1000 mA typical, < 2000 mA 12 VDC – < 1600 mA typical, < 2500 mA
maximum maximum maximum
Operating Environmental
Temperature 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F)
Relative Humidity 8% to 80% 8% to 80% 8% to 80% 8% to 80%
Maximum Wet Bulb Temperature 30° C (86° F) 30° C (86° F) 30° C (86° F) 30° C (86° F)
Operating Systems Supported Windows 10 Professional or Home 64-bit Windows 10 Professional or Home 64-bit Windows 10 Professional or Home 64-bit Windows 10 Professional or Home 64-bit
Windows 7 Professional 64-bit Windows 7 Professional 64-bit Windows 7 Professional 64-bit Windows 7 Professional 64-bit
Red Hat Enterprise Linux (RHEL) 7.2 Red Hat Enterprise Linux (RHEL) 7.2 Red Hat Enterprise Linux (RHEL) 7.2 Red Hat Enterprise Linux (RHEL) 7.2

Graphics Cards

P6000 P5000
# CUDA Cores 3840 2560
Single Precision
PCIe Gen 3 3
Memory Size 24G 16G
Memory BW 433 GB/s 288 GB/s
Slots + Display Connectors 4xDP+DVI-D 4xDP+DVI-D
Display Support 5 5
Advanced Display SDI, SYNC, Stereo SDI, SYNC, Stereo
Board Power 250W 180W
SLI Support Yes Yes
Form Factor FH FH
M6000 M5000 M4000 M2000
# CUDA Cores 3072 2048 1664 768
Single Precision 7.1 TFLOPs 4.3 TFLOPs 2.6 TFLOPs 1.8 TFLOPs
PCIe Gen 3 3 3 3
Memory Size 12GB 8 GB 8 GB 4GB
Memory BW 317 GB/s 211 GB/s 192 GB/s 105.7 GB/s
Slots + Display Connectors 4x DP + DVI-I 4x DP + 1x DVI 4x DP 4x DP
Display  Support 4 4 4 4
Advanced Display SDI, SYNC, Stereo SYNC SYNC N/A
Board Power 250W 150 W 120 W 75W
SLI Support Yes Yes Yes No
Form Factor FH FH FH FH
K2200 K1200 K620 K420
# CUDA Cores 640 512 384 192
Single Precision 1.3 TFLOPs 1 TFLOPs 0.8 TFLOPs 0.3 TFLOPs
PCIe Gen 2 2 2 2
Memory Size 4 GB 4GB 2 GB 1 GB
Memory BW 80 GB/s 80 GB/s 29 GB/s 29 GB/s
Slots + Display Connectors 2x DP + DVI 4x mDP DP + DVI DP + DVI
Display  Support 4 4 4 4
Advanced Display N/A N/A N/A N/A
Board Power 68 W 46 W 45 W 41 W
SLI Support No No No No
Form Factor FH LP HH HH
NVS310 NVS315 NVS510 NVS810
# CUDA Cores 48 48 192 1024(512 per GPU)
PCIe Gen 2 2 2 3
Memory Size 512 MB 1GB 2GB 4GB
Memory BW 14 GB/s 14 GB/s 28.5 GB/s 28.8 GB/s
Slots + Display Connectors DP DMS-59 Mini DP Mini DP
Max Display 2 2 4 8
Max Power 19.5 W 19.3 W 35 W 68 W
Max Resolution 2560 × 1600 at 60Hz (DP) 2560 × 1600 at 60Hz (DP) 3840×2160 at 60Hz (DP) 4096×2160 at 30Hz (DP)
Form Factor HH HH HH FH
K40
# CUDA Cores 2880
PCIe Gen Gen 3
Memory Size 12GB
Memory BW 288 GB/sec
Display  Support
Board Power 235W
Supported APIs C Based
Form Factor FL/FH/2x W

Available Graphics Drivers

  • Microsoft Windows 7 Professional (64-bit and 32-bit)
  • Microsoft Windows 10 Professional (64-bit)
  • Red Hat Enterprise Linux(RHEL) 7 Desktop/Workstation
Intel Xeon Phi Coprocessor 3120A
Processor Number 3120A processor
Processor Intel® Xeon® Phi™
Cache 28.5 MB L2
Instruction Set 64-bit
Instruction Set Extensions IMCI
Embedded Options Available No
Lithography 22 nm
# of Cores 57
Processor Base Frequency 1.1 GHz
TDP 300 W
Max Memory Size (dependent on memory type) 6 GB
Max # of Memory Channels 12
Max Memory Bandwidth 240 GB/s
ECC Memory Supported Yes
PCI Express Revision 2

Networking

P910
Connector RJ-45
Controller Intel, Clarkville WGI210AT

Intel, Clarkville WGI218LM

Intel i218 Gigabit Ethernet – LM

Lithography 40 nm
TDP 0.5 W
Operating Temperature Range 0°C to 85°C
# of Ports Single
Data Rate Per Port 1 Gbps
Jumbo Frames Supported Yes
1000Base-T Yes
Supported Under vPro Yes

Intel i210 Gigabit Ethernet – AT

Operating Temperature Range 0°C to 70°C
# of Ports Single
Data Rate Per Port 1 Gbps
System Interface Type PCIe v2.1 (2.5GT/s)
NC Sideband Interface Yes
Jumbo Frames Supported Yes
1000Base-T Yes
MACsec IEEE 802.1 AE No
IEEE 1588 Yes

Other

MEDIA CARD READER

9 in 1 29 in 1
Description Description
The Media card reader device is standard in our Pseries products  The device connects to a 2×5 two channel USB header on the motherboard of the system. There is no USB controller card provided. Please see the Disc Formats section below for a list of flash memory card formats that are supported. The Media card reader mounts into our FLEX module which fits into a standard 5.25″ Optical bay.
Mounting Orientation The Media Card Reader can not be changed and is hard wired into the system Mounting Orientation The Media Card Reader can not be changed, it only fits into the FLEX Module one way.
Interface Type Interface Type
USB 2.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots) USB 3.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots)
Disc Formats Disc Formats
SD xD-H
SDHC xD-M
SDXC Micro SD
Mini SD Micro SDHC
Mini SDHC SD
Micro SD* SDHC
Micro SDHC* SDXC
Micro SDXC* Mini SD
RS-MMC Mini SDHC
MMC MultiMediaCard (MMC)
MMC Micro Reduced Size MultiMediaCard (RS MMC)
MMC Mobile (MMC Plus)
MMC Plus (MMC Mobile)
M2 CompactFlash Card Type I (CF Type 1)
CF Type 2
MicroDrive (MD)
Memory Stick (MS)
Memory Stick Select
MS Duo
MS PRO
MS PRO DuMS PRO-HG Duo
MS XS Duo
MS XC-HG Duo
MS HG Micro*
MS XC Micro*
MS XC-HG Micro*
MMC Micro
Memory Stick Micro (M2)*
*Available with adapter *Available with adapter

IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 internal port, 1 external port)

Data Transfer Rate Supports up to 400 Mbps
Devices Supported IEEE-1394 compliant devices
Bus Type PCIe card full height PCIe slots
Ports One IEEE-1394a bilingual 6-Pin Connector (Rear)
System Requirements Genuine Windows 10® Professional 64-bit, Genuine Windows 10DG to 7® Professional 64-big
Not supported on Linux.
Premium® III or higher processor 128-MB RAM 1-GB Hard Drive CD-ROM drive Built in sound system available PCI slot
Temperature – 50° to 131° F (10° to 55° C)
Operating
Temperature – Storage –22° to 140° F (–30° to 60° C)
Relative Humidity – 20% to 80%
Operating
Compliances FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-
1998 STD, Taiwan BSMI CNS13438, Korea MIC

 

Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Cable Medium Copper Copper Copper
Cabling Type RJ-45 Category-5, up to 100 m Cat 5 up to 100m Cat 5 up to 100m
Bracket Height Low Profile and Full Height Low Profile and Full Height Low Profile and Full Height
TDP 1W 4.4W 5W
# of Ports Single Dual Quad
System Interface Type PCIe 2.1(2.5GT/s) PCIe v2.1 (5.0GT/s) PCIe v2.1 (5.0GT/s)
Intel® Virtualization Technology for Connectivity (VT-c) Yes Yes
Speed & Slot Width 2.5 GT/s, x1 Lane 5 GT/s, x4 Lane 5 GT/s, x4 Lane
Controller Intel I210 Intel I350 Intel I350
iWARP/RDMA No No No
Intel® Ethernet Power Management Yes Yes Yes
Intel® Data Direct I/O Technology No
Intelligent Offloads Yes Yes Yes
Storage Over Ethernet iSCSI, NFS iSCSI, NFS
On-chip QoS and Traffic Management No Yes Yes
Flexible Port Partitioning No Yes Yes
Virtual Machine Device Queues (VMDq) No Yes Yes
PCI-SIG* SR-IOV Capable No Yes Yes