PDFVersion: 1.5, May 19, 2014

ThinkStation C30

Product Overview

The dual-processor C30 workstation uses an Extended-ATX/EEB based motherboard, an 800 Watt (W) power supply unit (PSU), and a 24-liter ATX form factor tower. The C30 motherboard consists of the Intel® C602 Chipset and two 2011-pin Land Grid Array (LGA2011) Socket-R processor sockets, with support for quad core, six core, eight core, ten core and twelve core  processors from the Intel® Xeon line. Memory support consists of error-correcting code (ECC) unbuffered Double Data Rate 3 (DDR3) Synchronous Dynamic Random Access Memory (SDRAM). Maximum memory supported is 128GB for UDIMMs and 256GB (pending 32GB RDIMM availability).

Section I: System Overview

Operating Systems

Preloaded
Genuine Windows 8® Professional 64-bit
Genuine Windows 8.1® Professional 64-bit
Genuine Windows 7® Professional 64-bit
Genuine Windows 7® Professional 32-bit

Supported
Genuine Windows XP Professional 64-bit
Genuine Windows XP Professional 32-bit
Red Hat Enterprise Linux 6.4

Motherboard – C30

Table 1. C30 Motherboard Summary

C30 Motherboard Summary
Form Factor
Board Size 12.23″ x 14.01″ (310.68mm x 355.9mm)
Layout Custom, based on Extended-ATX/EEB Standard
Motherboard Core
Processor Support Intel® Xeon™ Dual Core (Sandy Bridge EP)
Intel® Xeon™ Quad Core
Intel® Xeon™ Six Core
Intel® Xeon™ Eight Core
Intel® Xeon™ Ten Core
Intel® Xeon™ Twelve Core
Socket Type (2) x Intel Socket-R (LGA2011)
Memory Support 1866/1600/1333/1066/800 MHz
QPI (GTPS) 6.4/7.2/8.0 GTPS Links
Voltage Regulator VR12.1 – 130W TDP
Chipset (PCH) Patsburg-A (Intel C602)
Support for Intel HW module to allow enablement of Patsburg-B
Flash 128Mbit SPI Flash with FWH
HW Monitor N/A
Super I/O Nuvoton 6681D
Clock ICS932SQ420B
Audio Realtek ALC662-VD
Ethernet Intel Lewisville(82579)
SAS Integrated with Patsburg –A + Enablement Module (Patsburg –B equivalent)
Memory
Slots 4 per CPU socket
Channels 4 per CPU socket
Type DDR3 Unbuffered SDRAM (UDIMM, RDIMM, LRDIMM)
ECC Support Yes
Speed Up to PC3-14900 (1866MHz)
Max DIMM Size Up to 8GB UDIMM, up to 32GB RDIMM
Max System Memory UDIMM: up to 64GB (w/8GB modules)
RDIMM: up to 256GB RDIMM (w/32GB modules)
Ethernet
Vendor Intel
Count 1
EEPROM None (part of SPI flash)
Speeds 10/100/1000 Mbps
Functions PXE, WOL, AMT (82579), NC-SI (82574), Jumbo Frames, Teaming
Connectors (1) x RJ45 on Rear I/O
Audio
Vendor Realtek
Type HD (5.1)
Internal Speaker Yes, using SSM2211 amplifier
Connectors (3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
(2) x Front 3.5mm Jacks (Headphone out, Microphone In)
(1) x 2-Pin Internal Speaker Header
Video
Onboard <Not Supported>
Adapter (2) x PCI-E 3.0 16-Lane Slots
Additional adapters may be supported in x4 slots for Spec Bids
Multi-GPU Support BIOS supported, card dependent
Storage
Floppy None
IDE None
SATA/SAS (2) x SATA Connectors, Gen. 2 (AHCI)
(2) x SATA Connectors, Gen. 3 (AHCI)
(3) x SATA/SAS Connectors, Gen. 2 (SCU)
(1) x eSATA Connector, Gen. 2 (eSATA bracket)

• SATA RAID 0,1, 5 supported natively
• SAS RAID 0,1 and SATA RAID 0,1 supported via SAS Enablement Module
• SAS RAID 0,1,5 and SATA RAID 0,1,5 supported via LSI 9260-8i adapter
SAS RAID 0,1 5 and SATA RAID 0,1, 5 supported via LSI 9240-8i adapter (with RAID5 key)

eSATA (1) x eSATA Connector, Gen. 2, cabled to Slot via bracket
Slots
Slot 1 (Near CPU) 4-Lane PCI-E v3.0 (16-Lane Mechanical) – Half Length, Full Height
Slot 2 16-Lane PCI-E v3.0 – Full Length, Full Height
Slot 3 PCI v2.3 – Full Length, Full Height
Slot 4 16-Lane PCI-E v3.0 – Full Length, Full Height
Slot 5 4-Lane PCI-E v2.0 Full Length, Full Height, open tailgate (RF 2.5)
Slot 6 (Near Edge) PCI v2.3 – Half Length, Full Height
Rear I/O
COM (1) x Serial Port (COM1)
eSATA (1) x eSATA Port (Gen. 2), optional via bracket
LPT None
Video <No Onboard Video>
Audio Microphone-In, Line In, Line Out
Ethernet (1) x RJ45
USB 2.0 (2) x USB 2.0 Ports
USB 3.0 (2) x USB 3.0 Ports
Firewire None
Internal I/O
USB 2.0
  • x Front Panel USB Header (2 ports, Base MTM)
  • x Media Card Reader Header
  • x Internal USB connector
USB 3.0
  • x Front Panel USB 3.0 edge connector (2 ports)
PS/2 (1) x 2-port PS/2 Header (Rear)
Audio (1) x Front Panel Mic & Line-Out Header
COM2 None
Clear CMOS 3-Pin Clear CMOS Header
Speaker 2-Pin Internal Speaker Header
Chassis Intrusion 2-Pin Chassis Intrusion Switch Header
Firewire None
Thermal
Fans (1) x 4-Wire CPU Fans
(1) x 5-Wire Rear Fans (1 header, two fans)
(1) x 4-Wire Front Fan
(2) x 5-Wire Memory Fan (not used on C30)
(1) x 3-Wire PCH Fan (PCH fan not installed)
Power Connectors
Main (1) 24-Pin (2×12) ATX Standard
Memory & CPU (2) 8-Pin (2×4) ATX 12V Standard
Graphics (1) 4-Pin (2×2) ATX 12V Standard
Security
TPM Version 1.2, Nuvoton NPCT421LA0WX (Base MTMs)
Version 1.2, ST Micro ST33TPM12LPC (MTMs and later)
Asset ID NXP PCA24S08
vPro AMT 8.0
BIOS
Vendor AMI

Ethernet

The C30 motherboard implements an onboard gigabit Ethernet port via the Intel (82579) PHY. This integrated solution has support for the industry standard functions of Wake on LAN (WOL) and Preboot Execution Environment (PXE), Teaming, and Jumbo Frames. Additionally, for Manageability features, (82579) will support AMT 7.0.

Audio

The ALC662-VD chip from Realtek provides C30 with stereo audio capability that meets Windows7 Premium performance requirements. There are 2 front analog jacks, and 3 rear color-coded analog jacks.

Clock Generator

The clock generator chip on C30 is an ICS932SQ420B. It is compliant with the Intel requirement for CK420 clock generation, and had downstream support with a DB1900Z clock buffer.

Chassis Summary

Chassis Info

Chassis Format: Tower
Chassis Dimension – cm: 444mm D x 130mm W x 427mm H
Chassis Dimension – in: 17.48″ D x 5.12″ W x 16.81″ H
Chassis Weight = 40.7 lbs (18.5kg) maximum configuration
Chassis color: Raven Black
Power supply: 800W 90% Efficient

2P Thermal Solutions

A single unique heatsink design for the front CPU (CPU1) that supports up to 135W processors. The rear CPU (CPU2) heatsink design is common with S30 and D30, and also support up to 135W CPUs.

Security & Serviceability

Physical Security and Serviceability
Access Panel Tool-less side cover removal
Optical Drive Tool-less
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less
Color coded User Touch Points Yes
Color-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Tool-less
Green Color Power LED on Front of Computer Yes
Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via Lenovo Support
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Security Chip Yes
Access Panel Key Lock Yes
Boot Sequence Control Yes
Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal
Boot without keyboard and/or mouse Yes

Operating Environment

Air Temperature

  • Operating: 10°C to 35°C (50°F to 95°F)
  • Storage: -40°C to 60°C (-40°F to 140°F) in original shipping package
  • Storage: -10°C to 60°C (14°F to 140°F) without package
  • Note: The allowable upper temperature limit decreases by 1°C (1.8°F) for every 300 m (1000 ft) above sea level.

Humidity

  • Operating: 10% to 80% (non-condensing)
  • Storage: 10% to 90% (non-condensing)

Altitude

  • Operating: -50 to 10 000 ft (-15.2 to 3 048 m)

Regulations and Standards

C30 is expected to be compliant to the Lenovo Standards Compliance Reference List

EMC

FCC (DoC)/Canada
CE (EMC)
VCCI
JEIDA
C-Tick
BSMI
CCIB

Safety

UL (C-UL)
TUV-GS
ISO-9241 – parts 3, 7, 8
NOM
IRAM
CCIB
PSB
CE (LVD)

Energy Star

All C30 systems are designed to with the premise of maximizing energy efficiency. Select models will meet the workstation requirements outlined the Energy Star specification:

Energy Star Program Requirements for Computers: Version 6.0

EPEAT™

C30 models which are Energy Star 6.0 compliant will also qualify for the EPEAT™ Gold rating. The Development team is currently assessing whether some or all of these models may also qualify for EPEAT™ Gold.

EuP Lot-6 2012

C30 systems are complaint with the EuP Lot-6 2012 standard for low power consumption. This is enabled by default for all systems shipping to EMEA, and can be toggled on or off in the system BIOS.

Section II: Supported Components

CPU Specifications

Part Description
2S Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems, but will also work on single CPU systems
 
Intel Xeon E5-2697 v2 – 12 cores, 2.7 GHz, 8.0 QPI, 30MB Cache, DDR3-1866, Turbo, HT, 130W
 
Intel Xeon E5-2695 v2 – 12 cores, 2.4 GHz, 8.0 QPI, 30MB Cache, DDR3-1866, Turbo, HT, 115W
 
Intel Xeon E5-2690 v2 – 10 cores, 3.0 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 130W
 
Intel Xeon E5-2680 v2 – 10 cores, 2.8 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 115W
 
Intel Xeon E5-2670 v2 – 10 cores, 2.5 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 115W
 
Intel Xeon E5-2667 v2 – 8 cores, 3.3 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 130W
 
Intel Xeon E5-2660 v2 – 10 cores, 2.2 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 95W
 
Intel Xeon E5-2650 v2 – 8 cores, 2.6 GHz, 8.0 QPI, 20MB Cache, DDR3-1866, Turbo, HT, 95W
 
Intel Xeon E5-2643 v2 – 6 cores, 3.5 GHz, 8.0 QPI, 25MB Cache, DDR3-1866, Turbo, HT, 130W
 
Intel Xeon E5-2640 v2 – 8 cores, 2.0 GHz, 7.2 QPI, 20MB Cache, DDR3-1600, Turbo, HT, 95W
 
Intel Xeon E5-2637 v2 – 4 cores, 3.5 GHz, 8.0 QPI, 15MB Cache, DDR3-1866, Turbo, HT, 130W
 
Intel Xeon E5-2630 v2 – 6 cores, 2.6 GHz, 7.2 QPI, 15MB Cache, DDR3-1600, Turbo, HT, 80W
 
Intel Xeon E5-2620 v2 – 6 cores, 2.1 GHz, 7.2 QPI, 15MB Cache, DDR3-1600, Turbo, HT, 80W
 
Intel Xeon E5-2609 v2 – 4 cores, 2.5 GHz, 6.4 QPI, 10MB Cache, DDR3-1333, 80W
Intel Xeon E5-2603 v2 – 4 cores, 1.8 GHz, 6.4 QPI, 10MB Cache, DDR3-1333, 80W
2S Low Power Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems, but will also work on single CPU systems. They also have a lower TDP than standard power CPUs.
 
Intel Xeon E5-2650L v2 – 10 cores, 1.7 GHz, 8.0 QPI, 25MB Cache, DDR3-1600, Turbo, HT, 70W
 
Intel Xeon E5-2630L v2 – 6 cores, 2.4 GHz, 7.2 QPI, 15MB Cache, DDR3-1600, Turbo, HT, 60W
1S Processor SKUs – These SKUs have 1 QPI link and are targeted for single CPU  configurations
Intel Xeon E5-1660 v2 – 6 cores, 3.7 GHz, 15MB Cache, DDR3-1866, Turbo, HT, 130W
Intel Xeon E5-1650 v2 – 6 cores, 3.5 GHz, 15MB Cache, DDR3-1866, Turbo, HT, 130W
Intel Xeon E5-1620 v2 – 4 cores, 3.7 GHz, 10MB Cache, DDR3-1866, Turbo, HT, 130W
Intel Xeon E5-1607 v2 – 4 cores, 3.0 GHz, 10MB Cache, DDR3-1600, 130W

When ordering two processors, the second processor must be the same as the first. Intel processor numbers are not a measurement of higher performance. Processor numbers differentiate features within each processor family, not across different processor families.

Multi core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; Not all customers or software applications will necessarily benefit from use of these technologies.

64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations

RAM Specifications

Part Description
UDIMMs – 1866MHz
4GB DDR3 ECC UDIMM PC3-14900E (1866MHz) 1Rx8 4Gbit
8GB DDR3 ECC UDIMM PC3-14900E (1866MHz) 2Rx8 4Gbit
RDIMMs – 1866MHz
4GB DDR3 ECC RDIMM PC3-14900R (1866MHz) 1Rx8 4Gbit
8GB DDR3 ECC RDIMM PC3-14900R (1866MHz) 2Rx8 4Gbit
UDIMMs – 1600MHz
2GB DDR3 ECC UDIMM PC3-12800 (1600MHz) 1Rx8 2Gbit
4GB DDR3 ECC PC3-12800 (1600MHz) 2Rx8 2Gbit
8GB DDR3 ECC UDIMM PC3-12800 (1600MHz) 2Rx8 4Gbit
RDIMMs – 1600MHz
2GB DDR3 ECC RDIMM PC3-12800R (1600MHz) 1Rx8 2Gbit
4GB DDR3 ECC RDIMM PC3-12800R (1600MHz) 2Rx8 2Gbit
8GB DDR3 ECC RDIMM PC3-12800R (1600MHz) 2Rx4 2Gbit
16GB DDR3 ECC RDIMM PC3-12800R (1600MHz) 2Rx4 4Gbit
32GB DDR3 ECC RDIMM PC3-12800R (1333 MHz) 2Rx4 4Gbit (performance is configuration dependant)

Memory Support Matrix

Storage – Hard Drive/SSD Specifications

Part Description
3.5″ SATA Hard Disk Drive (HDD)
250GB SATA – 7200rpm, 6Gb/s, 3.5″
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″
2.5″ SATA Hard Disk Drive (HDD)
250GB SATA – 10000rpm, 6Gb/s, 2.5″
500GB SATA – 10000rpm, 6Gb/s, 2.5″
1TB SATA – 10000rpm, 6Gb/s, 2.5″
3.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 15000rpm, 6Gb/s, 3.5″
450GB SAS – 15000rpm, 6Gb/s, 3.5″
600GB SAS – 15000rpm, 6Gb/s, 3.5″
2.5″ SAS Hard Disk Drive (HDD)
146GB SAS – 15000rpm, 6Gb/s, 2.5″
300GB SAS – 15000rpm, 6Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
180GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
240GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
256GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, OPAL, 2.5″
mSATA Drives
128GB mSATA Drive, 6Gb/s, MLC
256GB mSATA Drive, 6Gb/s, MLC
3.5″ Hybrid Drives
1TB – 7200 rpm 8GB Flash
2TB – 7200 rpm 8GB Flash

HDD to ODD Conversion

Kits are available through the special bid process to convert a 5.25″ HDD bay into either a 3.5″ or 2.5″ optical drive.

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

RAID levels and requirements:

  • RAID 0 (striping) provides increased performance by writing data across multiple drives.
  • RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
  • RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives.
  • RAID 10 (or RAID 1+0) combines
  • RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.

Optional Hard Disk Drive Controllers:

LSI 9240-8i SATA/SAS RAID adapter
Description: PCIe x8 adapter card
Enables: Up to 5 SAS or SATA drives @ SATA3 (6GB/s) speeds, RAID 0,1,10
RAID 5 Support available with optional RAID key

SAS HDD enablement module (1-3 drives)
Description: S30 / C30 SAS HDD enablement module
Enables: Up to 3 SATA or SAS drives at SATA2 (3Gb/s) speeds, RAID 0,1

Storage – Optical Drive

Part Description
DVD-ROM Drive – 16x/48x (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
Blu-Ray Burner Drive w/AACS encryption (SATA)

Keyboard Specifications

Part Description
Preferred Pro Fullsize Keyboard (USB)

Pointing Devices Specifications

Part Description
Optical Wheel Mouse (800 DPI), USB – red wheel

Video Adapters Specifications

Part Description
NVIDIA NVS300 (DMS-59 to Dual DVI, DMS-59 to Dual DP) – 512MB GDDR3
NVIDIA NVS310 (Dual DP) 512MB DDR3
NVIDIA NVS315 (DMS-59) 1GB DDR3
NVIDIA NVS 510 (mini DP x 4) – 2GB DDR3
NVIDIA Quadro 410 (Dual link DVI, DP) 512MB DDR3
NVIDIA Quadro K600 (Dual link DVI, DP) – 1GB DDR3
NVIDIA Quadro K2000 (Dual link DVI, DP, DP) – 2GB GDDR5
NVIDIA Quadro K2000D (Dual link DVI x 2) – 2GB GDDR5
NVIDIA Quadro K4000 (Dual link DVI, DP, DP, Stereo 3D) – 3GB GDDR5
NVIDIA Quadro K5000 (Dual link DVI x 2, DP, DP) – 4GB GDDR5
NVIDIA Quadro 6000 (Dual link DVI, DP, DP, Stereo 3D) – 6GB GDDR5
SLI Implementations
2 x NVIDIA Quadro K5000 with SLI Cable
2 x NVIDIA Quadro 5000 with SLI Cable
2 x NVIDIA Quadro 5000
SLI Cable
Compute Adapters
NVIDIA Tesla K20 – 5GDDR5

PCI/PCIe Adapters Specifications

Part Description
IEEE 1394a (Firewire-400) PCI Express x1 Adapter (2 external ports)
Intel 82574L Gigabit CT2 Desktop Ethernet Adapter
Intel 1 Gigabit ET Dual Port Server Adapter
USB 3.0 PCI Express x1 Adapter
SoundBlaster Recon3D Audio Card (PCIe x1)

Speakers Specifications

Part Description
Lenovo Branded 2-Piece Speaker Set
Speaker Brick

Section III: System Technical Specifications

Power Supply Specifications

Power Supply 800w PSU
Operating Voltage Range 90-264 VAC
Rated Voltage Range 100-127V / 200-240V
Rated Line Frequency 50/60Hz.
Operating Line Frequency Range 47Hz/63Hz
Rated Input Current 12A @ 100-127 VAC6A @ 200-240 VAC
Power Supply Fan 92x38mm, 2400rpm max
ENERGY STAR® qualified (Config Dependent) YES
80 PLUS Compliant YES, 80 PLUS Gold
Built-in Self Test (BIST) LED YES
Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V) YES
Aux Power connectors P3: One (1) 6-Pin (2×3) PCI-E Auxiliary Power Connector
P4: One (1) 6-Pin/8-Pin (2×4) PCI-E Auxiliary Power Connector

Click here to access the ThinkStation Power Calculator.

BIOS Specifications

Features
WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1) System Configuration Setup program available at power-on with F1 key
Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.
Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert Power-on Error message in event of decrease in system memory
Thermal Alert Power-on Error message in event of fan failure
Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume time Support for power S3 (suspend to RAM) and prompt resume times
ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation System can be booted without a keyboard
Per-port Control Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature. User has ability to provide custom fan control table
Security User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location
Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory modes Supports mirroring, lock step, and sparing memory modes
Windows 8 ready Supports Windows 8 requirements – Secure flash, UEFI v 2.3.1 spec
Industry Standard Specification Support
UEFI Unified Extensible Firmware Interface v2.3.1
ACPI (Advanced Configuration and power Management Interface) Advanced Configuration and Power Interface v4.0
ASF 2.0 DMTF Alert Standard Format Specification v2.0
ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot “El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI PCI Local Bus v3.0PC Firmware Specification 2.1
PCI Express PCI Express Base Specification 3.0
SATA Serial ATA Revision 3.0 Specification
TPM Trusted Computing Group TPM Specification Version 1.2
UHCI Universal Host Controller Interface Design Guide, Revision 1.1
USB Universal Serial Bus Revision 1.1Universal Serial Bus v2.0Universal Serial Bus v3.0
SMBIOS DMTF System Management Spec v2.7.1

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium,
0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal
reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-
trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated
terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the
chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5
microgram/cm²/week
REACH Article 33 information about substances in articles is available at:
http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains
more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall be
marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is
provided in user manual
Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or
accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers (as dependent on the
design of the product). Exception: Batteries that are permanently installed for safety, performance, medical
or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling

The product complies with legally required safety standards as specified
The product complies with legally required standards for electromagnetic compatibility
If product is intended for connection to a public telecom network or contains a radio transmitter, it complies
with legally required standards for radio and telecommunication devices
The product is labeled to show conformance with applicable legal requirements

Product packaging

Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and
hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified in the Montreal
Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality:

  • Intel LAN with AMT
Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability software consoles:

  • Lenovo ThinkManagement Console
  • LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
  • Microsoft System Center Configuration Manager
System Software Manager Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:

  • System Update
  • Update Retriever
  • Thin Installer
Service, Support, and Warranty On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Technical Specifications

HDD Specifications

3.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 15000rpm, 6Gb/s, 3.5″
450GB SAS – 15000rpm, 6Gb/s, 3.5″
600GB SAS – 15000rpm, 6Gb/s, 3.5″
2.5″ SAS Hard Disk Drive (HDD)
146GB SAS – 15000rpm, 6Gb/s, 2.5″
300GB SAS – 15000rpm, 6Gb/s, 2.5″
Specification 3.5″ 15K 2.5″ 15K
Interface
Connector SAS SFF-8482
Transfer Rate (Gb/sec) 3Gb
Performance
Spindle Speed(RPM) 15,000 +/- 15,000 +/-
Power off to Spindle Stop(sec) 30 max
DC Power to Drive Ready(sec) 30 max
Receipt of Start Unit Command to Drive Ready(sec) 30 max
Average Latency(msec) 2 +/- 0.25
Full Stroke Seek for Read/Write(ms max) 8 / 9
Power Management
Input(VDC) +5v +- 5%+12v +- 5%
Typical(Watts) TBD
Idle(Watts) TBD
Dimensions
Height(mm – Max) 26.11 15
Width(mm) 101.6 +/- 0.25 69.85 +/- 0.25
Depth(mm – Max) 146.99 100 +/- 0.45
Weight(grams) 800 max
Temperature
Operating(C) Ambient 5 to 55
Operating(C) Base Casting 60 max
Non-Operating(C) Ambient -40 to 70
Gradient(C per Hour) 20 max
Shock
Operating(Gs @ 2ms) 60 max
Non-Operating(Gs @ 2ms) 250 max
Part Description
3.5″ SATA Hard Disk Drive (HDD)
250GB SATA – 7200rpm, 6Gb/s, 3.5″
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″
2.5″ SATA Hard Disk Drive (HDD)
150GB SATA – 10000rpm, 6Gb/s, 2.5″
300GB SATA – 10000rpm, 6Gb/s, 2.5″
600GB SATA – 10000rpm, 6Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, 2.5″
256GB SATA – Solid State Drive (SSD), 6Gb/s, MLC, OPAL, 2.5″
mSATA Drives
128GB mSATA Drive, 6Gb/s, MLC
256GB mSATA Drive, 6Gb/s, MLC
Specification
Interface
Connector SATA
Ports Single
Transfer Rate 6Gb
Temperature
Operational Ambient (C) 0 to 55
Base Casting (C) 60 max
Gradient(C per Hour) 20 max
Non-Operational Ambient(C)) -40 to 70
Gradient(C per Hour) 30 max
Humidity
Operational Relative Non-Condensing Wet bulb (%) 5 to 90
Gradient (% per hour) 20
Non-Operational Relative Non-Condensing Wet bulb (%) 5 to 95
Gradient (% per hour) 20
Altitude
Operating(feet) -1000 to 10,000
Non-Operating(feet) -1000 to 40,000
Shock – All Axis
OperationalNo Data loss. Data recovery is allowed ½ Sine @ 2ms (Read & Write) (G) 60
Rotational (Rad/sec**2) 8.5
Non-Operational No damage allowed ½ Sine @ 2ms (G) 250
Rotational (Rad/sec**2) 20,000

HDD Controller Specifications

LSI 9240-8i SATA/SAS RAID adapter

PCI Bus PCI-Express 2.0 x8 lanes
PCI Modes Bus Master DMA
RAID Levels RAID 0, 1, 5, 10, 50 and JBOD mod
Data Transfer Rates Up to 6 Gb/s per port
PCI Card Type 3.3V Add-in card
PCI Voltage +12V ±10
PCI Power 13.5W
Bracket Full Height and Low-Profile
Certification Level PCI-Express 2.0
Internal Connectors Two X4 Mini-SAS SFF8087 (vertical orientation

SSD Technical Specifications

Solid State Drives for Workstations

Capacity 128GB, 180GB, 240GB, 256GB
Physical Size Model Height (mm) 6.80 ± 0.20
Width (mm) 69.85 ± 0.25
Length (mm) 100.00 ± 0.25
Weight (gram) Max 58
Interface SATA
Synchronous Transfer Rate 6Gb/s
Operating Temperature 0°C to 60°C (32° to 140°F)

CD – RW Rambo Drive

Description 5.25-inch, half-height, tray-load
Mounting Orientation Either horizontal or vertical
Interface Type SATA/ATAPI
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in)
Disc Formats DVD-RAMDVD+RDVD+RWDVD+R DLDVD-R DL

DVD-R
DVD-RW
CD-R
CD-RW

Disc Capacity

DVD-ROM 8.5 GB DL or 4.7 GB standard
Full Stroke DVD < 250 ms (seek)
Full Stroke CD < 210 ms (seek)

Maximum Data Transfer Rates

CD ROM Read CD-ROM, CD-R Up to 40XCD-RW Up to 32X
DVD ROM Read DVD-RAM Up to 12XDVD+RW Up to 8XDVD-RW Up to 8XDVD+R DL Up to 8XDVD-R DL Up to 8X
DVD-ROM Up to 16X
DVD-ROM DL Up to 8X
DVD+R Up to 16X
DVD-R Up to 16X

Power

Source SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, <1600 mA maximum12 VDC – <600 mA typical, <1400 mAMaximum

Operating Environmental

Temperature 5° to 50° C (41° to 122° F)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 30° C (86° F)

Operating Systems Supported
Windows 7 Professional 32-bit and 64-bit,
Windows XP Professional or Windows XP Home 32*.
Red Hat Enterprise Linux(RHEL) 6
Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.

Kit Contents
SATA SuperMulti DVD Writer Drive, Roxio
Easy Media Creator software, Intervideo
WinDVD Software, installation guide, and
DVD+R media.

DVD – ROM Drive

Description 5.25-inch, half-height, tray-load
Mounting Orientation Either horizontal or vertical
Interface Type SATA/ATAPI
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in)
Disc Capacity DVD-ROM Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB

Access Times

DVD-ROM Single Layer < 140 ms (typical)
CD-ROM Mode 1 < 125 ms (typical)
Full Stroke DVD < 250 ms (seek)
Full Stroke CD < 210 ms (seek)

Power

Source SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, < 1600 mAmaximum12 VDC – < 600 mA typical, < 1400 mAmaximum

Operating Environmental

Temperature 5° to 50° C (41° to 122° F)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 30° C (86° F)

Operating Systems Supported
Windows 7 Professional 32-bit and 64-bit,
Windows XP Professional or Windows XP Home 32*.
Red Hat Enterprise Linux(RHEL) WS4**, 5, 6
Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.

Blu-Ray Burner Drive w/ AACS encryption

Description 5.25-inch, half-height, tray-load
Mounting Orientation Either horizontal or vertical
Interface Type SATA
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in)
Disc Formats BD-ROMBD-RBD-REDVD-RAMDVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW

Disc Capacity

DVD-ROM 8.5 GB DL or 4.7 GB standard
Blu-ray 50 GB DL or 25 GB standard
Full Stroke DVD < 250 ms (seek)
Full Stroke CD < 210 ms (seek)
Blu-ray <275 ms (seek)
Startup Time BD-ROM (SL/DL) 25S / 28SBD-R (SL/DL) 25S / 28SBD-RE (SL/DL) 25S / 28SDVD-ROM (SL/DL) 18S / 18SDVD-R (SL/DL) 25S / 25S
DVD-RW 25S
DVD+R (SL/DL) 25S / 25S
DVD+RW 25S
DVD-RAM 45SCD-ROM 45S
Maximum Data Transfer Rates CD ROM Read CD-ROMCD-RCD-RWUp to 40XUp to 40XUp to 40X
DVD ROM Read DVD-RAM Up to 5XDVD+RW Up to 10XDVD-RW Up to 10XDVD+R DL Up to 8XDVD-R DL Up to 8X
DVD-ROM Up to 16X
DVD-ROM DL Up to 8X
DVD+R Up to 12X
DVD-R Up to 12X
Blu-Ray BD-ROM Up to 6XBD-ROM DL Up to 4.8XBD-R Up to 6XBD-R DL Up to 4.8XBD-R Up to 6XBD-RE SL/DL Up to 4.8X

Power

Source SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p12 VDC ± 10%-100 mV ripple p-p
DC Current 5 VDC -900 mA typical, 1200 mA maximum12 VDC -1000 mA typical, 1600 mA maximum

Operating Environmental

Temperature 5° to 50° C (41° to 122° F)
Relative Humidity 15% to 80%
Maximum Wet Bulb Temperature 30° C (86° F)

Operating Systems Supported
Windows 7 Professional 32-bit and 64-bit,
Windows XP, Professional or Windows XP Home 32*.
Red Hat Enterprise Linux(RHEL) WS 6

Kit Contents
Blue Laser RW Drive, Roxio Easy Media
Creator software, Intervideo WinDVD
Software, installation guide.

Disclaimer

As Blu-Ray is a new format containing new technologies, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for some Blu-Ray titles to play, they may require a DVI or HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played on this workstation.

Video Cards

NVIDIA NVS 300 512MB Graphics Card

Form Factor
2.7 inches (H) x 5.7 inches (L), Half-Height

Graphics Controller
NVIDIA NVS 300 Graphics Board

Bus Type
PCI Express x16, Generation 2.0

Memory
512 MB GDDR3 SDRAM unified graphics memory

Connectors
DMS-59
Includes DMS-59 to Dual DVI-I adapter or DMS-59 to Dual DP adapter

Maximum Resolution
DVI: two digital displays up to 1920 x 1200
DisplayPort: two digital displays up to 2560 x 1600
VGA: two analog displays up to 1920 x 1080

Image Quality Features

Display Output
This card support up to two displays: Drives DVI enabled digital displays at resolutions up to 1920 × 1200 at 60 Hz with reduced blanking Drives DisplayPort enabled digital displays at resolutions up to 2560 × 1600 at 60 Hz with reduced blanking (through optional DMS-59 to DisplayPort adapter)

Drives VGA enabled analog displays at resolutions up to 1920 x 1080 (through optional DMS-59 to VGA adapter)

Supported Graphics APIs
OGL 3.3
DirectX 10.1

Available Graphics Drivers
Genuine Windows 7 Professional (64-bit and 32-bit)
Microsoft Windows XP Professional (64-bit and 32-bit)
Red Hat Enterprise Linux(RHEL) 6 Desktop/Workstation

Power Consumption
<18 Watts

NVIDIA NVS 310 512MB Graphics Card

Form Factor
Low Profile: 2.713 inches in height × 6.150 inches in length

Graphics Controller
NVIDIA NVS 310

Bus Type
PCI Express x16, 2.0 compliant

Memory
Size: 512MB DDR3
Clock: 875Mhz
Memory Bandwidth: 14GB/s
Connectors
2 x DisplayPort 1.2

Maximum Resolution
Up to 2560 x 1600 (digital display) per display.

Image Quality Features
See Display Output section.
The following video formats are supported:
– MPEG2
– MPEG4 Part 2 Advanced Simple Profile
– H.264 SVC codec support
– Support for 3D Blu Ray
– VC1
– DivX version 3.11 and later
– MVC

A full range of video resolutions are supported including 1080p, 1080i, 720p, 480p and 480i. The NVS 310 GPU provides hardware acceleration for the computationally intensive parts of video processing, as well as provides improved video playback speeds via faster decode and transcode.

Display Output
Up to 2 displays in the following configurations:

Drives two DisplayPort enabled digital display at resolutions up to 2560 × 1600 at 60 Hz with reduced blanking, when connected natively using the 2 DisplayPort connectors on the NVS 310 graphics card Supports 2 monitors up to resolution of 1920 × 1200 at 60 Hz with reduced blanking using DisplayPort 1.2 multi stream topology technology.

DVI-D output:

Drives two digital display at resolutions up to 1920 × 1200 at 60Hz with reduced blanking using DisplayPort to DVI-D single-link cable adaptors Drives two digital display at resolutions up to 2560× 1600 at 60 Hz with reduced blanking using DisplayPort to DVI-D dual-link cable adaptors HDMI output:
NVS 310 is capable of driving two high definition (HD) panels up to resolutions of 1920 × 1080P at 60 Hz using DisplayPort to HDMI cable adaptors

VGA display output:
Drives two analog display at resolutions up to 1920 × 1200 at 60 Hz using DisplayPort to VGA cable adaptors

Shading Architecture
Shader Model 5.0

Supported Graphics APIs
DX11, OpenGL 4.1

Available Graphics Drivers
Genuine Windows 7 Professional (64-bit and 32-bit)
Microsoft Windows XP Professional (64-bit and 32-bit)
Red Hat Enterprise Linux(RHEL)

Power Consumption
19.5 Watts

Note

The thermal solution used on this card is an active fan heatsink.

NVIDIA NVS 315 1GB PCIe Graphics Card

Form Factor
Low Pofile, 1/2 length Active cooling

Bus Type
PCI Express x16, Generation 2.0

Memory
1GB GDDR3

Connectors
DMS59

Maximum Resolution
DisplayPort: 2560 x 1600
DVI: 1920 x 1200
VGA: 2048 x 1536

Supported Graphics APIs
OpenGL 4.1 DirectX 11

NVIDIA Quadro NVS 510

CUDA Cores
192

Memory Size Total
2.0 GB DDR3

Memory Interface
128-bit

Memory Bandwidth (GB/sec)
28.5

Display Connector
Mini DisplayPort (mDP)

# of Connectors
4

DisplayPort
4

Single-Link DVI-D
41

Dual-Link DVI-D
42

VGA
43

Maximum Display Resolution (Digital @ 60Hz)
3840×21604

Maximum Display Resolution (Analog @ 60 Hz)
1920×12005

Number of Slots
1

Audio Support (via DisplayPort)

1 using mDP to SL-DVI, or included mDP-DP Cable with a DP to SL-DVI Cable Adaptor
2 using included mDP-DP cable with DP to DL-DVI Cable Adaptor
3 using included mDP-DP cable with DP to VGA Cable Adaptor
4 Through native DisplayPort (DP)
5 Through DP to VGA Cable Adaptor

NVIDIA Quadro 410 512MB Graphics

Form Factor
Low Profile: 2.713 inches × 5.7 inches, single slot

Graphics Controller
NVIDIA Quadro 410

Bus Type
PCI Express x16, 3.0 compliant

Memory
Size: 512MB DDR3
Clock: 900MHz
Memory Bandwidth: 14GB/s

Connectors
One dual-link DVI-I connector
One DisplayPort connector

Maximum Resolution
Up to 2560 x 1600 (digital display) per display.

RAMDAC
400 MHz integrated RAMDAC

Display Output
Maximum resolution over DisplayPort: 2560 × 1600 × 32 bpp at 60 Hz (reduced blanking)
Maximum resolution over DVI port: 2560 × 1600 × 32 bpp at 60 Hz (reduced blanking)
Maximum resolution over VGA (through DVI to VGA cable): 2048 × 1536 × 32 bpp at 85 Hz

Shading Architecture
Shader Model 5.0

Supported Graphics APIs
DX11, OpenGL 4.2

Available Graphics Drivers
Genuine Windows 7 Professional (64-bit and 32-bit)
Microsoft Windows XP Professional (64-bit and 32-bit)
Red Hat Enterprise Linux(RHEL) 6 Desktop/Workstation

Power Consumption
< 35 Watts

NVIDIA Quadro K600

CUDA Parallel-Processing Cores
192

Frame Buffer Memory
1 GB DDR3

Max Power Consumption
41W

Graphics Bus
PCI Express 2.0 x16

Display Connectors
DVI-I (1), DP 1.2 (1)

Form Factor
2.713″ H x 6.3 L Single Slot

NVIDIA Quadro K2000

CUDA Parallel-Processing Cores
384

Frame Buffer Memory
2 GB GDDR5

Max Power Consumption
51W

Graphics Bus
PCI Express 2.0 x16

Display Connectors
DVI-I (1), DP 1.2 (1)

Form Factor
4.376″ H x 7.97 L Single Slot

NVIDIA Quadro K4000

CUDA Parallel-Processing Cores
768

Frame Buffer Memory
3 GB GDDR5

Max Power Consumption
80W

Graphics Bus
PCI Express 2.0 x16

Display Connectors
DVI-I (1), DP 1.2 (2)

Form Factor
4.376″ H x 9.5 L Single Slot

NVIDIA Quadro K5000 4GB Graphics Card

CUDA Cores
1536

Single Precision Compute Performance
2.1 Teraflops

Memory Size Total
4GB GDDR5

Memory Interface
256-bit

Memory Bandwidth (GB/sec)
173 GB/s

Dual Link DVI-I
1

Dual Link DVI-D
1

DisplayPort 1.2
2

# of Digital Outputs
4

Stereo (3-pin Mini-DIN)
Optional

Maximum Display Resolution (Digital)
DVI-DL: Up to 330M Pixels/sec: (ex 1920×1200@120Hz, 2560×1600@60Hz)
DisplayPort 1.2: Up to 540M Pixels/sec & 17.3 Gbps data rate
(ex 3840×2160@60Hz 30bpp, 2560×1440@120Hz 30bpp, 4096×2160@24Hz 36bpp, 4096×2160@50Hz 30bpp )

NVIDIA Quadro 6000 6GB Graphics Card

Form Factor
4.376″ H x 9.75″ L
Dual Slot

Graphics Controller
NVIDIA Quadro 6000 Graphics Card

Bus Type
PCI Express 2.0 x16

Memory
6 GB GDDR5
384-bit
ECC Memory

Connectors
1 DVI-I output, 2 DisplayPort outputs, 1 Stereo(3-pin mini DIN);
One DP to DVI adapter included with card
DVI to VGA, DisplayPort to VGA and DisplayPort to dual link DVI
adapters available as accessories

Maximum Resolution
Dual DisplayPort (up to 2560 x 1600 @ 60Hz and 1920×1200 @ 120Hz)
Dual-link DVI-I output (up to 2560 x 1600 @ 60Hz and 1920×1200 @
120Hz)

Image Quality Features
30-bit color
Up to 16K x16K texture and render processing
Transparent multisampling and super sampling
16x angle independent anisotropic filtering
128-bit floating point performance
32-bit per-component floating point texture filtering and blending
64x full scene antialiasing (FSAA) / 128x FSAA in SLI Mode
Support for any combination of two connected displays
DisplayPort 1.1a, HDMI 1.3a, and HDCP support
NVIDIA 3D Vision™ technology, 3D DLP, Interleaved, and other
3D stereo format support
Full OpenGL quad buffered stereo support
Underscan/overscan compensation and hardware scaling
NVIDIA nView® multi-display technology

Shading Architecture
Shader Model 5.0

Supported Graphics APIs
OpenGL 4.0
DirectX 11
CUDA API support includes:
CUDA C, CUDA C++, DirectCompute 5.0, OpenCL, Java, Python, and Fortran

Available Graphics Drivers
Genuine Windows 7 Professional (64-bit and 32-bit)
Microsoft Windows XP Professional (64-bit and 32-bit)
Red Hat Enterprise Linux (RHEL) 6 Desktop/Workstation

Power Consumption
<250 Watts

NVIDIA Tesla C2075 Compute Processor

Form Factor
4.376 inches by 9.75 inches
Dual Slot

System Interface
PCI Express Gen2 ×16

Video Outputs
One Dual Link DVI-I
(Video output on this connector is not supported in Maximus configurations per NVIDIA)

Memory
6GB GDDR5

Peak Memory Bandwidth
+170 GB/s

Supported APIs
CUDA API support includes:
CUDA C, CUDA C++, DirectCompute 5.0, OpenCL, Java, Python, and Fortran

Supported Operating Systems
Genuine Windows 7 Professional (64-bit)
Genuine Windows Vista Business (64-bit)
Microsoft Windows XP Professional (64-bit)
Red Hat Enterprise Linux (RHEL) 6 Desktop/Workstation (64-bit)

Processor Cores
448 CUDA cores

Power Consumption
~215 Watts

Audio Devices

SoundBlaster Recon3D Audio Card (PCIe x1)

24-bit Analog-to-Digital conversion of analog inputs 96kHz sample rate
24-bit Digital-to-Analog conversion of digital sources 96kHz to analog
16-bit to 24-bit recording sampling rates 8,11.025,16, 22.05, 24, 32, 44.1, 48 and 96kHz
16-bit to 24-bit playback sampling rates 8,11.025,16, 22.05, 24, 32, 44.1, 48, 96 and
192kHz
Rear Panel Connectivity Line in / Microphone In: Shared 1/8″ mini jack
Headphone: 1 x 1/8″ mini jack
Speaker Out: 3x 1/8″ mini jacks
Optical Out: TOSLINK
Optical In: TOSLINK
Speaker Support Stereo/2.1 Speakers
5.1 Speakers
Headphones
Bus Connection PCI Express 1x
Package Contents Sound Card
Quick Start leaflet
Installation CD containing:
• Drivers for Windows®
• Creative Software Suite
• User’s Guide
Software Sound Blaster Recon3D PCIe Control Panel
• THX® TruStudio Pro™ effects
• THX® TruStudio Pro Surround™
• THX® TruStudio Pro Crystalizer™
• THX® TruStudio Pro Bass™
• THX® TruStudio Pro Smart Volume™
• THX® TruStudio Pro Dialog Plus™
CrystalVoice effects
• CrystalVoice™ Acoustic Echo Cancellation
• CrystalVoice™ Noise Reduction
• CrystalVoice™ Smart Volume
• CrystalVoice™ FX
• CrystalVoice™ Focus
EAX Advanced HD
OpenAL
Creative Alchemy
Minimum System Requirements Intel® Core™ 2 Duo or AMD® equivalent processor, 2.2 GHz or faster
Intel®, AMD® or 100% compatible motherboard
Microsoft® Windows® 7 (32/64-bit)
1 GB RAM
600 MB of free hard disk space
Available PCI Express® (x1, x4 or x16) slot
Available CD-ROM or DVD-ROM drive

Networking

Intel 82574L Gigabit CT2 Desktop Ethernet Adapter

Connector RJ-45
Controller Intel 82574L
Memory Integrated Dual 48K configurable transit receive FIFO Buffers
Data Rates Supported 10/100/1000 Mbps
Compliance IEEE 802.1p, Quality of Service (QoS) Support
Bus Architecture PCI-E 1.1
Typical Power Consumption 1.9W
Operating Temperature 32º to 131º F (0º to 55º C)
Storage Humidity 90% at 35ºC
Dimensions (H x W x D) 12cm x 5.53cm x 11.92cm
Operating System Driver Support Windows 7 Professional 32-bit and 64-bit, Windows XP Professional 64-bit, Red Hat Enterprise Linux 4 (4.8 or newer), 5 (5.3 or newer), 6

Intel 1 Gigabit ET Dual Port Server Adapter

Cabling Type Category-5 up to 100m
Bracket Height Low Profile & Full Height
Max TDP 2.9 W
Networking Specifications
# of Ports Dual
System Interface Type PCIe v2.0 (2.5GT/s)
Intel® Virtualization Technology for Connectivity (VT-c) VMDq, VMDc
Speed & Slot Width 2.5 GT/s, x4 Lane
Controller Intel 82576

USB 3.0

Interface: Single-Lane (x1) PCI Express Gen2
Mode: Universal Serial Bus 3.0
Controller: Renesas (NEC) μPD720200
PCB Version: Ver1.1
Port: 2 external USB3.0 ports
Speed: Data Transfer rate of 1.5/12/480/5000 Mbps.
Low Speed (1.5Mbps), Full Speed(12Mbps), High Speed(480Mbps), Super
Speed(5Gpbs)
Power Output: +5V / 900mA (each port)
Bracket: Standard 121mm / Low Profile 79.2mm
O.S. support: Windows XP/2003/Vista/7/2008, (32/64-bit)
Linux 2.6.31 or later (Linux OS already implemented USB3.0 driver)
Environment: Operation temp. 0 °C ~ 57 °C
Operation humidity: 5 ~ 95% RH
Storage temp. -20 °C ~ 85 °C

IEEE 1394a (Firewire-400) PCI Express x1 Adapter

Data Transfer Rate Supports up to 400 Mbps
Devices Supported IEEE-1394 compliant devices
Bus Type PCIe card full height PCIe slots
Ports One IEEE-1394a 6-Pin Connector
System Requirements Windows 7 Professional 32-bit and 64-bit, Microsoft® Windows® XP
Professional. Not supported on Linux. Pentium® III or higher processor 128-MB RAM 1-GB Hard Drive CD-ROM drive Built in sound system Available PCI slot
Temperature –Operating 50° to 131° F (10° to 55° C)
Temperature – Storage –22° to 140° F (–30° to 60° C)
Relative Humidity –Operating 20% to 80%
Compliances FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998 STD, Taiwan BSMI CNS13438, Korea MIC
Operating Systems Supported Windows 7 Professional 32-bit and 64-bit,Windows® XP Professional, XP Professional 64-bit.Not supported on Linux