PDFVersion: 1.2, April 7, 2014

ThinkStation E32

Product Overview

The single-processor E32 workstation uses a Micro Advanced Technology Extended (MATX) motherboard, both 280 watt (W), and an optional 450 watt (W) power supply unit (PSU) for Tower and a 240 watt(W) for the Small Form Factor (SFF). The motherboard chipset consists of the Intel® PCH supporting error-correcting code (ECC) Double Data Rate 3 (DDR3). Maximum memory supported is 32GB for UDIMMs. The processor socket is an Intel® LGA1150 GA-C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3-1200V3 family of processors).

Section I: System Overview

Operating Systems

Preloaded
Genuine Windows 7® Professional 64-bit
Genuine Windows 7® Professional 32-bit
Genuine Windows 8® Professional 64-bit
Genuine Windows 8® 64-bit
Genuine Windows 8® 64-bit China
Genuine Windows 8.1® Professional 64-bit
Genuine Windows 8.1® 64-bit
Genuine Windows 8.1® 64-bit China

Supported
Red Hat Enterprise Linux 6.4

Motherboard – E32

Table 1. E32 Motherboard Summary

E32 Motherboard Summary
Form Factor
Board Size 9.6″ x 9.6″ (244mm x 244mm)
Layout Custom ATX
Motherboard Core
Processor Support Intel® Xeon™ E3-1200V3 (Haswell)
Intel® i7™ Quad Core
Intel® i5™ Quad Core
Intel® i3™ Dual Core
Socket Type (1) x Intel Socket (LGA1150)
Memory Support 1600/1333/1066 MHz
Voltage Regulator 87W TDP
Chipset (PCH) Denlow (Intel C226)
HW Monitor N/A
Super I/O IT8731F
Audio ALC662VC1-GR/ALC662VD-GR(co-lay)
Ethernet Intel L217LM Clarkville
Memory
Slots 4
Channels 2
Type DDR3 Unbuffered DRAM (UDIMM)
ECC Support Yes
Speed Up to PC3-12800 (1600MHz)
Max DIMM Size up to 8GB UDIMM, up to 32GB UDIMM
Max System Memory Up to 32GB UDIMM (w/8GB)
Ethernet
Vendor Intel
Count 1
EEPROM None (part of SPI flash)
Speeds 10/100/1000 Mbps
Functions PXE
WOL
AMT
Connectors (1) x RJ45 on Rear I/O
Audio
Vendor Realtek
Type Integrated Audio
Internal Speaker Yes
Connectors (3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
(2) x Front 3.5mm Jacks (Headphone out, Microphone In)
One 14-pin connector cut pin 14
Chipset ALC662
Stereo Conversion 24-bit DAC and 24-bit ADC
High Definition Stereo Support
Number of Channels 6
Number of Bits/Audio Resolution 6 channels of DAC support 16/20/24-bit PCM format for 5.1 audio solution
2 stereo ADC support 16/20-bit PCM format
Sampling Rate (recording/playback) Support 44.1K/48K/96K sample rate
Signal to Noise Ratio DAC SNR>98dBFSA, ADC SNR>90dBFSA
Wavetable Voices 32-voice wavetable(For XP only)
Analog Audio
Dolby Digital None
THX None
Digital Out (S/PDIF) None
Speaker Power Rating Int Speaker (1.5W) / Ext 2.0 Speaker (4W) – Tower

Adapter(1) x PCI-E 3.0 16-lane Slot
(1) x PCI-E 3.0 16 lane Slot (x4 electrical)

Video
Onboard Supported
Type Integrated
Bus Interface Processor onboard
Display Interface VGA/DP/DP
Video Resolution (max) VGA/DP: 2560×1600@60Hz
DVI/HDMI: 1920×1200@60Hz
Graphics Cover Name Intel HD Graphics P4600
Storage
Floppy None
IDE None
SATA (2) x SATA Connectors, Gen. 2 (AHCI)(2) x SATA Connectors, Gen. 3 (AHCI)(1) x eSATA Connector, Gen. 2 (eSATA bracket)SATA RAID 0,1, supported natively via Intel Controller
eSATA (1) x eSATA Connector, Gen. 2, cabled to slot via bracket
Slots
PCI
Available Slots 1 Full Height, 1 Low Profile (SFF)
PIN Count 120 pins connectors
Data Bus Width 32bit /33MHz; 133MB/s
Voltage 3.3V
PCI Express x4 (physical x16)
Available Slots 1 Full Height, 1 Low Profile (SFF)
PIN Count 164 pins connectors
Data Bus Width 8GB/s per Direction; duplex 16GB/s
Voltage 12V
Power (Max) 75W, 45W (SFF)
PCI Express x1
Available Slots 1 Full Height, 1 Low Profile (SFF)
PIN Count 36 pins connectors
Data Bus Width 500MB/s per Direction ; duplex 1GB/s
Voltage 12V
Power (Max) 25W
PCI Express x16
Available Slots 1 Full Height, 1 Low Profile (SFF)
PIN Count 164 pins connectors
Data Bus Width 8GB/s per Direction; duplex 16GB/s
12V 75W, 45W (SFF)
Rear I/O
COM (1) x Serial Port (COM1), (1) x optional
eSATA (1) x eSATA Port (Gen. 2), optional via bracket
LPT None
Video 1 VGA
2 Display Port
Audio Microphone-In, Line In, Line Out
Ethernet (1) x RJ45
USB 2.0 (2) x USB 2.0 Ports
USB 3.0 (4) x USB 3.0 Ports
Internal I/O
USB 2.0
  • Front Panel USB Header (2 ports)
  • Media Card Reader Header
  • Internal USB connector
PS/2 (1) x 2-port PS/2 Header, ports optional via bracket
Audio (1) x Front Panel Mic & Line-Out Header
COM2 (1) x Serial Port (COM2)
Clear CMOS 3-Pin Clear CMOS Header
Speaker 2-Pin Internal Speaker Header
Chassis Intrusion 2-Pin Chassis Intrusion Switch Header
Thermal
Fans Headers (1) x 4-Wire CPU Fan
(1) x 4-Wire Rear Fan
(1) x 3-Wire Front PCI Fan
Power Connectors
Main (1) 14-Pin (2×7) ATX Standard
VRM (1) 4-Pin (2×2) ATX 12V Standard
Security
Nuvoton Nuvoton NPCT421LA0WX / STMicro ST33ZP24AR28PVQC (co-lay)
Asset ID Rohm BUL08-1FJ-W/FVJ-W / NXP PCA24S08AD
vPro vPro for WS (AMT 9.x)
BIOS
Vendor AMI

Ethernet

The E32 motherboard implements onboard gigabit Ethernet via one Intel L217LM Clarkville controller. This integrated solution has support for the industry standard functions of Wake on LAN (WOL) and Preboot Execution Environment (PXE). Additionally, for Manageability features, Clarkville will support AMT.

Audio

The ALC662-VD chip from Realtek provides E32 with stereo audio capability that meets Windows7 Premium performance requirements. HD 5.1 audio is supported via jack remapping. There are 2 front analog jacks, and 3 rear color-coded (per MS Vista Logo Specification SYSFUND-0041) analog jacks.

Chassis Summary

E32 Chassis is a 25-liter ATX-form factor tower mechanical with 2 external 5.25″ drive bays, 1 external 3.5″ drive bay, and 2 internal 3.5″ drive bays.

The other E32 chassis is a 12.9-liter ATX-form factor tower mechanical with 1 external 5.25″ drive bays, 1 external 3.5″ drive bay, 1 internal 3.5″ drive bays and 1 optional internal 2.5” drive bay

Chassis Info:

Tower SFF
Color Raven Black paint Raven Black paint
Form Factor Tower SFF
Volume (Approximate) 25L 12.9L
Orientation Vertical Vertical or horizontal
Kensington slot Yes Yes
Padlock loop Yes No
Intrusion switch Yes Yes
Handles Front removable & Handler filler & rear lip No
5.25″ to 3.5″ HDD Conversion Kit,325BT(with 1to 2 power converter cable) Yes No
50mm 1 to 2 fan power converter cable Yes No
Q4000 bracket 325BT Yes (Special bid only to support the K4000 card) No
Chassis Dimensions
Height (mm) 425.2 338
Height (inch) 16.74 13.31
Width (mm) 175 102
Width (inch) 6.89 4.02
Depth (mm) 431 375
Depth (inch) 16.97 14.76
Weight (kgs) 12.5 7.8
Weight (lbs) 27.56 17.20
NOTE: HxWxD(mm) are based on maximum length, which include: PCI holder, plastic foot
Packaging Parameters without External Speaker
Height (mm) 510 505
Height (inch) 20.08 19.88
Width (mm) 310 215
Width (inch) 12.20 8.46
Depth (mm) 540 530
Depth (inch) 21.26 20.87
Weight (kgs) 14 9.23
Weight (lbs) 30.86 20.34

1P Thermal Solution

The E32 1P system will utilize a single fansink solution supporting 87W, 69W, 77W, 55W, and 65W CPUs. In addition to the CPU fansink, the E32 1P system will contain a rear system fan, an optional front PCI fan (to be used only with Inactive powered graphics adapters).

Security & Serviceability

Physical Security and Serviceability
Access Panel Tool-less side cover removal
Optical Drive Tool-less
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less
Color coded User Touch Points Yes
Color-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Tool-less
Green Color Power LED on Front of Computer Yes
Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via Lenovo Support
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Security Chip Yes
Boot Sequence Control Yes
Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal E32 SFF do not support it.
Boot without keyboard and/or mouse Yes

Operating Environment

Temperature
Operating Temperature 10 degrees C – 35 degrees C (50F to 95F)
Non-operating Temperature (-40 degrees C – 60 degrees C) (50F to 140F)
Wet bulb temperature 25 degrees C (max)(Operating)
40 degrees C (max) (Non-Operating)
Humidity
Operating  Humidity 20% ~ 80% (non-condensing)
Non-Operating 20% ~ 90%(non-condensing)
Heat Maximum: 955 Btu/hr / 280 W
Altitude
Operating –15.2 to 3048 m (–50 to 10,000 ft)
Storage –15.2 to 10,668 m (–50 to 35,000 ft)
Vibration
With Package 1.04 G at 2 to 200 Hz at 1 octave/min
Without package
Operating 0.27 G at 5 to 500 Hz at 0.5 octave/min,Ramdom(without LCD panel)
Non-Operating 1.04 G at 2 to 200 Hz at 1 octave/min
Shock
Without package Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)
Operating 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Temperature

  • Operating
    • 10 – 35 degrees C
  • Non-Operating
    • -40 – 60 degrees C

Humidity

  • Relative Humidity
    • Operating: 20 – 80% non-condensing (10% per hour)
    • Storage: 20 – 90% non-condensing (10% per hour)
  • Wet Bulb Temperature
    • Operating: 25 degrees C (max)
    • Non-Operating: 40 degrees C (max)

Altitude

Operating: –15.2 to 3048 m (–50 to 10,000 ft)
Storage:–15.2 to 10,668 m (–50 to 35,000 ft)

Regulations and Standards

EMC & Safety

FCC DoC for North America Yes
VCCI certification for Japan Yes
BSMI certification for Taiwan Yes
EU/EFTA CE Mark & DoC Yes
UL/CUL Yes
TUV-GS Yes
IEC60950-1 CB Report/Certificate Yes
Saudi Arabia ICCP(SASO) Yes
China CCC Mark  Yes
Hong Kong SAR (CB report) Yes
Argentina S-mark Yes
Singapore – PSB Yes
South Africa – SABS Yes
Russia-GOST Yes
Mexico-NOM Yes
Kazakhstan -GOST-K Yes
Belarus-certificate Yes
Croatia-certificate Yes
Serbia – KVALITET Yes
Ukraine – UKrCEPRO Yes
Energy Star 5.0/5.2 Yes
PEP(Internal Certification) Yes
China RoHS Yes
EU RoHS Yes
EU WEEE Yes
Japan J-Moss Yes
California RoHS Yes
USA Chemical Emission Test Yes
New York RoHS Yes
Japan Energy Saving Yes

Energy Star

All E32 systems are designed to with the premise of maximizing energy efficiency. The latest version of the Energy Star standard is still being defined. Pending ratification of the newest Energy Star spec, the Development team will assess which models will be able to be Energy Star compliant.

EPEAT™

E32 models which are Energy Star compliant (pending ratification of latest Energy Star spec) will also qualify for the EPEAT™ Gold rating.

EuP Lot-6 2012

E32 systems are complaint with the EuP Lot-6 2012 standard for low power consumption. This is enabled by default for all systems shipping to EMEA, and can be toggled on or off in the system BIOS.

Section II: Supported Components

CPU Specifications

E3-1280V3 ( 3.60GHz / 4C / 8M / 1600 / 80w / T / 0GT )
E3-1270V3 ( 3.50GHz / 4C / 8M / 1600 / 80w / T / 0GT )
E3-1240V3 ( 3.40GHz / 4C / 8M / 1600 / 80w / T / 0GT )
E3-1230V3 ( 3.30GHz / 4C / 8M / 1600 / 80w / T / 0GT )
E3-1220V3 ( 3.10GHz / 4C / 8M / 1600 / 80w / T / 0GT )
E3-1275V3 ( 3.50GHz / 4C / 8M / 1600 / 84w / T / 2GT )
E3-1245V3 ( 3.40GHz / 4C / 8M / 1600 / 84w / T / 2GT )
E3-1225V3 ( 3.20GHz / 4C / 8M / 1600 / 84w / T / 2GT )
Haswell i7-4770 ( 3.40GHz / 4C / 8M / 1600 / 84w / T / 2GT )
Haswell i5-4670 ( 3.40GHz / 4C / 6M / 1600 / 84w / T / 2GT )
Haswell i5-4570 ( 3.20GHz / 4C / 6M / 1600 / 84w / T / 2GT )
Haswell i3-4340 (3.6GHz / 2C / 4M/ 1600 / 54W / 2GT)
Haswell i3-4330 (3.5GHz / 2C / 4M / 1600 / 54W / 2GT)
Haswell i3-4130 (3.4GHz / 2C / 3M / 1600 / 54W / 2GT)
Haswell Pentium G3430 (3.3GHz / 2C / 3M / 1600 / 53W / 1GT)
Haswell Pentium G3420 (3.2GHz / 2C / 3M / 1333 / 53W / 1GT)
Haswell Pentium G3220 (3.0GHz / 2C / 3M / 1333 / 53W / 1GT)

Intel processor numbers are not a measurement of higher performance. Processor numbers differentiate features within each processor family, not across different processor families.

Quad, Dual core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; Not all customers or software applications will necessarily benefit from use of these technologies.

64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations

RAM Specifications

UDIMMs (non-ECC)
2GB DDR3 non-ECC UDIMM PC3-12800 (1600MHz)
4GB DDR3 non-ECC UDIMM PC3-12800 (1600MHz)
8GB DDR3 non-ECC UDIMM PC3-12800 (1600MHz)
UDIMMs (ECC)
2GB DDR3 ECC UDIMM PC3-12800E (1600MHz)
4GB DDR3 ECC UDIMM PC3-12800E (1600MHz)
8GB DDR3 ECC UDIMM PC3-12800E (1600MHz)

Storage – HDD/SSD

Part Description
3.5″ SATA Hard Disk Drive (HDD)
250GB SATA – 7200rpm, 6Gb/s, 3.5″
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
2.5″ SATA Hard Disk Drive (HDD)
250GB SATA – 10000rpm, 6Gb/s, 2.5″
500GB SATA – 10000rpm, 6Gb/s, 2.5″
1TB SATA – 10000rpm, 6Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
180GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
240GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
256GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, OPAL, 2.5″
256GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
480GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
512GB SATA 3 Solid State Drive (SSD), 2.5″,6Gb/s Value
512GB SATA 3 Solid State Drive (SSD), 2.5″,6Gb/s,Performance
3.5″ SATA Hybrid
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
4TB SATA – 7200 rpm, 6Gb/s 3.5″
3.5″ SATA Hybrid
500GB+8GB Hybrid HDD 5400RPM SATA 2.5″

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

RAID levels and requirements:

  • RAID 0 (striping) provides increased performance by writing data across multiple drives.
  • RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
  • RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1.

Storage – Optical Drive/Removable Media

Part Description
DVD-ROM Drive – 16x/48x (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
Blu-Ray Burner Drive w/AACS encryption (SATA)
29-in-1 Media Card Reader, 3.5″

Keyboard Specifications

Part Description
Preferred Pro Fullsize Keyboard (USB)
Preferred Pro Fingerprint Keyboard (USB) (for EPEAT gold)

Pointing Devices Specifications

Part Description
Optical Wheel Mouse (800 DPI), USB – red wheel

Graphics Cards

Part Description (E32 SFF only can support LP Graphics Cards) Intel Integrated HD Graphics P4600 NVIDIA NVS300 (with DMS-59 to Dual DVI single link dongle) – 512MB GDDR3 (HP/LP) NVIDIA NVS300 (with DMS-59 to Dual Display Port dongle) – 512MB GDDR3 (HP/LP) NVIDIA NVS310 (Dual DP) 512MB DDR3 (HP/LP) NVIDIA NVS510 (x4 DP, mini-DP, Single Link DVI-D, Dual Link DVI-D, VGA) – 2GB DDR3 (HP) NVIDIA Quadro 410 (Dual link DVI, DP) – 512MB GDDR3 (HP/LP) NVIDIA Quadro K600 (DVI-I (1), DP 1.2 (1)) – 1GB GDDR3 (HP/LP) NVIDIA Quadro K2000 (DVI-I (1), DP 1.2 (2)) – 2GB GDDR5 (HP) NVIDIA Quadro 2000D(Dual link DVIx2, mDP,) – 2GB GDDR5 (HP) NVIDIA Quadro 4000 (Dual link DVI, DP, DP, Stereo 3D) – 2GB GDDR5 (HP)

Network/Audio Devices

Part Description
USB 3.0 PCI Express x1 Adapter
IEEE 1394(Firewire) PCI Express x1 Adapter
Intel 1 Gigabit ET Dual Port Server Adapter
1000M Ethernet PCI Express 1x Adapter

Section III: System Technical Specifications

Power Supply Specifications

DC Power Supply -Wattage 450W 92plus Single output 280W 85plus Single output 240W 92plus Single output 240W 85plus Single output
Power Efficiency 92% 85% 92% 85%
Manual / Auto-sensing Auto-sensing Auto-sensing Auto-sensing Auto-sensing
Type 115/230V(50/60Hz) 115/230V(50/60Hz) 115/230V(50/60Hz) 115/230V(50/60Hz)
Wattage 450W 280W 240W 240W
AC Input Voltage Range 100-127v/200-240v 100-127v/200-240v 100-127v/200-240v 100-127v/200-240v
AC Input Current (low ac range/high AC range) 8A/4A 8A/4A 8A/4A 8A/4A
AC Input Frequency 50/60HZ 50/60HZ 50/60HZ 50/60HZ
AC Holdup Time (50% load) 17MS 17MS 17MS 17MS
Minimum Efficiency 0.89 0.82 0.89 0.82
PFC (Active) ACTIVE ACTIVE ACTIVE ACTIVE
80 PLUS compliant Yes – Platinum Yes – Silver Yes – Platinum Yes – Silver
Power Supply Cable Length
Cable 1(SATA Power Cable 200mm + 200mm) Yes No
Cable 2(SATA Power Cable 400mm for ODD) No Yes
Cable 3(SATA Power Cable 200mm for HDD) No Yes
Cable 4(SATA Power Cable 210mm + 170mm + 180mm) Yes No
Cable 1 (2*7 Pin P1 main connector for MB) 280mm 250mm 230mm
Cable 2 (2*2 Pin P2 for CPU ) 230mm 230mm 280mm
Cable 3 (2×3 PIN,P3 for Gfx card) 400mm NA NA
DC Parameters
+3.3v Output NA NA NA NA
+5.0v Output NA NA NA NA
+12.0v Output 12V1/16A, 12V2/18A,12V3/12A 12V1/16A, 12V2/16A 12V1/12A, 12V2/16A 12V1/12A, 12V2/16A
+5.0v Auxiliary Output 3A 2.5A 1A 2.5A
-12.0v Output 0.2A 0.2A 0.2A 0.2A
Max Total Power 450W 280W 240W 240W
Max Combined +3.3v/+5.0v Power NA NA NA NA
Max Combined 12.0v Power 435W 270W 233W 233W
19.5V Output NA NA NA NA
Power Supply Meets Requirements of:
Energy Star 4.0 Compliant Power Supply Yes Yes Yes Yes
Energy Star 5.0 Compliant Power Supply Yes Yes Yes Yes
Blue Angel Compliant Yes Yes Yes Yes
UL Certified Yes Yes Yes Yes

Click here to access the ThinkStation Power Calculator.

BIOS Specifications

Features
WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1) System Configuration Setup program available at power-on with F1 key
Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.
Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert Power-on Error message in event of decrease in system memory
Thermal Alert Power-on Error message in event of fan failure
Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume time Support low power S3 (suspend to RAM) and prompt resume times
ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation System can be booted without a keyboard
Per-port Control Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature.
Security User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location
Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory modes Supports mirroring, lock step, and sparing memory modes
Windows 8 ready Supports Windows 8 requirements – Secure flash, UEFI v 2.3.1 spec

Industry Standard Specification Support
UEFI Unified Extensible Firmware Interface v2.3.1
ACPI (Advanced Configuration and power Management Interface) Advanced Configuration and Power Interface v4.0
ASF 2.0 DMTF Alert Standard Format Specification v2.0
ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot “El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI PCI Local Bus v3.0
PCI Firmware Specification 3.0
PCI Express PCI Express Base Specification 3.0
SATA Serial ATA Revision 3.0 Specification
TPM Trusted Computing Group TPM Specification Version 1.2
UHCI Universal Host Controller Interface Design Guide, Revision 1.1
USB Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS DMTF System Management Spec v2.7.1

Social and Environmental Responsibility

Quality Control

The company is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium,
0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal
reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-
trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated
terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the
chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5
microgram/cm²/week
REACH Article 33 information about substances in articles is available at:
http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains
more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall be
marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is
provided in user manual
Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or
accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers (as dependent on the
design of the product). Exception: Batteries that are permanently installed for safety, performance, medical
or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling

The product complies with legally required safety standards as specified
The product complies with legally required standards for electromagnetic compatibility
If product is intended for connection to a public telecom network or contains a radio transmitter, it complies
with legally required standards for radio and telecommunication devices
The product is labeled to show conformance with applicable legal requirements

Product packaging

Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and
hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified in the Montreal
Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality:

  • Intel LAN with AMT
Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability software consoles:

  • Lenovo ThinkManagement Console
  • LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
  • Microsoft System Center Configuration Manager
System Software Manager Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

  • System Update
  • Update Retriever
  • Thin Installer
Service, Support, and Warranty On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Technical Specifications

HDD Specifications

3.5″ SATA Hard Disk Drive (HDD)

250GB 7200RPM SATA Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 4.00 x 5.787 x 0.787 (inches)
Size 3.5”
Interface Type SATA-III
Available Drives 7200RPM
Bus Transfer Rate 600MB/s
Partition Support NTFS (Default) / FAT32
Average Seek Time <10ms
Logical Blocks 488,397,168
IOEDC (Input/Output Error Detection Code) or SMART IV (Self Monitoring And Reporting Technology ) Yes
Power Source (Idle)
DC Power (Max) 8.0W
DC Current 0.800@5V, 0.8@12V
500GB 7200RPM SATA Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 4.00 x 5.787 x 0.787 (inches)
Size 3.5”
Interface Type SATA-III
Available Drives 7200RPM
Bus Transfer Rate 600MB/s
Partition Support NTFS (Default) / FAT32
Average Seek Time <10ms
Logical Blocks 976,773,168
IOEDC (Input/Output Error Detection Code) or SMART IV (Self Monitoring And Reporting Technology ) Yes
Power Source (Idle)
DC Power (Max) 8.0W
DC Current 0.800@5V, 0.8@12V
1TB 7200RPM SATA Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 4.00 x 5.787 x 0.787 (inches)
Size 3.5”
Interface Type SATA-III
Available Drives 7200RPM
Bus Transfer Rate 600MB/s
Partition Support NTFS (Default) / FAT32
Average Seek Time <10ms
Logical Blocks 1,953,525,168
IOEDC (Input/Output Error Detection Code) or SMART IV (Self Monitoring And Reporting Technology ) Yes
Power Source (Idle)
DC Power (Max) 8.0W
DC Current 0.800@5V, 0.8@12V
2TB 7200RPM SATA Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 4.010 x 5.787 x 1.028 (inches)
Size 3.5”
Interface Type SATA-III
Available Drives 7200RPM
Bus Transfer Rate 600MB/s
Partition Support NTFS (Default) / FAT32
Logical Blocks 3,907,029,168
IOEDC (Input/Output Error Detection Code) or SMART IV (Self Monitoring And Reporting Technology ) Yes
Power Source (Idle)
DC Power (Max) 8.0W
DC Current 0.800@5V, 0.8@12V, 0.8@12V
3TB 7200RPM SATA Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 4.010 x 5.787 x 1.028 (inches)
Size 3.5”
Interface Type SATA-III
Available Drives 7200RPM
Bus Transfer Rate 600MB/s
Partition Support NTFS (Default) / FAT32
Logical Blocks 5,860,533,168
IOEDC (Input/Output Error Detection Code) or SMART IV (Self Monitoring And Reporting Technology ) Yes
Power Source (Idle)
DC Power (Max) 8.0W
DC Current 0.800@5V, 0.8@12V, 0.8@12V

2.5″ SATA Hard Disk Drive (HDD)

2.5” 10000rpm SATA, NCQ  250GB Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 2.750 x 3.955 x 0.591 (inches)
Size 2.5”
Interface Type SATA-III
Available Drives 10000RPM
Bus Transfer Rate 600MB/s
Average Seek Time Read 3.6 ms
Write 4.2 ms
Power Source (Idle)
DC Power (Max) 5.8W
2.5” 10000rpm SATA, NCQ  500GB Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 2.750 x 3.955 x 0.591 (inches)
Size 2.5”
Interface Type SATA-III
Available Drives 10000RPM
Bus Transfer Rate 600MB/s
Average Seek Time Read 3.6 ms
Write 4.2 ms
Power Source (Idle)
DC Power (Max) 5.8W
2.5” 10000rpm SATA, NCQ  1TB Yes
Supported Types Serial-ATA
Dimensions inches/centimeters (W x D x H) 2.750 x 3.955 x 0.591 (inches)
Size 2.5”
Interface Type SATA-III
Available Drives 10000RPM
Bus Transfer Rate 600MB/s
Average Seek Time Read 3.6 ms
Write 4.2 ms
Power Source (Idle)
DC Power (Max) 5.8W

2.5″ SATA Solid State Drive (SSD)

Optical Drives Specifications

CD – RW Rambo Drive

HH DVD Recorder Yes Yes
Type
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 146±0.5×41.5±0.5×175(Max)
Unit:mm
Speed 16x/40x Max
Bay Type Half-Height
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 1Kg
Internal Buffer Size 0.75MB Min
Access Times (typical) 140 ms
Rates
Writes 16x DVD+/-R / 8x DVD+RW/ 6x DVD-RW/5x DVD-RAM
40x CD-R / 24x CD-RW
Reads 40XCD-ROM/16XDVD-ROM
Power Source
DC Power Requirements (+5V±5%; 12V±10%)
DC Current Max 2.5A@12V
Max 2.0A@5v

DVD – ROM Drive

Type DVD-ROM
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 146±0.5×41.5±0.5×175(Max)
Unit:mm
Speed 16x/48x Max
Bay Type Half-Height
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 1Kg
Internal Buffer Size 196KB Min
Access Times (typical) 140 ms
Rates
Writes NA
Reads 48XCD-ROM/16XDVD-ROM
Power Source
DC Power Requirements (+5V±5%; 12V±10%)
DC Current Max 2.0A@12V
Max 1.5A@5v

Blu-Ray Burner Drive w/ AACS encryption

HH Blu-ray Recorder Yes Yes
Type Blu-ray Recordable
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 146±0.5×41.5 +0.5/-0.7×184.7±0.5(Max)
Unit:mm
Speed 6x Max
Bay Type Half-Height
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 1Kg
Internal Buffer Size 2MB Min
Access Times (typical) 180 ms
Rates
Writes 6x BD-R / 2x BD-RE
16XDVD +R / 8XDVD+RW / 4XDVD+R DL
16XDVD-R / 6XDVD-RW / 4XDVD-R DL
5XDVD-RAM
40XCD-R / 24XCD-RW
Reads 6x BD-ROM
16XDVD-ROM,  40XCD-ROM
Power Source
DC Power Requirements +5V±5%; 12V±10%
DC Current Max 3.0A@12V,
Max 1.9A@5v

Disclaimer
As Blu-Ray is a new format containing new technologies, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for some Blu-Ray titles to play, they may require a DVI or HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played on this workstation.

SLIM DVD Recorder:

Slim DVD Recorder (SFF Support Only)
Type DVD Recordable
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 126.5±0.4×12.7 ±0.4×128±0.4(Max)
Unit:mm
Speed 8x Max
Bay Type 12.7mm Slim
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 0.2Kg
Internal Buffer Size 0.5MB Min
Access Times (typical) 160s
Rates
Writes 8x DVD+/-R / 6x DVD+/-RW/5x DVD-RAM
24x CD-R / 16x CD-RW
Reads 8XDVD-ROM / 24XCD-ROM
Power Source
DC Power Requirements +5V±5%
DC Current Max 2.5A@5v

Slim DVD ROM

Slim DVD ROM (SFF Support Only)
Type DVD ROM
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 126.5±0.4×12.7 ±0.4×128±0.4(Max)
Unit:mm
Speed 8x Max
Bay Type 12.7mm Tray
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 0.2Kg
Internal Buffer Size 0.5MB Min
Access Times (typical) 160s
Rates  
Writes NA
Reads 8XDVD-ROM / 24XCD-ROM
Power Source  
DC Power Requirements +5V±5%
DC Current Max 2.5A@5v

Slim – ODD Rambo:

Slim ODD Rambo (SFF Support Only)
Type BD Rambo
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 126.5±0.4×12.7 ±0.4×128±0.4(Max)
Unit:mm
Speed 6x Max
Bay Type 12.7mm Tray
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 0.2Kg
Internal Buffer Size 2MB Min
Access Times (typical) 160s
Rates
Writes 6x BD-R / 2x BD-RE
8XDVD +R / 8XDVD+RW / 4XDVD+R DL
8XDVD-R / 6XDVD-RW / 4XDVD-R DL
5XDVD-RAM
24XCD-R / 16XCD-RW
Reads 6XBD-ROM /8XDVD-ROM / 24XCD-ROM
Power Source
DC Power Requirements +5V±5%
DC Current Max 2.5A@5v

Slim Blu-ray recorder:

Slim Blu-ray Recorder (SFF Support Only)
Type DVD ROM
External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel-W x H x D) 126.5±0.4×12.7 ±0.4×128±0.4(Max)
Unit:mm
Speed 8x Max
Bay Type 12.7mm Slim
Color Business Black
Removable No
Interface Type and Speed SATA 1.5 Gb/s
Weight (max) POUNDS/KILOGRAMS 0.2Kg
Internal Buffer Size 1MB Min
Access Times (typical) 160s
Rates
Writes NA
Reads 8XDVD-ROM / 24XCD-ROM
Power Source
DC Power Requirements +5V±5%
DC Current Max 2.5A@5v

29-in-1 Media Card Reader

Description
The Media Card Reader device uses the same physical form factor and mounting as a Floppy Disk Drive. The device connects to a 2×5 two channel USB header on the motherboard of the system. There is no USB controller card provided. Please see the Disc Formats section below for a list of flash memory card formats that are supported.

Mounting Orientation The Media Card Reader can be mounted in a dedicated Floppy Drive bay (if the chassis provides one) or in an appropriate Optical Bay adapter. It will operate in any orientation.

Interface Type
USB 2.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots)

Disc Formats

29 in 1 Card Reader (5 slots) o With adapter
Card reader support SD Micro SDXC MS PRO DUO MS DUO
SDHC RS-MMC MS PRO-HG Duo MS
SDXC MMC MS HG Micro o MS PRO
Mini SD MMC Micro MS XS Duo CF Type I
Mini SDHC MMC Mobile MS XC-HG Duo CF Type II
Micro SD MMC Plus MS XC Micro o MD
Micro SDHC M2 o MS XC-HG Micro o XD-H
XD-M

Video Cards


Integrated Graphics Adapter

Supported on both Tower and SFF
Type Integrated
Bus Interface Processor onboard
Display Interface VGA/DP/DP
Video Resolution (max) VGA/DP: 2560×1600@60Hz
DVI/HDMI: 1920×1200@60Hz
Graphics Cover Name Intel HD Graphics P4600
Video Ram Max TBD
Memory type TBD
Triple Monitor Support TBD
Display Rotation Support TBD
3D Setup & Render Engine TBD
GPU Core Clock TBD
Maximum Color Depth TBD
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) TBD

NVIDIA NVS315

(Supported on both Tower and SFF)
Type Discrete
Bus Interface PCI Express Gen2 ×16
Display Interface DMS59
Video Resolution (max) DVI(Dual Link):2560×1600 @ 60HZ
Graphics Chipset NVS315 GF119-825
Video Ram Max 1G
Memory type 4 pcs 128M x16 DDR3 SDRAM
Memory clock frequency(MHz) 875MHz
Memory size(MB) 1G
Memory bit(bit) 64 bit
RAMDAC TBD
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type DDR3
GPU Core  frequency(MHz) 523Mhz
Maximum Power Consumption 19.3W
Operating System Graphics/Video API Support Window 7, Window 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP :  2560*1600 @ 60HZ
Thermal Active
Dimension 2.713 inches by 5.7 inches

NVIDIA NVS 310

(Supported on both Tower and SFF)
Type Discrete
Bus Interface PCI Express 2 ×16
Display Interface DP + DP
Video Resolution (max) DVI(Dual Link): 2560×1600 @ 60HZ
Graphics Chipset Q310 GF119-825
Video Ram Max 512 MB
Memory type 4 pcs 128M x 16 DDR3 SDRAM
Memory clock frequency(MHz) 875 MHz
Memory size(MB) 512 MB
Memory bit(bit) 64 bit
RAMDAC TBD
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX 11
VRAM Type DDR3
GPU Core  frequency(MHz) 523 MHz
Maximum Power Consumption 19.5 W
Operating System Graphics/Video API Support Window 7, Window 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP :  2560*1600 @ 60HZ
Thermal Active
Dimension 2.713 inches by 5.7 inches

NVIDIA Quadro 410

(Supported on both Tower and SFF)
Type discrete
Bus Interface PCI Express 3.0 ×16
Display Interface DVI-I + DP
Video Resolution (max) DVI(Single Link): 2560 × 1600
Graphics Chipset Quadro 410
Video Ram Max 512MB
Memory type 4 pcs 128M X16 DDR3
Memory clock frequency(MHz) 891 MHz
Memory size(MB) 512MB
Memory bit(bit) 64 bit
RAMDAC 400MHZ
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX 11
VRAM Type DDR3
GPU Core  frequency(MHz) 706 MHz
Maximum Power Consumption 36.7W
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) VGA( through DVI to VGA): 2048*1536@85Hz
DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Thermal Active
Dimension 2.713 inches by 6.93 inches

NVIDIA NVS 510

(Supported on both Tower and SFF)
Type discrete
Bus Interface PCI Express 3.0 ×16
Display Interface 4 mini-DP
Video Resolution (max) 2560× 1600
Graphics Chipset NVS 510
Video Ram Max 2048MB
Memory type 8 pcs 128M x 16 DDR3
Memory clock frequency(MHz) 891 MHz
Memory size(MB) 2048MB
Memory bit(bit) 128-bit
RAMDAC TBD
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type DDR3
GPU Core  frequency(MHz) 797 MHz
Maximum Power Consumption 33.4 W
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP : 3840 *2160 @60Hz
Multi-Stream Topology up to a maximum of 4 monitors at resolution of 1920 x1200 @60Hz with reduced blanking using.
Thermal Active
Dimension 2.713 inches × 6.303 inches

NVIDIA K600

(Supported on both Tower and SFF)
Type Discrete
Bus Interface PCI-E 2.0, 16 lane
Display Interface DVI-I + DP
Video Resolution (max) DVI-I(Dual Link) :2560 x 1600
DP 1.2: 3840 x 2160
Graphics Chipset GK107
Video Ram Max 1 GB
Memory type 8 pcs  128M x 16 DDR3
Memory clock frequency(MHz) 891 MHz
Memory size(MB) 1 GB
Memory bit(bit) 128-bit
RAMDAC 400 MHz
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type DDR3
GPU Core  frequency(MHz) 875 MHz
Maximum Power Consumption 41W
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) VGA( through DVI to VGA): 2048*1536@85Hz
DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Thermal Active
Dimension 2.713 inches × 6.3 inches

NVIDIA Quadro K2000

(Supported on Tower only)
Type Discrete
Bus Interface PCI-E 2.0, 16 lane
Display Interface DVI-I + DP + DP
Video Resolution (max) DVI-I(Dual Link) :2560 x 1600
DP 1.2 :3840 x 2160
Graphics Chipset GK107
Video Ram Max 2 GB
Memory type GDDR5
Memory clock frequency(MHz) 2000 MHz
Memory size(MB) 2 GB
Memory bit(bit) 128-bit
RAMDAC 400MHz
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type DDR5
GPU Core  frequency(MHz) 954 MHz
Maximum Power Consumption 51.1w
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) VGA( through DVI to VGA): 2048*1536@85Hz
DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Thermal Active
Dimension 4.38 inches x 7.97 inches

NVIDIA Quadro K2000D

(Supported on Tower only)
Type Discrete
Bus Interface PCI-E 2.0, 16 lane
Display Interface DVI-I + DVI + mini DP
Video Resolution (max) DVI-I :2560 x 1600
DP:3840 x 2160
Graphics Chipset GK107
Video Ram Max 2 GB
Memory type GDDR5
Memory clock frequency(MHz) 2000 MHz
Memory size(MB) 2 GB
Memory bit(bit) 128-bit
RAMDAC 400 MHz
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type 8 pcs 128M x 16 GDDR5
GPU Core  frequency(MHz) 954 MHz
Maximum Power Consumption 51.1w
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) VGA( through DVI to VGA): 2048*1536@85Hz
DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Thermal Active
Dimension 4.38 inches x 7.97 inches

NVIDIA Quadro K4000

(Supported on Tower only)
Type Discrete
Bus Interface PCI-E 2.0, 16 lane
Display Interface DP + DP +DVI-I + 3-pin mini DIN(available via optional bracket)
Video Resolution (max) DVI(Dual Link): 2560*1600 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Graphics Chipset GK106
Video Ram Max 3 GB
Memory type 12 pcs 128M x 16 GDDR5 SGRAM
Memory clock frequency(MHz) 2800MHz
Memory size(MB) 3 GB
Memory bit(bit) 192-bit
RAMDAC 400MHz
Dual Monitor Support Yes
Display Rotation Support Yes
3D Setup & Render Engine DX11
VRAM Type DDR5
GPU Core  frequency(MHz) 810MHz
Maximum Power Consumption 80w (Board Power)
Operating System Graphics/Video API Support Window 7,Windows 8
Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital) VGA( through DVI to VGA): 2048*1536@85Hz
DVI(Dual Link): 2560*1600 @ 60HZ
DVI(Single Link): 1920*1200 @ 60HZ
DP 1.2: 3840 *2160 @60Hz
Thermal Active
Dimension 4.376 inches x 9.5 inches ,Single- slot
Note: K4000 is for special bid only. Requires 450w power supply

USB 3.0

Interface: Single-Lane (x1) PCI Express Gen2
Mode: Universal Serial Bus 3.0
Controller: Renesas (NEC) μPD720200
PCB Version: Ver1.1
Port: 2 external USB3.0 ports
Speed: Data Transfer rate of 1.5/12/480/5000 Mbps.
Low Speed (1.5Mbps), Full Speed(12Mbps), High Speed(480Mbps), Super
Speed(5Gpbs)
Power Output: +5V / 900mA (each port)
Bracket: Standard 121mm / Low Profile 79.2mm
O.S. support: Windows XP/2003/Vista/7/2008, (32/64-bit)
Linux 2.6.31 or later (Linux OS already implemented USB3.0 driver)
Environment: Operation temp. 0 °C ~ 57 °C
Operation humidity: 5 ~ 95% RH
Storage temp. -20 °C ~ 85 °C

Other PCI-E / PCI Adapters:

Tower SFF
1394 Firewire Adapter Card (PCIe x1,with 2 external ports) Yes(High profile) Yes(Low profile)
IEEE 1394 (Firewire) PCI Adapter with internal port
-with 1 internal port, 1 external port
Yes(High profile) Yes(Low profile)
Gigabit Ethernet Card(Bitland 88E8070@1000M PCIE ASF NIC FH(R )) Yes(High profile) Yes(Low profile)
Intel ® 1Gbps ET Dual Port Server Adapter Yes(High profile) Yes(Need to replace high bracket low one)
Intel ® 1Gbps Ethernet Qual Port Adapter Yes(High profile) Yes(Need to replace high bracket low one)
USB3.0 Add-in Card Yes(High profile) Yes(Low profile)
PCI-E 1X Wifi  Card (Taylor Peak) Yes(High profile) Yes(Low profile)