PDFVersion: 1.4, Sept 24, 2015

ThinkStation P900

Product Overview

The ThinkStation P900 is high performance dual socket workstation. An Intel® Grantley-based product, the P900 provides excellent performance and quality for applications where processor, memory, graphics, and storage requirements are critical.

The P900 is positioned above two Grantley-based workstations, the single socket P500 and dual socket P700.

Operating Systems

Preloaded
Genuine Windows 7® Professional 64-bit
Genuine Windows 10® Professional 64-bit
Genuine Windows 10® 64-bit

Supported
Red Hat Enterprise Linux 7

Motherboard – P900

Form Factor

Board Size 13.15" x 14.9" (334mm x 378.5mm)
Layout Custom ATX

Motherboard Core

Processor Support Intel® Xeon™ Quad Core (Haswell EP)
Intel® Xeon™ Six Core (Haswell EP)
Intel® Xeon™ Eight Core (Haswell EP)
Intel® Xeon™ Ten Core (Haswell EP)
Intel® Xeon™ Twelve Core (Haswell EP)
Intel® Xeon™ Fourteen Core (Haswell EP)
Intel® Xeon™ Sixteen Core (Haswell EP)
Intel® Xeon™ Eighteen Core (Haswell EP)
Socket Type Socket-R3 (LGA 2011)
Memory Support 1333/1600/1866/2133 MHz
QPI (GTPS) 6.4/8.0/9.6 GTPS Links
Voltage Regulator Intel VR12.5 – 145W TDP Capable
Chipset (PCH) Wellsburg (Intel 612)
Flash 16MB + Depoped 16MB
HW Monitor
Super I/O Nuvoton NCT6683D
Clock Wellsburg (Intel 612) Native isCLK
Audio Realtek ALC662
Ethernet Intel Clarkville WGI218LM
SAS Optional via Flex Adapter

Memory

Slots 16 total Slots, 8 per CPU
Channels 4 Channels per CPU
Type DDR4 288-Pin, 1333/1600/1866/2133 MHz ECC UDIMM, RDIMM, and LRDIMM support
ECC Support YES
Speed Up to 2133 MHz
Max DIMM Size Up to 32GB RDIMM, 64GB LRDIMM
Max System Memory Up to 1TB LRDIMM (w/ 64GB)

Ethernet

Vendor Intel
Count 2
EEPROM None for Clarkville
Speeds 10/100/1000 Mbps
Functions PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors (2) x RJ45 on Rear I/O

Audio

Vendor Realtek
Type HD (5.1)
Internal Speaker Yes, using SSM2211 amplifier
Connectors (3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
Global Headphone Jack (Headphone + MIC in
(1) x 2-Pin Internal Speaker Header

Video

Onboard <Not Supported>
Adapter (3) x PCI-E 3.0 16-Lane Slots
Additional adapters may be supported in x4 slots for Spec Bids
Multi-GPU Support BIOS supported, card dependent

Storage

Floppy None
IDE None
SATA/SAS (8) x SATA Connectors, Gen. 3
4 SATA HDD ports connected through 2 Mini SAS HD (X2 electrical, X4 mechanical) (2 HDDs upper bay, 2HDDs lower bay) + 2 SATA Gen 3 for ODDs + 1SATA for Mez Connector
eSATA (1) x eSATA Connector, Gen. 3 (Optional eSATA bracket)

Slots

Slot 1 (Near CPU) PCIe x16, gen 3, full length, full height
Slot 2 PCIe x1, gen 2, full length, full height, open ended  ( “Half length with Flex Adapters / Full length without Flex Adapter”)
Slot 3 PCIe x16, gen 3, full length, full height
Slot 4 PCIe x1, gen 2, full length, full height, open ended
Slot 5 PCIe x4, gen 2, half length, full height, open ended
Slot 6 (Near Edge) PCIe x16, gen 3, full length, full height   ( “Half length with Flex Adapters / Full length without Flex Adapter”)
Slot 7 PCIe x16, gen 3, full length, full height
Slot 8 PCIe x4, gen 2, full length, full height, open ended

Rear I/O

COM (1) x Serial Port (COM1)
eSATA (1) x eSATA Port (Gen. 2), optional via bracket
LPT None
Video <No Onboard Video>
Audio Microphone-In, Line In, Line Out
Ethernet (2) x RJ45
USB 2.0 (4) x USB 2.0 Ports
USB 3.0 (4) x USB 3.0 Ports
Firewire Optional

Internal I/O

USB 2.0 6 Total (4 Rear, 2 Internal to Flex Slot)
USB 3.0 9 total (4 front, 4 rear, 1 internal header for MCR)
PS/2 Yes (2)
Audio 2×7-pin (Mic In, Headphone) Global Version
COM2 None
Clear CMOS 3-Pin Clear CMOS Header
Speaker 2-Pin Internal Speaker Header
Chassis Intrusion 2-Pin Chassis Intrusion Switch Header
Firewire None

Thermal

Temp Sensors Ambient Thermal Sensor – Thermal diode Connected to Super I/O
VR1 Thermal Sensor – Thermal diode Connected to Super I/O
VR2 Thermal Sensor- Thermal diode Connected to Super I/O
PSU Thermal Sensor
Fans CPU Fan 4-pin header with 3-pin key
Rear SYSTEM Fan X2 4-pin header with 4-pin key
Front Fan 4-pin header with 4 pin key
ODD bay Fan X2 4-pin header with 3-pin key
PSU Fan Main PSU power connector

Power Connectors

Main Single Card Edge Connector
Memory & CPU
Graphics

Security

TPM Version 1.2, Infineon SLB9660TT1.3
Asset ID Yes, 1024X8bit, might depoped in future
vPro Intel vPro for WS (AMT 9.x)

BIOS

Vendor AMI

Chassis Summary

Chassis Information

Format 55L Rack Mountable Tower
Dimensions 440mm H x 200mm W x 620mm D (chassis only)446mm H x 200mm W x 620mm D (with rear handle & feet)
Weight 71.3lbs
Color
PSU 1300W 92% Efficient tooless
Thermal Solutions Three (3) system fans standard (2 front, 1 rear)

Physical Security & Serviceability

Access Panel Tool-less side cover removal
Optical Drive Tool-less
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less
Color coded User Touch Points Yes
Color-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Tool-less
Green Color Power LED on Front of Computer Yes
Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via Lenovo Support
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Security Chip Yes
Access Panel Key Lock Optional
Boot Sequence Control Yes
Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal
Boot without keyboard and/or mouse Yes

Operating Environment

Air Temperature

  • Operating: 10°C to 35°C (50°F to 95°F)
  • Storage: -40°C to 60°C (-40°F to 140°F) in original shipping carton
  • Storage: -10°C to 60°C (14°F to 140°F) without carton

Humidity

  • Relative Humidity Operating: 10% to 80% (non-condensing)
  • Relative Humidity Storage/Transit: 10% to 90% (non-condensing)
  • Wet Bulb Temperature Operating: 25°C max
  • Wet Bulb Temperature Non-operating: 40°C max

Altitude

  • Operating: -15.2 m to 3048 m (-50 ft to 10 000 ft)

Regulations and Standards

EMC

  • FCC (DoC)/Canada
  • CE (EMC)
  • VCCI
  • JEIDA
  • C-Tick
  • BSMI
  • CCIB

Safety

  • FCC (DoC)/Canada
  • CE (EMC)
  • VCCI
  • JEIDA
  • C-Tick
  • BSMI
  • CCIB
  • PSB
  • CE (LVD)

Environmentals

Energy Star

  • Energy Star Program Requirements for Computers: Version 6.0 (select models)

EPEAT

  • EPEAT™ Gold rating (select models)

EuP Lot-6 2012

  • EuP Lot-6 2012 (Enabled via system setup. Default on for systems shipped to EMEA.)

Hazardous Substances

  • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE).
  • Products do not contain Asbestos.
  • Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
  • Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation.
  • Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
  • Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week.

Section II: Supported Components

CPU Specifications

2S Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems but will also work on single CPU systems
Intel Xeon E5-2687W v3  – 10 Cores, 3,1GHz, 9.6 QPI, 25MB Cache,  DDR4-2133, Turbo. HT, 160W
Intel Xeon E5-2699 v3 – 18 Cores,  2.3GHz, 9.6 QPI, 45MB Cache, DDR4-2133, Turbo, HT, 145W
Intel Xeon E5-2698 v3  – 16 Cores, 2.3GHz, 9.6 QPI, 40MB Cache, DDR4-2133, Turbo, HT, 135W
Intel Xeon E5-2697 v3 – 14 Cores, 2.6GHz, 9.6 QPI, 35MB Cache, DDR4-2133, Turbo, HT, 145W
Intel Xeon E5-2695 V3 – 14 Cores, 2.3GHz, 9.6 QPI, 35MB Cache, DDR4-2133, Turbo, HT, 120W
Intel Xeon E5-2690 v3 –  12 Cores, 2.6GHz, 9.6 QPI, 30MB Cache, DDR4-2133, Turbo, HT, 135W
Intel Xeon E5-2685 v3 – 12 Cores, 2.6GHz, 9.6 QPI, 30MB Cache, DDR4-2133, Turbo, 120W
Intel Xeon E5-2683 v3 – 14 Cores , 2.0GHz, 9.6 QPI, 35MB Cache, DDR4-2133,Turbo, HT, 120W
Intel Xeon E5-2680 v3 –  12 Cores, 2.5GHz, 9.6 QPI, 30MB Cache, DDR4-2133, Turbo, HT, 120W
Intel Xeon E5-2670 v3 –  12 Cores, 2.3GHz, 9.6 QPI, 30MB Cache, DDR4-2133,Turbo, HT, 120W
Intel Xeon E5-2667 v3, EP2S – 8 Cores, 3.2 GHz, 9.6 QPI, 20MB Cache, DDR4-2133, Turbo, HT, 135W
Intel Xeon E5-2660 v3 –  10 Cores, 2.6GHz, 9.6 QPI, 25MB Cache, DDR4-2133, Turbo, HT, 105W
Intel Xeon E5-2650 v3 –  10 Cores, 2.3GHz, 9.6 QPI, 25MB Cache, DDR4-2133, Turbo, HT, 105W
Intel Xeon E5-2643 v3 – 6 Cores, 3.4GHz, 9.6 QPI, 20MB Cache, DDR4-2133 , Turbo, HT, 135W
Intel Xeon E5-2640 v3 – 8 Cores, 2.6GHz, 8.0 QPI, 20MB Cache, DDR4-1866, Turbo, HT, 90W
Intel Xeon E5-2637 v3 – 4 Cores, 3.5GHz, 9.6 QPI, 15MB Cache, DDR4-2133, Turbo, HT, 135W
Intel Xeon E5-2630 v3 – 8 Cores, 2.4GHz, 8.0 QPI, 20MB Cache, DDR4-1866, Turbo, HT, 85W
Intel Xeon E5-2623 v3 – 4 Cores, 3.0GHz, 8.0 QPI, 10MB Cache, DDR4-1866, Turbo, HT, 105W
Intel Xeon E5-2620 v3  6 Cores, 2.4GHz, 8.0 QPI, 15MB Cache, DDR4-1866, Turbo, HT, 85W
Intel Xeon E5-2609 v3 – 6 Cores, 1.9GHz, 6.4 QPI, 15MB Cache, DDR4-1600, 85W
Intel Xeon E5-2603 v3 – 6 Cores, 1.6GHz, 6.4 QPI, 15MB Cache, DDR4-1600, 85W
Intel Xeon E5-2650L v3 –  12 Cores, 1.8GHz, 9.6 QPI, 30MB Cache, DDR4-2133, Turbo, HT, 65W
Intel Xeon E5-2630L v3 – 8 Cores, 1.8GHZ, 8.0 QPI, 20MB Cache, DDR4-1866, Turbo, HT, 55W
1S Processor SKUs – These SKUs have 1 QPI link and are targeted for single CPU systems.  If these are to be used in a dual processor system, only one 1S CPU can be installed and the CPU2 memory slots will not be functional.
Intel Xeon E5-1680 v3 – 8 Cores,3.2 GHz,  20MB Cache, DDR4-2133, Turbo, HT, 140W
Intel Xeon E5-1660 v3 – 8 Cores, 3.0 GHz, 20MB Cache, DDR4-2133, Turbo, HT, 140W
Intel Xeon E5-1650 v3 – 6 Cores,3.5 GHz, 15MB Cache, DDR4-2133, Turbo, HT, 140W
Intel Xeon E5-1630 v3 – 4 Cores, 3.7 GHz, 10MB Cache, DDR4-2133, Turbo, HT,140W
Intel Xeon E5-1620 v3 – 4 Cores, 3.5 GHz,  10 MB Cache, DDR4-2133, Turbo, HT, 140W
Intel Xeon E5-1607 v3 – 4 Cores, 3.1 GHz,10 MBCache, DDR4-1866, 140W
Intel Xeon E5-1603 v3 – 4 Cores, 2.8 GHz, 10 MB Cache, DDR4-1866, 140W

Notes

When ordering two processors, the second processor must be the same as the first. Intel processor numbers are not a measurement of higher performance. Processor numbers differentiate features within each processor family, not across different processor families.

Multi core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; not all customers or software applications will necessarily benefit from use of these technologies.

64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations

Memory Specifications

P900

RDIMMs – 2133MHz
4GB DDR4 ECC RDIMM PC4-2133-R
8GB DDR4 ECC RDIMM PC4-2133-R 1Rx4 4Gbit
16GB DDR4 ECC RDIMM PC4-2133-R 2Rx4 4Gbit
32GB DDR4 ECC RDIMM PC4-2133-R 2Rx4 8Gbit
LRDIMMs – 2133MHz
32GB DDR4 ECC LRDIMM PC4-2133-L 4Rx4 4Gbit
64GB DDR4 ECC LRDIMM PC4-2133-L

Storage – Hard Drive/SSD Specifications

3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive (HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ SAS Hard Disk Drive (HDD)
 300GB SAS – 15000rpm, 12Gb/s, 2.5″
450GB SAS – 15000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″
2.5″ SAS Solid State Drive (SSD)
200GB SAS SSD  – 12Gb/s, 2.5″
400GB SAS SSD – 12Gb/s, 2.5″
800GB SAS SSD – 12Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD. 6Gb/s. OPAL.2.5″
240GB SATA SSD, 6Gb/s,OPAL. 2.5″
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
1 TB SATA SSD , 6Gb/s, 2.5″ Non-OPAL
M.2 (NGFF)  PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen2x4
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
256 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
PCIe Half Height / Half Length Solid State Drive (SSD)
410GB PCIe – FusionIO ioFX-2 410GB HHHL PCIe SSD, Gen2,  x4 electrical x4 physical
1.6TB PCIe – FusionIO ioFX-2 1.6TB HHHL PCIe SSD, Gen2,  x4 electrical x4 physical

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. Max support RAID 0,1,5,10

RAID levels and requirements:

  • RAID 0 (striping) provides increased performance by writing data across multiple drives.
  • RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
  • RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives.
  • RAID 10 (or RAID 1+0) combines
  • RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.

Optional Hard Disk Drive Controllers

  • LSI 9364-8i 8-port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module
  • LSI 9364-8i 8-port SATA/SAS ROC Adapter(Protected Mode) w/ 1GB Flash Memory Module+SuperCap
  • LSI SAS/SATA RAID Flex adapter

Optical Drive/Removable Media

DVD-ROM Drive (SATA)
DVD-ROM Drive – 16x/48x (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
Blu-Ray Burner Drive (SATA)
Blu-Ray Burner Drive w/AACS encryption (SATA)
DVD Burner/CD-RW Rambo Drive (Slim SATA)
DVD Burner/CD-RW Rambo Drive (9.5mm Slim SATA)
Media Card Reader
Front 9 in 1 Media Card reader Standard
Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)

Keyboard

  • Preferred Pro Fullsize Keyboard (USB)
  • Preferred Pro Fullsize Keyboard (PS/2)

Pointing Devices

  • Optical Wheel Mouse (1000 DPI), USB – red wheel

Graphics Cards

Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS315 (with DMS-59 to Dual DVI single link dongle) –  1GB GDDR5
Nvidia NVS315 (with DMS-59 to Dual Display Port dongle) –  1GB GDDR5
Nvidia NVS 510 (mini DP x 4) – 2GB DDR5
NVQuadro K420(DP/DVI)-2GB DDR3- ATX
Nvidia Quadro K620 (DVI, DP) – 2GB DDR3 ATX
Nvidia Quadro K2200 (DVI, DP, DP) – 4GB DDR5 ATX
Nvidia Quadro K4200 (2xDP+DVI) – 4GB DDR5 ATX–Long Offset Ext Bracket
Nvidia Quadro M4000 (DP x 4I) – 8GB GDDR5- ATX Long Offset Ext Bracket
Nvidia Quadro K5200 (DVI x 2, DP, DP) –  8GB DDR5 –  Long Offset Ext Bracket,  ATX Lext
Nvidia Quadro M5000 (DVI, DP x 4) – 8GB GDDR5- ATX Long Offset Ext Bracket
Nvidia Quadro K6000 (Dual link DVI x 2, DP, DP) – 12GB GDDR5 –  Long Offset Ext Bracket, 2*6-pin Pwr
Nvidia Quadro M6000 (DP x 4, DVI ) – 12GB GDDR5 – Long Offset Ext Bracket, 8-pin Pwr
NVIDIA SLI Implementations
2 x Nvidia Quadro K5200 with SLI cable
2 x Nvidia Quadro K6000 with SLI Cable
NVIDIA GPU Computing Processor
Nvidia Tesla K20 – 5GB GDDR5 – Long Offset Ext Bracket
NVIDIA Tesla K40 GPU Active Accelerator – 12GB GDDR5 Long Ext
NVIDIA Stereo 3D Bracket
Nvidia Stereo 3D Connector Bracket

FLEX Components

Flex Bay: Formerly known as ODD bays.  Will support not only ODD, but also HDDs and Flex Module
Flex Module: Module supported in the Flex Bay with several options integrated. Will support slim ODD, High Speed Media Card Reader or 2 universal ports supporting IEEE1394, eSATA, etc…
Flex Connector: Mezzanine connector in the motherboard, that enables expanded storage and I/O.  2 available in P900, 1 available in P500/P700
Flex Tray: New HDD Tray design enables that two drives on a single tray (when used in a blind connect configuration)

PCIe

Network Intel 82574L Gigabit CT2 Desktop Ethernet Adapter
Intel 1 Gigabit ET Dual Port Server Adapter
Thunderbolt
IEE 1394 IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 external, 1 internal port)
USB USB 3.0 PCI Express x1 Adapter
Audio Devices Lenovo Branded 2-Piece Speaker Set
Speaker Brick

Section III: System Technical Specifications

Power Supply Specifications

Power Supply 1300W PSU
Operating Voltage Range 90-264VAC
Rated Voltage Range 100-240V
50/60Hz
Rated Line Frequency 47Hz/63Hz
Operating Line Frequency Range 15A-9A
Rated Input Current
(2) 60x38mm, 14000rpm max
Power Supply Fan
ENERGY STAR® qualified (Config Dependent) *System level select models
80 PLUS Compliant Yes 80 PLUS Platinum
Built-in Self Test (BIST) LED YES
Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V) YES
Aux Power Drop Quad Drop

Click here to access the ThinkStation Power Calculator.

BIOS Specifications

WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1) System Configuration Setup program available at power-on with F1 key
Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.
Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert Power-on Error message in event of decrease in system memory
Thermal Alert Power-on Error message in event of fan failure
Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume time Support lor power S3 (suspend to RAM) and prompt resume times
ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation System can be booted without a keyboard
Per-port Control Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature. User has ability to provide custom fan control table
Security User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location
Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory modes Supports mirroring, lock step, and sparing memory modes
Windows 8 ready Supports Windows 8 requirements – Secure flash, UEFI v 2.3.1 spec
Industry Standard Specification Support
UEFI Unified Extensible Firmware Interface v2.3.1d
ACPI (Advanced Configuration and power Management Interface) Advanced Configuration and Power Interface v5.0
ASF 2.0 DMTF Alert Standard Format Specification v2.0
ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot “El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI PCI Local Bus v3.0
PC Firmware Specification 3.1
PCI Express PCI Express Base Specification 3.0
SATA Serial ATA Revision 3.0 Specification
TPM Trusted Computing Group TPM Specification Version 1.2
UHCI Universal Host Controller Interface Design Guide, Revision 1.1
USB Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS DMTF System Management Spec v2.8.0

Social and Environmental Responsibility

Quality Control

  • Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation

  • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B2
  • Products do not contain Asbestos
  • Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
  • Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation
  • Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
  • Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.6 microgram/cm²/week
  • REACH Article 33 information about substances in articles is available at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

  • If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead,it shall be marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is provided in user manual
  • Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
  • Batteries and accumulators are easily removable by either users or service providers (as dependent on the design of the product). Exception: Batteries that are permanently installed for safety, performance, medical or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling

  • The product complies with legally required safety standards as specified
  • The product complies with legally required standards for electromagnetic compatibility
  • If product is intended for connection to a public telecom network or contains a radio transmitter, it complies with legally required standards for radio and telecommunication devices
  • The product is labeled to show conformance with applicable legal requirements

Product packaging

  • Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and hexavalent chromium by weight of these together.
  • Plastic packaging material is marked according to ISO 11469 referring ISO 1043
  • The product packaging material is free from ozone depleting substances as specified in the Montreal Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality:
Intel LAN with AMT
Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability software consoles:
Lenovo ThinkManagement Console
LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
Microsoft System Center Configuration Manager
System Software Manager Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
System Update
Update Retriever
Thin Installer
Service, Support, and Warranty On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Component Specifications

HDD Specifications

2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 15000rpm, 12Gb/s, 2.5″
450GB SAS – 15000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″
3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ 15K 3.5″ 7200 3.5″ Hybrid
Connector SAS SFF-8482 SATA SATA
Transfer Rate (Gb/sec) 12Gb 600MB/sec 600MB/sec
Performance
Spindle Speed(RPM) 15,000 +/- 7200 7200
Power off to Spindle Stop(sec) 30 max 11 max 11 max
DC Power to Drive Ready(sec) 30 max 17 max <1
Receipt of Start Unit Command to Drive Ready(sec) 30 max 17 max <1
Average Latency(msec) 2 +/- 0.25 4.16 4.16
Power Management
Input(VDC) +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5%
Typical(Watts) TBD 8 max 6.7 max
Idle(Watts) TBD 0.75 0.75
Dimensions
Height(mm – Max) 26.11 26.11 26.11
Width(mm) 101.6 +/- 0.25 101.6 101.6
Depth(mm – Max) 146.99 146.99 146.99
Weight(grams) 800 max 626 max 535 max
Temprature
Operating(C) Ambient 5 to 55 0 to 60 0 to 60
Operating(C) Base Casting 60 max
Non-Operating(C) Ambient -40 to 70  -40 to 70  -40 to 70
Gradient(C per Hour) 20 max 30 max 30 max
Shock
Operating(Gs @ 2ms) 60 max 80 max 80 max
Non-Operating(Gs @ 2ms) 250 max 350 max 350 max

SSD Specifications

2.5″ SAS Solid State Drive (SSD)
200GB SAS SSD  – 12Gb/s, 2.5″
400GB SAS SSD – 12Gb/s, 2.5″
800GB SAS SSD – 12Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD. 6Gb/s. OPAL.2.5″
240GB SATA SSD, 6Gb/s,OPAL. 2.5″
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
1 TB SATA SSD , 6Gb/s, 2.5″ Non-OPAL
M.2 (NGFF)  PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen2x4
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
256 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
  180GB SATA SSD. 6Gb/s. OPAL.2.5"  240GB SATA SSD, 6Gb/s,OPAL. 2.5" 480GB SATA SSD, 6Gb/s,OPAL. 2.5" 128GB SATA SSD, 6Gb/s, 2.5" Non-OPAL 256GB SATA SSD, 6Gb/s, 2.5" OPAL 256GB SATA SSD, 6Gb/s, 2.5" Non-OPAL 512GB SATA SSD, 6Gb/s, 2.5" Non-OPAL 1 TB  SATA SSD , 6Gb/s, 2.5" Non-OPAL
Min Sequential Read 540 MB/s 540 MB/s 540 MB/s 510 MB/s 520 MB/s 520 MB/s 520 MB/s 560 MB/s
MIn Sequential Write 490 MB/s 490 MB/s 490 MB/s 300 MB/s 280 MB/s 280 MB/s 460 MB/s 510 MB/s
Min Random Read (8GB Span) 48000 IOPS 48000 IOPS 48000 IOPS 85000 IOPS 90000 IOPS 90000 IOPS 96000 IOPS 100,000 IOPS
Min Random Write (8GB Span) 80000 IOPS 80000 IOPS 80000 IOPS 65000 IOPS 80000 IOPS 80000 IOPS 80000 IOPS 88,000 IOPS
Min Power – Active 165 mW 165 mW  165 mW  120 mW 120 mW 120 mW 120 mW 150 mW
Min Power – Idle 55 mW 55 mW 55 mW 80 mW 50 mW 50 mW 50 mW 70 mW
Min MTBF 1.2 M hours 1.2 M hours 1.2 M hours 1.5 M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours
Hardware Encryption AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit
Lithography 16 nm 16 nm 16 nm          

 

Interface  PCIe Gen2 x4 ACHI  PCIe Gen3 x4 ACHI  PCIe Gen3 x4 ACHI PCIe Gen3 x4 NVMe PCIe Gen3 x4 NVMe
Capacity  256GB  256GB  512GB  256GB  512GB 
Performance  Sequential Read 1,200 MB/s  2,250 MB/s 2,250 MB/s 2,250 MB/s 2,600 MB/s
Sequential Write  1,000 MB/s 1,250 MB/s  1,550 MB/s  1,250 MB/s  1,500 MB/s 
Random Read  105,000 IOPS  150,000 IOPS  150,000 IOPS  295,000 IOPS  310,000 IOPS 
Random Write  75,000 IOPS  95,000 IOPS  100,000 IOPS  93,000 IOPS  100,000 IOPS 
Power Consumption  5.4W  6.4W 6.4W 6.5W 5.5W

HDD Controllers

LSI 9364-8i 8-port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module LSI 9364-8i 8-port SATA/SAS ROC Adapter(Protected Mode) w/ 1GB Flash Memory Module+SuperCap
PCI Bus x8 lane PCI Express® 3.0 x8 lane PCI Express® 3.0
PCI Modes
RAID Levels RAID 0, 1, 5, 10, 50 and JBOD mod RAID 0, 1, 5, 10, 50 and JBOD mod
Data Transfer Rates Up to 12Gb/s per port Up to 12Gb/s per port
PCI Card Type
PCI Voltage +3.3V, +12V +3.3V, +12V
PCI Power
Bracket Full Height and Low-Profile Full Height and Low-Profile
Certification Level
Internal Connectors 2 HD Mini-SAS SFF8643 (Vertical mount) 2 HD Mini-SAS SFF8643 (Vertical mount)

Optical Drives Specifications

DVD-ROM Drive – 16x/48x (SATA) DVD Burner/CD-RW Rambo Drive (SATA)
Description 5.25-inch, half-height, tray-load 5.25-inch, half-height, tray-load
Mounting Orientation Either horizontal or vertical Either horizontal or vertical
Interface Type SATA/ATAPI SATA/ATAPI
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in) (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in)
Disc Capacity DVD-ROM Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB
Access Times
DVD-ROM Single Layer < 140 ms (typical) < 140 ms (typical)
CD-ROM Mode 1 < 125 ms (typical) < 125 ms (typical)
Full Stroke DVD < 250 ms (seek) < 250 ms (seek)
Full Stroke CD < 210 ms (seek) < 210 ms (seek)
Power
Source SATA DC power receptacle SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p 12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, < 1600 mA 5 VDC – <1000 mA typical, < 1600 mA
maximum maximum
12 VDC – < 600 mA typical, < 1400 mA 12 VDC – < 600 mA typical, < 1400 mA
maximum maximum
Operating Environmental
Temperature 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F)
Relative Humidity 10% to 90% 10% to 90%
Maximum Wet Bulb Temperature 30° C (86° F) 30° C (86° F)
Operating Systems Supported Windows 7 Professional 32-bit and 64-bit, Windows 7 Professional 32-bit and 64-bit,
Windows XP Professional or Windows XP Home 32*. Windows XP Professional or Windows XP Home 32*.
Red Hat Enterprise Linux(RHEL) WS4**, 5, 6 Red Hat Enterprise Linux(RHEL) WS4**, 5, 6
Desktop/Workstation. No driver is required for this device. Native Desktop/Workstation. No driver is required for this device. Native
support is provided by the operating system. support is provided by the operating system.

Graphics Cards

M6000 K6000 M5000 K5200 M4000 K4200 K2200 K620 K420
# CUDA Cores 3072 2880 2048 2304 1664 1344 640 384 192
Single Precision 7.1 TFLOPs 5.2 TFLOPs 4.3 TFLOPs 3.1 TFLOPs 2.6 TFLOPs 2.1 TFLOPs 1.3 TFLOPs 0.8 TFLOPs 0.3 TFLOPs
PCIe Gen 3 3 3 3 3 2 2 2 2
Memory Size 12GB 12 GB 8 GB 8 GB 8 GB 4 GB 4 GB 2 GB 1 GB
Memory BW 317 GB/s 288 GB/s 211 GB/s 192 GB/s 192 GB/s 173 GB/s 80 GB/s 29 GB/s 29 GB/s
Slots + Display Connectors 4x DP + DVI-I 2x DP + 2x DVI 4x DP + 1x DVI 2x DP + 2x DVI 4x DP 2x DP +  DVI 2x DP + DVI DP + DVI DP + DVI
Display  Support 4 4 4 4 4 4 4 4 4
Advanced Display SDI, SYNC, Stereo SDI, SYNC, Stereo SYNC SDI, SYNC, Stereo SYNC SDI, SYNC, Stereo SDI, SYNC, Stereo SDI, SYNC, Stereo SDI, SYNC, Stereo
Board Power 250W 225 W 150 W 150 W 120 W 108 W 68 W 45 W 41 W
SLI Support Yes Yes Yes Yes Yes Yes No No No
Form Factor FH FH FH FH FH FH FH HH HH
NVS310 NVS315 NVS510
# CUDA Cores 48 48 192
PCIe Gen 2 2 2
Memory Size 512 MB 1GB 2GB
Memory BW 14 GB/s 14 GB/s 28.5 GB/s
Slots + Display Connectors DMS-59 DMS-59 Mini DP
Max Display 2 2 4
Max Power 19.5 W 19.3 W 35 W
Max Resolution 2560 × 1600 at 60Hz (DP) 2560 × 1600 at 60Hz (DP) 3840×2160 at 60Hz (DP)
Form Factor HH HH HH
K20 K40
# CUDA Cores 2496 2880
PCIe Gen Gen 2 Gen 3
Memory Size 5GB 12GB
Memory BW 208 GB/sec 288 GB/sec
Display  Support
Board Power 225 W 235W
Supported APIs C Based C Based
Form Factor FL/FH/2x W FL/FH/2x W

Available Graphics Drivers

  • Microsoft Windows 8.1 (64-bit and 32-bit)
  • Microsoft Windows 7 Professional (64-bit and 32-bit)
  • Microsoft Windows 10 Professional (64-bit)
  • Red Hat Enterprise Linux(RHEL) 7 Desktop/Workstation

Networking

P900
Connector RJ-45
Controller Intel 82574L
Memory Integrated Dual 48K configurable transit receive FIFO Buffers
Data Rates Supported 10/100/1000 Mbps
Compliance IEEE 802.1p, Quality of Service (QoS) Support
Bus Architecture PCI-E 1.1
Typical Power Consumption 1.9W
Operating Temperature 32º to 131º F (0º to 55º C)
Storage Humidity 90% at 35ºC
Dimensions (H x W x D) 12cm x 5.53cm x 11.92cm
Operating System Driver Support Windows 7 Professional 32-bit and 64-bit, Red Hat Enterprise Linux 4 (4.8 or newer), 5 (5.3 or newer), 6
Cabling Type Category-5 up to 100m
Bracket Height Low Profile & Full Height
Max TDP 2.9 W
# of Ports Dual
System Interface Type PCIe v2.0 (2.5GT/s)
Intel® Virtualization Technology for Connectivity (VT-c) VMDq, VMDc
Speed & Slot Width 2.5 GT/s, x4 Lane

Other

MEDIA CARD READER

9 in 1 29 in 1
Description Description
The Media card reader device is standard in our Pseries products  The device connects to a 2×5 two channel USB header on the motherboard of the system. There is no USB controller card provided. Please see the Disc Formats section below for a list of flash memory card formats that are supported. The Media card reader mounts into our FLEX module which fits into a standard 5.25″ Optical bay.
Mounting Orientation The Media Card Reader can not be changed and is hard wired into the system Mounting Orientation The Media Card Reader can not be changed, it only fits into the FLEX Module one way.
Interface Type Interface Type
USB 2.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots) USB 3.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots)
Disc Formats Disc Formats
SD xD-H
SDHC xD-M
SDXC Micro SD
Mini SD Micro SDHC
Mini SDHC SD
Micro SD* SDHC
Micro SDHC* SDXC
Micro SDXC* Mini SD
RS-MMC Mini SDHC
MMC MultiMediaCard (MMC)
MMC Micro Reduced Size MultiMediaCard (RS MMC)
MMC Mobile (MMC Plus)
MMC Plus (MMC Mobile)
M2 CompactFlash Card Type I (CF Type 1)
CF Type 2
MicroDrive (MD)
Memory Stick (MS)
Memory Stick Select
MS Duo
MS PRO
MS PRO DuMS PRO-HG Duo
MS XS Duo
MS XC-HG Duo
MS HG Micro*
MS XC Micro*
MS XC-HG Micro*
MMC Micro
Memory Stick Micro (M2)*
*Available with adapter *Available with adapter

IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 internal port, 1 external port)

Data Transfer Rate Supports up to 400 Mbps
Devices Supported IEEE-1394 compliant devices
Bus Type PCIe card full height PCIe slots
Ports One IEEE-1394a bilingual 6-Pin Connector (Rear)
System Requirements Windows 7 Professional 32-bit and 64-bit, Microsoft® Windows® XP
Professional. Not supported on Linux. Pentium® III or higher processor 128-MB RAM 1-GB Hard Drive CD-ROM drive Built in sound system Available PCI slot
Temperature – 50° to 131° F (10° to 55° C)
Operating
Temperature – Storage –22° to 140° F (–30° to 60° C)
Relative Humidity – 20% to 80%
Operating
Compliances FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-
1998 STD, Taiwan BSMI CNS13438, Korea MIC
Operating Systems Windows 7 Professional 32-bit and 64-bit,
Supported Windows® XP Professional, XP Professional 64-bit.
Not supported on Linux